IHW40N60T [INFINEON]

Low Loss DuoPack : IGBT in TrenchStop -technology with anti-parallel diode; 低损耗DuoPack : IGBT在TRENCHSTOP - 技术与反并联二极管
IHW40N60T
型号: IHW40N60T
厂家: Infineon    Infineon
描述:

Low Loss DuoPack : IGBT in TrenchStop -technology with anti-parallel diode
低损耗DuoPack : IGBT在TRENCHSTOP - 技术与反并联二极管

晶体 二极管 晶体管 功率控制 双极性晶体管 栅 局域网
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IHW40N60T  
q
Soft Switching Series  
®
Low Loss DuoPack : IGBT in TrenchStop -technology with anti-parallel diode  
Features:  
C
Very low VCE(sat) 1.5 V (typ.)  
Maximum Junction Temperature 175 °C  
Short circuit withstand time – 5µs  
G
®
E
TrenchStop and Fieldstop technology for 600 V applications  
offers :  
- very tight parameter distribution  
- high ruggedness, temperature stable behavior  
- low VCE(sat)  
PG-TO-247-3-21  
Positive temperature coefficient in VCE(sat)  
Low EMI  
Low Gate Charge  
Qualified according to JEDEC1 for target applications  
Pb-free lead plating; RoHS compliant  
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/  
Applications:  
Inductive Cooking  
Soft Switching Applications  
Type  
VCE  
IC  
VCE(sat),Tj=25°C Tj,max  
1.55V  
Marking  
Package  
IHW40N60T  
600V  
40A  
H40T60  
PG-TO-247-3-21  
175°C  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Collector-emitter voltage  
DC collector current, limited by Tjmax  
TC = 25°C  
VCE  
IC  
600  
V
A
80  
40  
TC = 100°C  
Pulsed collector current, tp limited by Tjmax  
ICpul s  
-
IF  
120  
120  
Turn off safe operating area (VCE 600V, Tj 175°C)  
Diode forward current, limited by Tjmax  
TC = 25°C  
40  
20  
TC = 100°C  
Diode pulsed current, tp limited by Tjmax  
Gate-emitter voltage  
Transient Gate-emitter voltage (tp < 5 ms)  
Short circuit withstand time2)  
IFpul s  
VG E  
60  
±20  
±25  
5
V
tSC  
µs  
VGE = 15V, VCC 400V, Tj 150°C  
Pt ot  
Tj  
Tstg  
-
303  
W
Power dissipation TC = 25°C  
Operating junction temperature  
Storage temperature  
Soldering temperature, 1.6mm (0.063 in.) from case for 10s  
-40...+175  
-55...+175  
260  
°C  
1 J-STD-020 and JESD-022  
2) Allowed number of short circuits: <1000; time between short circuits: >1s.  
1
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
Thermal Resistance  
Parameter  
Symbol  
Conditions  
Max. Value  
0.49  
Unit  
Characteristic  
IGBT thermal resistance,  
junction – case  
Diode thermal resistance,  
junction – case  
Thermal resistance,  
junction – ambient  
Rt hJC  
Rt hJCD  
Rt hJA  
K/W  
0.76  
40  
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified  
Value  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Static Characteristic  
Collector-emitter breakdown voltage V( BR)CES  
V
G E=0V, IC =0.5mA  
600  
-
-
V
Collector-emitter saturation voltage  
VC E( sat ) VG E = 15V, IC =40A  
Tj =25°C  
-
-
1.55  
1.9  
2.05  
-
Tj =175°C  
Diode forward voltage  
VF  
VG E=0V, IF =20A  
-
-
1.1  
1.05  
-
-
Tj =25°C  
Tj =175°C  
IC =0.8mA,  
Gate-emitter threshold voltage  
VG E(t h)  
ICES  
4.1  
4.9  
5.7  
V
CE=VG E  
Zero gate voltage collector current  
V
CE=600V,  
µA  
V
G E=0V  
Tj =25°C  
Tj =175°C  
-
-
-
-
-
-
-
22  
-
40  
1000  
100  
-
Gate-emitter leakage current  
Transconductance  
IGES  
gfs  
V
V
CE=0V,VG E=20V  
CE=20V, IC =40A  
nA  
S
Integrated gate resistor  
RG int  
Dynamic Characteristic  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Gate charge  
Ciss  
Coss  
Crss  
V
V
CE=25V,  
G E=0V,  
-
-
-
-
2423  
113  
72  
-
-
-
-
pF  
f=1MHz  
V
V
QGate  
CC =480V, IC =40A  
G E=15V  
215  
nC  
nH  
Internal emitter inductance  
LE  
-
13  
-
measured 5mm (0.197 in.) from case  
2
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
Switching Characteristic, Inductive Load, at Tj=25 °C  
Value  
Unit  
Parameter  
Symbol  
Conditions  
min.  
Typ.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Turn-off delay time  
Fall time  
Turn-on energy  
Turn-off energy  
Total switching energy  
td(on)  
tr  
td(off)  
tf  
Eon  
Eoff  
Et s  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
Tj =25°C,  
V
V
CC =400V,IC =40A,  
G E=0/15V,  
186  
66.3  
-
0.92  
0.92  
RG=5.6 ,  
Lσ 1) =40nH,  
Cσ 1) =30pF  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.  
Switching Characteristic, Inductive Load, at Tj=175 °C  
Value  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Turn-off delay time  
Fall time  
Turn-on energy  
Turn-off energy  
Total switching energy  
td(on)  
tr  
td(off)  
tf  
Eon  
Eoff  
Et s  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
Tj =175°C,  
V
V
CC =400V,IC =40A,  
G E=0/15V,  
196  
76.5  
-
1.4  
1.4  
RG= 5.6 Ω  
Lσ 1) =40nH,  
Cσ 1) =30pF  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.  
1) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.  
3
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
140A  
120A  
100A  
80A  
60A  
40A  
20A  
0A  
100A  
tp=1µs  
2µs  
TC=80°C  
TC=110°C  
10A  
1A  
10µs  
50µs  
Ic  
DC  
1ms  
10ms  
10Hz  
100Hz  
1kHz  
10kHz  
100kHz  
1V  
10V  
100V  
1000V  
f, SWITCHING FREQUENCY  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 1. Collector current as a function of  
switching frequency for triangular  
current (Eon = 0, hard turn-off)  
Figure 2. Safe operating area  
(D = 0, TC = 25°C, Tj 175°C;  
VGE=15V)  
(Tj 175°C, D = 0.5, VCE = 400V,  
VGE = 0/+15V, RG = 5.6)  
350W  
300W  
250W  
200W  
150W  
100W  
50W  
60A  
40A  
20A  
0A  
0W  
25°C  
50°C  
75°C  
100°C 125°C 150°C  
25°C  
75°C  
125°C  
TC, CASE TEMPERATURE  
TC, CASE TEMPERATURE  
Figure 3. Power dissipation as a function of  
case temperature  
Figure 4. Collector current as a function of  
case temperature  
(Tj 175°C)  
(VGE 15V, Tj 175°C)  
4
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
100A  
100A  
80A  
60A  
40A  
20A  
0A  
V
GE=20V  
15V  
V
GE=20V  
80A  
60A  
40A  
20A  
0A  
15V  
13V  
13V  
11V  
9V  
11V  
9V  
7V  
7V  
0V  
1V  
2V  
3V  
0V  
1V  
2V  
3V  
VCE, COLLECTOR-EMITTER VOLTAGE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 5. Typical output characteristic  
Figure 6. Typical output characteristic  
(Tj = 25°C)  
(Tj = 175°C)  
2.5V  
2.0V  
1.5V  
1.0V  
0.5V  
0.0V  
IC=80A  
100A  
80A  
IC=40A  
IC=20A  
60A  
40A  
TJ=175°C  
20A  
25°C  
0A  
0V  
2V  
4V  
6V  
8V  
10V  
0°C  
50°C  
100°C  
150°C  
V
GE, GATE-EMITTER VOLTAGE  
Figure 7. Typical transfer characteristic  
TJ, JUNCTION TEMPERATURE  
Figure 8. Typical collector-emitter  
(VCE=20V)  
saturation voltage as a function of  
junction temperature  
(VGE = 15V)  
5
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
td(off)  
td(off)  
100ns  
tf  
100ns  
tf  
10ns  
10ns  
10Ω  
20Ω  
0A  
20A  
40A  
60A  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 9. Typical switching times as a  
function of collector current  
(inductive load, TJ=175°C,  
Figure 10. Typical switching times as a  
function of gate resistor  
(inductive load, TJ = 175°C,  
V
CE = 400V, VGE = 0/15V, RG = 5.6,  
VCE= 400V, VGE = 0/15V, IC = 40A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
6V  
td(off)  
max.  
5V  
typ.  
100ns  
tf  
min.  
4V  
3V  
10ns  
25°C  
50°C  
75°C  
100°C 125°C 150°C  
25°C  
50°C  
75°C 100°C 125°C 150°C  
TJ, JUNCTION TEMPERATURE  
TJ, JUNCTION TEMPERATURE  
Figure 11. Typical switching times as a  
function of junction temperature  
(inductive load, VCE = 400V,  
Figure 12. Gate-emitter threshold voltage as  
a function of junction temperature  
(IC = 0.8mA)  
V
GE = 0/15V, IC = 40A, RG=5.6,  
Dynamic test circuit in Figure E)  
6
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
2.5mJ  
2.0mJ  
1.5mJ  
1.0mJ  
0.5mJ  
0.0mJ  
2.0mJ  
1.5mJ  
1.0mJ  
0.5mJ  
Eoff  
Eoff  
0.0mJ  
0Ω  
10Ω  
20Ω  
0A 10A 20A 30A 40A 50A 60A 70A  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 13. Typical switching energy losses  
as a function of collector current  
(inductive load, TJ = 175°C,  
Figure 14. Typical switching energy losses  
as a function of gate resistor  
(inductive load, TJ = 175°C,  
V
CE = 400V, VGE = 0/15V, RG = 5.6,  
VCE = 400V, VGE = 0/15V, IC = 40A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
1.4mJ  
1.2mJ  
1.0mJ  
0.8mJ  
0.6mJ  
0.4mJ  
0.2mJ  
0.0mJ  
Eoff  
1.5mJ  
1.0mJ  
0.5mJ  
0.0mJ  
Eoff  
300V  
350V  
400V  
450V  
25°C  
50°C  
75°C 100°C 125°C 150°C  
TJ, JUNCTION TEMPERATURE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 15. Typical switching energy losses  
as a function of junction  
Figure 16. Typical switching energy losses  
as a function of collector emitter  
voltage  
temperature  
(inductive load, VCE = 400V,  
VGE = 0/15V, IC = 40A, RG = 5.6,  
Dynamic test circuit in Figure E)  
(inductive load, TJ = 175°C,  
V
GE = 0/15V, IC = 40A, RG = 5.6,  
Dynamic test circuit in Figure E)  
7
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
Ciss  
12V  
9V  
6V  
3V  
0V  
1nF  
120V  
480V  
Coss  
Crss  
100pF  
0V  
10V  
20V  
30V  
40V  
0nC 30nC 60nC 90nC 120nC150nC180nC210nC  
QGE, GATE CHARGE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 17. Typical gate charge  
Figure 18. Typical capacitance as a function  
(IC=40 A)  
of collector-emitter voltage  
(VGE=0V, f = 1 MHz)  
D=0.5  
D=0.5  
0.2  
0.2  
10-1K/W  
R , ( K /W )  
τ , ( s )  
8.74*10-2  
1.07*10-2  
7.49*10-4  
8.85*10-5  
7.39*10-6  
10-1K/W  
0.1  
0.1  
0.093  
R , ( K /W )  
0.151  
τ , ( s )  
1.26*10-1  
9.7*10-3  
1.4*10-3  
1.51*10-4  
0.119  
0.0828  
0.0386  
0.0221  
0.223  
0.05  
0.02  
0.05  
0.02  
0.01  
single pulse  
0.273  
0.111  
R1  
R2  
R1  
R2  
0.01  
single pulse  
C1=τ1/R1 C2=τ2/R2  
10-2K/W  
C1=τ1/R1 C2=τ2/R2  
10-2K/W  
10µs  
100µs  
1ms  
10ms  
100ms  
1µs  
10µs 100µs 1ms 10ms 100ms  
tP, PULSE WIDTH  
tP, PULSE WIDTH  
Figure 19. IGBT transient thermal resistance  
Figure 20. Diode transient thermal  
(D = tp / T)  
impedance as a function of pulse  
width  
(D=tP/T)  
8
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
70A  
60A  
50A  
40A  
30A  
20A  
10A  
0A  
IF=40A  
TJ=25°C  
1.0V  
0.5V  
0.0V  
175°C  
20A  
10A  
0.0V  
0.5V  
1.0V  
1.5V  
25°C  
50°C  
75°C 100°C 125°C 150°C  
VF, FORWARD VOLTAGE  
TJ, JUNCTION TEMPERATURE  
Figure 21. Typical diode forward current as  
Figure 22. Typical diode forward voltage as a  
a function of forward voltage  
function of junction temperature  
9
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
PG-TO247-3-21  
10  
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
i,v  
tr r =tS +tF  
diF /dt  
Qr r =QS +QF  
tr r  
IF  
tS  
tF  
t
QS  
10% Ir r m  
QF  
Ir r m  
dir r /dt  
VR  
90% Ir r m  
Figure C. Definition of diodes  
switching characteristics  
τ1  
τ2  
r 2  
τn  
r1  
r n  
T (t)  
j
p(t)  
r 2  
r1  
rn  
Figure A. Definition of switching times  
T
C
Figure D. Thermal equivalent  
circuit  
Figure E. Dynamic test circuit  
Figure B. Definition of switching losses  
11  
Rev. 2.2 Apr. 06  
Power Semiconductors  
IHW40N60T  
q
Soft Switching Series  
Edition 2006-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 5/31/06.  
All Rights Reserved.  
Attention please!  
The information given in this data sheet shall in no event be regarded as a guarantee of conditions or  
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical  
values stated herein and/or any information regarding the application of the device, Infineon Technologies  
hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types  
in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or  
system. Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
12  
Rev. 2.2 Apr. 06  
Power Semiconductors  

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