HMC560LM3TR [HITTITE]
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| 型号： | HMC560LM3TR |
| 厂家： | 
HITTITE MICROWAVE CORPORATION |
| 描述： | 暂无描述 电信集成电路 电信电路 |
| 文件： | 总8页 (文件大小：330K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HMC560LM3
v00.0705
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Typical Applications
Features
The HMC560LM3 is ideal for:
• Test Equipment & Sensors
• Point-to-Point Radios
Wide IF Bandwidth: DC - 17 GHz
Input IP3: +21 dBm
High LO/RF Isolation: 35 dB
7
• Point-to-Multi-Point Radios
• Military & Space
Passive Double Balanced Topology
Leadless RoHS Compliant SMT Package, 25 mm2
Functional Diagram
General Description
The HMC560LM3 is a 24 - 40 GHz passive, double-
balanced MMIC mixer in a SMT leadless chip carrier
package. The mixer is fabricated in a GaAs MESFET
process, and can be used as a downconverter or
upconverter. The wide operating bandwidth allows this
device to be used across multiple radio bands with a
common platform. Excellent isolations are provided by
on-chip baluns. The HMC560LM3 requires no external
components and no DC bias. All data is with the
non-hermetic, epoxy sealed LM3 package mounted
in a 50 Ohm test fixture. Utilizing the HMC560LM3
eliminates the need for wirebonding, thereby providing
a consistent connection interface for the customer,
and allowing the use of surface mount manufacturing
techniques.
Electrical Specifications, TA = +25° C, IF = 1 GHz, LO = +13 dBm*
Parameter
Frequency Range, RF & LO
Frequency Range, IF
Conversion Loss
Min.
Typ.
24 - 36
DC - 17
10
Max.
Min.
Typ.
36 - 40
DC - 17
11
Max.
Units
GHz
GHz
dB
12
12
14
14
Noise Figure (SSB)
LO to RF Isolation
LO to IF Isolation
10
11
dB
25
23
16
35
22
18
20
28
dB
30
25
dB
RF to IF Isolation
20
25
dB
IP3 (Input)
18
21
dBm
dBm
dBm
IP2 (Input)
50
40
1 dB Compression (Input)
18
20
* Unless otherwise noted, all measurements performed as downconverter
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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HMC560LM3
v00.0705
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Conversion Gain vs.
Temperature @ LO = +13 dBm
Isolation @ LO +13 dBm
0
0
-10
-20
-30
-40
-50
LO/RF
RF/IF
LO/IF
-5
7
-10
+25 C
+85 C
-40 C
-15
-20
24
26
28
30
32
34
36
38
40
40
40
42
42
42
24
26
28
30
32
34
36
38
40
42
20
40
RF FREQUENCY (GHz)
FREQUENCY (GHz)
IF Bandwidth @ LO = +13 dBm
Conversion Gain vs. LO Drive
0
0
+7 dBm
+9 dBm
-5
-5
+11 dBm
+13 dBm
+15 dBm
-10
-15
-20
-10
Conversion Gain
-15
IF Return Loss
-20
24
26
28
30
32
34
36
38
0
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
FREQUENCY (GHz)
Upconverter Performance
Conversion Gain @ LO = +13 dBm
Return Loss @ LO = +13 dBm
0
0
-5
-10
-15
-20
-5
-10
RF
LO
-15
-20
24
26
28
30
32
34
36
38
24
26
28
30
32
34
36
38
RF FREQUENCY (GHz)
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 419
HMC560LM3
v00.0705
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Input IP3 vs.
Temperature @ LO = +13 dBm*
Input IP3 vs. LO Drive*
25
25
20
15
10
5
20
15
7
10
+9 dBm
+11 dBm
+13 dBm
+15 dBm
+25 C
+85 C
-40 C
5
0
0
24
26
28
30
32
34
36
38
38
38
40
40
40
24
26
28
30
32
34
36
38
38
38
40
40
40
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Input IP2 vs.
Temperature @ LO = +13 dBm*
Input IP2 vs. LO Drive*
80
80
70
60
50
40
30
20
10
0
70
60
50
40
30
+9 dBm
+11 dBm
+13 dBm
+15 dBm
20
+25 C
+85 C
-40 C
10
0
24
26
28
30
32
34
36
24
26
28
30
32
34
36
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Upconverter Performance
Input IP3 @ LO = +13 dBm
Input P1dB vs.
Temperature @ LO = +13 dBm
25
20
20
15
10
5
15
10
+25 C
+85 C
-40 C
5
0
0
24
26
28
30
32
34
36
24
26
28
30
32
34
36
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
* Two-tone input power = -10 dBm each tone, 1 MHz spacing.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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HMC560LM3
v00.0705
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
MxN Spurious
Outputs as a Down Converter
Absolute Maximum Ratings
RF / IF Input
+25 dBm
nLO
LO Drive
+23 dBm
mRF
0
xx
3
1
-5
0
2
3
4
IF DC Current
Channel Temperature
2 mA
0
1
2
3
4
5
150 °C/W
25
49
73
88
7
Continuous Pdiss (T= 85 °C )
58
48
78
58
63
85
0.344 W
(derate 5.3 mW/ °C above 85 °C)
83
89
Thermal Resistance (RTH
)
188 °C/W
(channel to package bottom)
RF = 24 GHz @ -10 dBm
LO = 25 GHz @ +13 dBm
Storage Temperature
-65 to +150 °C
-55 to +85 °C
Operating Temperature
All values in dBc below IF output power level.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. MATERIAL: PLASTIC
2. PLATING: GOLD OVER NICKEL
3. ALL DIMENSIONS IN INCHES (MILLIMETERS)
4. ALL TOLERANCES ARE 0.005 ( 0.13)
5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
6.
INDICATES PIN 1
•
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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HMC560LM3
v00.0705
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Pin Descriptions
Pin Number
Function
Description
Interface Schematic
This pin may be connected to the PCB ground
or left unconnected.
1, 2, 3
N/C
7
This pin is DC coupled and matched to 50 Ohm
from 24 to 40 GHz.
4
5
6
RF
This pin is DC coupled. For applications not requiring opera-
tion to DC, this port should be DC blocked externally using a
series capacitor whose value has been chosen to pass the
necessary IF frequency range. For operation to DC, this pin
must not source or sink more than 2 mA of current or part
non-function and possible part failure will result.
IF
This pin is DC coupled and matched to 50 Ohm
from 24 to 40 GHz.
LO
GND
Package base must be soldered to PCB RF ground.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 422
HMC560LM3
v00.0705
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Evaluation PCB
7
The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground
(GSG) probes for testing. Suggested probe pitch is 400 mm (16 mils). Alternatively, the board can be mounted
in a metal housing with 2.4 mm coaxial connectors.
Evaluation Circuit Board Layout Design Details
Layout Technique
Material
Micro Strip to CPWG
Rogers 4003 with 1/2 oz. Cu
0.008” (0.20 mm)
Dielectric Thickness
Microstrip Line Width
CPWG Line Width
CPWG Line to GND Gap
Ground Via Hole Diameter
0.018” (0.46 mm)
0.016” (0.41 mm)
0.005” (0.13 mm)
0.008” (0.20 mm)
LM3 package mounted to evaluation PCB
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 423
HMC560LM3
v00.0705
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Suggested LM3 PCB Land Pattern
7
NOTES:
1. DIMENSIONS ARE IN INCHES [MILLIMETERS]
2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY.
BEYOND SOLDERING AREA ALL CONDUCTORS THAT
CARRY RF AND MICROWAVE SIGNALS SHOULD
HAVE 50 OHM CHARACTERISTIC IMPEDANCE.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 424
HMC560LM3
v00.0705
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
225
The HMC LM3 package was designed to be compatible with high
200
volume surface mount PCB assembly processes. The LM3 package
7
requires a specific mounting pattern to allow proper mechanical
attachment and to optimize electrical performance at millimeterwave
frequencies. This PCB layout pattern can be found on each LM3
product data sheet. It can also be provided as an electronic drawing
upon request from Hittite Sales & Application Engineering.
175
150
125
100
75
50
Follow these precautions to avoid permanent damage:
25
Cleanliness: Observe proper handling procedures to ensure clean
devices and PCBs. LM3 devices should remain in their original
0
1
2
3
4
5
6
7
8
TIME (min)
packaging until component placement to ensure no contamination or damage to RF, DC & ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair
of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess
pressure to the top of the lid.
Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is
not recommended. Conductive epoxy attachment is not recommended.
Solder Paste: Solder paste should be selected based on the user’s experience and be compatible with the metallization
systems used. See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application: Solder paste is generally applied to the PCB using either a stencil printer or dot placement.
The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure
consistent mechanical & electrical performance. Excess solder may create unwanted electrical parasitics at high
frequencies.
Solder Reflow: The soldering process is usually accomplished in a reflow oven but may also use a vapor phase
process. A solder reflow profile is suggested above.
Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard profile
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the
flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak
reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of
235°C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235°C.
Cleaning: A water-based flux wash may be used.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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