ICS85214AGT [IDT]

Low Skew Clock Driver, 85214 Series, 5 True Output(s), 0 Inverted Output(s), PDSO20, 6.50 X 4.40 MM, 0.92 MM HEIGHT, MO-153, TSSOP-20;
ICS85214AGT
型号: ICS85214AGT
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Low Skew Clock Driver, 85214 Series, 5 True Output(s), 0 Inverted Output(s), PDSO20, 6.50 X 4.40 MM, 0.92 MM HEIGHT, MO-153, TSSOP-20

驱动 光电二极管 逻辑集成电路
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LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-  
HSTL FANOUT BUFFER  
ICS85214  
Description  
Features  
The ICS85214 is a low skew, high performance  
Five differential HSTL compatible outputs  
S
IC  
1-to-5 Differential-to-HSTL Fanout Buffer and a  
member of the HiPerClockSfamily of High  
Performance Clock Solutions from IDT. The CLK0,  
CLK0 pair can accept most standard differential  
Selectable differential CLK0, CLK0 or LVCMOS/LVTTL clock  
HiPerClockS™  
inputs  
CLK0, CLK0 pair can accept the following differential input  
levels: LVPECL, LVDS, HSTL, HCSL, SSTL  
input levels. The single ended CLK1 input accepts LVCMOS or  
LVTTL input levels. Guaranteed output and part-to-part skew  
characteristics make the ICS85214 ideal for those clock  
distribution applications demanding well defined performance and  
repeatability.  
CLK1 can accept the following input levels: LVCMOS or LVTTL  
Output frequency up to: 700MHz  
Translates any single-ended input signal to HSTL levels with  
resistor bias on CLK0 input  
Output skew: 30ps (maximum)  
Part-to-part skew: 250ps (maximum)  
Propagation delay: 1.8ns (maximum)  
3.3V core, 1.8V output operating supply  
0°C to 85°C ambient operating temperature  
Industrial temperature information available upon request  
Available in both standard (RoHS 5) and lead-free (RoHS 6)  
packages  
Pin Assignment  
Block Diagram  
Pulldown  
CLK_EN  
D
Q0  
Q0  
Q1  
Q1  
Q2  
Q2  
Q3  
1
2
20  
19  
VDDO  
CLK_EN  
Q
LE  
Pullup  
CLK0  
CLK0  
3
4
18  
17  
VDD  
nc  
Pulldown  
0
Q0  
Q0  
5
6
7
8
9
16 CLK1  
Pulldown  
Pulldown  
CLK1  
1
15  
14  
13  
CLK0  
CLK0  
nc  
Q1  
Q1  
CLK_SEL  
Q3  
Q4  
Q4 10  
Q2  
Q2  
12 CLK_SEL  
GND  
11  
Q3  
Q3  
ICS85214  
20-Lead TSSOP  
6.5mm x 4.4mm x 0.925mm  
package body  
G Package  
Top View  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Table 1. Pin Descriptions  
Number  
1, 2  
Name  
Q0, Q0  
Q1, Q1  
Q2, Q2  
Q3, Q3  
Q4, Q4  
GND  
Type  
Description  
Output  
Output  
Output  
Output  
Output  
Power  
Differential output pair. HSTL interface levels.  
Differential output pair. HSTL interface levels.  
Differential output pair. HSTL interface levels.  
Differential output pair. HSTL interface levels.  
Differential output pair. HSTL interface levels.  
Power supply ground.  
3, 4  
5, 6  
7, 8  
9, 10  
11  
Clock select input. When HIGH, selects differential CLK1input. When LOW,  
selects CLK0, CLK0 inputs. LVCMOS/LVTTL interface levels.  
12  
CLK_SEL  
Input  
Pulldown  
13, 17  
14  
nc  
Unused  
Input  
No connect.  
CLK0  
CLK0  
Pullup  
Inverting differential clock input.  
15  
Input  
Pulldown Non-inverting differential LVPECL clock input.  
Pulldown Single-ended clock input. LVCMOS/LVTTL interface levels.  
Positive supply pin.  
16  
18  
CLK1  
VDD  
Input  
Power  
Synchronizing clock enable. When LOW, clock outputs follow clock input.  
Pulldown When HIGH, Qx outputs are forced low, Qx outputs are forced high.  
LVTTL/LVCMOS interface levels.  
19  
20  
CLK_EN  
Input  
VDDO  
Power  
Output supply pin.  
NOTE: Pullup and Pulldown refer to intenal input resistors. See Table 2, Pin Characteristics, for typical values.  
Table 2. Pin Characteristics  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
Input Capacitance  
Input Pullup Resistor  
4
RPULLUP  
51  
51  
k  
RPULLDOWN Input Pulldown Resistor  
kΩ  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Function Tables  
Table 3A. Control Input Function Table  
Inputs  
Outputs  
CLK_EN  
Q0:Q4  
Enabled  
Q0:Q4  
Enabled  
0
1
Disabled; LOW  
Disabled; HIGH  
After CLK_EN switches, the clock outputs are disabled or enabled following a rising and falling input clock edge as shown in Figure 1.  
In the active mode, the state of the outputs are a function of the CLK0 , CLK0 inputs as described in Table 3B.  
Enabled  
Disabled  
CLK0  
CLK0  
CLK_EN  
Q0:Q4  
Q0:Q4  
Figure 1. CLK_EN Timing Diagram  
Table 3B. Clock Input Function Table  
Inputs  
Outputs  
CLK0 or CLK1  
CLK0  
Q[0:4]  
LOW  
HIGH  
LOW  
HIGH  
HIGH  
LOW  
Q[0:4]  
HIGH  
LOW  
HIGH  
LOW  
LOW  
HIGH  
Input to Output Mode  
Differential to Differential  
Differential to Differential  
Single-Ended to Differential  
Single-Ended to Differential  
Single-Ended to Differential  
Single-Ended to Differential  
Polarity  
Non-Inverting  
Non-Inverting  
Non-Inverting  
Non-Inverting  
Inverting  
0
0
1
1
0
Baised; NOTE 1  
1
Baised; NOTE 1  
Baised; NOTE 1  
Baised; NOTE 1  
0
1
Inverting  
NOTE 1: Please refer to the Application Information section, Wiring the Differential Input to Accept Single-Ended Levels.  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.  
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond  
those listed in the DC Characteristics or AC Characterisitcs is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VDD  
Inputs, VI  
4.6V  
-0.5V to VDD + 0.5V  
-0.5V to VDD + 0.5V  
73.2°C/W (0 lfpm)  
-65°C to 150°C  
Outputs, VDDO  
Package Thermal Impedance, θJA  
Storage Temperature, TSTG  
DC Electrical Characteristics  
Table 4A. Power Supply DC Characteristics, VDD = 3.3V 5%, VDDO = 1.8V 0.2V, TA = 0°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum  
3.465  
2.0  
Units  
V
VDD  
VDDO  
IDD  
Positive Supply Voltage  
Output Supply Voltage  
Power Supply Current  
1.6  
1.8  
V
80  
mA  
Table 4B. LVCMOS/LVTTL DC Characteristics, VDD = 3.3V 5%, VDDO = 1.8V 0.2V, TA = 0°C to 850°C  
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
VDD + 0.3  
0.8  
Units  
VIH  
VIL  
Input High Voltage  
2
V
V
Input Low Voltage  
Input High Current  
-0.3  
CLK1,  
CLK_EN, CLK_SEL  
IIH  
IIL  
VDD = VIN = 3.465V  
150  
µA  
µA  
CLK1,  
CLK_EN, CLK_SEL  
Input Low Current  
VDD = 3.465V, VIN = 0V  
-5  
Table 4C. Differential DC Characteristics, VDD = 3.3V 5%, VDDO = 1.8V 0.2V, TA = 0°C to 70°C  
Symbol  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
µA  
µA  
µA  
µA  
V
CLK  
CLK  
CLK  
CLK  
VDD = VIN = 3.465V  
5
IIH  
Input High Current  
VDD = VIN = 3.465V  
150  
VDD = 3.465V, VIN = 0V  
VDD = 3.465V, VIN = 0V  
-150  
-5  
IIL  
Input Low Current  
VPP  
Peak-to-Peak Voltage  
0.15  
1.3  
Common Mode Input Voltage;  
NOTE 1, 2  
VCMR  
0.5  
VDD – 0.85  
V
NOTE 1: Common mode input voltage is defined as VIH.  
NOTE 2: For single-ended applications, the maximum input voltage for CLK, CLK is VDD + 0.3V.  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Table 4D. HSTL DC Characteristics, VDD = 3.3V 5%, VDDO = 1.8V 0.2V, TA = 0°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
Output High Current;  
NOTE 1  
VOH  
1.0  
1.4  
V
Output Low Current;  
NOTE 1  
VOL  
0
0.4  
60% x (VOH – VOL) + VOL  
1.1  
V
V
V
Output  
Crossover Voltage  
VOX  
38% x (VOH – VOL) + VOL  
0.6  
Peak-toPeak  
Output Voltage Swing  
VSWING  
NOTE 1: Outputs termination with 50to ground.  
AC Electrical Characteristics  
Table 5. AC Characteristics, VDD = 3.3V 5%, VDDO = 1.8V 0.2V, TA = 0°C to 70°C  
Parameter Symbol  
Test Conditions  
Minimum Typical Maximum  
Units  
MHz  
MHz  
ns  
CLK0, CLK0  
CLK1  
700  
300  
fMAX  
Output Frequency  
tPD  
Propagation Delay; NOTE 1  
ƒ700MHz  
1.0  
1.8  
30  
tsk(o)  
tsk(pp)  
tR / tF  
Output Skew; NOTE 2, 4  
Part-to-Part Skew; NOTE 3, 4  
Output Rise/Fall Time  
ps  
250  
700  
54  
ps  
20% to 80%  
200  
46  
ps  
CLK0, CLK0  
Output Duty Cycle  
CLK1  
%
odc  
45  
55  
%
All parameters measured at fMAX unless noted otherwise.  
The cycle to cycle jitter on the input will equal the jitter on the output. The part does not add jitter.  
NOTE 1: Measured from either the differential input crossing point or VDD/2 to the differential output crossing point.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.  
Measured at output differential cross points.  
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages and with equal load conditions.  
Using the same type of inputs on each device, the outputs are measured at the differential cross points.  
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.Parameter Measurement Information  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Parameter Measurement Information  
3.3V 5%  
1.8V 0.2V  
V
DD  
,
,
SCOPE  
,
Qx  
V
DD  
CLK0  
CLK0  
V
DDO  
VPP  
VCMR  
Cross Points  
HSTL  
nQx  
GND  
GND  
GND = 0V  
3.3V/1.8V Output Load AC Test Circuit  
Differential Input Level  
Part 1  
Qx  
Qx  
Qx  
Qx  
Part 1  
Qy  
Qy  
Qy  
Qy  
tsk(o)  
tsk(pp)  
Output Skew  
Part-to-Part Skew  
CLK0  
CLK0  
CLK1  
Q0:Q4  
Q0:Q4  
Q0:Q4  
Q0:Q4  
tPD  
tPD  
Differential Propagation Delay  
LVCMOS Propagation Delay  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Parameter Measurement Information, continued  
Q0:Q4  
Q0:Q4  
80%  
tF  
tPW  
80%  
tR  
tPERIOD  
VSWING  
20%  
Clock  
Outputs  
20%  
tPW  
odc =  
x 100%  
tPERIOD  
Output Duty Cycle/Pulse Width/Period  
Output Rise/Fall Time  
Application Information  
Wiring the Differential Input to Accept Single Ended Levels  
Figure 2 shows how the differential input can be wired to accept  
single ended levels. The reference voltage V_REF = VDD/2 is  
generated by the bias resistors R1, R2 and C1. This bias circuit  
should be located as close as possible to the input pin. The ratio of  
R1 and R2 might need to be adjusted to position the V_REF in the  
center of the input voltage swing. For example, if the input clock  
swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V and  
VDD  
R1  
1K  
Single Ended Clock Input  
R2/R1 = 0.609.  
CLK  
V_REF  
nCLK  
C1  
0.1u  
R2  
1K  
Figure 2. Single-Ended Signal Driving Differential Input  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Differential Clock Input Interface  
The CLK0 /CLK0 accepts LVDS, LVPECL, HSTL, SSTL, HCSL and  
other differential signals. The signals must meet the VPP and VCMR  
input requirements. Figures 3A to 3D show interface examples for  
the HiPerClockS CLK0/CLK0 input driven by the most common  
driver types. The input interfaces suggested here are examples  
only. Please consult with the vendor of the driver component to  
confirm the driver termination requirements. For example, in Figure  
3A, the input termination applies for IDT HiPerClockS HSTL  
drivers. If you are using an HSTL driver from another vendor, use  
their termination recommendation.  
3.3V  
3.3V  
3.3V  
1.8V  
Zo = 50  
Zo = 50Ω  
CLK  
CLK  
Zo = 50Ω  
nCLK  
Zo = 50Ω  
HiPerClockS  
Input  
nCLK  
LVPECL  
HiPerClockS  
LVHSTL  
R1  
50  
R2  
50  
Input  
R1  
50  
R2  
50  
IDT  
HiPerClockS  
LVHSTL Driver  
R2  
50  
Figure 3A. HiPerClockS CLK/CLK Input Driven by an  
IDT HiPerClockSHSTLDriver  
Figure 3B. HiPerClockS CLK/CLK Input  
Driven by a 3.3V LVPECL Driver  
3.3V  
3.3V  
3.3V  
3.3V  
R3  
125  
R4  
125  
3.3V  
Zo = 50Ω  
Zo = 50Ω  
Zo = 50Ω  
CLK  
CLK  
R1  
100  
nCLK  
nCLK  
Zo = 50Ω  
HiPerClockS  
Input  
LVPECL  
Receiver  
LVDS  
R1  
84  
R2  
84  
Figure 3C. HiPerClockS CLK/CLK Input  
Driven by a 3.3V LVPECL Driver  
Figure 3D. HiPerClockS CLK/CLK Input  
Driven by a 3.3V LVDS Driver  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
LVCMOS Control Pins:  
HSTL Outputs  
All control pins have internal pull-ups or pull-downs; additional  
resistance is not required but can be added for additional  
protection. A 1kresistor can be used.  
All unused HSTL outputs can be left floating. We recommend that  
there is no trace attached. Both sides of the differential output pair  
should either be left floating or terminated.  
CL0K/CLK0 INPUT:  
For applications not requiring the use of the differential input, both  
CLK0 and CLK0 can be left floating. Though not required, but for  
additional protection, a 1kresistor can be tied from CLK0 to  
ground.  
CLK1 INPUT:  
For applications not requiring the use of a clock input, it can be left  
floating. Though not required, but for additional protection, a 1kΩ  
resistor can be tied from the CLK1 input to ground.  
Schematic Example  
Figure 4 shows a schematic example of the ICS85214. In this  
example, the input is driven by an IDT HiPerClockS HSTL driver.  
The decoupling capacitors should be physically located near the  
power pin. For ICS85214, the unused clock outputs can be left  
floating.  
Zo = 50  
+
Zo = 50  
-
R2  
50  
R1  
50  
U1  
1.8V  
R12 1K  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
10  
9
8
7
6
5
4
3
2
1
GND  
nQ4  
Q4  
Zo = 50  
Zo = 50  
CLK_SEL  
nc  
nQ3  
Q3  
+
-
Zo = 50 Ohm  
Zo = 50 Ohm  
nCLK  
CLK  
nQ2  
Q2  
SCLK  
nc  
nQ1  
Q1  
3.3V  
VDD  
C2  
0.1u  
nCLK_EN  
VDDO  
nQ0  
Q0  
1.8V  
R4  
50  
R3  
50  
LVHSTL Driver  
R9  
50  
R10  
50  
C1  
0.1u  
ICS85214  
Zo = 50  
+
-
R11  
1K  
Zo = 50  
R8  
50  
R7  
50  
Figure 4. ICS85214 HSTL Buffer Schematic Example  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Power Considerations  
This section provides information on power dissipation and junction temperature for the ICS85214.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS85214 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
Power (core)MAX = VDD_MAX * IDD_MAX = 3.465V * 850mA = 227.2mW  
Power (outputs)MAX = 32.8mW/Loaded Output pair  
If all outputs are loaded, the total power is 5 x 32.8mW = 164mW  
Total Power_MAX (3.465V, with all outputs switching) = 227.2mW + 144mW = 391.2mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.  
The maximum recommended junction temperature for HiPerClockS devices is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = Junction Temperature  
θJA = Junction-to-Ambient Thermal Resistance  
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)  
TA = Ambient Temperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a moderate  
air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.391W * 66.6°C/W = 111°C. This is well below the limit of 125°C.  
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type  
of board (single layer or multi-layer).  
Table 6. Thermal Resitance θJA for 20 Lead TSSOP, Forced Convection  
θJA by Velocity  
Linear Feet per Minute  
0
200  
500  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
114.5°C/W  
73.2°C/W  
98.0°C/W  
66.6°C/W  
88.0°C/W  
63.5°C/W  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
3. Calculations and Equations.  
The purpose of this section is to derive the power dissipated into the load.  
HSTL output driver circuit and termination are shown in Figure 6.  
VDDO  
Q1  
VOUT  
RL  
50  
Figure 6. HSTL Driver Circuit and Termination  
To calculate worst case power dissipation into the load, use the following equations which assume a 50load.  
Pd_H is power dissipation when the output drives high.  
Pd_L is the power dissipation when the output drives low.  
Pd_H = (VOH_MAX /RL) * (VDDO_MAX - VOH_MAX  
)
Pd_L = (VOL_MAX/RL) * (VDDO_MAX- VOL_MAX  
)
Pd_H = (1.0V/50) * (2V - 1.0V) = 20mW  
Pd_L = (0.4V/50) * (2V - 0.4V) = 12.8mW  
Total Power Dissipation per output pair = Pd_H + Pd_L = 32.8mW  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Reliability Information  
Table 7. θJA vs. Air Flow Table for a 20 Lead TSSOP  
θJA by Velocity  
Linear Feet per Minute  
0
200  
500  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
114.5°C/W  
73.2°C/W  
98.0°C/W  
66.6°C/W  
88.0°C/W  
63.5°C/W  
Transistor Count  
The transistor count for ICS85214 is: 674  
Package Outline and Package Dimension  
Package Outline - G Suffix for 20 Lead TSSOP  
Table 8. Package Dimensions  
All Dimensions in Millimeters  
Symbol  
Minimum  
Maximum  
N
A
20  
1.20  
0.15  
1.05  
0.30  
0.20  
6.60  
A1  
A2  
b
0.05  
0.80  
0.19  
0.09  
6.40  
c
D
E
6.40 Basic  
E1  
e
4.30  
4.50  
0.65 Basic  
L
0.45  
0°  
0.75  
8°  
α
2
aaa  
0.10  
Reference Document: JEDEC Publication 95, MO-153  
f  
&  
d  
IDT™ / ICS™ HSTL FANOUT BUFFER  
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ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Ordering Information  
Table 9. Ordering Information  
Part/Order Number  
85214AG  
85214AGT  
85214AGLF  
85214AGLFT  
Marking  
Package  
20 Lead TSSOP  
20 Lead TSSOP  
Shipping Packaging  
Tube  
2500 Tape & Reel  
Tube  
Temperature  
0°C to 85°C  
0°C to 85°C  
0°C to 85°C  
0°C to 85°C  
ICS85214AG  
ICS85214AG  
ICS85214AGLF  
ICS85214AGLF  
“Lead-Free” 20 Lead TSSOP  
“Lead-Free” 20 Lead TSSOP  
2500 Tape & Reel  
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for  
the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use  
in normal commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements  
are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any  
IDT product for use in life support devices or critical medical instruments.  
IDT™ / ICS™ HSTL FANOUT BUFFER  
13  
ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-5, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
Revision History Sheet  
Rev  
Table  
Page  
Description of Change  
Date  
Changed LVHSTL to HSTL throughout the datasheet.  
A
7/17/03  
T2  
2
Pin Characteristics Table - changed CIN 4pF max. to 4pF typical  
1
9
Features Section - added Lead-Free Bullet.  
Added Recommendation of Unused Input and Output Pins.  
Ordering Information Table - added Lead-Free part number, marking, and note.  
Changed format throughout the datasheet.  
A
3/13/07  
T9  
13  
IDT™ / ICS™ HSTL FANOUT BUFFER  
14  
ICS85214AG REV. A MARCH 13, 2007  
ICS85214  
LOW SKEW, 1-TO-4, DIFFERENTIAL-TO-HSTL FANOUT BUFFER  
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