HY1606U [HUAYI]

N-Channel Enhancement Mode MOSFET;
HY1606U
型号: HY1606U
厂家: HUAYI MICROELECTRONICS CO.,LTD.    HUAYI MICROELECTRONICS CO.,LTD.
描述:

N-Channel Enhancement Mode MOSFET

文件: 总12页 (文件大小:963K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HY1606D/U/V  
N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
60V/66A,  
R
DS(ON)=10.4m(typ.) @ VGS=10V  
Avalanche Rated  
Reliable and Rugged  
S
D
S
Lead Free and GreenDevicesAvailable  
(RoHS Compliant)  
G
D
G
S
D
G
TO-251-3L  
TO-251-3L  
TO-252-2L  
Applications  
Power Management for Inverter Systems.  
N-ChannelMOSFET  
Ordering and Marking Information  
Package Code  
D : TO-252-2L  
V : TO-251-3S  
U : TO-251-3L  
D
U
V
HY1606  
HY1606  
HY1606  
Assembly Material  
G : Lead Free Device  
Date Code  
YYXXX WW  
YYXXXJWW G YYXXXJWW G YYXXXJWW G  
Note: HUAYI lead -free products contain molding compounds/die attach materials and 100% matte tin plate  
Termination finish;which are fully compliant with RoHS. HUAYI lead -free products meet or exceed the lead-  
Free requirements of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature.  
HUAYI defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed  
900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
HUAYI reserves the right to make changes, corrections, enhancements, modifications, and improvements to  
this pr-oduct and/or to this document at any time without notice.  
www.hymexa.com  
V1.1  
1
HY1606D/U/V  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings (TC=25°C Unless Otherwise Noted)  
VDSS  
VGSS  
TJ  
Drain-Source Voltage  
60  
±25  
V
Gate-Source Voltage  
Maximum Junction Temperature  
Storage Temperature Range  
Diode Continuous Forward Current  
175  
°C  
°C  
A
TSTG  
IS  
-55 to 175  
66  
TC=25°C  
Mounted on Large Heat Sink  
IDM  
TC=25°C  
TC=25°C  
TC=100°C  
TC=25°C  
TC=100°C  
250**  
66  
A
A
Pulsed Drain Current *  
ID  
Continuous Drain Current  
45  
64  
PD  
Maximum Power Dissipation  
W
32  
Thermal Resistance-Junction to Case  
Thermal Resistance-Junction to Ambient  
Drain-Source Avalanche Energy  
2.35  
110  
200***  
°C/W  
°C/W  
mJ  
RJC  
RJA  
EAS  
L=0.5mH  
Note  
*
Repetitive rating ; pulse width limiited by junction temperature  
** Drain current is limited by junction temperature  
*** VD=48V  
Electrical Characteristics (TC = 25C Unless Otherwise Noted)  
HY1606  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Static Characteristics  
BVDSS Drain-Source Breakdown Voltage  
60  
-
-
-
-
1
V
VGS=0V, IDS=250A  
VDS=60V, VGS=0V  
IDSS Zero Gate Voltage Drain Current  
A  
TJ=85°C  
-
-
10  
4
VGS(th) Gate Threshold Voltage  
IGSS Gate Leakage Current  
2
-
3
-
V
VDS=VGS, IDS=250A  
VGS=±25V, VDS=0V  
±100  
nA  
m  
*
RDS(ON) Drain-Source On-state Resistance VGS=10V, IDS=33A  
-
10.4 12.5  
Diode Characteristics  
*
VSD  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
ISD=33A, VGS=0V  
-
-
-
0.8  
33  
61  
1.2  
V
trr  
-
-
ns  
nC  
ISD=33A, dlSD/dt=100A/s  
Qrr  
www.hymexa.com  
V1.1  
2
HY1606D/U/V  
Electrical Characteristics (Cont.) (TC = 25C Unless Otherwise Noted)  
HY1606  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Dynamic Characteristics  
RG  
Ciss  
Coss  
Crss  
Gate Resistance  
VGS=0V,VDS=0V,F=1MHz  
-
-
-
-
-
-
-
-
0.9  
2040  
760  
370  
14  
-
-
-
-
-
-
-
-
Input Capacitance  
VGS=0V,  
VDS=25V,  
Frequency=1.0MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
td(ON) Turn-on Delay Time  
Tr Turn-on Rise Time  
td(OFF) Turn-off Delay Time  
Tf Turn-off Fall Time  
Gate Charge Characteristics  
V =30V, R = ,  
5
DD  
G
13  
I
DS=33A, V =10V,  
ns  
GS  
20  
7
Qg  
Qgs  
Qgd  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
-
-
-
51  
11  
17  
-
-
-
VDS=48V, VGS=10V,  
IDS=33A  
nC  
Note * : Pulse test ; pulse width 300s, duty cycle2%.  
.
www.hymexa.com  
V1.1  
3
HY1606D/U/V  
Typical Operating Characteristics  
Power Dissipation  
Drain Current  
105  
90  
75  
60  
45  
30  
15  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
TC=25oC  
0
TC=25oC,VG=10V  
0
20 40 60 80 100 120 140 160 180 200  
0
20 40 60 80 100 120 140 160 180 200  
Tc -  
Temperature (°C)  
Tc-Case Temperature (°C)  
Case  
Safe Operation Area  
500  
100  
10us  
100us  
1ms  
Rds(on) Limit  
10  
1
10ms  
DC  
TC=25OC  
0.1  
0.1  
1
10  
100  
500  
VDS - Drain - Source Voltage (V)  
Thermal Transient Impedance  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = Pdm x Zthjc + Tc  
0.1  
0.02  
0.01  
Pdm  
0.01  
t1  
t2  
SINGLE PULSE  
( THERMAL RESPONSE )  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
Maximum Effective Transient Thermal Impedance, Junction-to-Case  
www.hymexa.com  
V1.1  
4
HY1606D/U/V  
Typical Operating Characteristics (Cont.)  
Output Characteristics  
Drain-Source On Resistance  
16  
14  
80  
70  
60  
50  
40  
30  
20  
10  
0
VGS= 6,7,8,9,10V  
5.5V  
12  
10  
V
GS =10V  
5V  
8.0  
6.0  
4.5V  
0
20  
40  
60  
80  
100  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
VDS - Drain-Source Voltage (V)  
ID - Drain Current (A)  
Drain-Source On Resistance  
Gate Threshold Voltage  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
18  
17  
IDS=33A  
IDS =250A  
15  
13  
11  
9
7
4
5
6
7
8
9
10  
-50 -25  
0
25 50 75 100 125 150 175  
VGS - Gate - Source Voltage (V)  
Tj - Junction Temperature (°C)  
www.hymexa.com  
V1.1  
5
HY1606D/U/V  
Typical Operating Characteristics (Cont.)  
Source-Drain Diode Forward  
Drain-Source On Resistance  
170  
100  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
VGS = 10V  
IDS = 33A  
Tj=175oC  
10  
1
Tj=25oC  
RON@T=j25o C:10.4m  
0.1  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
-50 -25  
0
25 50 75 100 125 150 175  
Tj - Junction Temperature (°C)  
VSD - Source-Drain Voltage (V)  
Capacitance  
Gate Charge  
10  
6000  
5400  
4800  
4200  
3600  
3000  
2400  
1800  
1200  
600  
VDS= 48V  
IDS= 33A  
Frequency=1MHz  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
0
0
5
10  
15  
20  
7
14 21 28 35 42 49 56  
0
VDS - Drain - Source Voltage (V)  
QG -Gate Charge (nC)  
www.hymexa.com  
V1.1  
6
HY1606D/U/V  
Avalanche Test Circuit  
Switching Time Test Circuit  
Gate Charge Test Circuit  
www.hymexa.com  
V1.1  
7
HY1606D/U/V  
Device Per Unit  
Package Type  
TO-252-2L  
Unit  
Tube  
Quantity  
75  
TO-252-2L  
Reel  
Tube  
Tube  
2500  
75  
TO-251-3L  
TO-251-3S  
75  
Package Information  
TO-252-2L  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
2.20  
0.00  
0.97  
0.68  
5.20  
0.43  
5.98  
NOM  
2.30  
-
MAX  
2.40  
0.20  
1.17  
0.90  
5.50  
0.63  
6.22  
A
A1  
A2  
b
1.07  
0.78  
5.33  
0.53  
6.10  
5.30REF  
6.60  
-
b3  
c
D
D1  
E
6.40  
4.63  
6.80  
-
E1  
e
2.286BSC  
10.10  
1.50  
2.90REF  
0.51BSC  
-
H
9.40  
1.38  
10.50  
1.75  
L
L1  
L2  
L3  
L4  
L5  
θ
0.88  
-
1.28  
1.00  
1.95  
8°  
-
1.65  
0°  
1.80  
-
www.hymexa.com  
V1.1  
8
HY1606D/U/V  
TO-251-3L  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
2.20  
0.97  
0.68  
0.00  
0.00  
5.20  
0.43  
5.98  
NOM  
2.30  
MAX  
2.40  
1.17  
0.90  
0.10  
0.10  
5.50  
0.63  
6.22  
A
A2  
b
1.07  
0.78  
b2  
b2'  
b3  
c
0.04  
0.04  
5.33  
0.53  
D
6.10  
D1  
E
5.30REF  
6.60  
6.40  
4.63  
6.80  
-
E1  
e
-
2.286BSC  
16.52  
9.40  
H
16.22  
9.15  
0.88  
1.65  
16.82  
9.65  
1.28  
1.95  
L1  
L3  
L5  
1.02  
1.80  
www.hymexa.com  
V1.1  
9
HY1606D/U/V  
TO-251-3S  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
2.20  
0.97  
0.68  
5.20  
0.43  
5.98  
NOM  
2.30  
MAX  
2.40  
1.17  
0.90  
5.50  
0.63  
6.22  
A
A2  
b
1.07  
0.78  
b3  
c
5.33  
0.53  
D
6.10  
D1  
E
5.30REF  
6.60  
6.40  
4.63  
6.80  
-
E1  
e
-
2.286BSC  
11.22  
4.10  
H
10.00  
3.90  
0.88  
1.65  
11.44  
4.30  
1.28  
1.95  
L1  
L3  
L5  
1.02  
1.80  
www.hymexa.com  
V1.1  
10  
HY1606D/U/V  
Classification Profile  
Classification Reflow Profiles  
Profile Feature  
Preheat & Soak  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
100 C  
150 C  
60-120 seconds  
150 C  
200 C  
60-120 seconds  
Temperature min (Tsmin  
)
Temperature max (Tsmax  
)
Time (Tsmin to Tsmax) (ts)  
Average ramp-up rate  
(Tsmax to TP)  
3 C/second max.  
3C/second max.  
Liquidous temperature (TL)  
Time at liquidous (tL)  
183 C  
60-150 seconds  
217 C  
60-150 seconds  
Peak package body Temperature  
(Tp)*  
See Classification Temp in table 1  
20** seconds  
See Classification Temp in table 2  
30** seconds  
Time (tP)** within 5C of the specified  
classification temperature (Tc)  
Average ramp-down rate (Tp to Tsmax  
)
6 C/second max.  
6 C/second max.  
6 minutes max.  
8 minutes max.  
Time 25C to peak temperature  
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.  
www.hymexa.com  
V1.1  
11  
HY1606D/U/V  
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)  
Volume mm3  
Package  
Thickness  
Volume mm3  
<350  
350  
<2.5 mm  
235 C  
220 C  
220 C  
2.5 mm  
220 C  
Table 2. Pb-free Process – Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm3  
<350  
Volume mm3  
350-2000  
260 C  
Volume mm3  
>2000  
260 C  
245 C  
245 C  
260 C  
260 C  
250 C  
1.6 mm – 2.5 mm  
2.5 mm  
250 C  
245 C  
Reliability Test Program  
Test item  
SOLDERABILITY  
Method  
JESD-22, B102  
Description  
5 Sec, 245C  
HTRB  
PCT  
TCT  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
168Hrs/500Hrs/1000Hrs,Bias@125  
96 Hrs, 100RH, 2atm, 121C  
500 Cycles, -55C~150C  
C  
Customer Service  
Worldwide Sales and Service: sales@hymexa.com  
Technical Support: Technology@hymexa.com  
Huayi Microelectronics Co., Ltd.  
No.8928,Shangji Road,Economic and Technological Development Zone,Xi'an,China  
TEL: (86-029) 86685706  
FAX: (86-029) 86685705  
E-mail: sales@hymexa.com  
Web net: www.hymexa.com  
www.hymexa.com  
V1.1  
12  

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