IPB120N10S4-05 [INFINEON]

车规级MOSFET;
IPB120N10S4-05
型号: IPB120N10S4-05
厂家: Infineon    Infineon
描述:

车规级MOSFET

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中文:  中文翻译
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IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
OptiMOS®-T2 Power-Transistor  
Product Summary  
VDS  
100  
5.0  
V
RDS(on),max (SMD version)  
mW  
A
ID  
120  
Features  
• N-channel - Normal Level - Enhancement mode  
PG-TO263-3-2  
PG-TO262-3-1  
PG-TO220-3-1  
• AEC Q101 qualified  
• MSL1 up to 260°C peak reflow  
• 175°C operating temperature  
• Green Product (RoHS compliant)  
• 100% Avalanche tested  
Type  
Package  
Marking  
4N1005  
4N1005  
4N1005  
IPB120N10S4-05  
IPI120N10S4-05  
IPP120N10S4-05  
PG-TO263-3-2  
PG-TO262-3-1  
PG-TO220-3-1  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol  
Conditions  
Unit  
T C=25°C, V GS=10V1)  
I D  
Continuous drain current  
120  
95  
A
T C=100°C, V GS=10V2)  
Pulsed drain current2)  
I D,pulse  
E AS  
T C=25°C  
480  
330  
120  
±20  
190  
Avalanche energy, single pulse2)  
Avalanche current, single pulse  
Gate source voltage  
I D=60A  
mJ  
A
I AS  
-
V GS  
-
V
P tot  
T C=25°C  
Power dissipation  
W
T j, T stg  
Operating and storage temperature  
-
-55 ... +175  
°C  
Rev.1.0  
page 1  
2014-07-01  
IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
Values  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Thermal characteristics2)  
R thJC  
R thJA  
R thJA  
Thermal resistance, junction - case  
-
-
-
-
-
-
0.8  
62  
K/W  
Thermal resistance, junction -  
ambient, leaded  
SMD version, device on PCB  
minimal footprint  
-
-
-
-
62  
40  
6 cm2 cooling area3)  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS V GS=0V, I D= 1mA  
V GS(th) V DS=V GS, I D=120µA  
Drain-source breakdown voltage  
Gate threshold voltage  
100  
2.0  
-
-
-
3.5  
1
V
2.7  
0.1  
I DSS  
V DS=100V, V GS=0V  
Zero gate voltage drain current  
µA  
V DS=100V, V GS=0V,  
T j=125°C2)  
-
10  
100  
I GSS  
V GS=20V, V DS=0V  
Gate-source leakage current  
-
-
-
100 nA  
R DS(on) V GS=10V, I D=100A  
Drain-source on-state resistance  
4.5  
5.3  
5.0  
mW  
V GS=10V, I D=100A,  
SMD version  
-
4.2  
Rev.1.0  
page 2  
2014-07-01  
IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
Values  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Dynamic characteristics2)  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C iss  
C oss  
Crss  
t d(on)  
t r  
-
-
-
-
-
-
-
5030  
1600  
100  
15  
6540 pF  
2080  
V GS=0V, V DS=25V,  
f =1MHz  
200  
-
-
-
-
ns  
10  
V DD=50V, V GS=10V,  
I D=120A, R G=3.5W  
t d(off)  
t f  
Turn-off delay time  
Fall time  
30  
35  
Gate Charge Characteristics2)  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
24  
14  
70  
4.9  
31  
28  
91  
-
nC  
Q gd  
V DD=80V, I D=120A,  
V GS=0 to 10V  
Q g  
V plateau  
Gate plateau voltage  
V
A
Reverse Diode  
Diode continous forward current2)  
Diode pulse current2)  
I S  
-
-
-
-
120  
480  
T C=25°C  
I S,pulse  
V GS=0V, I F=100A,  
T j=25°C  
V SD  
Diode forward voltage  
Reverse recovery time2)  
Reverse recovery charge2)  
-
-
-
1.0  
65  
1.3  
V
V R=50V, I F=50A,  
di F/dt =100A/µs  
t rr  
-
-
ns  
nC  
Q rr  
130  
1) Current is limited by bondwire; with an R thJC = 0.8K/W the chip is able to carry 134A at 25°C.  
2) Specified by design. Not subject to production test.  
3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
Rev.1.0  
page 3  
2014-07-01  
IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
1 Power dissipation  
2 Drain current  
P tot = f(T C); V GS = 10 V  
I D = f(T C); V GS = 10 V; SMD  
300  
250  
200  
150  
100  
50  
140  
120  
100  
80  
60  
40  
20  
0
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
TC [°C]  
TC [°C]  
3 Safe operating area  
4 Max. transient thermal impedance  
Z thJC = f(t p)  
I D = f(V DS); T C = 25 °C; D = 0; SMD  
parameter: t p  
parameter: D =t p/T  
101  
1000  
1 µs  
10 µs  
100  
100 µs  
1 ms  
100  
0.5  
10-1  
0.1  
0.05  
10  
0.01  
10-2  
single pulse  
10-3  
1
0.1  
1
10  
100  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
VDS [V]  
tp [s]  
Rev.1.0  
page 4  
2014-07-01  
IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
5 Typ. output characteristics  
I D = f(V DS); T j = 25 °C; SMD  
parameter: V GS  
6 Typ. drain-source on-state resistance  
R DS(on) = f(I D); T j = 25 °C; SMD  
parameter: V GS  
480  
14  
5 V  
6 V  
5.5 V  
10 V  
7 V  
12  
10  
8
360  
240  
120  
0
6 V  
5.5 V  
6
7 V  
5 V  
10 V  
4
2
0
1
2
3
4
5
0
120  
240  
360  
480  
VDS [V]  
ID [A]  
7 Typ. transfer characteristics  
I D = f(V GS); V DS = 6V  
parameter: T j  
8 Typ. drain-source on-state resistance  
R DS(on) = f(T j); I D = 100 A; V GS = 10 V; SMD  
480  
360  
240  
120  
0
10  
9
-55 °C  
25 °C  
8
175 °C  
7
6
5
4
3
2
3
4
5
6
7
-60  
-20  
20  
60  
100  
140  
180  
VGS [V]  
Tj [°C]  
Rev.1.0  
page 5  
2014-07-01  
IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
9 Typ. gate threshold voltage  
V GS(th) = f(T j); V GS = V DS  
parameter: I D  
10 Typ. capacitances  
C = f(V DS); V GS = 0 V; f = 1 MHz  
104  
4
3.5  
3
Ciss  
Coss  
103  
102  
101  
1200 µA  
2.5  
120 µA  
2
1.5  
1
Crss  
0
5
10  
15  
20  
25  
30  
-60  
-20  
20  
60  
100  
140  
180  
VDS [V]  
Tj [°C]  
11 Typical forward diode characteristicis  
12 Avalanche characteristics  
I A S= f(t AV  
I F = f(VSD)  
)
parameter: T j  
parameter: Tj(start)  
103  
1000  
102  
100  
25 °C  
100 °C  
150 °C  
175 °C  
25 °C  
101  
10  
100  
1
1
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
10  
100  
1000  
VSD [V]  
tAV [µs]  
Rev.1.0  
page 6  
2014-07-01  
IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
13 Avalanche energy  
E AS = f(T j)  
14 Drain-source breakdown voltage  
V BR(DSS) = f(T j); I D = 1 mA  
parameter: I D  
110  
108  
106  
104  
102  
100  
98  
800  
600  
30 A  
400  
60 A  
200  
120 A  
96  
94  
0
-55  
-15  
25  
65  
105  
145  
25  
75  
125  
175  
Tj [°C]  
Tj [°C]  
15 Typ. gate charge  
16 Gate charge waveforms  
V GS = f(Q gate); I D = 120 A pulsed  
parameter: V DD  
10  
9
8
7
6
5
4
3
2
1
0
V GS  
20 V  
Q g  
80 V  
V gs(th)  
Q g(th)  
Q sw  
Q gd  
Q gate  
Q gs  
0
20  
40  
60  
80  
Qgate [nC]  
Rev.1.0  
page 7  
2014-07-01  
IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© Infineon Technologies AG 2014  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions  
or characteristics. With respect to any examples or hints given herein, any typical values stated  
herein and/or any information regarding the application of the device, Infineon Technologies hereby  
disclaims any and all warranties and liabilities of any kind, including without limitation, warranties  
of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact  
the nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the  
express written approval of Infineon Technologies, if a failure of such components can reasonably be  
expected to cause the failure of that life-support device or system or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be implanted  
in the human body or to support and/or maintain and sustain and/or protect human life.  
If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.  
Rev.1.0  
page 8  
2014-07-01  
IPB120N10S4-05  
IPI120N10S4-05, IPP120N10S4-05  
Revision History  
Version  
Date  
Changes  
Revision 1.0  
01.07.2014 Data Sheet Revision 1.0  
Rev.1.0  
page 9  
2014-07-01  

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