GDSSF3611E [GOOD-ARK]

Advanced trench MOSFET process technology;
GDSSF3611E
型号: GDSSF3611E
厂家: GOOD-ARK ELECTRONICS    GOOD-ARK ELECTRONICS
描述:

Advanced trench MOSFET process technology

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中文:  中文翻译
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GDSSF3611E  
Main Product Characteristics:  
VDSS -30 V  
RDS(on) 10.6 mΩ(typ.)  
ID -12A  
Markingandpin  
Assignment  
Schematicdiagram  
Features and Benefits:  
AdvancedtrenchMOSFETprocesstechnology  
Special designed for PWM, load switching and  
generalpurposeapplications  
Ultralowon-resistancewithlowgatecharge  
Fastswitchingandreversebodyrecovery  
150operatingtemperature  
Description:  
It utilizes the latest trench processing techniques to achieve the high cell density and reduces the  
on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely  
efficientandreliabledeviceforuseinpowerswitchingapplicationandawidevarietyofotherapplications  
Absolute max Rating:  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Max.  
-12  
Units  
Continuous Drain Current, VGS @ 10V①  
Continuous Drain Current, VGS @ 10V①  
Pulsed Drain Current②  
-7.4  
A
-48  
PD @TC = 25°C  
VDS  
Power Dissipation③  
2
W
V
Drain-Source Voltage  
-30  
VGS  
Gate-to-Source Voltage  
± 20  
V
TJ TSTG  
Operating Junction and Storage Temperature Range  
-55 to +150  
°C  
Thermal Resistance  
Symbol  
Characterizes  
Junction-to-ambient (t ≤ 10s) ④  
Typ.  
Max.  
Units  
RθJA  
62.5  
/W  
Suzhou Goodark Electronics Co., Ltd  
Version 1.0  
GD  
                                                                                 
SSF3611E  
Electrical Characterizes @TA=25unless otherwise specified  
Symbol Parameter  
Min.  
-30  
1
Typ.  
Max.  
13  
16  
2
Units  
Conditions  
V(BR)DSS Drain-to-Source breakdown voltage  
V
VGS = 0V, ID = 250μA  
VGS =-10.0V, ID =-10.0A  
VGS =-4.50V, ID =-7.50A  
VDS = VGS, ID = 250μA  
VDS = -30V,VGS = 0V  
VGS = 20V  
10.6  
14.1  
RDS(on)  
Static Drain-to-Source on-resistance  
mΩ  
VGS(th)  
IDSS  
Gate threshold voltage  
V
Drain-to-Source leakage current  
-1  
μA  
10  
-10  
IGSS  
Gate-to-Source forward leakage  
μA  
nC  
VGS = -20V  
Qg  
Total gate charge  
Gate-to-Source charge  
Gate-to-Drain("Miller") charge  
Turn-on delay time  
Rise time  
55  
ID = -10A,  
Qgs  
Qgd  
td(on)  
tr  
3.5  
18  
VDS=-25V,  
VGS = -10V  
8.0  
5.8  
56  
VGS=-10V, VDS=-15V,  
RL=15Ω,  
ns  
td(off)  
tf  
Turn-Off delay time  
Fall time  
RGEN=3Ω  
38  
Ciss  
Coss  
Crss  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
3224  
459  
425  
VGS = 0V  
VDS = -15V  
ƒ = 1MHz  
pF  
Source-Drain Ratings and Characteristics  
Symbol  
Parameter  
Continuous Source Current  
(Body Diode)  
Min.  
Typ.  
Max.  
Units  
Conditions  
MOSFET symbol  
showing the  
IS  
-12  
A
integral reverse  
Pulsed Source Current  
(Body Diode)  
ISM  
-48  
A
p-n junction diode.  
IS=-2.1A, VGS=0V  
TJ = 25°C, IF =-10A, di/dt =  
100A/μs  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
-0.73  
16  
-1.2  
V
ns  
uC  
Qrr  
5.9  
Suzhou Goodark Electronics Co., Ltd  
Version 1.0  
GDSSF3611E  
                                                                                 
Test circuits and Waveforms  
Switch time test circuit:  
Switch Waveforms:  
Notes:  
The maximum current rating is limited by bond-wires.  
Repetitive rating; pulse width limited by max. junction temperature.  
The power dissipation PD is based on max. junction temperature, using junction-to-ambient thermal  
resistance.  
The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a  
still air environment with TA =25°C  
These curves are based on the junction-to-case thermal impedence which is measured with the  
device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C.  
The maximum current rating is limited by bond-wires.  
Suzhou Goodark Electronics Co., Ltd  
Version 1.0  
GDSSF3611E  
                                                                                 
Mechanical Data:  
SOP8 PACKAGE OUTLINE DIMENSION  
Dimension In Millimeters  
Dimension In Inches  
Symbol  
Min  
1.350  
0.100  
1.280  
Max  
1.750  
0.250  
1.480  
Min  
0.053  
0.004  
0.050  
Max  
0.069  
0.010  
0.058  
A
A1  
A2  
b
0.406  
0.016  
c
D
0.173  
4.800  
3.800  
5.800  
0.233  
5.000  
4.000  
6.200  
0.007  
0.189  
0.150  
0.228  
0.009  
0.197  
0.157  
0.244  
E
E1  
e
1.27TYP  
0.050TYP  
L
0.400  
1.250  
0.016  
0.050  
Suzhou Goodark Electronics Co., Ltd  
Version 1.0  
GD  
                                                                                 
SSF3611E  
Ordering and Marking Information  
Device Marking: SSF3611E  
Package (Available)  
SOP-8  
Operating Temperature Range  
C : -55 to 150 ºC  
Devices per Unit  
Package Units/ Tapes/Inner  
Units/Inner Inner  
Units/Carton  
Type  
Tape  
Box  
Box  
Boxes/Carton Box  
Box  
SOP-8  
2500  
2
5000  
8
40000  
Suzhou Goodark Electronics Co., Ltd  
Version 1.0  

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