IPB160N04S3-H2 [INFINEON]
OptiMOS-T Power-Transistor; 的OptiMOS -T电源晶体管
| 型号： | IPB160N04S3-H2 |
| 厂家： | 
Infineon |
| 描述： | OptiMOS-T Power-Transistor |
| 文件： | 总9页 (文件大小：193K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IPB160N04S3-H2
OptiMOS®-T Power-Transistor
Product Summary
VDS
R DS(on)
I D
40
2.1
160
V
mΩ
A
Features
• N-channel - Enhancement mode
PG-TO263-7-3
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green package (RoHS compliant)
• Ultra low Rds(on)
• 100% Avalanche tested
Type
Package
Marking
IPB160N04S3-H2
PG-TO263-7-3
3QN04H2
Maximum ratings, at T j=25 °C, unless otherwise specified
Value
Parameter
Symbol
Conditions
Unit
T C=25°C, VGS=10V1)
I D
Continuous drain current
160
157
A
T C=100 °C,
V
GS=10 V2)
Pulsed drain current2)
I D,pulse
EAS
T C=25 °C
I D=80 A
640
898
Avalanche energy, single pulse
Gate source voltage
mJ
V
VGS
±20
Ptot
T C=25 °C
Power dissipation
214
W
°C
T j, T stg
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
-55 ... +175
55/175/56
Rev. 1.0
page 1
2007-04-16
IPB160N04S3-H2
Values
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Thermal characteristics2)
R thJC
R thJA
Thermal resistance, junction - case
SMD version, device on PCB
-
-
-
-
-
-
0.7
62
40
K/W
minimal footprint
6 cm2 cooling area3)
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
V(BR)DSS
VGS(th)
V
V
GS=0 V, I D= 1 mA
Drain-source breakdown voltage
Gate threshold voltage
40
-
-
V
DS=VGS, I D=150 µA
2.1
3.0
4.0
V
DS=40 V, VGS=0 V,
I DSS
Zero gate voltage drain current
-
-
-
-
1
µA
T j=25 °C
V
DS=40 V, VGS=0 V,
100
T j=125 °C2)
I GSS
V
V
GS=20 V, VDS=0 V
GS=10 V, I D=80 A
Gate-source leakage current
-
-
-
100 nA
RDS(on)
Drain-source on-state resistance
1.6
2.1
mΩ
Rev. 1.0
page 2
2007-04-16
IPB160N04S3-H2
Values
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Dynamic characteristics2)
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
C iss
C oss
Crss
t d(on)
t r
-
-
-
-
-
-
-
7400
2000
310
30
9600 pF
2600
V
GS=0 V, VDS=25 V,
f =1 MHz
465
-
-
-
-
ns
16
V
DD=20 V, VGS=10 V,
I D=80 A, R G=3.3 Ω
t d(off)
t f
Turn-off delay time
Fall time
46
17
Gate Charge Characteristics2)
Gate to source charge
Gate to drain charge
Gate charge total
Q gs
-
-
-
-
38
25
50
45
145
-
nC
Q gd
V
V
DD=32 V, I D=80 A,
GS=0 to 10 V
Q g
110
5.2
Vplateau
Gate plateau voltage
V
A
Reverse Diode
Diode continous forward current2)
Diode pulse current2)
I S
-
-
-
-
160
640
T C=25 °C
I S,pulse
V
GS=0 V, I F=80 A,
VSD
Diode forward voltage
-
0.85
1.3
V
T j=25 °C
Reverse recovery time2)
Reverse recovery charge2)
t rr
-
-
60
95
-
-
ns
VR=20 V, I F=50A,
diF/dt =100 A/µs
Q rr
nC
1) Current is limited by bondwire; with an R thJC = 0.7 K/W the chip is able to carry 221 A at 25°C. For detailed
information see Application Note ANPS071E at www.infineon.com/optimos
2) Defined by design. Not subject to production test.
3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.0
page 3
2007-04-16
IPB160N04S3-H2
1 Power dissipation
2 Drain current
P
tot = f(T C); VGS ≥ 6 V
I D = f(T C); VGS ≥ 6 V
250
180
160
140
120
100
80
200
150
100
50
60
40
20
0
0
0
50
100
150
200
0
50
100
150
200
T
C [°C]
T
C [°C]
3 Safe operating area
4 Max. transient thermal impedance
thJC = f(t p)
I D = f(VDS); T C = 25 °C; D = 0
parameter: t p
Z
parameter: D =t p/T
100
1000
100
10
1 µs
0.5
10 µs
100 µs
10-1
0.1
0.05
1 ms
0.01
10-2
single pulse
10-3
10-6
10-5
10-4
10-3
10-2
10-1
100
0.1
1
10
100
t
p [s]
V
DS [V]
Rev. 1.0
page 4
2007-04-16
IPB160N04S3-H2
5 Typ. output characteristics
I D = f(VDS); T j = 25 °C
parameter: VGS
6 Typ. drain-source on-state resistance
DS(on) = (I D); T j = 25 °C
R
parameter: VGS
14
10 V
6 V
5.5 V
6.5 V
7 V
600
7 V
12
10
8
500
400
300
200
100
0
6.5 V
6
6 V
4
5.5 V
5 V
2
10 V
0
0
100
200
300
D [A]
400
500
600
0
2
4
6
V
DS [V]
I
7 Typ. transfer characteristics
I D = f(VGS); VDS = 6V
parameter: T j
8 Typ. drain-source on-state resistance
R
DS(on) = f(T j); I D = 80 A; VGS = 10 V
3
600
500
400
300
2.5
2
200
1.5
1
175 °C
100
25 °C
-55 °C
0
-60
-20
20
60
T j [°C]
100
140
180
2
3
4
5
6
7
8
V
GS [V]
Rev. 1.0
page 5
2007-04-16
IPB160N04S3-H2
9 Typ. gate threshold voltage
GS(th) = f(T j); VGS = VDS
10 Typ. capacitances
V
C = f(VDS); VGS = 0 V; f = 1 MHz
parameter: I D
105
104
103
4
3.5
3
1500µA
Ciss
150µA
2.5
2
Coss
1.5
Crss
1
0
5
10
15
20
25
30
-60
-20
20
60
T j [°C]
100
140
180
V
DS [V]
11 Typical forward diode characteristicis
12 Typ. avalanche characteristics
AS = f(t AV
IF = f(VSD)
I
)
parameter: T j
parameter: Tj(start)
103
1000
102
100
10
25°C
100°C
150°C
25 °C
175 °C
101
100
1
1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
10
100
1000
V
SD [V]
t
AV [µs]
Rev. 1.0
page 6
2007-04-16
IPB160N04S3-H2
13 Typical avalanche energy
AS = f(T j)
14 Drain-source breakdown voltage
E
V
BR(DSS) = f(T j); I D = 1 mA
parameter: I D
52
4000
3500
48
44
40
36
32
20 A
3000
2500
2000
40 A
1500
1000
80 A
500
0
-60
-20
20
60
100
140
180
25
75
125
175
T j [°C]
T j [°C]
15 Typ. gate charge
16 Gate charge waveforms
V
GS = f(Q gate); I D = 80 A pulsed
parameter: VDD
12
VGS
10
8
Qg
8 V
32 V
6
4
Qgate
2
Qgd
Qgs
0
0
20
40
60
80
100
120
Q
gate [nC]
Rev. 1.0
page 7
2007-04-16
IPB160N04S3-H2
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 2007
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions
or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including
without limitation warranties of non‑infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please
contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information
on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the
express written approval of Infineon Technologies, if a failure of such components can reasonably
be expected to cause the failure of that life-support device or system, or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be
implanted in the human body, or to support and/or maintain and sustain and/or protect human life.
If they fail, it is reasonable to assume that the health of the user or other persons may be
endangered.
Rev. 1.0
page 8
2007-04-16
IPB160N04S3-H2
Revision History
Version
Date
Changes
Rev. 1.0
page 9
2007-04-16
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