IPB108N15N3G [INFINEON]
OptiMOSTM3 Power-Transistor Features Excellent gate charge x R DS(on) product (FOM); OptiMOSTM3电源晶体管特性优良的栅极电荷X R DS （ ON）的乘积（ FOM ）
| 型号： | IPB108N15N3G |
| 厂家： | 
Infineon |
| 描述： | OptiMOSTM3 Power-Transistor Features Excellent gate charge x R DS(on) product (FOM) |
| 文件： | 总11页 (文件大小：434K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
OptiMOSTM3 Power-Transistor
Product Summary
Features
V DS
150
10.8
83
V
• N-channel, normal level
R DS(on),max (TO263)
I D
mΩ
A
• Excellent gate charge x R DS(on) product (FOM)
• Very low on-resistance R DS(on)
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant; Halogen free
• Qualified according to JEDEC1) for target application
• Ideal for high-frequency switching and synchronous rectification
•Halogen-free according to IEC61249-2-21
Type
IPB108N15N3 G
IPP111N15N3 G
IPI111N15N3 G
Package
Marking
PG-TO263-3
108N15N
PG-TO220-3
111N15N
PG-TO262-3
111N15N
Maximum ratings, at T j=25 °C, unless otherwise specified
Value
Parameter
Symbol Conditions
Unit
I D
T C=25 °C
T C=100 °C
T C=25 °C
Continuous drain current
83
59
A
Pulsed drain current2)
I D,pulse
E AS
332
I D=83 A, R GS=25 Ω
Avalanche energy, single pulse
Gate source voltage
330
mJ
V
V GS
±20
P tot
T C=25 °C
Power dissipation
214
W
°C
T j, T stg
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
-55 ... 175
55/175/56
1)J-STD20 and JESD22
2) See figure 3
Rev. 2.1
page 1
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
Values
typ.
Parameter
Symbol Conditions
Unit
min.
max.
Thermal characteristics
R thJC
Thermal resistance, junction - case
-
-
-
-
-
-
0.7
62
40
K/W
R thJA
minimal footprint
Thermal resistance, junction -
ambient
6 cm2 cooling area3)
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
V (BR)DSS V GS=0 V, I D=1 mA
Drain-source breakdown voltage
Gate threshold voltage
150
2
-
-
V
V GS(th)
V DS=V GS, I D=160 µA
3
4
V DS=120 V, V GS=0 V,
T j=25 °C
I DSS
Zero gate voltage drain current
-
0.1
1
µA
V
DS=120 V, V GS=0 V,
-
-
-
10
1
100
T j=125 °C
I GSS
V GS=20 V, V DS=0 V
Gate-source leakage current
100 nA
V GS=10 V, I D=83 A,
R DS(on)
Drain-source on-state resistance
9.4
11.1
10.8
11.3
mΩ
(TO220; TO262)
V GS=10 V, I D=83 A,
-
-
9.1
9.5
(TO263)
V
GS=8 V, I D=41 A,
(TO220; TO262)
V
GS=8 V, I D=41 A,
-
-
9.2
2.4
94
11
-
(TO263)
R G
g fs
Gate resistance
Ω
|V DS|>2|I D|R DS(on)max
I D=83 A
,
Transconductance
47
-
S
2
3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 2.1
page 2
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
Values
typ.
Parameter
Symbol Conditions
Unit
min.
max.
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
C iss
-
-
-
-
-
-
-
3230
378
7
-
-
-
-
-
-
-
pF
ns
V GS=0 V, V DS=75 V,
f =1 MHz
C oss
C rss
t d(on)
t r
17
35
32
9
V
DD=75 V, V GS=10 V,
I D=83 A, R G=1.6 Ω
t d(off)
t f
Turn-off delay time
Fall time
Gate Charge Characteristics4)
Gate to source charge
Gate to drain charge
Switching charge
Q gs
-
-
-
-
-
-
18
7
-
-
nC
Q gd
V DD=75 V, I D=83 A,
GS=0 to 10 V
Q sw
Q g
16
41
5.7
106
-
V
Gate charge total
55
-
V plateau
Q oss
Gate plateau voltage
Output charge
V
V DD=75 V, V GS=0 V
141 nC
Reverse Diode
I S
Diode continous forward current
Diode pulse current
-
-
-
-
83
A
T C=25 °C
I S,pulse
332
V GS=0 V, I F=83 A,
T j=25 °C
V SD
Diode forward voltage
-
1
1.2
V
t rr
Reverse recovery time
-
-
132
415
-
-
ns
V R=75 V, I F=I S,
di F/dt =100 A/µs
Q rr
Reverse recovery charge
nC
4) See figure 16 for gate charge parameter definition
5) Plotted values correspond to IPP11N15N3 G and IPI111N15N3 G. Corresponding values for
IPB108N15N3 G are 0.3mΩ lower
Rev. 2.1
page 3
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
1 Power dissipation
2 Drain current
P
tot=f(T C)
I D=f(T C); V GS≥10 V
240
100
200
80
60
40
20
0
160
120
80
40
0
0
50
100
150
200
0
50
100
150
200
T C [°C]
T C [°C]
3 Safe operating area
I D=f(V DS); T C=25 °C; D =0
parameter: t p
4 Max. transient thermal impedance
Z thJC=f(t p)
parameter: D =t p/T
103
102
101
100
10-1
100
1 µs
10 µs
0.5
0.2
100 µs
10-1
1 ms
0.1
0.05
0.02
10 ms
DC
0.01
single pulse
10-2
10-5
10-4
10-3
10-2
10-1
100
10-1
100
101
102
103
t p [s]
V DS [V]
Rev. 2.1
page 4
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
6 Typ. drain-source on resistance 5)
5 Typ. output characteristics
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
200
20
8 V
5 V
7 V
10 V
5.5 V
6.5 V
6 V
150
100
50
15
6 V
8 V
10
10 V
5.5 V
5
5 V
4.5 V
0
0
0
1
2
3
4
5
0
20
40
60
ID [A]
80
100
120
V DS [V]
7 Typ. transfer characteristics
I D=f(V GS); |V DS|>2|I D|R DS(on)max
parameter: T j
8 Typ. forward transconductance
g fs=f(I D); T j=25 °C
200
150
100
50
120
100
80
60
40
20
0
25 °C
175 °C
0
0
2
4
6
8
0
40
80
120
ID [A]
V GS [V]
Rev. 2.1
page 5
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R
DS(on)=f(T j); I D=83 A; V GS=10 V
V GS(th)=f(T j); V GS=V DS
parameter: I D
35
30
25
20
4
3.5
3
1600 µA
160 µA
2.5
2
98%
15
1.5
1
typ
10
5
0.5
0
0
-60
-20
20
60
100
140
180
-60
-20
20
60
T j [°C]
100
140
180
T j [°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
I F=f(V SD
C =f(V DS); V GS=0 V; f =1 MHz
)
parameter: T j
104
103
Ciss
103
Coss
102
175 °C
25°C, 98%
102
175°C, 98%
25 °C
101
101
Crss
100
0
0.5
1
1.5
2
0
20
40
60
80
100
V SD [V]
V DS [V]
Rev. 2.1
page 6
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
13 Avalanche characteristics
AS=f(t AV); R GS=25 Ω
14 Typ. gate charge
GS=f(Q gate); I D=83 A pulsed
V
I
parameter: T j(start)
parameter: V DD
100
10
120 V
25 °C
100 °C
8
6
4
2
75 V
125 °C
30 V
10
1
1
0
0
10
100
1000
10
20
30
40
50
Q gate [nC]
t AV [µs]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V
BR(DSS)=f(T j); I D=1 mA
170
165
160
155
150
145
140
135
V GS
Q g
V gs(th)
Q g(th)
Q sw
Q gd
Q gate
Q gs
-60
-20
20
60
100
140
180
T j [°C]
Rev. 2.1
page 7
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
PG-TO220-3: Outline
Rev. 2.1
page 8
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
PG-TO263-3: Outline
Rev. 2.1
page 9
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
PG-TO262-3: Outline
Rev. 2.1
page 10
2009-12-01
IPB108N15N3 G IPP111N15N3 G
IPI111N15N3 G
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev. 2.1
page 11
2009-12-01
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