HFBR-5208M [HP]
Agilent HFBR/HFCT-5208M 1 x 9 Fiber Optic Transceivers for 622 Mb/s ATM/SONET/SDH Applications;
| 型号： | HFBR-5208M |
| 厂家： | 
HEWLETT-PACKARD |
| 描述： | Agilent HFBR/HFCT-5208M 1 x 9 Fiber Optic Transceivers for 622 Mb/s ATM/SONET/SDH Applications ATM 异步传输模式 电信 电信集成电路 |
| 文件： | 总21页 (文件大小：520K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
[ Obsolete product ]
Agilent has a new nam e
KeysightTechnologies.
Keysight Technologies Inc. is the world's leading electronic m easurem ent
com pany, transform ing today's m easurem ent experience through innovations in
wireless, m odular, and software solutions. W ith its HP and Agilent legacy,
Keysight delivers solutions in wireless com m unications, aerospace and defense
and sem iconductor m arkets with world-class platform s, software and
consistent m easurem ent science.
Alldatasheet.com
Agilent HFBR/HFCT-5208M 1 x 9
Fiber Optic Transceivers for 622 Mb/s
ATM/SONET/SDH Applications
Data Sheet
Features
•
Performance
HFBR-5208M:
Links of 500 m with 62.5/125 µm
multimode fiber (MMF) from
155-622 Mb/s
HFCT-5208M:
Links of 15 km with 9/125 µm
single-mode fiber (SMF)
Compliant with ATM forum
622.08 Mb/s physical layer
specification (AF-PHY-0046.000)
Compliant with ANSI broadband
ISDN - physical layer
Description
General
•
•
The HFBR-5208M (multimode
transceiver) and HFCT-5208M
(single-mode transceiver) from
Agilent allow the system designer
to implement a range of solutions
for ATM/SONET STS-12/SDH
STM-4 applications.
specification T1.646-1995 and
T1.646a-1997
•
HFBR-5208M is compliant with
ANSI network to customer
installation interfaces -
synchronous optical NETwork
(SONET) physical media
dependent specification:
multimode fiber T1.416.01-1998
HFCT-5208M is compliant to the
intermediate SONET OC12/SDH
STM(S4.1) specifications
Industry-standard multi-sourced
1 x 9 mezzanine package style
Single +5 V power supply
operation and PECL logic
interfaces
The overall Agilent transceiver
consists of three sections: the
transmitter and receiver optical
subassemblies, an electrical
subassembly and the mezzanine
package housing which
Applications
HFBR-5208M:
•
General purpose low-cost MMF
links at 155 to 650 Mb/s
•
•
ATM 622 Mb/s MMF links from
switch-to-switch or switch-to-
server in the end-user premise
Private MMF interconnections at
622 Mb/s SONET STS-12/SDH
STM-4 rate
incorporates a duplex SC
connector receptacle.
•
•
Transmitter Section
•
The transmitter section of the
HFBR-5208M consists of a 1300 nm
LED in an optical subassembly
(OSA) which mates to the multi-
mode fiber cable. The HFCT-5208M
incorporates a 1300 nm Fabry
Perot (FP) laser in the optical
subassembly. In addition, this
package has been designed to be
compliant with IEC 825 eye-safety
requirements under any single
fault condition. The OSA’s are
driven by a custom, silicon bipolar
IC which converts differential
PECL logic signals (ECL
HFCT-5208M:
•
•
ATM 622 Mb/s SMF links from
switch-to-switch or switch-to-
server in the end-user premise
Private SMF interconnections at
622 Mb/s SONET STS-12/SDH
STM-4 rate
•
•
Wave solder and aqueous wash
process compatible
Unconditionally eye safe laser IEC
825/CDRH Class 1 compliant
622 Mb/s Product Family
HFCT-5218M:
•
1300 nm laser-based transceiver
in 1 x 9 package for links of 40 km
with single-mode fiber cables
referenced to a +5 V supply) into
an analog LED/laser drive current.
-12
Receiver Section
The receiver contains an InGaAs
HFBR-5208M at a BER of 1 x 10
the receiver will require an input
,
relative input optical power varies
by <0.7 dB over this full range.
This small sensitivity variation
allows the optical budget to
remain nearly constant for designs
that make use of the broad
PIN photodiode mounted together signal approximately 0.6 dB higher
with a custom, silicon bipolar
than the -26 dBm level required for
-10
transimpedance preamplifier IC in 1 x 10 operation, i.e. -25.4 dBm.
an OSA. This OSA is mated to a
An informative graph of a typical,
custom, silicon bipolar circuit
signaling rate range of the
short fiber transceiver link per-
providing post amplification and
HFBR/HFCT-5208M. The curve
has been normalized to the input
optical power level (dBm avg.) of
the receiver for 622 MBd at center
of the Baud interval with a BER of
formance can be seen in Figure 2.
quantization and optical signal
This figure is useful for designing
detection.
short reach links with time-based
The custom, silicon bipolar circuit jitter requirements. This figure
includes a Signal Detect circuit
which provides a PECL logic high
state output upon detection of a
usable input optical signal level.
This single-ended PECL output is
indicates Relative Input Optical
Power versus Sampling Time
Position within the receiver
output data eye-opening. The
-10
10 . The data patterns that can
be used at these signaling rates
should be, on average, balanced
duty factor of 50%. Momentary
excursions of less or more data
duty factor than 50% can occur,
but the overall data pattern must
remain balanced. Unbalanced data
duty factor will cause excessive
pulse-width distortion, or worse,
bit errors. The test conditions are
listed in Figure 3.
given curves are at a constant bit-
designed to drive a standard PECL error-ratio (BER) of 10 for four
-10
input through normal 50 W PECL
load.
different signaling rates, 155 MBd,
311 MBd, 622 MBd and 650 MBd.
These curves, called “tub”
Applications Information
diagrams for their shape, show
the amount of data eye-opening
time-width for various receiver
input optical power levels. A
wider data eye-opening provides
more time for the clock recovery
circuit to operate within without
creating errors. The deeper the
tub is indicates less input optical
power is needed to operate the
receiver at the same BER
condition. Generally, the wider
and deeper the tub is the better.
The Relative Input Optical Power
amount (dB) is referenced to the
absolute level (dBm avg.) given
in the Receiver Optical
Typical BER Performance of
HFBR-5208M Receiver versus Input
Optical Power Level
The HFBR/HFCT-5208M
transceiver can be operated at
Bit-Error-Ratio conditions other
Recommended Circuit Schematic
When designing the HFBR/HFCT-
5208M circuit interface, there are
a few fundamental guidelines to
follow. For example, in the
Recommended Circuit Schematic,
Figure 4, the differential data
lines should be treated as 50 ohm
Microstrip or stripline
transmission lines. This will help
to minimize the parasitic
inductance and capacitance
effects. Proper termination of the
differential data signal will
-10
than the required BER = 1 x 10
of the 622 MBd ATM Forum
622.08 Mb/s Physical Layer
Standard and the ANSI T1.646a.
The typical trade-off of BER
versus Relative Input Optical
Power is shown in Figure 1. The
Relative Input Optical Power in
dB is referenced to the Input
Optical Power parameter value in
the Receiver Optical
Characteristics table. The 0 ns
sampling time position for this
Characteristics table. For better
BER condition than 1 x 10
more input signal is needed (+dB).
For example, to operate the
prevent reflections and ringing
-10
,
Figure 2 refers to the center of the which would compromise the
Baud interval for the particular signal fidelity and generate
signaling rate. The Baud interval is unwanted electrical noise. Locate
the reciprocal of the signaling rate termination at the received signal
in MBd. For example, at 622 MBd
the Baud interval is 1.61 ns, at
155 MBd the Baud interval is
6.45 ns. Test conditions for this
tub diagram are listed in Figure 2.
10-2
10-3
LINEAR EXTRAPOLATION OF
end of the transmission line. The
length of these lines should be
kept short and of equal length to
prevent pulse-width distortion
from occurring. For the high-speed
signal lines, differential signals
should be used, not single-ended
signals. These differential signals
need to be loaded symmetrically
to prevent unbalanced currents
from flowing which will cause
distortion in the signal.
10-4 THROUGH 10-7 DATA
10-4
ACTUAL DATA
10-5
10-6
10-7
10-8
10-9
The HFBR/HFCT-5208M receiver
input optical power requirements
vary slightly over the signaling
rate range of 20 MBd to 700 MBd
for a constant bit-error-ratio
10-10
10-11
10-12
10-13
10-14
10-15
-5
-1
1
2
-4 -3 -2
0
3
-10
(BER) of 10 condition. Figure 3
Figure 1. Relative Input Optical Power -
dBm Average.
illustrates the typical receiver
2
3
2.5
2
155.52 MBd
311.04 MBd
622.08 MBd
650.00 MBd
1.5
1
0.5
0
-0.5
-1
-3.5
-2.5
-1.5
-0.5
0.5
1.5
2.5
3.5
Clock to Data Offset Delay in nsec (0 = Data Eye Center)
Figure 2. HFBR-5208M Relative Input Optical Power as a function of sampling time position. Normalized to center of Baud interval at 622 MBd.
23
Test Conditions +25°C, 5.25 V, PRBS 2 -1, optical t /t = 0.9 ns with 3 m of 62.5 µm MMF.
r
f
2.5
2
HFBR-5208M
HFCT-5208M
1.5
1
0.5
0
-0.5
-1
-1.5
20
105
190
275
360
445
530
615
700
Module Data Stream Serial Data Rate in MBd
Figure 3. Relative Input Optical Power as a function of data rate normalized to center of Baud interval at 622 MBd.
23
Test Conditions +25°C, 5.25 V, PRBS 2 -1, optical t /t = 0.9 ns with 3 m of MMF or SMF.
r
f
3
Maintain a solid, low inductance
ground plane for returning signal
currents to the power supply.
Multilayer plane printed circuit
board is best for distribution of
MOUNTING POST
MOUNTING POST
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
V
, returning ground currents,
CC
forming transmission lines and
shielding. Also, it is important to
suppress noise from influencing
the fiber-optic transceiver per-
formance, especially the receiver
circuit. Proper power supply
HFBR/HFCT-5208M
TOP VIEW
Rx
Rx
Tx
Tx
VEER
RD
2
RD
3
SD
4
VCCR VCCT
TD
7
TD
8
VEET
filtering of V for this transceiver
CC
1
5
6
9
is accomplished by using the
recommended separate filter
circuits shown in Figure 4. These
filter circuits suppress V noise
C1
C2
CC
of 100 mV peak-to-peak or less
over a broad frequency range.
This prevents receiver sensitivity
degradation . It is recommended
that surface-mount components
be used. Use tantalum capacitors
for the 10 µF capacitors and
monolithic, ceramic bypass
capacitors for the 0.1 µF
VCC
R2
R3
C5
L1
L2
C7
TERMINATION
AT PHY
DEVICE
INPUTS
R1
R4
VCC
C3
V
C4
CC FILTER
AT VCC PINS
TRANSCEIVER
R9
R5
R7
TERMINATION
AT TRANSCEIVER
INPUTS
C6
R6
R8
R10
capacitors. Also, it is
recommended that a surface-
mount coil inductor of 1 µH be
used. Ferrite beads can be used to
replace the coil inductors
RD
RD
SD
VCC
TD
TD
when using quieter V supplies,
CC
NOTES:
but a coil inductor is recom-
mended over a ferrite bead to
provide low-frequency noise
filtering as well. Coils with a low,
series dc resistance (<0.7 ohms)
and high, self-resonating
frequency are recommended. All
power supply components need to
be placed physically next to the
THE SPLIT-LOAD TERMINATIONS FOR PECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE PECL SIGNALS. RECOMMEND MULTI-LAYER PRINTED
CIRCUIT BOARD WITH 50 OHM MICROSTRIP OR STRIPLINE SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = C7 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR (see text comments).
Figure 4. Recommended Circuit Schematic for dc Coupling (at +5 V) between Optical
Transceiver and Physical Layer IC
V
pins of the receiver and
CC
transmitter. Use a good, uniform
ground plane with a minimum
number of holes to provide a low-
inductance ground current return
path for the signal and power
supply currents.
either connect these front posts to In addition to these recommenda-
chassis ground or allow them to
remain unconnected. These front
posts should not be connected to
signal ground.
tions, Agilent’s Application
Although the front mounting posts
make contact with the metallized
housing, these posts should not be
relied upon to provide adequate
Engineering staff is available for
consulting on best layout practices
with various vendors’ serializer/
deserializer, clock recovery/
generation integrated circuits.
electrical connection to the plated Figure 5 shows the recommended
housing. It is recommended to
board layout pattern.
4
2 x Ø 1.9 0.1
(0.075 0.004)
Reference Design
20.32
(0.800)
Agilent has developed a reference
design for multimode and single-
mode OC-12 ATM-SONET/SDH
applications shown in Figure 6.
This reference design uses a
Vitesse Semiconductor Inc.’s
VSC8117 clock recovery/clock
generation/serializer/deserializer
integrated circuit and a PMC-
Sierra Inc. PM5355 framer IC.
Application Note 1178 documents
the design, layout, testing and
performance of this reference
design. Gerber files, schematic
and application note are available
from the Agilent Fiber-Optics
Components’ web site at the URL
of http://www.semiconductor.
agilent.com.
9 x Ø 0.8 0.1
(0.032 0.004)
20.32
(0.800)
2.54
(0.100)
TOP VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Figure 5. Recommended Board Layout Pattern
Operation in -5.2 V Designs
For applications that require
-5.2 V dc power supply level for
true ECL logic circuits, the
HFBR/HFCT-5208M transceiver
can be operated with a V = 0 V
CC
dc and a V = -5.2 V dc. This
EE
transceiver is not specified with
an operating, negative power
supply voltage. The potential
compromises that can occur with
use of -5.2 V dc power are that the
absolute voltage states for V
OH
and V will be changed slightly
OL
due to the 0.2 V difference in
supply levels. Also, noise
immunity may be compromised
for the HFBR/HFCT-5208M trans-
ceiver because the ground plane is
Figure 6. 622.08 Mb/s OC-12 ATM-SONET/SDH Reference Design Board
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
EMI shielding for providing the
now the V supply point. The
CC
designer with a means to achieve
good EMI performance. The EMI
performance of an enclosure
using these transceivers is
suggested power supply filter
circuit shown in the Recommended
Circuit Schematic figure should be
located in the V paths at the
EE
Success in controlling generated
Electromagnetic Interference
dependent on the chassis design.
Agilent encourages using standard
transceiver supply pins. Direct
coupling of the differential data
signal can be done between the
HFBR-5208M transceiver and the
standard ECL circuits. For
guaranteed -5.2 V dc operation,
contact your local Agilent
(EMI) enables the designer to pass RF suppression practices and
a governmental agency’s EMI
regulatory standard; and more
importantly, it reduces the
possibility of interference to
neighboring equipment. There are
three options available for the
HFBR/HFCT-5208M with regard to
avoiding poorly EMI-sealed
enclosures. In addition, Agilent
advises that for the best EMI
performance, the metalized case
must be connected to chassis
ground using one of the shield
options.
Component Field Sales Engineer
for assistance.
5
An un-shielded option, shown in
Figure 7 is available for the
HFBR/HFCT-5208M fiber optic
transceiver. This unit is intended
for applications where EMI is
either not an issue for the
will extend outside the equipment
enclosure. The metallized plastic
package and integral external
metal shield of the transceiver
helps locally to terminate EM
fields to the chassis to prevent
their emissions outside the
connection to the panel. This
option can accommodate various
panel or enclosure thicknesses,
i.e. 1.02 mm (.04 in) min to 2.54 mm
(0.1 in) max. The reference plane
for this panel thickness variation is
from the front surface of the panel
or enclosure. The recommended
designer, or the unit resides in a
highly-shielded enclosure.
enclosure. This metal shield
contacts the panel or enclosure on length for protruding the
The first shielded option, option
EM, is for applications where the
position of the transceiver module
the inside of the aperture on all
but the bottom side of the shield
and provides a good RF
HFBR/HFCT-5208EM transceiver
beyond the front surface of the
panel or enclosure is 6.35 mm
XXXX-XXXX
KEY:
Agilent
ZZZZZ LASER PROD
YYWW = DATE CODE
21CFR(J) CLASS 1
N.B. For shielded
module the label
is mounted on
the end as
XXXX-XXXX = HFBR-5208M or HFCT-5208M
ZZZZ = 1300 nm
COUNTRY OF ORIGIN YYWW
RX
TX
39.6
(1.56)
12.7
(0.50)
MAX.
shown.
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4
(1.00)
12.7
(0.50)
MAX.
2.0 0.1
(0.079 0.004)
SLOT WIDTH
2.5
(0.10)
SLOT DEPTH
+0.1
0.25
-0.05
+0.004
-0.002
(0.010
)
9.8
(0.386)
MAX.
0.51
(0.020)
3.3 0.38
(0.130 0.015)
20.32
(0.800)
15.8 0.15
(0.622 0.006)
+0.25
-0.05
0.46
+0.25
-0.05
+0.010
-0.002
9X Ø
+0.010
-0.002
1.27
(0.018
)
2X Ø
(
0.050
)
8X
20.32
(0.800)
23.8
(0.937)
2.54
(0.100)
20.32
(0.800)
14.5
(0.57)
1.3
(0.051)
2X Ø
Masked insulator material (no metalization)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX 0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X
0.05 mm
Figure 7. Package Outline Drawing for HFBR/HFCT-5208M
6
(0.25 in) . With this option, there
is flexibility of positioning the
module to fit the specific need of
the enclosure design. (See Figure 8 compatible with industry-standard
for the mechanical drawing
dimensions of this shield.)
Recommended Solder and Wash
Process
The HFBR/HFCT-5208M is
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with the
various regulations governing
certification of Information
Technology Equipment. See the
Regulatory Compliance Table
for details. Additional information
is available from your Agilent
sales representative.
wave or hand solder processes.
HFBR-5000 Process Plug
The HFBR/HFCT-5208M
The second shielded option,
option FM, is for applications that transceiver is supplied with a
are designed to have a flush
mounting of the module with
respect to the front of the panel or with the Duplex SC connector
enclosure. The flush-mount design receptacle. This process plug
process plug, the HFBR-5000, for
protection of the optical ports
accommodates a large variety of
panel thickness, i.e. 1.02 mm
(.04 in) min to 2.54 mm (0.1 in)
max. Note the reference plane for
the flush-mount design is the
interior side of the panel or
enclosure. The recommended
distance from the centerline of the 110 lb/in .
transceiver front solder posts to
the inside wall of the panel is
13.82 mm (0.544 in) . This option
contacts the inside panel or
enclosure wall on all four sides of
this metal shield. (See Figure 10
for the mechanical drawing
dimensions of this shield.)
prevents contamination during
wave solder and aqueous rinse as
well as during handling, shipping
or storage. It is made of high-
temperature, molded, sealing
material that will withstand
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage is
important.
The first case is during handling of
the transceiver prior to mounting it
on the circuit board. It is important
to use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas, etc.
+85°C and a rinse pressure of
2
Recommended Solder Fluxes and
Cleaning/Degreasing Chemicals
Solder fluxes used with the
HFBR/HFCT-5208M fiber-optic
transceiver should be water-
soluble, organic solder fluxes.
Some recommended solder fluxes
are Lonco 3355-11 from London
Chemical West, Inc. of Burbank,
CA, and 100 Flux from Alpha-
metals of Jersey City, NJ or
equivalent fluxes from other
companies.
The second case to consider is
static discharges to the exterior of
the equipment chassis containing
the transceiver parts. To the
extent that the duplex SC
connector receptacle is exposed
to the outside of the equipment
chassis, it may be subject to
whatever ESD system level test
criteria that the equipment is
intended to meet.
Both shielded design options
connect only to the equipment
chassis and not to the signal or
logic ground of the circuit board
within the equipment closure. The
front panel aperture dimensions
are recommended in Figures 9
Recommended cleaning and
and 11. When layout of the printed degreasing chemicals for the
circuit board is done to
HFBR/HFCT-5208M are alcohols
(methyl, isopropyl, isobutyl),
aliphatics (hexane, heptane) and
other chemicals, such as soap
solution or naphtha. Do not use
partially halogenated
incorporate these metal-shielded
transceivers, keep the area on the
printed circuit board directly
under the external metal shield
free of any components and
circuit board traces. For
additional EMI performance
advantage, use duplex SC fiber-
optic connectors that have low
metal content inside the
connector. This lowers the ability
of the metal fiber-optic
connectors to couple EMI out
through the aperture of the panel
or enclosure.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan.
hydrocarbons for cleaning/
degreasing. Examples of
chemicals to avoid are 1,1.1
trichloroethane, ketones (such as
MEK), acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride or
N methylpyrolldone.
The HFBR/HFCT-5208M EMI has
been characterized with a chassis
enclosure to demonstrate the
robustness of the parts.
Performance of a system
containing these transceivers will
vary depending on the individual
chassis design.
7
Immunity
Eye Safety
Equipment utilizing these
HFBR/HFCT-5208M transceivers
will be subject to radio-frequency
electromagnetic fields in some
The HFCT-5208M transceiver is
classified as AEL Class I (U.S. 21
CFR(J) and AEL Class 1 per
EN 60825-1 (+A11). It is eye safe
environments. These transceivers, when used within the data sheet
with their integral shields, have
been characterized without the
benefit of a normal equipment
chassis enclosure and the results
are reported below. Performance
of a system containing these
transceivers within a well-
limits per CDRH. It is also eye
safe under normal operating
conditions and under all
reasonably foreseeable single
fault conditions per EN60825-1.
Agilent has tested the transceiver
design for compliance with the
designed chassis is expected to be requirements listed below under
better than the results of these
tests without a chassis enclosure.
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to this
transceiver for laser eye safety and
use in EN 60950 and EN 60825-2
applications.
Regulatory Compliance - Targeted Specifications
Feature Test Method
Electrostatic Discharge MIL-STD-883C
Performance
Min 2000 V
(ESD)
Method 3015.4
Machine Model
JEDEC
Min 100 V
JESD22-A115-A
RAD
IEC-61000-4-2
Products of this design typically withstand 25 kV without
damage.
Electromagnetic
Interference (EMI)
FCC Class B
Margins are dependant on customer board and chassis design.
It is recommended that the flush mount shield design
(HFBR/HFCT-5208FM) be used for best EMI margin against
FCC Class B.
CENELEC EN55022
Class B (CISPR 22B)
VCCI Class 2
Immunity
Variation of IEC 801-3
Typically show no measurable effect from a 10 V/m field swept
from 26 to 1000 MHz applied to the transceiver when mounted to
a circuit card without a chassis enclosure.
Eye Safety
IEC 825/CDRH Class 1
CDRH Accession Numbers:
HFCT-5208xx
9521220 - 22
TUV Bauart License:
HFCT-5208xx
933/510906/01
The HFBR-5208M LED and the HFCT-5208M Laser transmitters are classified as IEC 825-1 Accessible Emission Limit
(AEL) Class 1. AEL Class 1 LED/Laser devices are considered eye safe.
8
1 = VEER
2 = RD
3 = RD
4 = SD
5 = VCCR
6 = VCCT
7 = TD
8 = TD
9 = VEET
N/C
TOP VIEW
N/C
N/C = NO INTERNAL CONNECTION
(MOUNTING POSTS) - CONNECT
TO CHASSIS GROUND OR LEAVE
FLOATING, DO NOT CONNECT TO
SIGNAL GROUND.
Table 1. Pinout Table
Pin Symbol
Mounting Studs
Functional Description
The mounting studs are provided for transceiver mechanical attachment to the circuit boards,
they are embedded in the metalized plastic housing and are not connected to the transceiver
internal circuit. They should be soldered into plated-through holes on the printed circuit board
and not connected to signal ground.
1
2
3
4
VEER
RD+
RD-
SD
Receiver Signal Ground
Directly connect this pin to receiver signal ground plane. Receiver VEER and transmitter VEET
can connect to a common circuit board ground plane.
Receiver Data Out
Terminate this high-speed, differential, PECL output with standard PECL techniques at the
follow-on device input pin.
Receiver Data Out Bar
Terminate this high-speed, differential, PECL output with standard PECL techniques at the
follow-on device input pin.
Signal Detect
Normal input optical signal levels to the receiver result in a logic "1" output (VOH).
Low input optical signal levels to the receiver result in a fault condition indication shown by a
logic "0" output (VOL).
If Signal Detect output is not used, leave it open-circuited.
This Signal Detect output can be used to drive a PECL input on an upstream circuit, such as,
Signal Detect input or Loss of Signal-bar.
5
6
7
8
9
VCCR
VCCT
TD-
TD+
VEET
Receiver Power Supply
Provide +5 V dc via the recommended receiver VCCR power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCR pin.
Transmitter Power Supply
Provide +5 V dc via the recommended transmitter VCCT power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCT pin.
Transmitter Data In Bar
Terminate this high-speed, differential, Transmitter Data input with standard PECL techniques
at the transmitter input pin.
Transmitter Data In
Terminate this high-speed, differential, Transmitter Data input with standard PECL techniques
at the transmitter input pin.
Transmitter Signal Ground
Directly connect this pin to the transmitter signal ground plane. Transmitter VEET and receiver
VEER can connect to a common circuit board ground plane.
9
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each
parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be
assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute
maximum ratings for extended periods can adversely affect device reliability.
Parameter
Symbol Minimum
Typical
Maximum Unit
Notes
Storage Temperature
TS
-40
+85
+260
+260
10
6.0
VCC
°C
°C
°C
sec.
V
Lead Soldering Temperature - HFBR-5208M
Lead Soldering Temperature - HFCT-5208M
Lead Soldering Time
Supply Voltage
Data Input Voltage
TSOLD
TSOLD
tSOLD
VCC
VI
-0.5
-0.5
V
Transmitter Differential Input Voltage
VD
1.6
V
1
Output Current
Relative Humidity
ID
RH
50
95
mA
%
0
Recommended Operating Conditions
Parameter
Symbol Minimum
Typical
Maximum Unit
Notes
Ambient Operating Temperature
HFBR-5208xM, HFCT-5208xM
Ambient Operating Temperature
HFBR-5208AxM , HFCT-5208AxM
Supply Voltage
TA
0
+70
+85
5.25
°C
°C
V
2
TA
-40
4.75
2
VCC
Power Supply Rejection
PSR
VIL-VCC
VIH-VCC
VD
100
mV p-p 3
Transmitter Data Input Voltage - Low
Transmitter Data Input Voltage - High
Transmitter Differential Input Voltage
-1.810
-1.165
0.3
-1.475
-0.880
1.6
V
V
V
4
4
Data Output Load
Signal Detect Output Load
Notes:
RDL
RSDL
50
50
5
5
1. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs without damaging the ESD protection circuit.
-1
2. 2 ms air flow required (for HFCT -5208xxM only).
3. Tested with a 100 mV p-p sinusoidal signal in the frequency range from 500 Hz to 1 MHz imposed on the V supply with the recommended
CC
power supply filter in place, see Figure 4. Typically less than a 0.5 dB change in sensitivity is experienced.
4. Compatible with 10K, 10KH and 100K ECL and PECL output signals.
5. The outputs are terminated to V - 2 V.
CC
10
HFBR-5208M Family, 1300 nm LED
Transmitter Electrical Characteristics
(T = 0°C to +70°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V)
A
CC
(T = -40°C to +85°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
A
CC
Parameter
Symbol Minimum
Typical
155
0.75
Maximum Unit
Notes
Supply Current
Power Dissipation
ICCT
PDIST
200
mA
W
1
1.05
Data Input Current - Low
Data Input Current -High
IIL
IIH
-350
µA
µA
350
Receiver Electrical Characteristics
(T = 0°C to +70°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V)
A
CC
(T = -40°C to +85°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
A
CC
Parameter
Supply Current
Power Dissipation
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Reaction Time
(Off to On)
Symbol Minimum
ICCR
PDISR
VOL - VCC -1.950
VOH - VCC -1.045
Typical
112
0.37
-1.82
-0.94
0.3
Maximum Unit
Notes
177
0.77
-1.620
-0.740
0.51
mA
W
V
2
3
3
4
4
3
3
5
V
tR
tF
0.2
0.2
ns
ns
V
0.3
0.51
VOL - VCC -1.950
VOH - VCC -1.045
tSDA
-1.82
-0.94
35
-1.620
-0.740
100
V
µs
Signal Detect Deassert Reaction Time
(On to Off)
tSDD
60
350
µs
6
Notes:
1. The I value is held nearly constant to minimize unwanted electrical noise from being generated and conducted or emitted to
CC
neighboring circuitry.
2. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of V and I minus the sum
CC
CC
of the products of the output voltages and load currents.
3. These outputs are compatible with 10K, 10KH and 100K ECL and PECL inputs.
4. These are 20% - 80% values.
5. The Signal Detect output will change from logic “V ” to “V ” within 100 µs of a step transition in input optical power from no light to -26 dBm.
OL
OH
6. The Signal Detect output will change from logic “V ” to “V ” within 350 µs of a step transition in input optical power from -26 dBm to no light.
OH
OL
11
HFBR-5208M Family, 1300 nm LED
Transmitter Optical Characteristics
(T = 0°C to +70°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V)
A
CC
(T = -40°C to +85°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
A
CC
Parameter
Symbol
Minimum Typical Maximum Unit
Notes
Output Optical Power
62.5/125 µm. NA = 0.275 fiber
PO (BOL)
PO (EOL)
-19.5
-20
-17
-14
-14
dBm avg.
Output Optical Power
50/125 µm. NA = 0.20 fiber
PO (BOL)
PO (EOL)
-21.5
-22
-14
-14
dBm avg. 7
Output Optical Power at Logic "0" State
Optical Extinction Ratio
Center Wavelength
Spectral Width - FWHM
Optical Rise Time
PO ("0")
ER
c
-60
46
dBm avg.
dB
nm
nm
ns
10
1270
1330
136
0.7
0.9
0
1380
200
1.25
1.25
25
8
9
9
tR
tF
Optical Fall Time
Overshoot
ns
%
Systematic Jitter Contributed by the Transmitter
Random Jitter Contributed by the Transmitter
Notes:
SJ
RJ
0.04
0.0
0.23
0.10
ns p-p
ns p-p
7. The Output Optical Power is measured with the following conditions:
•
•
•
1 meter of fiber with cladding modes removed.
The input electrical signal is a 12.5 MHz square wave.
The Beginning of Life (BOL) to End of Life (EOL) degradation is less than 0.5 dB.
8. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian-shaped spectrum
which results in RMS = FWHM/2.35.
9. These are 10-90% values.
12
HFBR-5208M Family, 1300 nm LED
Receiver Optical Characteristics
(T = 0°C to +70°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V)
A
CC
(T = -40°C to +85°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
A
CC
Parameter
Symbol
Minimum Typical Maximum Unit
Notes
dBm avg. 10
Fig 2
dBm avg. 10
Fig 2,3
dBm avg. 10
Minimum Input Optical Power at window edge
PIN MIN (W)
PIN MIN (C)
PIN MAX
-29.0
-30.5
-11
-26
Minimum Input Optical Power at eye center
Input Optical Power Maximum
Input Operating Wavelength
Systematic Jitter Contributed by the Receiver
Random Jitter Contributed by the Receiver
Signal Detect - Asserted
-14
1270
1380
0.30
0.48
-28
nm
SJ
RJ
PA
PD
0.1
0.25
ns p-p
ns p-p
dBm avg.
dBm avg.
dB
PD +1.0 dB -30.5
-45
1.0
Signal Detect - Deasserted
Signal Detect - Hysteresis
-33.7
3.2
PA - PD
5
Notes:
10. This specification is intended to indicate the performance of the receiver section of the transceiver when the input power ranges from the
minimum level (with a window time-width) to the maximum level. Over this range the receiver is guaranteed to provide output data with a
-10
Bit Error Ratio (BER) better than or equal to 1 x 10
•
•
•
At the Beginning of Life (BOL)
Over the specified operating temperature and voltage ranges
23
Input is at 622.08 Mbd, 2 -1 PRBS data pattern with 72 “1”s and 72 “0”s inserted per the CCITT (now ITU-T) recommendation G.958
Appendix 1.
•
Receiver worst-case output data eye-opening (window time-width) is measured by applying worst-case input systematic (SJ) and random
jitter (RJ). The worst-case maximum input SJ = 0.5 ns peak-to-peak and the RJ = 0.15 ns peak-to-peak per ANSI T1.646a standard. Since
the input (transmitter) random jitter contribution is very small and difficult to produce exactly, only the maximum systematic jitter is
produced and used for testing the receiver. The corresponding receiver test window time-width must meet the requirement of 0.31 ns or
larger. This worst-case test window time-width results from the following jitter equation:
Minimum Test Window Time-Width = Baud Interval - Tx SJ max. - Rx SJ max. - Rx RJ max.
Respectively, Minimum Test Window Time-Width = 1.608 ns - 0.50 ns - 0.30 ns - 0.48 ns = 0.328 ns.
This is a test method that is within practical test error of the worst-case 0.31 ns limit.
•
•
Input optical rise and fall times (10% - 90%) are 0.7 ns and 0.9 ns respectively.
Transmitter operating with a 622.08 MBd, 311.04 MHz square wave input signal to simulate any cross talk present between the transmitter
and receiver sections of the transceiver.
13
HFCT-5208M Family, 1300 nm FP Laser
Transmitter Electrical Characteristics
(T = 0°C to +70°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V)
A
CC
(T = -40°C to +85°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
A
CC
Typical
47
0.235
Parameter
Supply Current
Power Dissipation
Data Input Current - Low
Data Input Current -High
Symbol
ICCT
PDIST
IIL
Minimum
Maximum Unit
Notes
1
140
0.75
mA
W
-350
µA
µA
IIH
350
Receiver Electrical Characteristics
(T = 0°C to +70°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V)
A
CC
(T = -40°C to +85°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
A
CC
Typical
130
0.65
Parameter
Supply Current
Power Dissipation
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Reaction Time
(Off to On)
Symbol
ICCR
PDISR
VOL - VCC
VOH - VCC
tR
Minimum
Maximum Unit
Notes
1, 2
150
mA
W
V
0.787
-1.620
-0.740
-1.950
-1.045
3
3
4
4
3
3
5
V
0.5
0.5
ns
ns
V
V
µs
tF
VOL - VCC
VOH - VCC
tSDA
-1.950
-1.045
-1.620
-0.740
100
25
Signal Detect Deassert Reaction Time
(On to Off)
tSDD
80
100
µs
6
Notes:
1. The power supply current varies with temperature. Maximum current is specified at V = Maximum @ maximum temperature
CC
(not including termination currents) and end of life.
2. The current excludes the output load current.
3. These outputs are compatible with 10K, 10KH and 100K ECL and PECL inputs.
4. These are 20% - 80% values.
5. The Signal Detect output will change from logic “V ” to “V ” within 100 µs of a step transition in input optical power from no light to -28 dBm.
OL
OH
6. The Signal Detect output will change from logic “V ” to “V ” within 100 µs of a step transition in input optical power from -28 dBM to no light.
OH
OL
14
HFCT-5208M Family, 1300 nm FP Laser
Transmitter Optical Characteristics
(T = 0°C to +70°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V)
A
CC
(T = -40°C to +85°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
A
CC
Parameter
Symbol
Minimum Typical Maximum Unit
Notes
Output Optical Power
Optical Extinction Ratio
Center Wavelength
Spectral Width - (RMS)
Output Optical Eye Opening
PO
ER
c
-15
8.2
1274
-11
-8
dBm avg. 7
13.8
1313
1.1
dB
nm
nm
1356
2.5
Compliant with Bellcore TR-NWT-000253 and ITU-T
recommendation G.957.
Receiver Optical Characteristics
(T = 0°C to +70°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V)
A
CC
(T = -40°C to +85°C, V = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
A
CC
Parameter
Symbol
Minimum Typical Maximum Unit
Notes
Minimum Input Optical Power
Maximum Input Optical Power
Signal Detect - Asserted
P
P
PA
IN MIN
-32
-28
dBm
dBm
dBm
dB
8
8
IN MAX
-7
-42
0.5
-39
1.2
-31
4.0
Signal Detect - Hysteresis
PA - PD
9,10
Notes:
7. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
23
8. Minimum sensitivity and saturation levels for 2 -1 PRBS with 72 ones and 72 zeros inserted. (ITU-T recommendation G.958).
-10
Sensitivity is measured for a BER of 10 at center of Baud interval with the transmitter powered up to test for crosstalk between the
transmitter and receiver sections of the transceiver.
9. The Bit Error Rate (BER) measurements are not performed but a high to low transition in SD typically occurs at a receiver BER of 10 or
-6
worse.
10. For HFCT-5208Axx (extended temperature) Signal Detect - Hysteresis: 0.3 dB minimum.
15
KEY:
XXXX-XXXX
Agilent
YYWW = DATE CODE
FOR MULTIMODE MODULES:
XXXX-XXXX = HFBR-5208EM
ZZZZ = 1300 nm
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
TX
RX
29.6
(1.16)
FOR SINGLEMODE MODULES:
XXXX-XXXX = HFCT-5208EM
ZZZZ = 1300 nm
UNCOMPRESSED
39.6
(1.56)
12.7
(0.50)
4.7
(0.185)
MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
25.4 MAX.
(1.00)
12.7
(0.50)
18.1
(0.711)
2.0 0.1
(0.079 0.004)
SLOT WIDTH
20.5
(0.805)
3.3
+0.1
-0.05
+0.004
-0.002
(0.13)
2.09
(0.08)
0.25
10.2
(0.40)
UNCOMPRESSED
MAX.
(
0.010
)
9.8 MAX.
(0.386)
1.3
(0.05)
3.3 0.38
(0.130 0.015)
5.9
(0.23)
20.32
(0.800)
15.8 0.15
(0.622 0.006)
+0.25
-0.05
+0.010
-0.002
+0.25
-0.05
+0.010
-0.002
0.46
9X Ø
1.27
)
(
0.018
2X Ø
(
0.050
)
8X
20.32
(0.800)
23.8
(0.937)
2.54
(0.100)
20.32
(0.800)
14.5
(0.57)
13.6
(0.54)
1.3
(0.051)
2X Ø
Masked insulator material (no metalization)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX 0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X
0.05 mm
Figure 8. Package Outline for HFBR/HFCT-5208EM
16
0.8
(0.032)
2X
0.8
(0.032)
2X
+0.5
10.9
-0.25
+0.02
-0.01
)
0.43
)
9.4
(0.37)
27.4 0.50
(1.08 0.02)
6.35
(0.25)
MODULE
PROTRUSION
3.5
(0.14)
PCB BOTTOM VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX 0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X
0.05 mm
Figure 9. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-5208EM
17
KEY:
XXXX-XXXX
Agilent
YYWW = DATE CODE
FOR MULTIMODE MODULES:
XXXX-XXXX = HFBR-5208FM
ZZZZ = 1300 nm
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
TX
RX
FOR SINGLEMODE MODULES:
XXXX-XXXX = HFCT-5208FM
ZZZZ = 1300 nm
39.6
(1.56)
12.7
(0.50)
MAX.
1.01
4.7
(0.185)
(0.04)
AREA
RESERVED
FOR
PROCESS
PLUG
12.7
(0.50)
25.4
(1.00)
MAX.
29.7
(1.17)
2.0 0.1
SLOT WIDTH
(0.079 0.004)
25.8
(1.02)
MAX.
+0.1
2.2
(0.09)
-0.05
+0.004
-0.002
SLOT DEPTH
0.25
10.2
(0.40)
(
0.010
)
MAX.
14.4
(0.57)
MAX.
(0.386)
9.8
3.3 0.38
(0.130 0.015)
22.0
(0.87)
20.32
(0.800)
15.8 0.15
(0.622 0.006)
+0.25
-0.05
+0.010
-0.002
0.46
+0.25
-0.05
+0.010
9X Ø
1.27
)
(
0.018
2X Ø
(
0.050
)
-0.002
AREA
RESERVED
8X
20.32
(0.800)
20.32
(0.800)
23.8
(0.937)
2.54
(0.100)
FOR
PROCESS
PLUG
14.5
(0.57)
1.3
(0.051)
2X Ø
Masked insulator material (no metalization)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX 0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X
0.05 mm
Figure 10. Package Outline for HFBR/HFCT-5208FM
18
DIMENSION SHOWN FOR MOUNTING MODULE
FLUSH TO PANEL. THICKER PANEL WILL
RECESS MODULE. THINNER PANEL WILL
PROTRUDE MODULE.
1.98
(0.078)
1.27
(0.05)
SEPTUM
30.2
(1.19)
KEEP OUT ZONE
0.36
(0.014)
10.82
(0.426)
14.73
(0.58)
1.82
(0.072)
26.4
(1.04)
13.82
(0.544)
BOTTOM SIDE OF PCB
12.0
(0.47)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX 0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X
0.05 mm
Figure 11. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-5208FM
19
Ordering Information
1300 nm LED (temperature range 0°C to +70°C)
HFBR-5208M
HFBR-5208EM
HFBR-5208FM
No shield, metallized housing.
Extended/protruding shield, metallized housing.
Flush shield, metallized housing.
1300 nm LED (temperature range -40°C to +85°C)
HFBR-5208AM
HFBR-5208AEM
HFBR-5208AFM
No shield, metallized housing.
Extended/protruding shield, metallized housing.
Flush shield, metallized housing.
1300 nm FP Laser (temperature range 0°C to +70°C)
HFCT-5208M
HFCT-5208EM
HFCT-5208FM
No shield, metallized housing.
Extended/protruding shield, metallized housing.
Flush shield, metallized housing.
1300 nm FP Laser (temperature range -40°C to +85°C)
HFCT-5208AM
HFCT-5208AEM
HFCT-5208AFM
No shield, metallized housing.
Extended/protruding shield, metallized housing.
Flush shield, metallized housing.
Supporting Documentation
HFBR-5208M/HFCT-5208M
Application Note
HFBR-5208xx/HFCT-5208xx (0°C to +70°C)
HFBR-5208Axx (-40°C to +85°C)
HFCT-5208Axx (-40°C to +85°C)
HFCT-5208M/HFCT-5218M
Characterization Report
Characterization Report
Characterization Report
Qualification Report
HFBR-5208M
Qualification Report
HFBR-5208M/HFCT-5208M/HFCT-5218M
Reference Design Application Note 1178
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2001 Agilent Technologies, Inc.
Obsoletes: 5988-2479EN
May 9, 2001
5988-2916EN
相关型号：
HFBR-5208XX
Agilent HFBR/HFCT-5208M 1 x 9 Fiber Optic Transceivers for 622 Mb/s ATM/SONET/SDH Applications
AGILENT
HFBR-53A3VEMZ
Transceiver, 830nm Min, 860nm Max, SC Connector, Through Hole Mount, ROHS COMPLIANT PACKAGE
FOXCONN
©2020 ICPDF网 联系我们和版权申明