ESD5V3U2U-03F-E6433 [INFINEON]
Trans Voltage Suppressor Diode, 5.3V V(RWM), Unidirectional,;
| 型号： | ESD5V3U2U-03F-E6433 |
| 厂家： | 
Infineon |
| 描述： | Trans Voltage Suppressor Diode, 5.3V V(RWM), Unidirectional, 二极管 |
| 文件： | 总8页 (文件大小：560K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESD5V3U2U...
Ultra-Low Capacitance ESD Diode Array
• ESD / transient protection of high-speed
data lines exceeding
IEC61000-4-2 (ESD): 20 kV (air / contact)
IEC61000-4-4 (EFT): 40 A (5/50 ns)
IEC61000-4-5 (surge): 3 A (8/20 µs)
• Max. working voltage: 5.3 V
• Extremely low capacitance: down to 0.2 pF
• Very low clamping voltage: 12 V typ.
• Extremely low forward clamping voltage: 4 V typ.
• Very low reverse current: < 1 nA typ.
• Pb-free (RoHS compliant) package
Applications
• USB 2.0, 10/100/1000 Ethernet, FireWire, DVI
HDMI, S-ATA
• Mobile communication
• Consumer products (STB, MP3; DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD5V3U2U-03F
ESD5V3U2U-03LRH
1
2
3
Type
ESD5V3U2U-03F
Package
TSFP-3
Configuration
2 lines, uni-directional*
Marking
Z1
ESD5V3U2U-03LRH
TSLP-3-7
2 lines, uni-directional*
Z1
* or 1 line, bi-directional between pins 1 and 2, if pin 3 is not connected
2011-06-17
1
ESD5V3U2U...
Maximum Ratings at T = 25°C, unless otherwise specified
Parameter
ESD contact/ air discharge
Peak pulse current (t = 8 / 20 µs)
Symbol
V
ESD
I
pp
Value
20
Unit
kV
A
1)
2)
3
p
°C
Operating temperature range
Storage temperature
T
-40...125
-65...150
op
T
Electrical Characteristics at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Values
Unit
min.
typ. max.
Characteristics -
-
6
-
-
5.3
-
V
Reverse working voltage
Breakdown voltage
V
V
RWM
(BR)
I
= 1 mA, from pin 1 to 3
(BR)
-
< 1
50
nA
V
Reverse current
I
R
V = 5.3 V, from pin 1 to 3
R
Clamping voltage
V
CL
FC
2)
I
= 1 A, t = 8/20µs , from 1/2 to 3
-
-
10
12
13
15
PP
p
2)
I
= 3 A, t = 8/20µs , from 1/2 to 3
PP
p
Forward clamping voltage
V
2)
I
= 1 A, t = 8/20µs , from 3 to 1/2
-
-
2
4
4
6
PP
p
2)
I
= 3 A, t = 8/20µs , from 3 to 1/2
PP
p
pF
Line capacitance, V = 0 V, f = 1 MHz
from pin 1/2 to 3
from pin 1 to 2, pin 3 not connected
C
T
R
3)
-
-
0.4
0.2
0.6
0.4
1
V
according to IEC61000-4-2
according to IEC61000-4-5
ESD
2
3
I
pp
Total capacitance line to ground
2011-06-17
2
ESD5V3U2U...
Clamping voltage, V = ƒ(I )
Forward clamping voltage V = ƒ(I )
FC PP
cl
pp
t = 8 / 20 µs, from pin 1/2 to 3
t = 8 / 20 µs, from pin 3 to 1/2
p
p
13
V
6
V
11
10
9
4
3
2
1
0
8
7
6
A
A
0
1
2
4
0
1
2
3
5
I
I
pp
pp
Reverse current I = ƒ (T )
Diode capacitance C = ƒ (V )
R
A
T
R
V = Parameter, from pin 1/2 to 3
f = 1MHz, from pin 1/2 to 3
R
10 -6
A
0.6
pF
10 -7
10 -8
0.4
0.3
0.2
0.1
0
10 -9
10 -10
10 -11
25
°C
V
50
75
100
150
0
1
2
3
5
T
V
R
A
2011-06-17
3
ESD5V3U2U...
Line capacitance C = ƒ (f)
Line capacitance C = ƒ(T )
T A
T
V = parameter, from pin 1/2 to 3
V = 0 V, f = 1 MHz
R
R
0.7
pF
0.6
pF
0.5
VR=0V
0.4
5.3 V
0.4
0.3
0.2
0.1
0
VR=5.3V
0 V
0.3
0.2
0.1
0
MHz
°C
0
500
1000
1500
2000
3000
-50
-25
0
25
50
100
T
f
A
2011-06-17
4
ESD5V3U2U...
Application example ESD5V3U2U...
2 lines, uni-directional
2 protected high-speed I/O data lines
I/O ESD sensitive
I/O
device
2
1
The protection diode should be
placed very close to the location
where the ESD or other transients
can occur to keep loops and
inductances as small as possible.
Pin 3 should be connected directly to
a ground plane on the board.
0.4 pF typ.
3
Application example ESD5V3U2U...
1 line, bi-directional
1 protected high-speed I/O data lines
I/O ESD sensitive
I/O
device
2
1
The protection diode should be
placed very close to the location
where the ESD or other transients
can occur to keep loops and
inductances as small as possible.
Pin 3 should not be connected on
the board.
0.2 pF typ.
3
2011-06-17
5
Package TSFP-3
ESD5V3U2U...
Package Outline
0.0ꢀ
1.2
0.0ꢀ
0.04
0.2
0.ꢀꢀ
3
1
2
0.0ꢀ
0.0ꢀ
0.0ꢀ
0.2
0.1ꢀ
0.4
0.0ꢀ
0.4
Foot Print
0.4
0.4
0.4
Marking Layout (Example)
Manufacturer
BCR847BF
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
0.3
0.7
1.3ꢀ
Pin 1
2011-06-17
6
Package TSLP-3-7
ESD5V3U2U...
Package Outline
Top view
Bottom view
+0.01
-0.03
0.39
0.0ꢀ
0.6
Cathode2)
marking
1)
0.03ꢀ
0.0ꢀ MAX.
0.ꢀ
3
2
3
1
1
2
0.0ꢀ
1)
0.3ꢀ
Pin 1
marking
0.03ꢀ
2x0.1ꢀ
1) Dimension applies to plated terminal
2) Only for diodes, cathode marking on pin 3
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.4ꢀ
R0.1
0.2
0.22ꢀ
0.2
0.17
0.22ꢀ
0.1ꢀ
Copper
Solder mask
Stencil apertures
Marking Layout
Type code
Type code
Pin 1 marking
Cathode marking
Standard
Only for diodes, cathode marking on pin 3
Standard Packing
Reel ø180 mm = 1ꢀ.000 Pieces/Reel
Standard
4
Only for diodes, cathode marking on pin 3
0.ꢀ
4
Pin 1
marking
Cathode
marking
0.76
0.76
2011-06-17
7
ESD5V3U2U...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
2011-06-17
8
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