IKW40T120XK [INFINEON]
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IKW40T120
TrenchStop Series
Low Loss DuoPack : IGBT in Trench and Fieldstop technology
with soft, fast recovery anti-parallel EmCon HE diode
C
•
•
•
Best in class TO247
Short circuit withstand time – 10µs
Designed for :
G
E
- Frequency Converters
- Uninterrupted Power Supply
•
•
Trench and Fieldstop technology for 1200 V applications offers :
- very tight parameter distribution
- high ruggedness, temperature stable behavior
NPT technology offers easy parallel switching capability due to
positive temperature coefficient in VCE(sat)
Low EMI
P-TO-247-3-1
(TO-247AC)
•
•
•
•
Low Gate Charge
Very soft, fast recovery anti-parallel EmCon HE diode
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/
Type
VCE
IC
VCE(sat),Tj=25°C
Tj,max
Package
TO-247AC
Ordering Code
IKW40T120
1200V
40A
1.8V
Q67040-S4520
150°C
Maximum Ratings
Parameter
Symbol
Value
Unit
Collector-emitter voltage
DC collector current
TC = 25°C
VCE
IC
1200
V
A
75
40
TC = 100°C
Pulsed collector current, tp limited by Tjmax
Turn off safe operating area
ICpul s
-
105
105
VCE ≤ 1200V, Tj ≤ 150°C
Diode forward current
TC = 25°C
IF
80
40
TC = 100°C
Diode pulsed current, tp limited by Tjmax
Gate-emitter voltage
Short circuit withstand time1)
VGE = 15V, VCC ≤ 1200V, Tj ≤ 150°C
Power dissipation
IFpul s
VG E
tSC
105
±20
10
V
µs
Pt ot
270
W
TC = 25°C
Operating junction temperature
Storage temperature
Soldering temperature, 1.6mm (0.063 in.) from case for 10s
Tj
-40...+150
-55...+150
260
°C
Tstg
-
1) Allowed number of short circuits: <1000; time between short circuits: >1s.
1
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
Thermal Resistance
Parameter
Symbol
Conditions
Max. Value
Unit
Characteristic
IGBT thermal resistance,
junction – case
Diode thermal resistance,
junction – case
Thermal resistance,
junction – ambient
Rt hJC
Rt hJCD
Rt hJA
0.45
0.81
40
K/W
TO-247AC
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified
Value
typ.
Parameter
Symbol
Conditions
Unit
min.
max.
Static Characteristic
Collector-emitter breakdown voltage V( BR)CES VG E=0V, IC =1.5mA
1200
-
-
V
Collector-emitter saturation voltage
VC E( sat ) VG E = 15V, IC =40A
Tj =25°C
-
-
-
1.8
2.1
2.3
2.3
-
-
Tj =125°C
Tj =150°C
Diode forward voltage
VF
VG E=0V, IF =40A
Tj =25°C
-
-
-
1.75
1.75
1.75
2.3
-
-
Tj =125°C
Tj =150°C
Gate-emitter threshold voltage
Zero gate voltage collector current
VG E(t h)
ICES
IC =1.5mA,VCE=VG E
5.0
5.8
6.5
VCE=1200V,
mA
VG E=0V
Tj =25°C
Tj =150°C
-
-
-
-
-
-
-
21
6
0.4
4.0
600
-
Gate-emitter leakage current
Transconductance
IGES
gfs
VCE=0V,VG E=20V
VCE=20V, IC =40A
nA
S
Integrated gate resistor
RG int
Ω
2
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
Dynamic Characteristic
Input capacitance
Output capacitance
Reverse transfer capacitance
Gate charge
Ciss
VCE=25V,
VG E=0V,
f=1MHz
VCC =960V, IC =40A
VG E=15V
-
-
-
-
2500
130
110
203
-
-
-
-
pF
Coss
Crss
QGate
nC
nH
A
Internal emitter inductance
LE
TO-247AC
-
-
-
13
-
measured 5mm (0.197 in.) from case
Short circuit collector current1)
IC( SC)
210
VG E=15V,tSC≤10µs
VCC = 600V,
Tj = 25°C
Switching Characteristic, Inductive Load, at Tj=25 °C
Value
typ.
Parameter
Symbol
Conditions
Unit
min.
max.
IGBT Characteristic
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Turn-on energy
Turn-off energy
Total switching energy
Anti-Parallel Diode Characteristic
Diode reverse recovery time
Diode reverse recovery charge
td(on)
tr
td( off)
tf
-
-
-
-
-
-
-
48
34
480
70
3.3
3.2
6.5
-
-
-
-
-
-
-
ns
Tj =25°C,
VCC =600V,IC =40A,
VG E=0/15V,
RG=15Ω,
Lσ 2) =180nH,
Cσ 2) =39pF
Eon
Eoff
Et s
mJ
Energy losses include
“tail” and diode
reverse recovery.
trr
-
-
-
-
240
3.8
28
-
-
ns
µC
A
Tj =25°C,
VR =600V, IF =40A,
diF/dt=800A/µs
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
dirr /dt
370
A/µs
recovery current during tb
1) Allowed number of short circuits: <1000; time between short circuits: >1s.
2) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.
3
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
Switching Characteristic, Inductive Load, at Tj=150 °C
Value
Unit
Parameter
Symbol
Conditions
min.
typ.
max.
IGBT Characteristic
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Turn-on energy
Turn-off energy
Total switching energy
Anti-Parallel Diode Characteristic
Diode reverse recovery time
Diode reverse recovery charge
td(on)
tr
td( off)
tf
-
-
-
-
-
-
-
52
40
-
-
-
-
-
-
-
ns
Tj =150°C
VCC =600V,IC =40A,
VG E=0/15V,
580
120
5.0
5.4
10.4
RG= 15Ω,
Lσ 1) =180nH,
Cσ 1) =39pF
Eon
Eoff
Et s
mJ
Energy losses include
“tail” and diode
reverse recovery.
trr
-
-
-
-
410
8.8
36
-
-
-
ns
µC
A
Tj =150°C
VR =600V, IF =40A,
diF/dt=800A/µs
Qrr
Diode peak reverse recovery current Irrm
dirr /dt
330
Diode peak rate of fall of reverse
A/µs
recovery current during tb
1) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.
Preliminary / Rev. 1 Jul-02
4
Power Semiconductors
IKW40T120
TrenchStop Series
100A
tp=3µs
100A
80A
60A
40A
20A
0A
TC=80°C
10µs
TC=110°C
10A
1A
50µs
150µs
500µs
Ic
20ms
DC
Ic
0,1A
10Hz
100Hz
1kHz
10kHz
100kHz
1V
10V
100V
1000V
f, SWITCHING FREQUENCY
Figure 1. Collector current as a function of
switching frequency
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 2. Safe operating area
(D = 0, TC = 25°C,
(Tj ≤ 150°C, D = 0.5, VCE = 600V,
Tj ≤150°C;VGE=15V)
VGE = 0/+15V, RG = 15Ω)
70A
60A
50A
40A
30A
20A
10A
0A
250W
200W
150W
100W
50W
0W
25°C
75°C
125°C
25°C
50°C
75°C
100°C
125°C
TC, CASE TEMPERATURE
Figure 3. Power dissipation as a function of
case temperature
TC, CASE TEMPERATURE
Figure 4. Collector current as a function of
case temperature
(Tj ≤ 150°C)
(VGE ≥ 15V, Tj ≤ 150°C)
5
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
100A
90A
80A
70A
60A
50A
40A
30A
20A
10A
0A
100A
90A
VGE=17V
VGE=17V
80A
70A
60A
50A
40A
30A
20A
10A
0A
15V
15V
13V
11V
9V
13V
11V
9V
7V
7V
0V
1V
2V
3V
4V
5V
6V
0V
1V
2V
3V
4V
5V
6V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 5. Typical output characteristic
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 6. Typical output characteristic
(Tj = 25°C)
(Tj = 150°C)
100A
90A
80A
70A
60A
50A
40A
30A
3,5V
3,0V
2,5V
2,0V
1,5V
1,0V
0,5V
0,0V
IC=80A
IC=40A
IC=25A
IC=10A
20A
TJ=150°C
25°C
10A
0A
-50°C
0°C
50°C
100°C
0V
2V
4V
6V
8V
10V 12V
VGE, GATE-EMITTER VOLTAGE
Figure 7. Typical transfer characteristic
TJ, JUNCTION TEMPERATURE
Figure 8. Typical collector-emitter
(VCE=20V)
saturation voltage as a function of
junction temperature
(VGE = 15V)
6
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
td(off)
1000 ns
td(off)
100ns
10ns
1ns
tf
tf
100 ns
10 ns
1 ns
td(on)
tr
td(on)
tr
0A
20A
40A
60A
5Ω
15Ω
25Ω
35Ω
45Ω
IC, COLLECTOR CURRENT
RG, GATE RESISTOR
Figure 10. Typical switching times as a
function of gate resistor
Figure 9. Typical switching times as a
function of collector current
(inductive load, TJ=150°C,
(inductive load, TJ=150°C,
VCE=600V, VGE=0/15V, RG=15ꢀ,
Dynamic test circuit in Figure E)
VCE=600V, VGE=0/15V, IC=40A,
Dynamic test circuit in Figure E)
td(off)
7V
6V
5V
4V
3V
2V
1V
0V
max.
typ.
100ns
tf
min.
td(on)
tr
10ns
-50°C
0°C
50°C
100°C
150°C
0°C
50°C
100°C
150°C
TJ, JUNCTION TEMPERATURE
TJ, JUNCTION TEMPERATURE
Figure 11. Typical switching times as a
Figure 12. Gate-emitter threshold voltage as
a function of junction temperature
(IC = 1.5mA)
function of junction temperature
(inductive load, VCE=600V,
VGE=0/15V, IC=40A, RG=15ꢀ,
Dynamic test circuit in Figure E)
7
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
*) Eon and Etsinclude losses
due to diode recovery
*) Eon and Ets include losses
due to diode recovery
Ets*
15 mJ
25,0mJ
20,0mJ
15,0mJ
10,0mJ
5,0mJ
Ets*
10 mJ
Eon*
Eoff
Eon*
Eoff
5 mJ
0,0mJ
0 mJ
10A 20A 30A 40A 50A 60A 70A
5Ω
15Ω
25Ω
35Ω
IC, COLLECTOR CURRENT
RG, GATE RESISTOR
Figure 13. Typical switching energy losses
as a function of collector current
(inductive load, TJ=150°C,
Figure 14. Typical switching energy losses
as a function of gate resistor
(inductive load, TJ=150°C,
VCE=600V, VGE=0/15V, RG=15ꢀ,
Dynamic test circuit in Figure E)
VCE=600V, VGE=0/15V, IC=40A,
Dynamic test circuit in Figure E)
*) Eon and Ets include losses
due to diode recovery
*) Eon and Ets include losses
due to diode recovery
15mJ
15mJ
Ets*
10mJ
5mJ
0mJ
10mJ
Ets*
Eoff
5mJ
Eoff
Eon*
Eon*
0mJ
50°C
100°C
150°C
400V
500V
600V
700V
800V
TJ, JUNCTION TEMPERATURE
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 16. Typical switching energy losses
as a function of collector emitter
voltage
Figure 15. Typical switching energy losses
as a function of junction
temperature
(inductive load, VCE=600V,
VGE=0/15V, IC=40A, RG=15ꢀ,
Dynamic test circuit in Figure E)
(inductive load, TJ=150°C,
VGE=0/15V, IC=40A, RG=15ꢀ,
Dynamic test circuit in Figure E)
8
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
Ciss
15V
10V
5V
1nF
100pF
10pF
240V
960V
Coss
Crss
0V
0V
10V
20V
0nC
50nC
100nC 150nC 200nC 250nC
QGE, GATE CHARGE
Figure 17. Typical gate charge
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 18. Typical capacitance as a function
(IC=40 A)
of collector-emitter voltage
(VGE=0V, f = 1 MHz)
15µs
10µs
5µs
300A
200A
100A
0A
0µs
12V
14V
16V
12V
14V
16V
18V
VGE, GATE-EMITTETR VOLTAGE
VGE, GATE-EMITTETR VOLTAGE
Figure 20. Typical short circuit collector
current as a function of gate-
emitter voltage
Figure 19. Short circuit withstand time as a
function of gate-emitter voltage
(VCE=600V, start at TJ=25°C)
(VCE ≤ 600V, Tj ≤ 150°C)
9
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
VCE
600V
400V
200V
0V
600V
400V
200V
0V
60A
40A
20A
0A
60A
40A
20A
0A
IC
VCE
IC
0us
0us
0.5us
1us
1.5us
0.5us
1us
1.5us
t, TIME
t, TIME
Figure 21. Typical turn on behavior
(VGE=0/15V, RG=15ꢀ, Tj = 150°C,
Dynamic test circuit in Figure E)
Figure 22. Typical turn off behavior
(VGE=15/0V, RG=15ꢀ, Tj = 150°C,
Dynamic test circuit in Figure E)
D=0.5
D=0.5
0.2
0.1
0.2
10-1K/W
10-1K/W
10-2K/W
10-3K/W
R , ( K / W )
0.228
τ , ( s ) =
1.01*10-1
1.15*10-2
1.30*10-3
1.53*10-4
0.1
0.05
0.257
R , ( K / W )
0.159
τ , ( s ) =
1.10*10-1
1.56*10-2
1.35*10-3
1.51*10-4
0.02
0.01
single pulse
0.238
0.05
0.087
0.133
0.02
0.01
0.120
R1
R2
0.038
10-2K/W
10-3K/W
single pulse
R1
R2
C1=τ1/R1 C2=τ2/R2
C1=τ1/R1 C2=τ2/R2
10µs
100µs
1ms
10ms
100ms
10µs
100µs
1ms
10ms
100ms
tP, PULSE WIDTH
Figure 23. IGBT transient thermal resistance
tP, PULSE WIDTH
Figure 24. Diode transient thermal
(D = tp / T)
impedance as a function of pulse
width
(D=tP/T)
10
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
8µC
6µC
4µC
TJ=150°C
600ns
500ns
400ns
300ns
200ns
100ns
0ns
TJ=150°C
TJ=25°C
2µC
0µC
TJ=25°C
400A/µs
600A/µs
800A/µs 1000A/µs
400A/µs
600A/µs
800A/µs
1000A/µs
diF/dt, DIODE CURRENT SLOPE
diF/dt, DIODE CURRENT SLOPE
Figure 24. Typical reverse recovery charge
as a function of diode current
slope
Figure 23. Typical reverse recovery time as
a function of diode current slope
(VR=600V, IF=40A,
Dynamic test circuit in Figure E)
(VR=600V, IF=40A,
Dynamic test circuit in Figure E)
TJ=25°C
40A
-400A/µs
-300A/µs
-200A/µs
-100A/µs
-0A/µs
TJ=150°C
35A
TJ=150°C
30A
TJ=25°C
25A
20A
15A
10A
5A
0A
400A/µs
600A/µs
800A/µs
1000A/µs
400A/µs
600A/µs
800A/µs
1000A/µs
diF/dt, DIODE CURRENT SLOPE
Figure 25. Typical reverse recovery current
as a function of diode current
slope
diF/dt, DIODE CURRENT SLOPE
Figure 26. Typical diode peak rate of fall of
reverse recovery current as a
function of diode current slope
(VR=600V, IF=40A,
(VR=600V, IF=40A,
Dynamic test circuit in Figure E)
Dynamic test circuit in Figure E)
11
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
100A
80A
60A
40A
20A
0A
TJ=25°C
IF=80A
150°C
2,0V
1,5V
1,0V
0,5V
0,0V
40A
25A
10A
-50°C
0°C
50°C
100°C
0V
1V
2V
VF, FORWARD VOLTAGE
Figure 27. Typical diode forward current as
a function of forward voltage
TJ, JUNCTION TEMPERATURE
Figure 28. Typical diode forward voltage as a
function of junction temperature
12
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
dimensions
TO-247AC
symbol
[mm]
[inch]
min
4.78
2.29
1.78
1.09
1.73
2.67
max
5.28
2.51
2.29
1.32
2.06
3.18
min
max
A
B
C
D
E
F
0.1882 0.2079
0.0902 0.0988
0.0701 0.0902
0.0429 0.0520
0.0681 0.0811
0.1051 0.1252
0.0299 max
0.8189 0.8331
0.6161 0.6358
0.2051 0.2252
0.7799 0.8142
0.1402 0.1941
0.1421
G
H
K
L
0.76 max
20.80
15.65
5.21
21.16
16.15
5.72
M
N
P
Q
19.81
3.560
20.68
4.930
3.61
6.12
6.22
0.2409 0.2449
13
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
i,v
tr r =tS +tF
diF /dt
Qr r =QS +QF
tr r
IF
tS
tF
t
QS
10% Ir r m
QF
Ir r m
dir r /dt
90% Ir r m
VR
Figure C. Definition of diodes
switching characteristics
τ1
τ
r22
τn
r1
r n
T (t)
j
p(t)
r 2
r1
rn
Figure A. Definition of switching times
T
C
Figure D. Thermal equivalent
circuit
Figure E. Dynamic test circuit
Leakage inductance Lσ =180nH
and Stray capacity Cσ =39pF.
Figure B. Definition of switching losses
14
Preliminary / Rev. 1 Jul-02
Power Semiconductors
IKW40T120
TrenchStop Series
Published by
Infineon Technologies AG,
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St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
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Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).
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Due to technical requirements components may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or
systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
15
Preliminary / Rev. 1 Jul-02
Power Semiconductors
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