ICS9169C-273 [ICSI]

Frequency Generator for Pentium⑩ Based Systems; 频率发生器奔腾?基于系统
ICS9169C-273
型号: ICS9169C-273
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

Frequency Generator for Pentium⑩ Based Systems
频率发生器奔腾?基于系统

文件: 总8页 (文件大小:360K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Integrated  
Circuit  
Systems, Inc.  
ICS9169C-273  
Frequency Generator for Pentium™ Based Systems  
General Description  
Features  
Twelve selectable CPU clocks operate up to 83.3MHz  
Maximum CPU jitter of ± 200ps  
The ICS9169C-273 is a low-cost frequency generator  
designed specifically for Pentium based chip set systems.  
The integrated buffer minimizes skew and provides all the  
clocks required. A 14.318 MHz XTAL crystal provides the  
reference clock to generate standard Pentium frequencies.  
The CPU clock makes gradual frequency transitions without  
violating the PLL timing of internal microprocessor clock  
multipliers.  
Six BUS clocks support sync or async bus operation  
250ps skew window for CPU outputs, 500ps skew  
window for BUS outputs  
CPU clocks BUS clocks skew 0-2ns (CPU early)  
Integrated buffer outputs drive up to 30pF loads  
3.0V - 3.7V supply range, CPU(1:6) outputs 2.5V(2.375-  
2.62V)VDD option  
32-pin SOJ package  
Logic inputs latched at Power-On for frequency selection  
saving pins as Input/Output  
Twelve CPU clock outputs provide sufficient clocks for the  
CPU, chip set, memory and up to two DIMM connectors (with  
four clocks to each DIMM). Either synchronous (CPU/2) or  
asynchronous (32 MHz) PCI bus operation can be selected  
by latching data on the BSEL input.  
48 MHz clock for USB support and 24 MHz clock for FD  
Block Diagram  
Pin Configuration  
32-Pin SOJ  
Functionality  
3.3V±10%, 0-70°C  
Crystal (X1, X2) = 14.31818 MHz  
ADDRESS  
CPU(1:12)  
BUS (1:6)MHz  
SELECT  
FS2 FS1 FS0  
(MHz)  
VDD Groups:  
48MHz 24MHz  
REF  
BSEL=1 BSEL=0  
VDD1 = X1, X2, REF/BSEL  
VDD2 = CPU(1:6)  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
50  
60  
25  
30  
32  
32  
48  
48  
24  
24  
REF  
REF  
REF  
REF  
REF  
REF  
REF  
VDD3 = CPU(7:12) & PLL Core  
VDD4 = BUS(1:6)  
VDD5 = 48/24 MHz  
66.6  
REF/2  
55  
33.3  
REF/4  
27.5  
37.5  
41.7  
32  
48  
24  
REF/3  
32  
REF/2  
48  
REF/4  
24  
Latched Inputs:  
L1 = BSEL  
L2 = FS0  
L3 = FS1  
L4 = FS2  
75  
32  
48  
24  
83.3  
Tristate  
32  
48  
24  
Tristate Tristate Tristate Tristate Tristate  
Pentium is a trademark on Intel Corporation.  
9169C-273RevC031897  
ICS reserves the right to make changes in the device data identified in this publication  
without further notice. ICS advises its customers to obtain the latest version of all  
device data to verify that any information being relied upon by the customer is current  
and accurate.  
ICS9169C-273  
Pin Descriptions  
PIN NUMBER  
PIN NAME  
VDD1  
TYPE  
DESCRIPTION  
1
PWR  
Power for device logic, and 24/48MHz output  
XTAL or external reference frequency input. This input  
includes XTAL load capacitance and feedback bias for a  
12-16MHz crystal, nominally 14.31818MHz external crystal  
load of 30pF to GND recommended for VDD power on faster  
than 2.0ms.  
2
X1  
IN  
XTAL output which includes XTAL load capacitance.  
External crystal load of 10pF to GND recommended for VDD  
power on faster than 2.0ms.  
3
X2  
OUT  
4,11,20,26  
GND  
PWR  
OUT  
Ground for device logic.  
Processor clock output which is a multiple of the input  
reference frequency.  
CPU(1)  
5
FS0  
IN  
Frequency multiplier select pin. See shared pin description.*  
CPU  
(2:5) (8:12)  
Processor clock outputs which are a multiple of the input  
reference frequency.  
6,7,9,10,15,16,17,18,19  
8
OUT  
PWR  
Power for CPU(1:6) output buffers only. Can be reduced VDD  
for 2.5V (2.375-2.62V) next generation processor clocks.  
VDD2  
CPU(6)  
FS1  
Processor clock output which is a multiple of the input  
reference frequency internal pull up devices.  
OUT  
IN  
12  
13  
Frequency multiplier select pin. See shared pin description.*  
Processor clock output which is a multiple of the input  
reference frequency internal pull up devices.  
CPU(7)  
FS2  
OUT  
IN  
Frequency multiplier select pin. See shared pin description.*  
Power for CPU(7:12) output buffers. Must be nominal  
3.3V (3.0 to 3.7V)  
14  
VDD3  
PWR  
BUS clock outputs which are a multiple of the input reference  
clock.  
28, 27, 25, 24, 22, 21  
BUS (1:6)  
OUT  
23  
29  
VDD4  
VDD5  
PWR  
PWR  
Power for BUS clock buffers BUS(1:6).  
Power for fixed clock buffer (48 MHz, 24 Mhz).  
Fixed 24MHz clock (assuming a 14.31818MHz REF  
frequency).  
30  
31  
24MHz  
48MHz  
REF  
OUT  
OUT  
OUT  
Fixed 48MHz clock (assuming a 14.31818MHz REF  
frequency).  
Fixed 14.31818MHz clock (assuming a 14.31818MHz REF  
frequency).  
32  
Selection for synchronous or asynchronous bus clock  
operation. See shared pin programming description late in this  
data sheet for further explanation.  
BSEL  
IN  
* The internal pull-up will vary from 350K to 500K based on temperature.  
2
ICS9169C-273  
Shared Pin Operation -  
Input/Output Pins  
Test Mode Operation  
The ICS9169C-273 includes a production test verification  
mode of operation. This requires that the FSO and FS1 pins  
be programmed to a logic high and the FS2 pin be  
programmedtoalogiclow(seeSharedPinOperationsection).  
In this mode the device will output the following  
frequencies.  
Shared Pin Operation - Input/Output Pins 5, 12, 13 and 32  
on the ICS9169C-273 serve as dual signal functions to the  
device. During initial power-up, they act as input pins.  
The logic level (voltage) that is present on these pins at  
this time is read and stored into a 4-bit internal data latch.  
At the end of Power-On reset, (see AC characteristics for  
timing values), the device changes the mode of operation  
for these pins to an output function. In this mode the pins  
produce the specified buffered clocks to external loads.  
Pin  
Frequency  
REF  
REF/2  
REF/4  
REF2  
REF/4  
REF/3  
REF  
48MHz  
24MHz  
CPU (1:12)  
To program (load) the internal configuration register for  
these pins, a resistor is connected to either theVDD (logic 1)  
power supply or the GND (logic 0) voltage potential. A 10  
Kilohm(10K) resistor is used to provide both the solid CMOS  
programming voltage needed during the power-up  
programming period and to provide an insignificant load on  
the output clock during the subsequent operating period.  
BSEL=1  
BSEL = 0  
BUS (1:6)  
Note: REF is the frequency of either the crystal connected  
between the devices X1and X2 or, in the case of a device  
being driven by an external reference clock, the frequency  
of the reference (or test) clock on the devices X1 pin.  
Figures 1 and 2 show the recommended PCB means of  
implementing this function. In Fig. 1 either one of the  
resistors is stuffed on the board (selective stuffing) to  
configure the device’s internal logic. Figures 2a and b  
provide a single resistor stuffing option where either  
solder spot tabs or a physical jumper header may be used.  
These figures illustrate the optimal PCB physical layout  
options. These configuration resistors are of such a large  
ohmic value that they do not effect the low impedance clock  
signals. The layouts have been optimized to provide as little  
impedance transition to the clock signal as possible, as it  
passes through the programming resistor pad(s).  
(Resistors are surface mount devices  
shown schematically between 5.m. pads)  
*use only one programming resistor  
Fig. 1  
3
ICS9169C-273  
Fig. 2b  
Fig. 2a  
Fig. 3  
4
ICS9169C-273  
Technical Pin Function Descriptions  
VDD1  
clocks is controlled by the supply that is applied to the  
VDD pin of the group. See the Functionality Table at the  
beginning of this data sheet for a list of the specific  
frequencies that this clock operates at and the selection  
codes that are necessary to produce these frequencies.  
This is the power supply to the internal logic of the device as  
well as the following clock output buffers:  
A. REF clock output buffers  
B. BUS clock output buffers  
C. Fixed clock output buffers  
FS0, FS1, FS2  
These pins control the frequency of the clocks at the CPU,  
CPUL, BUS & SDRAM pins. See the Funtionality table at  
the beginning of this data sheet for a list of the specific  
frequencies that this clock operates at and the selection  
codes that are necessary to produce these frequencies. The  
device reads these pins at power-up and stores the  
programmed selection code in an internal data latch. (See  
programming section of this data sheet for configuration  
circuitry recommendations.  
This pin may be operated at any voltage between 3.0 and  
5.5 volts. Clocks from the listed buffers that it supplies  
will have a voltage swing from ground to this level. For the  
actual guaranteed high and low voltage levels of these  
clocks, please consult the AC parameter table in this data  
sheet.  
GND  
This is the power supply ground return pin for the internal  
logic of the device as well as the following Clock Output  
buffers:  
BSEL  
When this pin is a logic 1, it will place the CPU clocks in  
the synchronous mode (running at half the frequency of  
the Ref). If this pin is a logic 0, it will be in the asynchronous  
mode for the CPU clocks and will operate at the  
preprogrammed fixed frequency rate. It is a shared pin  
and is programed the same way as the frequency select  
pins.  
A. REF clock output buffers  
B. BUS clock output buffers  
C. CPU clock output buffers  
D. Fixed clock output buffers  
E. 24/48MHz clock output buffers  
VDD (2:3)  
X1  
These are the power supply pins for the CPU (1:6) and  
CPU (7:12) clock buffers. By separating the clock power  
pins, each group can receive the appropriate power  
decoupling and bypassing necessary to minimize EMI  
and crosstalk between the individual signals. VDD2 can  
be reduced to 2.5V VDD for advanced processor clocks,  
which will bring CPU (1:6) outputs at 0 to 2.5V output  
swings.  
This pin serves one of two functions. When the device is  
used with a crystal, X1 acts as the input pin for the reference  
signal that comes from the discrete crystal. When the device  
is driven by an external clock signal, X1 is the device’ input  
pin for that reference clock. This pin also implements an  
internal crystal loading capacitor that is connected to ground.  
See the data tables for the value of the capacitor.  
X2  
VDD4  
This pin is used only when the device uses a Crystal as the  
reference frequency source. In this mode of operation, X2 is  
an output signal that drives (or excites) the discrete crystal.  
This pin also implements an internal crystal loading capacitor  
that is connected to ground. See the data tables for the value  
of the capacitor.  
This is the power supply pin for BUS clock buffers  
BUS (1:6).  
VDD5  
This is the power supply pin for fixed clock buffer (48MHz  
and 24MHz).  
CPU (1:12)  
48 MHz  
These pins are clock outputs that drive the processor and  
other CPU related circuitry that require clocks which are  
in tight skew tolerance with the CPU clock. The voltage  
swing of these clocks is controlled by that which is applied  
to the VDD pins of the device. See note on VDD3. See the  
Functionality Table at the beginning of this data sheet for  
a list of the specific frequencies that this clock operates at  
and the selection codes that are necessary to produce  
these frequencies.  
This is a fixed frequency clock that is typically used to  
drive Super I/O peripheral device needs.  
24 MHz  
This is a fixed frequency clock that is typically used to  
drive Keyboard controller clock needs.  
REF  
This is a fixed frequency clock that runs at the same  
frequency as the input reference clock (typically 14.31818  
MHz) is and typically used to drive Video and ISA BUS  
requirements.  
BUS (1:6)  
These pins are the Clock Outputs that are intended to drive  
the systems plug-in card bus. The voltage swing of these  
5
ICS9169C-273  
Absolute Maximum Ratings  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V  
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND –0.5V to VDD +0.5V  
Ambient Operating Temperature . . . . . . . . . . . . 0°C to +70°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are  
stress specifications only and functional operation of the device at these or any other conditions above those listed in the  
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended  
periods may affect product reliability.  
Electrical Characteristics at 3.3V  
VDD = 3.0 – 3.7V, TA = 0 70°C unless otherwise stated  
DC Characteristics  
PARAMETER  
Input Low Voltage  
Input High Voltage  
Input Low Current  
Input High Current  
Output Low Current1  
Output High Current1  
Output Low Current1  
Output High Current1  
Output Low Voltage1  
Output High Voltage1  
Output Low Voltage1  
Output High Voltage1  
Supply Current  
SYMBOL  
TEST CONDITIONS  
MIN  
-
TYP  
-
MAX  
UNITS  
V
IL  
V
DD  
0.2V  
IH  
V
DD  
0.7V  
-28.0  
-5.0  
16.0  
-
-
-
-
V
IL  
I
IN  
V
= 0V  
= V  
-10.5  
-
µA  
µA  
mA  
mA  
mA  
mA  
V
IH  
IN  
V
DD  
I
5.0  
-
OL  
I
OL  
V
= 0.8V; for CPU, BUS, Fixed CLKs  
= 2.0V; for CPU, BUS, Fixed CLKs  
OL  
= 0.8V; for REF CLK  
25.0  
-30.0  
30.0  
-38.0  
0.3  
2.8  
0.3  
2.8  
90  
OH  
I
OL  
V
-14  
-
OL  
I
V
19.0  
-
OH  
I
OL  
= 2.0V; for REF CLK  
V
-16.0  
0.4  
-
OL  
V
OL  
I
= 8mA; for CPU, BUS, Fixed CLKs  
= -8mA; for CPU, BUS, Fixed CLKs  
OL  
= 10mA; for REF CLK  
-
OH  
V
OH  
I
2.4  
-
V
OL  
V
I
0.4  
-
V
OH  
V
OH  
= -15mA; for REF CLK  
I
2.4  
-
V
DD  
I
@66.6 MHz; all outputs unloaded  
180  
mA  
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.  
6
ICS9169C-273  
Electrical Characteristics at 3.3V  
VDD = 3.0 – 3.7V, TA = 0 70°C unless otherwise stated  
AC Characteristics  
PARAMETER  
Rise Time1  
SYMBOL  
Tr1  
TEST CONDITIONS  
20pF load, 0.8 to 2.0V  
CPU & BUS  
20pF load, 2.0 to 0.8V  
CPU & BUS  
20pF load, 20% to 80%  
CPU & BUS  
MIN  
TYP  
0.9  
0.8  
1.5  
1.4  
50  
MAX  
1.5  
UNITS  
ns  
-
-
Fall Time1  
Tf1  
1.4  
ns  
Rise Time1  
Tr2  
-
2.5  
ns  
20pF load, 80% to 20%  
CPU & BUS  
Fall Time1  
Tf2  
-
2.4  
ns  
Duty Cycle1  
Jitter, One Sigma1  
Dt  
20pF load @ VOUT=1.4V  
45  
-
60  
%
CPU & BUS Clocks; Load=20pF,  
BSEL=1  
Tj1s1  
50  
150  
ps  
CPU & BUS Clocks; Load=20pF,  
BSEL=1  
Jitter, Absolute1  
Tjab1  
Tj1s2  
Tjab2  
Fi  
-250  
-
1
250  
3
ps  
%
Jitter, One Sigma1  
Jitter, Absolute1  
REF & Fixed CLK; Load=20pF  
REF & Fixed CLK; Load=20pF  
-
-5  
2
5
%
Input Frequency1  
Logic Input Capacitance1  
Crystal Oscillator Capacitance1  
Power-on Time1  
Clock Skew1  
12.0  
14.318  
5
16.0  
-
MHz  
pF  
pF  
ms  
ps  
CIN  
Logic input pins  
X1, X2 pins  
-
-
CINX  
ton  
18  
-
From VDD=1.6V to 1st crossing of  
66.6 MHz VDD supply ramp < 40ms  
-
2.5  
150  
150  
1.0  
4.5  
250  
250  
2
Tsk1  
Tsk2  
Tsk3  
CPU to CPU; Load=20pF; @1.4V  
-
Clock Skew1  
BUS to BUS; Load=20pF; @1.4V  
-
ps  
CPU to BUS; Load=20pF; @1.4V  
(CPU is early)  
Clock Skew1  
0
ns  
CPU (@3.3V) to CPU (@2.5V)  
(2.5V CPU is late)  
Clock Skew1  
TSR4  
0.5  
1
ns  
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.  
7
ICS9169C-273  
0.818  
SOIC Package  
Ordering Information  
ICS9169CM-273  
SOJ Package  
ICS9169CJ-273  
Example:  
ICS XXXX M- PPP  
Pattern Number (2 or 3 digit number for parts with ROM code patterns)  
Package Type  
M=SOIC  
J=SOJ  
Device Type (consists of 3 or 4 digit numbers)  
Prefix  
ICS, AV = Standard Device  
ICS reserves the right to make changes in the device data identified in this publication  
without further notice. ICS advises its customers to obtain the latest version of all  
device data to verify that any information being relied upon by the customer is current  
and accurate.  
8

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