IPA180N10N3GXKSA1 [INFINEON]
Power Field-Effect Transistor, 28A I(D), 100V, 0.018ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, GREEN, PLASTIC, TO-220FP, 3 PIN;
| 型号： | IPA180N10N3GXKSA1 |
| 厂家： | 
Infineon |
| 描述： | Power Field-Effect Transistor, 28A I(D), 100V, 0.018ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, GREEN, PLASTIC, TO-220FP, 3 PIN 局域网 开关 脉冲 晶体管 |
| 文件： | 总9页 (文件大小：319K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IPA180N10N3 G
OptiMOSTM3 Power-Transistor
Product Summary
Features
VDS
100
18
V
• N-channel, normal level
RDS(on),max
ID
mW
A
• Excellent gate charge x R DS(on) product (FOM)
• Very low on-resistance R DS(on)
28
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC1) for target application
• Ideal for high-frequency switching and synchronous rectification
Type
IPA180N10N3 G
Package
Marking
PG-TO220-FP
180N10N
Maximum ratings, at T j=25 °C, unless otherwise specified
Value
Parameter
Symbol Conditions
Unit
T C=25 °C2)
I D
Continuous drain current
28
20
A
T C=100 °C
Pulsed drain current2)
I D,pulse
E AS
T C=25 °C
112
I D=28 A, R GS=25 W
Avalanche energy, single pulse
Gate source voltage
59
mJ
V
V GS
±20
P tot
T C=25 °C
Power dissipation
30
W
°C
T j, T stg
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
-55 ... 175
55/175/56
1)J-STD20 and JESD22
2) See figure 3
Rev. 2.3
page 1
2013-08-27
IPA180N10N3 G
Values
Parameter
Symbol Conditions
Unit
min.
typ.
max.
Thermal characteristics
R thJC
Thermal resistance, junction - case
-
-
5
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
V (BR)DSS V GS=0 V, I D=1 mA
V GS(th) V DS=V GS, I D=35 µA
Drain-source breakdown voltage
Gate threshold voltage
100
2
-
-
V
2.7
3.5
V DS=100 V, V GS=0 V,
T j=25 °C
I DSS
Zero gate voltage drain current
-
-
0.1
10
1
µA
V DS=100 V, V GS=0 V,
T j=125 °C
100
I GSS
V GS=20 V, V DS=0 V
Gate-source leakage current
-
-
1
100 nA
R DS(on) V GS=10 V, I D=28 A
Drain-source on-state resistance
15.5
18
mW
V GS=6 V, I D=14 A
-
-
19.2
1.4
33
-
R G
Gate resistance
W
|V DS|>2|I D|R DS(on)max
I D=28 A
,
g fs
Transconductance
19
37
-
S
3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 2.3
page 2
2013-08-27
IPA180N10N3 G
Values
Parameter
Symbol Conditions
Unit
min.
typ.
max.
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
C iss
-
-
-
-
-
-
-
1350
237
11
11
5
1800 pF
V GS=0 V, V DS=50 V,
f =1 MHz
C oss
C rss
t d(on)
t r
315
-
-
-
-
-
ns
V DD=50 V, V GS=10 V,
I D=28 A, R G,ext=1.6 W
t d(off)
t f
Turn-off delay time
Fall time
18
3
Gate Charge Characteristics4)
Gate to source charge
Gate to drain charge
Switching charge
Q gs
-
-
-
-
-
-
7
4
-
-
nC
Q gd
V DD=50 V, I D=28 A,
V GS=0 to 10 V
Q sw
Q g
6
-
Gate charge total
19
4.8
25
25
-
V plateau
Q oss
Gate plateau voltage
Output charge
V
V DD=50 V, V GS=0 V
33
nC
Reverse Diode
I S
Diode continous forward current
Diode pulse current
-
-
-
-
28
A
T C=25 °C
I S,pulse
112
V GS=0 V, I F=28 A,
T j=25 °C
V SD
Diode forward voltage
-
0.9
1.2
-
V
t rr
Reverse recovery time
-
-
57
94
ns
V R=50 V, I F=28A ,
di F/dt =100 A/µs
Q rr
Reverse recovery charge
nC
4) See figure 16 for gate charge parameter definition
Rev. 2.3
page 3
2013-08-27
IPA180N10N3 G
1 Power dissipation
2 Drain current
P tot=f(T C)
I D=f(T C); V GS≥10 V
40
35
30
25
20
15
10
5
30
25
20
15
10
5
0
0
0
50
100
150
200
0
50
100
150
200
TC [°C]
TC [°C]
3 Safe operating area
I D=f(V DS); T C=25 °C; D =0
parameter: t p
4 Max. transient thermal impedance
Z thJC=f(t p)
parameter: D =t p/T
103
101
limited by on-state
resistance
0.5
0.2
1 µs
102
10 µs
100 µs
100
0.1
0.05
0.02
101
1 ms
0.01
single pulse
DC
10-1
10 ms
100
10-1
10-2
10-1
100
101
102
103
10-5
10-4
10-3
10-2
10-1
100
101
tp [s]
VDS [V]
Rev. 2.3
page 4
2013-08-27
IPA180N10N3 G
5 Typ. output characteristics
I D=f(V DS); T j=25 °C
6 Typ. drain-source on resistance
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
120
30
4.5 V
5 V
100
25
10 V
6 V
80
20
15
10
5
7.5 V
7.5 V
10 V
60
5.5 V
40
20
0
5 V
4.5 V
0
0
1
2
3
0
20
40
60
VDS [V]
ID [A]
7 Typ. transfer characteristics
I D=f(V GS); |V DS|>2|I D|R DS(on)max
parameter: T j
8 Typ. forward transconductance
g fs=f(I D); T j=25 °C
60
50
40
30
20
10
60
50
40
30
20
10
0
25 °C
175 °C
0
0
2
4
6
8
0
20
40
60
80
VGS [V]
ID [A]
Rev. 2.3
page 5
2013-08-27
IPA180N10N3 G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
V GS(th)=f(T j); V GS=V DS
parameter: I D
R DS(on)=f(T j); I D=28 A; V GS=10 V
40
36
32
28
4
3.5
3
350 µA
2.5
24
35 µA
98 %
20
2
1.5
1
typ
16
12
8
0.5
0
4
0
-60
-20
20
60
100
140
180
-60
-20
20
60
100
140
180
Tj [°C]
Tj [°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
I F=f(V SD
C =f(V DS); V GS=0 V; f =1 MHz
)
parameter: T j
104
103
Ciss
103
102
101
102
Coss
25 °C
175 °C, 98%
101
Crss
175 °C
25 °C, 98%
100
0
0
20
40
VDS [V]
60
80
0.5
1
1.5
2
VSD [V]
Rev. 2.3
page 6
2013-08-27
IPA180N10N3 G
13 Avalanche characteristics
14 Typ. gate charge
V GS=f(Q gate); I D=28 A pulsed
parameter: V DD
I AS=f(t AV); R GS=25 W
parameter: T j(start)
100
10
8
80 V
50 V
20 V
6
25 °C
10
100 °C
4
150 °C
2
1
0
1
10
100
1000
0
4
8
12
16
20
tAV [µs]
Qgate [nC]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V BR(DSS)=f(T j); I D=1 mA
110
105
100
95
V GS
Qg
V gs(th)
Qg(th)
Qsw
Qgd
Qgate
Qgs
90
-60
-20
20
60
100
140
180
Tj [°C]
Rev. 2.3
page 7
2013-08-27
IPA180N10N3 G
PG-TO220-FP
Rev. 2.3
page 8
2013-08-27
IPA180N10N3 G
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
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conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev. 2.3
page 9
2013-08-27
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