IKW40T120XK [INFINEON]

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IKW40T120XK
型号: IKW40T120XK
厂家: Infineon    Infineon
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晶体 二极管 晶体管 功率控制 瞄准线 双极性晶体管 栅 局域网 快速恢复二极管
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IKW40T120  
TrenchStop Series  
Low Loss DuoPack : IGBT in Trench and Fieldstop technology  
with soft, fast recovery anti-parallel EmCon HE diode  
C
Best in class TO247  
Short circuit withstand time – 10µs  
Designed for :  
G
E
- Frequency Converters  
- Uninterrupted Power Supply  
Trench and Fieldstop technology for 1200 V applications offers :  
- very tight parameter distribution  
- high ruggedness, temperature stable behavior  
NPT technology offers easy parallel switching capability due to  
positive temperature coefficient in VCE(sat)  
Low EMI  
P-TO-247-3-1  
(TO-247AC)  
Low Gate Charge  
Very soft, fast recovery anti-parallel EmCon HE diode  
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/  
Type  
VCE  
IC  
VCE(sat),Tj=25°C  
Tj,max  
Package  
TO-247AC  
Ordering Code  
IKW40T120  
1200V  
40A  
1.8V  
Q67040-S4520  
150°C  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Collector-emitter voltage  
DC collector current  
TC = 25°C  
VCE  
IC  
1200  
V
A
75  
40  
TC = 100°C  
Pulsed collector current, tp limited by Tjmax  
Turn off safe operating area  
ICpul s  
-
105  
105  
VCE 1200V, Tj 150°C  
Diode forward current  
TC = 25°C  
IF  
80  
40  
TC = 100°C  
Diode pulsed current, tp limited by Tjmax  
Gate-emitter voltage  
Short circuit withstand time1)  
VGE = 15V, VCC 1200V, Tj 150°C  
Power dissipation  
IFpul s  
VG E  
tSC  
105  
±20  
10  
V
µs  
Pt ot  
270  
W
TC = 25°C  
Operating junction temperature  
Storage temperature  
Soldering temperature, 1.6mm (0.063 in.) from case for 10s  
Tj  
-40...+150  
-55...+150  
260  
°C  
Tstg  
-
1) Allowed number of short circuits: <1000; time between short circuits: >1s.  
1
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
Thermal Resistance  
Parameter  
Symbol  
Conditions  
Max. Value  
Unit  
Characteristic  
IGBT thermal resistance,  
junction – case  
Diode thermal resistance,  
junction – case  
Thermal resistance,  
junction – ambient  
Rt hJC  
Rt hJCD  
Rt hJA  
0.45  
0.81  
40  
K/W  
TO-247AC  
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified  
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Static Characteristic  
Collector-emitter breakdown voltage V( BR)CES VG E=0V, IC =1.5mA  
1200  
-
-
V
Collector-emitter saturation voltage  
VC E( sat ) VG E = 15V, IC =40A  
Tj =25°C  
-
-
-
1.8  
2.1  
2.3  
2.3  
-
-
Tj =125°C  
Tj =150°C  
Diode forward voltage  
VF  
VG E=0V, IF =40A  
Tj =25°C  
-
-
-
1.75  
1.75  
1.75  
2.3  
-
-
Tj =125°C  
Tj =150°C  
Gate-emitter threshold voltage  
Zero gate voltage collector current  
VG E(t h)  
ICES  
IC =1.5mA,VCE=VG E  
5.0  
5.8  
6.5  
VCE=1200V,  
mA  
VG E=0V  
Tj =25°C  
Tj =150°C  
-
-
-
-
-
-
-
21  
6
0.4  
4.0  
600  
-
Gate-emitter leakage current  
Transconductance  
IGES  
gfs  
VCE=0V,VG E=20V  
VCE=20V, IC =40A  
nA  
S
Integrated gate resistor  
RG int  
2
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
Dynamic Characteristic  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Gate charge  
Ciss  
VCE=25V,  
VG E=0V,  
f=1MHz  
VCC =960V, IC =40A  
VG E=15V  
-
-
-
-
2500  
130  
110  
203  
-
-
-
-
pF  
Coss  
Crss  
QGate  
nC  
nH  
A
Internal emitter inductance  
LE  
TO-247AC  
-
-
-
13  
-
measured 5mm (0.197 in.) from case  
Short circuit collector current1)  
IC( SC)  
210  
VG E=15V,tSC10µs  
VCC = 600V,  
Tj = 25°C  
Switching Characteristic, Inductive Load, at Tj=25 °C  
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Turn-off delay time  
Fall time  
Turn-on energy  
Turn-off energy  
Total switching energy  
Anti-Parallel Diode Characteristic  
Diode reverse recovery time  
Diode reverse recovery charge  
td(on)  
tr  
td( off)  
tf  
-
-
-
-
-
-
-
48  
34  
480  
70  
3.3  
3.2  
6.5  
-
-
-
-
-
-
-
ns  
Tj =25°C,  
VCC =600V,IC =40A,  
VG E=0/15V,  
RG=15,  
Lσ 2) =180nH,  
Cσ 2) =39pF  
Eon  
Eoff  
Et s  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.  
trr  
-
-
-
-
240  
3.8  
28  
-
-
ns  
µC  
A
Tj =25°C,  
VR =600V, IF =40A,  
diF/dt=800A/µs  
Qrr  
Diode peak reverse recovery current Irrm  
Diode peak rate of fall of reverse  
dirr /dt  
370  
A/µs  
recovery current during tb  
1) Allowed number of short circuits: <1000; time between short circuits: >1s.  
2) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.  
3
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
Switching Characteristic, Inductive Load, at Tj=150 °C  
Value  
Unit  
Parameter  
Symbol  
Conditions  
min.  
typ.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
Turn-off delay time  
Fall time  
Turn-on energy  
Turn-off energy  
Total switching energy  
Anti-Parallel Diode Characteristic  
Diode reverse recovery time  
Diode reverse recovery charge  
td(on)  
tr  
td( off)  
tf  
-
-
-
-
-
-
-
52  
40  
-
-
-
-
-
-
-
ns  
Tj =150°C  
VCC =600V,IC =40A,  
VG E=0/15V,  
580  
120  
5.0  
5.4  
10.4  
RG= 15,  
Lσ 1) =180nH,  
Cσ 1) =39pF  
Eon  
Eoff  
Et s  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.  
trr  
-
-
-
-
410  
8.8  
36  
-
-
-
ns  
µC  
A
Tj =150°C  
VR =600V, IF =40A,  
diF/dt=800A/µs  
Qrr  
Diode peak reverse recovery current Irrm  
dirr /dt  
330  
Diode peak rate of fall of reverse  
A/µs  
recovery current during tb  
1) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.  
Preliminary / Rev. 1 Jul-02  
4
Power Semiconductors  
IKW40T120  
TrenchStop Series  
100A  
tp=3µs  
100A  
80A  
60A  
40A  
20A  
0A  
TC=80°C  
10µs  
TC=110°C  
10A  
1A  
50µs  
150µs  
500µs  
Ic  
20ms  
DC  
Ic  
0,1A  
10Hz  
100Hz  
1kHz  
10kHz  
100kHz  
1V  
10V  
100V  
1000V  
f, SWITCHING FREQUENCY  
Figure 1. Collector current as a function of  
switching frequency  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 2. Safe operating area  
(D = 0, TC = 25°C,  
(Tj 150°C, D = 0.5, VCE = 600V,  
Tj 150°C;VGE=15V)  
VGE = 0/+15V, RG = 15)  
70A  
60A  
50A  
40A  
30A  
20A  
10A  
0A  
250W  
200W  
150W  
100W  
50W  
0W  
25°C  
75°C  
125°C  
25°C  
50°C  
75°C  
100°C  
125°C  
TC, CASE TEMPERATURE  
Figure 3. Power dissipation as a function of  
case temperature  
TC, CASE TEMPERATURE  
Figure 4. Collector current as a function of  
case temperature  
(Tj 150°C)  
(VGE 15V, Tj 150°C)  
5
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
100A  
90A  
80A  
70A  
60A  
50A  
40A  
30A  
20A  
10A  
0A  
100A  
90A  
VGE=17V  
VGE=17V  
80A  
70A  
60A  
50A  
40A  
30A  
20A  
10A  
0A  
15V  
15V  
13V  
11V  
9V  
13V  
11V  
9V  
7V  
7V  
0V  
1V  
2V  
3V  
4V  
5V  
6V  
0V  
1V  
2V  
3V  
4V  
5V  
6V  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 5. Typical output characteristic  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 6. Typical output characteristic  
(Tj = 25°C)  
(Tj = 150°C)  
100A  
90A  
80A  
70A  
60A  
50A  
40A  
30A  
3,5V  
3,0V  
2,5V  
2,0V  
1,5V  
1,0V  
0,5V  
0,0V  
IC=80A  
IC=40A  
IC=25A  
IC=10A  
20A  
TJ=150°C  
25°C  
10A  
0A  
-50°C  
0°C  
50°C  
100°C  
0V  
2V  
4V  
6V  
8V  
10V 12V  
VGE, GATE-EMITTER VOLTAGE  
Figure 7. Typical transfer characteristic  
TJ, JUNCTION TEMPERATURE  
Figure 8. Typical collector-emitter  
(VCE=20V)  
saturation voltage as a function of  
junction temperature  
(VGE = 15V)  
6
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
td(off)  
1000 ns  
td(off)  
100ns  
10ns  
1ns  
tf  
tf  
100 ns  
10 ns  
1 ns  
td(on)  
tr  
td(on)  
tr  
0A  
20A  
40A  
60A  
5Ω  
15Ω  
25Ω  
35Ω  
45Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 10. Typical switching times as a  
function of gate resistor  
Figure 9. Typical switching times as a  
function of collector current  
(inductive load, TJ=150°C,  
(inductive load, TJ=150°C,  
VCE=600V, VGE=0/15V, RG=15,  
Dynamic test circuit in Figure E)  
VCE=600V, VGE=0/15V, IC=40A,  
Dynamic test circuit in Figure E)  
td(off)  
7V  
6V  
5V  
4V  
3V  
2V  
1V  
0V  
max.  
typ.  
100ns  
tf  
min.  
td(on)  
tr  
10ns  
-50°C  
0°C  
50°C  
100°C  
150°C  
0°C  
50°C  
100°C  
150°C  
TJ, JUNCTION TEMPERATURE  
TJ, JUNCTION TEMPERATURE  
Figure 11. Typical switching times as a  
Figure 12. Gate-emitter threshold voltage as  
a function of junction temperature  
(IC = 1.5mA)  
function of junction temperature  
(inductive load, VCE=600V,  
VGE=0/15V, IC=40A, RG=15,  
Dynamic test circuit in Figure E)  
7
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
*) Eon and Etsinclude losses  
due to diode recovery  
*) Eon and Ets include losses  
due to diode recovery  
Ets*  
15 mJ  
25,0mJ  
20,0mJ  
15,0mJ  
10,0mJ  
5,0mJ  
Ets*  
10 mJ  
Eon*  
Eoff  
Eon*  
Eoff  
5 mJ  
0,0mJ  
0 mJ  
10A 20A 30A 40A 50A 60A 70A  
5Ω  
15Ω  
25Ω  
35Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 13. Typical switching energy losses  
as a function of collector current  
(inductive load, TJ=150°C,  
Figure 14. Typical switching energy losses  
as a function of gate resistor  
(inductive load, TJ=150°C,  
VCE=600V, VGE=0/15V, RG=15,  
Dynamic test circuit in Figure E)  
VCE=600V, VGE=0/15V, IC=40A,  
Dynamic test circuit in Figure E)  
*) Eon and Ets include losses  
due to diode recovery  
*) Eon and Ets include losses  
due to diode recovery  
15mJ  
15mJ  
Ets*  
10mJ  
5mJ  
0mJ  
10mJ  
Ets*  
Eoff  
5mJ  
Eoff  
Eon*  
Eon*  
0mJ  
50°C  
100°C  
150°C  
400V  
500V  
600V  
700V  
800V  
TJ, JUNCTION TEMPERATURE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 16. Typical switching energy losses  
as a function of collector emitter  
voltage  
Figure 15. Typical switching energy losses  
as a function of junction  
temperature  
(inductive load, VCE=600V,  
VGE=0/15V, IC=40A, RG=15,  
Dynamic test circuit in Figure E)  
(inductive load, TJ=150°C,  
VGE=0/15V, IC=40A, RG=15,  
Dynamic test circuit in Figure E)  
8
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
Ciss  
15V  
10V  
5V  
1nF  
100pF  
10pF  
240V  
960V  
Coss  
Crss  
0V  
0V  
10V  
20V  
0nC  
50nC  
100nC 150nC 200nC 250nC  
QGE, GATE CHARGE  
Figure 17. Typical gate charge  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 18. Typical capacitance as a function  
(IC=40 A)  
of collector-emitter voltage  
(VGE=0V, f = 1 MHz)  
15µs  
10µs  
5µs  
300A  
200A  
100A  
0A  
0µs  
12V  
14V  
16V  
12V  
14V  
16V  
18V  
VGE, GATE-EMITTETR VOLTAGE  
VGE, GATE-EMITTETR VOLTAGE  
Figure 20. Typical short circuit collector  
current as a function of gate-  
emitter voltage  
Figure 19. Short circuit withstand time as a  
function of gate-emitter voltage  
(VCE=600V, start at TJ=25°C)  
(VCE 600V, Tj 150°C)  
9
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
VCE  
600V  
400V  
200V  
0V  
600V  
400V  
200V  
0V  
60A  
40A  
20A  
0A  
60A  
40A  
20A  
0A  
IC  
VCE  
IC  
0us  
0us  
0.5us  
1us  
1.5us  
0.5us  
1us  
1.5us  
t, TIME  
t, TIME  
Figure 21. Typical turn on behavior  
(VGE=0/15V, RG=15, Tj = 150°C,  
Dynamic test circuit in Figure E)  
Figure 22. Typical turn off behavior  
(VGE=15/0V, RG=15, Tj = 150°C,  
Dynamic test circuit in Figure E)  
D=0.5  
D=0.5  
0.2  
0.1  
0.2  
10-1K/W  
10-1K/W  
10-2K/W  
10-3K/W  
R , ( K / W )  
0.228  
τ , ( s ) =  
1.01*10-1  
1.15*10-2  
1.30*10-3  
1.53*10-4  
0.1  
0.05  
0.257  
R , ( K / W )  
0.159  
τ , ( s ) =  
1.10*10-1  
1.56*10-2  
1.35*10-3  
1.51*10-4  
0.02  
0.01  
single pulse  
0.238  
0.05  
0.087  
0.133  
0.02  
0.01  
0.120  
R1  
R2  
0.038  
10-2K/W  
10-3K/W  
single pulse  
R1  
R2  
C1=τ1/R1 C2=τ2/R2  
C1=τ1/R1 C2=τ2/R2  
10µs  
100µs  
1ms  
10ms  
100ms  
10µs  
100µs  
1ms  
10ms  
100ms  
tP, PULSE WIDTH  
Figure 23. IGBT transient thermal resistance  
tP, PULSE WIDTH  
Figure 24. Diode transient thermal  
(D = tp / T)  
impedance as a function of pulse  
width  
(D=tP/T)  
10  
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
8µC  
6µC  
4µC  
TJ=150°C  
600ns  
500ns  
400ns  
300ns  
200ns  
100ns  
0ns  
TJ=150°C  
TJ=25°C  
2µC  
0µC  
TJ=25°C  
400A/µs  
600A/µs  
800A/µs 1000A/µs  
400A/µs  
600A/µs  
800A/µs  
1000A/µs  
diF/dt, DIODE CURRENT SLOPE  
diF/dt, DIODE CURRENT SLOPE  
Figure 24. Typical reverse recovery charge  
as a function of diode current  
slope  
Figure 23. Typical reverse recovery time as  
a function of diode current slope  
(VR=600V, IF=40A,  
Dynamic test circuit in Figure E)  
(VR=600V, IF=40A,  
Dynamic test circuit in Figure E)  
TJ=25°C  
40A  
-400A/µs  
-300A/µs  
-200A/µs  
-100A/µs  
-0A/µs  
TJ=150°C  
35A  
TJ=150°C  
30A  
TJ=25°C  
25A  
20A  
15A  
10A  
5A  
0A  
400A/µs  
600A/µs  
800A/µs  
1000A/µs  
400A/µs  
600A/µs  
800A/µs  
1000A/µs  
diF/dt, DIODE CURRENT SLOPE  
Figure 25. Typical reverse recovery current  
as a function of diode current  
slope  
diF/dt, DIODE CURRENT SLOPE  
Figure 26. Typical diode peak rate of fall of  
reverse recovery current as a  
function of diode current slope  
(VR=600V, IF=40A,  
(VR=600V, IF=40A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
11  
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
100A  
80A  
60A  
40A  
20A  
0A  
TJ=25°C  
IF=80A  
150°C  
2,0V  
1,5V  
1,0V  
0,5V  
0,0V  
40A  
25A  
10A  
-50°C  
0°C  
50°C  
100°C  
0V  
1V  
2V  
VF, FORWARD VOLTAGE  
Figure 27. Typical diode forward current as  
a function of forward voltage  
TJ, JUNCTION TEMPERATURE  
Figure 28. Typical diode forward voltage as a  
function of junction temperature  
12  
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
dimensions  
TO-247AC  
symbol  
[mm]  
[inch]  
min  
4.78  
2.29  
1.78  
1.09  
1.73  
2.67  
max  
5.28  
2.51  
2.29  
1.32  
2.06  
3.18  
min  
max  
A
B
C
D
E
F
0.1882 0.2079  
0.0902 0.0988  
0.0701 0.0902  
0.0429 0.0520  
0.0681 0.0811  
0.1051 0.1252  
0.0299 max  
0.8189 0.8331  
0.6161 0.6358  
0.2051 0.2252  
0.7799 0.8142  
0.1402 0.1941  
0.1421  
G
H
K
L
0.76 max  
20.80  
15.65  
5.21  
21.16  
16.15  
5.72  
M
N
P
Q
19.81  
3.560  
20.68  
4.930  
3.61  
6.12  
6.22  
0.2409 0.2449  
13  
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
i,v  
tr r =tS +tF  
diF /dt  
Qr r =QS +QF  
tr r  
IF  
tS  
tF  
t
QS  
10% Ir r m  
QF  
Ir r m  
dir r /dt  
90% Ir r m  
VR  
Figure C. Definition of diodes  
switching characteristics  
τ1  
τ
r22  
τn  
r1  
r n  
T (t)  
j
p(t)  
r 2  
r1  
rn  
Figure A. Definition of switching times  
T
C
Figure D. Thermal equivalent  
circuit  
Figure E. Dynamic test circuit  
Leakage inductance Lσ =180nH  
and Stray capacity Cσ =39pF.  
Figure B. Definition of switching losses  
14  
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  
IKW40T120  
TrenchStop Series  
Published by  
Infineon Technologies AG,  
Bereich Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 2001  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,  
descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon  
Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in question  
please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of  
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or  
systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect  
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.  
15  
Preliminary / Rev. 1 Jul-02  
Power Semiconductors  

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