AUIRFR4105_11 [INFINEON]

Advanced Planar Technology Low On-Resistance; 高级平面技术低导通电阻
AUIRFR4105_11
型号: AUIRFR4105_11
厂家: Infineon    Infineon
描述:

Advanced Planar Technology Low On-Resistance
高级平面技术低导通电阻

文件: 总12页 (文件大小:244K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97597A  
AUTOMOTIVEGRADE  
AUIRFR4105  
HEXFET® Power MOSFET  
Features  
D
V(BR)DSS  
55V  
AdvancedPlanarTechnology  
LowOn-Resistance  
RDS(on) max.  
ID (Silicon Limited)  
ID (Package Limited)  
45m  
27A  
Ω
Dynamic dV/dT Rating  
175°COperatingTemperature  
Fast Switching  
Fully Avalanche Rated  
Repetitive Avalanche Allowed  
up toTjmax  
G
20A  
S
Lead-Free,RoHSCompliant  
Automotive Qualified *  
D
S
Description  
G
D-Pak  
AUIRFR4105  
Specifically designed for Automotive applications,  
this cellular design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve  
low on-resistance per silicon area. This benefit  
combined with the fast switching speed and  
ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in Automotive and a wide variety of other applications.  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
Parameter  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
27  
I
I
I
I
@ T = 25°C  
C
D
D
D
19  
@ T = 100°C  
A
C
20  
@ T = 25°C  
C
100  
DM  
68  
P
@T = 25°C Power Dissipation  
W
W/°C  
V
D
C
0.45  
Linear Derating Factor  
± 20  
Gate-to-Source Voltage  
V
GS  
EAS  
IAR  
65  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
mJ  
A
16  
6.8  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
5.0  
-55 to + 175  
T
T
Operating Junction and  
J
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
Max.  
2.2  
Units  
Rθ  
JC  
Rθ  
JA  
Rθ  
JA  
Junction-to-Case  
–––  
–––  
–––  
Junction-to-Ambient (PCB mount) **  
Junction-to-Ambient  
50  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
07/05/11  
AUIRFR4105  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
55 ––– –––  
Conditions  
VGS = 0V, ID = 250μA  
V(BR)DSS  
V
Δ
Δ
V(BR)DSS/ TJ  
Breakdown Voltage Temp. Coefficient ––– 0.052 ––– V/°C Reference to 25°C, ID = 1mA  
RDS(on)  
VGS(th)  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
–––  
2.0  
–––  
–––  
–––  
–––  
–––  
–––  
45  
4.0  
–––  
25  
VGS = 10V, ID = 16A  
Ω
V
m
VDS = VGS, ID = 250μA  
gfs  
IDSS  
Forward Transconductance  
6.5  
S
VDS = 25V, ID = 16A  
Drain-to-Source Leakage Current  
–––  
–––  
–––  
–––  
μA VDS = 55V, VGS = 0V  
250  
100  
VDS = 44V, VGS = 0V, TJ = 150°C  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA  
V
V
GS = 20V  
GS = -20V  
––– -100  
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter Min. Typ. Max. Units Conditions  
Total Gate Charge  
Qg  
Qgs  
Qgd  
td(on)  
tr  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
7.0  
49  
34  
6.8  
14  
ID = 16A  
DS = 44V  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
nC  
V
VGS = 10V, See Fig. 6 & 13  
VDD = 28V  
–––  
–––  
–––  
–––  
–––  
ID = 16A  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
31  
ns  
RG = 18Ω  
RD = 1.8Ω, See Fig. 10  
Between lead,  
40  
LD  
D
S
Internal Drain Inductance  
4.5  
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
VGS = 0V  
DS = 25V  
Ciss  
Coss  
Crss  
Input Capacitance  
–––  
–––  
–––  
700  
240  
100  
–––  
–––  
–––  
Output Capacitance  
pF  
V
Reverse Transfer Capacitance  
ƒ = 1.0MHz, See Fig. 5  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
I
I
Continuous Source Current  
–––  
–––  
MOSFET symbol  
27  
S
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
–––  
–––  
100  
SM  
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
57  
1.6  
86  
V
T = 25°C, I = 16A, V = 0V  
SD  
J S GS  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
ns T = 25°C, I = 16A  
J F  
rr  
di/dt = 100A/μs  
Q
t
130  
200  
nC  
rr  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes:  
„ Pulse width 300μs; duty cycle 2%.  
 Repetitive rating; pulse width limited by  
max. junction temperature. ( See fig. 11 )  
Calculated continuous current based on maximum allowable  
‚ VDD = 25V, starting TJ = 25°C, L = 410μH  
RG = 25Ω, IAS = 16A. (See Figure 12)  
junction temperature; Package limitation current = 20A.  
† R is measured at Tj approximately 90°C.  
θ
ƒ ISD 16A, di/dt 420A/μs, VDD V(BR)DSS  
TJ 175°C.  
,
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .  
For recommended footprint and soldering techniques refer to application note #AN-994  
2
www.irf.com  
AUIRFR4105  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive qualification. IR’s  
Industrial and Consumer qualification level is granted by extension of the  
higher Automotive level.  
Moisture Sensitivity Level  
D-PAK  
MSL1  
Class M2 (+/- 200V)†††  
Machine Model  
AEC-Q101-002  
Class H1B (+/- 900V)†††  
Human Body Model  
ESD  
AEC-Q101-001  
Class C5 (+/- 1125V)†††  
AEC-Q101-005  
Charged Device  
Model  
RoHS Compliant  
Yes  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions (if any) to AEC-Q101 requirements are noted in the qualification report.  
††† Highest passing voltage  
www.irf.com  
3
AUIRFR4105  
1000  
100  
10  
1000  
VGS  
15V  
VGS  
TOP  
TOP  
15V  
10V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
100  
10  
1
BOTTOM 4.5V  
BOTTOM 4.5V  
4.5V  
4.5V  
1
20μs PULSE WIDTH  
20μs PULSE WIDTH  
T
C
= 175°C  
T
C
= 25°C  
0.1  
0.1  
A
0.1  
0.1  
A
1
10  
100  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
100  
I
= 26A  
D
TJ = 25°C  
T = 175°C  
J
10  
VDS = 25V  
20μs PULSE WIDTH  
10A  
V
= 10V  
GS  
A
1
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
4
5
6
7
8
9
T , Junction Temperature (°C)  
VGS , Gate-to-Source Voltage (V)  
J
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
4
www.irf.com  
AUIRFR4105  
20  
16  
12  
8
1200  
1000  
800  
600  
400  
200  
0
I = 16A  
D
V
C
C
C
= 0V,  
f = 1MHz  
GS  
iss  
rss  
oss  
= C + C  
,
C
SHORTED  
V
V
= 44V  
= 28V  
gs  
gd  
gd  
ds  
DS  
DS  
= C  
= C + C  
C
ds  
gd  
iss  
C
oss  
C
rss  
4
FOR TEST CIRCUIT  
SEE FIGURE 13  
A
0
A
1
10  
100  
0
10  
20  
30  
40  
V
, Drain-to-Source Voltage (V)  
Q , Total Gate Charge (nC)  
DS  
G
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
1000  
100  
10  
1000  
100  
10  
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
10μs  
T = 175°C  
J
T = 25°C  
J
100μs  
1ms  
T
T
= 25°C  
= 175°C  
C
J
V
GS  
= 0V  
Single Pulse  
A
1
1
A
100  
0.4  
0.8  
1.2  
1.6  
2.0  
1
10  
V
, Drain-to-Source Voltage (V)  
V
, Source-to-Drain Voltage (V)  
SD  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
www.irf.com  
5
AUIRFR4105  
RD  
VDS  
30  
VGS  
LIMITED BY PACKAGE  
D.U.T.  
25  
20  
15  
10  
5
RG  
+VDD  
-
5.0V  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
0
90%  
25  
50  
75  
100  
125  
150  
175  
°
T , Case Temperature ( C)  
C
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 9. Maximum Drain Current Vs.  
Case Temperature  
Fig 10b. Switching Time Waveforms  
10  
D = 0.50  
0.20  
1
0.10  
0.05  
P
2
DM  
0.02  
0.01  
SINGLE PULSE  
(THERMAL RESPONSE)  
0.1  
t
1
t
2
Notes:  
1. Duty factor D =  
t / t  
1
2. Peak T =P  
x Z  
+ T  
thJC C  
J
DM  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRFR4105  
140  
120  
100  
80  
I
D
TOP  
6.5A  
11A  
BOTTOM 16A  
15V  
DRIVER  
+
L
V
DS  
D.U.T  
R
G
V
60  
DD  
-
I
A
AS  
10V  
Ω
0.01  
t
p
40  
20  
Fig 12a. Unclamped Inductive Test Circuit  
V
= 25V  
50  
DD  
0
A
175  
25  
75  
100  
125  
150  
Starting T , Junction Temperature (°C)  
J
V
(BR)DSS  
t
p
Fig 12c. Maximum Avalanche Energy  
Vs. Drain Current  
I
AS  
Fig 12b. Unclamped Inductive Waveforms  
Current Regulator  
Same Type as D.U.T.  
50KΩ  
.2μF  
12V  
5.0 V  
.3μF  
Q
G
+
V
DS  
D.U.T.  
-
Q
Q
GD  
GS  
V
GS  
V
G
3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 13a. Basic Gate Charge Waveform  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRFR4105  
Peak Diode Recovery dv/dt Test Circuit  
D.U.T  
Circuit Layout Considerations  
+
ƒ
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
+
‚
„
-
+
-

+
-
dv/dt controlled by RG  
RG  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
VDD  
Driver Gate Drive  
P.W.  
P.W.  
Period  
Period  
D =  
*
V
=10V  
GS  
D.U.T. I Waveform  
SD  
Reverse  
Recovery  
Current  
Body Diode Forward  
Current  
di/dt  
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  
V
DD  
Re-Applied  
Voltage  
Body Diode  
Forward Drop  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 14. For N-Channel HEXFETS  
8
www.irf.com  
AUIRFR4105  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak Part Marking Information  
PartNumber  
AUFR4105  
DateCode  
Y= Year  
WW= Work Week  
A=Automotive  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
9
AUIRFR4105  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
10  
www.irf.com  
AUIRFR4105  
Ordering Information  
Base part  
number  
Package Type  
Standard Pack  
Complete Part  
Number  
Form  
Tube  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
Quantity  
75  
2000  
3000  
3000  
AUIRFR4105  
Dpak  
AUIRFR4105  
AUIRFR4105TR  
AUIRFR4105TRL  
AUIRFR4105TRR  
www.irf.com  
11  
AUIRFR4105  
IMPORTANTNOTICE  
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR)  
reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and  
services at any time and to discontinue any product or services without notice. Part numbers designated with the “AU”  
prefix follow automotive industry and / or customer specific requirements with regards to product discontinuance and  
process change notification. All products are sold subject to IR’s terms and conditions of sale supplied at the time of order  
acknowledgment.  
IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with  
IR’s standard warranty. Testing and other quality control techniques are used to the extent IR deems necessary to support  
this warranty. Except where mandated by government requirements, testing of all parameters of each product is not  
necessarily performed.  
IRassumesnoliabilityforapplicationsassistanceorcustomerproductdesign.Customersareresponsiblefortheirproducts  
and applications using IR components. To minimize the risks with customer products and applications, customers should  
provide adequate design and operating safeguards.  
Reproduction of IR information in IR data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information  
withalterationsisanunfairanddeceptivebusinesspractice. IRisnotresponsibleorliableforsuchaltereddocumentation.  
Information of third parties may be subject to additional restrictions.  
Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for that product  
orservicevoidsallexpressandanyimpliedwarrantiesfortheassociatedIRproductorserviceandisanunfairanddeceptive  
business practice. IR is not responsible or liable for any such statements.  
IR products are not designed, intended, or authorized for use as components in systems intended for surgical implant into  
the body, or in other applications intended to support or sustain life, or in any other application in which the failure of  
theIRproductcouldcreateasituationwherepersonalinjuryordeathmayoccur. ShouldBuyerpurchaseoruseIRproducts  
foranysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdInternationalRectifieranditsofficers,  
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and  
reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such  
unintendedorunauthorizeduse,evenifsuchclaimallegesthatIRwasnegligentregardingthedesignormanufactureofthe  
product.  
Only products certified as military grade by the Defense Logistics Agency (DLA) of the US Department of Defense, are  
designed and manufactured to meet DLA military specifications required by certain military, aerospace or other  
applications. Buyers acknowledge and agree that any use of IR products not certified by DLA as military-grade, in  
applications requiring military grade products, is solely at the Buyer’s own risk and that they are solely responsible for  
compliance with all legal and regulatory requirements in connection with such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless the specific IR  
products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part number including the  
designation“AU”. Buyersacknowledgeandagreethat,iftheyuseanynon-designatedproductsinautomotiveapplications,  
IR will not be responsible for any failure to meet such requirements.  
Fortechnicalsupport,pleasecontactIsTechnicalAssistanceCenter  
http://www.irf.com/technical-info/  
WORLD HEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
12  
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