IPD90P03P404ATMA2 [INFINEON]
Power Field-Effect Transistor,;
| 型号： | IPD90P03P404ATMA2 |
| 厂家： | 
Infineon |
| 描述： | Power Field-Effect Transistor, |
| 文件： | 总9页 (文件大小：165K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IPD90P03P4-04
OptiMOS®-P2 Power-Transistor
Product Summary
VDS
R DS(on)
I D
-30
4.5
-90
V
mΩ
A
Features
• P-channel - Normal Level - Enhancement mode
• AEC qualified
PG-TO252-3-11
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green package (RoHS compliant)
• 100% Avalanche tested
Type
Package
Marking
IPD90P03P4-04
PG-TO252-3-11 4P0304
Maximum ratings, at T j=25 °C, unless otherwise specified
Value
Parameter
Symbol
Conditions
Unit
T C=25°C,
GS=-10V
Continuous drain current1)
I D
-90
-90
A
V
T C=100°C,
GS=-10V2)
V
Pulsed drain current2)
I D,pulse
EAS
I AS
T C=25°C
-360
370
-90
I D=-45A
Avalanche energy, single pulse
Avalanche current, single pulse
Gate source voltage
mJ
A
-
VGS
Ptot
-
±20
137
V
T C=25 °C
Power dissipation
W
°C
T j, T stg
-
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
-
-
-55 ... +175
55/175/56
Rev. 1.0
page 1
2008-07-30
IPD90P03P4-04
Values
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Thermal characteristics2)
R thJC
R thJA
Thermal resistance, junction - case
SMD version, device on PCB
-
-
-
-
-
-
-
1.1
62
40
K/W
minimal footprint
6 cm2 cooling area3)
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
V(BR)DSS
VGS(th)
V
V
GS=0V, I D= -1mA
Drain-source breakdown voltage
Gate threshold voltage
-30
-
-
V
DS=VGS, I D=-253µA
-2.0
-3.0
-4.0
V
DS=-24V, VGS=0V,
I DSS
Zero gate voltage drain current
-
-
-0.05
-20
-1
µA
T j=25°C
V
DS=-24V, VGS=0V,
-200
T j=125°C2)
I GSS
V
V
GS=-20V, VDS=0V
GS=-10V, I D=-90A
Gate-source leakage current
-
-
-
-100 nA
R DS(on)
Drain-source on-state resistance
3.6
4.5
mΩ
Rev. 1.0
page 2
2008-07-30
IPD90P03P4-04
Values
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Dynamic characteristics2)
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
C iss
C oss
Crss
t d(on)
t r
-
-
-
-
-
-
-
7900
2340
50
10300 pF
3040
V
GS=0V, VDS=-25V,
f =1MHz
100
35
-
-
-
-
ns
V
V
DD=-15V,
GS=-10V, I D=-90A,
10
t d(off)
t f
Turn-off delay time
Fall time
70
R G=3.5Ω
20
Gate Charge Characteristics2)
Gate to source charge
Gate to drain charge
Gate charge total
Q gs
-
-
-
-
42
10
55
20
130
-
nC
Q gd
V
V
DD=-24V, I D=-90A,
GS=0 to -10V
Q g
100
-5.3
Vplateau
Gate plateau voltage
V
A
Reverse Diode
Diode continous forward current2)
Diode pulse current2)
I S
-
-
-
-
-90
T C=25°C
I S,pulse
-360
V
GS=0V, I F=-90A,
VSD
Diode forward voltage
-
-
-1.3
V
T j=25°C
Reverse recovery time2)
Reverse recovery charge2)
t rr
-
-
50
70
-
-
ns
VR=-15V, I F=-50A,
diF/dt =-100A/µs
Q rr
nC
1) Current is limited by bondwire; with an R thJC = 1.1K/W the chip is able to carry -143A at 25°C.
2) Defined by design. Not subject to production test.
3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.0
page 3
2008-07-30
IPD90P03P4-04
1 Power dissipation
2 Drain current
P
tot = f(T C); VGS ≤ -6V
I D = f(T C); VGS ≤ -6V
160
140
120
100
80
100
80
60
40
20
0
60
40
20
0
0
50
100
150
200
0
50
100
150
200
T
C [°C]
T
C [°C]
3 Safe operating area
4 Max. transient thermal impedance
thJC = f(t p)
I D = f(VDS); T C = 25 °C; D = 0
parameter: t p
Z
parameter: D =t p/T
101
1000
100
10
1 µs
10 µs
100
100 µs
0.5
1 ms
0.1
10-1
0.05
0.01
10-2
single pulse
10-3
1
10-6
10-5
10-4
10-3
10-2
10-1
100
0.1
1
10
100
t
p [s]
-V DS [V]
Rev. 1.0
page 4
2008-07-30
IPD90P03P4-04
5 Typ. output characteristics
I D = f(VDS); T j = 25 °C
parameter: VGS
6 Typ. drain-source on-state resistance
DS(on) = (I D); T j = 25 °C
R
parameter: VGS
360
-5V
-5.5V
-6.5V
-6V
24
10V
8V
7V
21
18
15
12
9
6.5V
270
180
90
6V
-7V
6
-10V
3
0
0
0
90
180
-I D [A]
270
360
0
1
2
3
4
5
6
-V DS [V]
7 Typ. transfer characteristics
I D = f(VGS); VDS = -6V
parameter: T j
8 Typ. drain-source on-state resistance
R
DS(on) = f(T j); I D = -90 A; VGS = -10 V
360
270
180
90
6
-55 °C
175 °C
25 °C
5
4
3
2
0
-60
-20
20
60
T j [°C]
100
140
180
2
3
4
5
6
7
8
-V GS [V]
Rev. 1.0
page 5
2008-07-30
IPD90P03P4-04
9 Typ. gate threshold voltage
GS(th) = f(T j); VGS = VDS
10 Typ. capacitances
V
C = f(VDS); VGS = 0 V; f = 1 MHz
parameter: -I D
105
104
103
102
101
4
3.5
3
Ciss
2530µA
Coss
253µA
2.5
2
Crss
1.5
-60
0
5
10
15
20
25
30
-20
20
60
T j [°C]
100
140
180
-V DS [V]
11 Typical forward diode characteristicis
12 Avalanche characteristics
AS = f(t AV
IF = f(VSD)
I
)
parameter: T j
parameter: Tj(start)
103
100
25 °C
100 °C
150 °C
102
10
25 °C
175 °C
101
100
1
1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
10
100
1000
-V SD [V]
t
AV [µs]
Rev. 1.0
page 6
2008-07-30
IPD90P03P4-04
13 Avalanche energy
AS = f(T j)
14 Drain-source breakdown voltage
E
V
BR(DSS) = f(T j); I D = -1 mA
parameter: I D
33
800
22.5 A
32
31
30
29
28
600
400
45 A
200
90 A
0
-60
-20
20
60
100
140
180
25
75
125
175
T j [°C]
T j [°C]
15 Typ. gate charge
16 Gate charge waveforms
V
GS = f(Q gate); I D = -90 A pulsed
parameter: VDD
12
VGS
-6V
10
8
Qg
-24V
6
4
Qgate
2
Qgd
Qgs
0
0
20
40
60
80
100
Q
gate [nC]
Rev. 1.0
page 7
2008-07-30
IPD90P03P4-04
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 2008
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions
or characteristics. With respect to any examples or hints given herein, any typical values stated
herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation, warranties
of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact
the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the
express written approval of Infineon Technologies, if a failure of such components can reasonably be
expected to cause the failure of that life-support device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted
in the human body or to support and/or maintain and sustain and/or protect human life.
If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Rev. 1.0
page 8
2008-07-30
IPD90P03P4-04
Revision History
Version
Date
Changes
Rev. 1.0
page 9
2008-07-30
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