IPU60R2K0C6_15 [INFINEON]
Material Content Data Sheet;
| 型号： | IPU60R2K0C6_15 |
| 厂家： | 
Infineon |
| 描述： | Material Content Data Sheet |
| 文件： | 总1页 (文件大小：32K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Material Content Data Sheet
Sales Product Name IPU60R2K0C6
Issued
29. September 2015
MA#
MA001402334
Package
PG-TO251-3-341
Weight*
387.39 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
1.272
0.248
0.33
0.06
0.02
64.06
0.11
0.10
3.08
30.71
0.98
0.13
0.01
0.01
0.40
0.33
3282
641
3282
leadframe
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
0.075
192
248.124
0.441
64.14
0.11
640508
1138
1017
30843
307076
9775
1330
105
641341
1138
wire
encapsulation
0.394
11.948
118.957
3.787
inorganic material
non noble metal
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
33.89
0.98
0.13
338936
9775
leadfinish
plating
nickel
0.515
1330
solder
silver
0.041
non noble metal
non noble metal
< 10%
tin
0.033
84
lead
1.553
0.42
4009
4198
*deviation
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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