IDB06E60_07 [INFINEON]

Fast Switching EmCon Diode; 快速开关EMCON二极管
IDB06E60_07
型号: IDB06E60_07
厂家: Infineon    Infineon
描述:

Fast Switching EmCon Diode
快速开关EMCON二极管

二极管 开关
文件: 总8页 (文件大小:201K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDB06E60  
Fast Switching EmCon Diode  
Product Summary  
Feature  
V
600  
6
V
A
RRM  
600 V EmCon technology  
Fast recovery  
I
F
V
T
1.5  
175  
V
F
Soft switching  
°C  
jmax  
Low reverse recovery charge  
Low forward voltage  
175°C operating temperature  
Easy paralleling  
PG-TO263-3-2  
2
1
3
* RoHS compliant  
Type  
Package  
Ordering Code Marking Pin 1 PIN 2 PIN 3  
IDB06E60  
PG-TO263-3-2  
-
D06E60  
NC  
C
A
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
V
Repetitive peak reverse voltage  
Continous forward current  
V
600  
RRM  
I
A
F
T =25°C  
14.7  
10  
C
T =90°C  
C
Surge non repetitive forward current  
I
I
29  
FSM  
FRM  
T =25°C, t =10 ms, sine halfwave  
C
p
Maximum repetitive forward current  
22  
T =25°C, t limited by T  
, D=0.5  
C
p
jmax  
W
Power dissipation  
P
tot  
T =25°C  
46.9  
26.6  
C
T =90°C  
C
-55...+175  
°C  
°C  
Operating and storage temperature  
T , T  
j stg  
Soldering temperature  
T
245  
S
reflow soldering, MSL1  
Page 1  
Rev.2.2  
2007-09-01  
IDB06E60  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
-
-
-
-
3.2  
62  
K/W  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
R
R
R
thJC  
thJA  
thJA  
-
-
-
62  
-
2
1)  
@ 6 cm cooling area  
35  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
µA  
V
min.  
typ. max.  
Static Characteristics  
Reverse leakage current  
I
R
V =600V, T =25°C  
-
-
-
-
50  
R
j
V =600V, T =150°C  
500  
R
j
Forward voltage drop  
V
F
I =6A, T =25°C  
-
-
1.5  
1.5  
2
-
F
j
I =6A, T =150°C  
F
j
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
Rev.2.2  
2007-09-01  
IDB06E60  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
ns  
A
Reverse recovery time  
t
I
rr  
V =400V, I =6A, di/dt=550A/µs, T =25°C  
-
-
-
70  
-
-
-
R
F
j
V =400V, I =6A, di/dt=550A/µs , T =125°C  
100  
105  
R
F
j
V =400V, I =6A, di/dt=550A/µs , T =150°C  
R
F
j
Peak reverse current  
rrm  
V =400V, I =6A, di/dt=550A/µs, T =25°C  
-
-
-
6.5  
7.4  
7.9  
-
-
-
R
F
j
V =400V, I =6A, di/dt=550A/µs, T =125°C  
R
F
j
V =400V, I =6A, di/dt=550A/µs, T =150°C  
R
F
j
nC  
Reverse recovery charge  
Q
S
rr  
V =400V, I =6A, di/dt=550A/µs, T =25°C  
-
-
-
240  
360  
400  
-
-
-
R
F
j
V =400V, I =6A, di/dt=550A/µs, T =125°C  
R
F
j
V =400V, I =6A, di/dt=550A/µs, T =150°C  
R
F
j
Reverse recovery softness factor  
V =400V, I =6A, di /dt=550A/µs, T =25°C  
-
-
-
4
-
-
-
R
F
F
j
V =400V, I =6A, di /dt=550A/µs, T =125°C  
4.8  
4.9  
R
F
F
j
V =400V, I =6A, di /dt=550A/µs, T =150°C  
R
F
F
j
Page 3  
Rev.2.2  
2007-09-01  
IDB06E60  
1 Power dissipation  
= f (T )  
2 Diode forward current  
I = f(T )  
P
tot  
C
F
C
parameter: T 175 °C  
parameter: T 175°C  
j
j
50  
16  
W
A
40  
35  
30  
25  
20  
15  
10  
5
12  
10  
8
6
4
2
0
0
25  
50  
75  
100  
125  
175  
25  
50  
75  
100  
125  
175  
°C  
°C  
T
T
C
C
3 Typ. diode forward current  
I = f (V )  
4 Typ. diode forward voltage  
V = f (T )  
F
F
F
j
2
18  
V
A
12A  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1
14  
12  
10  
8
-55°C  
25°C  
100°C  
150°C  
6A  
3A  
6
4
2
0
0
0.5  
1
1.5  
2.5  
-60  
-20  
20  
60  
100  
160  
V
°C  
T
V
F
j
Page 4  
Rev.2.2  
2007-09-01  
IDB06E60  
5 Typ. reverse recovery time  
t = f (di /dt)  
6 Typ. reverse recovery charge  
Q =f(di /dt)  
rr  
F
rr  
F
parameter: V = 400V, T = 125°C  
parameter: V = 400V, T = 125 °C  
R
j
R
j
300  
550  
nC  
12A  
ns  
500  
475  
450  
425  
400  
375  
350  
325  
300  
275  
250  
12A  
6A  
3A  
200  
150  
100  
50  
6A  
3A  
0
200  
300  
400  
500  
600  
800  
200  
300  
400  
500  
600  
800  
A/µs  
A/µs  
di /dt  
di /dt  
F
F
7 Typ. reverse recovery current  
I = f (di /dt)  
8 Typ. reverse recovery softness factor  
S = f(di /dt)  
rr  
F
F
parameter: V = 400V, T = 125°C  
parameter: V = 400V, T = 125°C  
R j  
R
j
11  
11  
A
9
8
7
6
5
4
3
2
1
0
12A  
6A  
3A  
12A  
6A  
3A  
9
8
7
6
5
4
3
200  
300  
400  
500  
600  
800  
200 300 400 500 600 700 800  
1000  
A/µs  
A/µs  
di /dt  
di /dt  
F
F
Page 5  
Rev.2.2  
2007-09-01  
IDB06E60  
9 Max. transient thermal impedance  
= f (t )  
Z
thJC  
p
parameter : D = t /T  
p
10 1  
IDP06E60  
K/W  
10 0  
10 -1  
D = 0.50  
0.20  
10 -2  
0.10  
0.05  
single pulse  
10 -3  
0.02  
0.01  
10 -4  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
t
p
Page 6  
Rev.2.2  
2007-09-01  
IDB06E60  
Page 7  
Rev.2.2  
2007-09-01  
IDB06E60  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Page 8  
Rev.2.2  
2007-09-01  

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