IR1161LPBF_16 [INFINEON]
SmartRectifier;型号: | IR1161LPBF_16 |
厂家: | Infineon |
描述: | SmartRectifier |
文件: | 总26页 (文件大小:416K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMPS IC
SmartRectifier
IR1161LPBF
SmartRectifier Control IC
Product Summary
Features
Flyback,
Resonant Half-bridge
•
Secondary side synchronous rectification
Topology
controller
•
DCM, CrCM Flyback and resonant half-bridge
topologies
VD
200V
•
•
•
•
•
•
•
•
•
•
Direct sensing of MOSFET drain voltage up to 200V
Max 500kHz switching frequency
Anti-bounce logic and UVLO protection
Micropower start-up & ultra-low quiescent current
50ns turn-off propagation delay
Programmable Minimum On Time
Vcc Operating voltage range 4.75V to 18V
Cycle by Cycle MOT Check Circuit
Lead-free
VCC
4.75V ~ 18V
+1A & -2.5A
50ns (typical)
50ns (typical)
Io+ & I o-
Turn on Propagation
Delay
Turn off Propagation
Delay
Compatible with 0.3W Standby, Energy Star, CECP,
etc.
Package Options
Applications
•
Charger, AC-DC adapters
5-Pin SOT-23
Application Diagram
+
-
LOAD
Primary
Controller
MOT
GND
VCC
VD
4
3
2
1
GATE
5
Ordering Information
Standard Pack
Base Part Number
Package Type
Complete Part Number
Quantity
Form
IR1161LPBF
1
5L-SOT-23
Tape and Reel
3000
IR1161LTRPBF
2016-07-01
IR1161LPBF
Table of Contents
Ordering Information
Page
1
3
Description
Absolute Maximum Ratings
Electrical Characteristics
Functional Block Diagram
Input/Output Pin Equivalent Circuit Diagram
Pin Definitions
4
5
7
8
9
Pin Assignments
9
Application Information and Additional Details
Package Details
10
21
22
24
25
Tape and Reel Details
Part Marking Information
Qualification Information
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IR1161LPBF
Description
The IR1161 is a synchronous rectification control IC designed to drive an N-Channel power MOSFET in a
secondary output rectifier circuit. The MOSFET gate is switched on and off to bypass its body diode during the of
the conduction period to minimize power dissipation, remaining off during the blocking period. The drain to source
voltage is accurately sensed to determine the direction and magnitude of the current allowing the IR1161 to turn
the MOSFET on and off at close to zero current.
An integrated cycle-by-cycle minimum on time (MOT) protection circuit automatically detects a no load condition
and turns off the gate driver output preventing negative current from flowing through the MOSFET.
Ruggedness and noise immunity are accomplished using an advanced blanking scheme and double-pulse
suppression, which allows reliable operation in all operating modes.
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IR1161LPBF
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to GND, all currents are defined positive into any pin. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol
VCC
VD
Definition
Supply Voltage
Min.
-0.3
-1
Max.
20
Units
Remarks
Cont. Drain Sense Voltage
Pulse Drain Sense Voltage
MOT Voltage
200
VD
-3
200
V
VMOT
VGATE
TJ
-0.3
-0.3
-40
-55
—
3.5
Gate Voltage
VCC+0.3
150
VCC=18V, Gate off
TAMB=25°C
Operating Junction Temperature
Storage Temperature
Thermal Resistance
Package Power Dissipation
°C
TS
150
212†
590†
°C/W
mW
RθJA
PD
—
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Symbol
Definition
Supply voltage
Min.
Max.
18
Units
VCC
4.75
V
-3 ††
-40
—
VD
TJ
Drain Sense Voltage
Junction Temperature
Switching Frequency
200
125
500
°C
Fsw
kHz
††
-3V negative spike width 100ns
≤
VD
Recommended Component Values
Symbol
RMOT
Component
MOT pin resistor value
VCC decoupling capacitor value
Min.
5
1
Max.
100
—
Units
kΩ
µF
CVCC
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IR1161LPBF
Electrical Characteristics
VCC=12V and TA=25°C unless otherwise specified. The output voltage and current (VO and IO) parameters are
referenced to GND pin.
Symbol
Definition
Min.
Typ. Max. Units
Remarks
Supply Section
VCC
Supply Voltage Operating Range
VCC Turn On Threshold
4.75
4.25
—
18
VCC ON
4.5
4.75
V
VCC Turn Off Threshold
(Under Voltage Lock Out)
VCC UVLO
4.15
4.4
4.65
VCC HYST
ICC
VCC Turn On/Off Hysteresis
Operating Current
—
—
0.1
5.0
—
CLOAD=1nF,
fSW=300kHz
8.0
mA
µA
IQCC
Quiescent Current
Start-up Current
—
—
0.65
10
1.1
50
RMOT=50k
ICC START
VCC= VCC ON - 0.1V
Comparator Section
VTH1
VTH2
Turn-off Threshold
-8
-263
—
-4
-230
230
-7.5
7
0
-197
—
VCC=5V to 15V
Turn-on Threshold
Hysteresis
mV
µA
VHYST
IIBIAS1
IIBIAS2
Input Bias Current
Input Bias Current
-10
—
—
VD=-50mV
VD=200V
30
One-Shot Section
tBLANK Blanking Pulse Duration
VTH3
8
1.06
—
13
1.18
400
70
24
1.31
—
µs
V
Reset Threshold
Blanking Time of Reset
Hysteresis
tBRST
ns
mV
VHYST3
—
—
GBD
Minimum On Time Section
80
400
0.8
100
500
1
120
600
1.2
ns
ns
µs
RMOT=5k
RMOT=24k
RMOT=50k
TONmin Minimum On Time
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IR1161LPBF
Electrical Characteristics
VCC=12V and TA=25°C unless otherwise specified. The output voltage and current (VO and IO) parameters are
referenced to GND pin.
Symbol
Definition
Min.
Typ. Max. Units
Remarks
Gate Driver Section
IGATE=100mA,
VCC=12V
VGLO
VGTH
Gate Low Voltage
Gate High Voltage
—
0.2
0.4
V
11.5
4.5
—
11.9
4.9
20
VCC
VCC
—
VCC=12V, IGATE=5mA
VCC=5V, IGATE=5mA
CLOAD=1nF, VCC=12V
CLOAD=1nF, VCC=12V
tr
tf
Rise Time
Fall Time
—
13
—
VDS to VGATE – VDS
goes down from 6V to
-1V
VDS to VGATE – VDS
goes up from
-1V to 6V
tDon
Turn on Propagation Delay
Turn off Propagation Delay
—
—
60
50
90
60
ns
tDoff
rup
Pull up Resistance
—
—
—
—
9
2
—
—
—
—
IGATE=100mA
IGATE=-100mA
GBD
Ω
rdown
Pull down Resistance
IO source
IO sink
Output Peak Current (source)
Output Peak Current (sink)
1
A
2.5
GBD
GBD – parameter is guaranteed by design and is not tested.
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IR1161LPBF
Functional Block Diagram
VCC
MOT
UVLO
Cycle by Cycle
MOT Check
Circuit
VCC
VD
S
R
Q
Q
Min ON Time
VTH2
RESET
VGATE
DRIVER
VTH1
GND
Arming Logic
& Blanking
SET
VTH3
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IR1161LPBF
I/O Pin Equivalent Circuit Diagram
VCC
VCC
ESD
ESD
Diode
Diode
MOT
GATE
ESD
ESD
Diode
Diode
GND
GND
VD
RESD
ESD
Diode
200V
Diode
GND
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IR1161LPBF
Pin Definitions
PIN#
Symbol
VCC
Description
Supply Voltage
1
2
3
4
5
GND
MOT
VD
Ground
Minimum On Time Program Input
FET Drain Sensing
Gate Drive Output
GATE
Pin Assignments
1
2
3
5
GATE
VD
VCC
GND
MOT
4
Detailed Pin Description
VCC: Power Supply
The supply voltage pin is monitored by the under voltage lockout circuit. It is possible to turn off the IC entering
UVLO mode by pulling this pin below the minimum turn off threshold voltage for micro power consumption.
To avoid noise problems a bypass ceramic capacitor connected to Vcc and GND is needed, which should be
placed as close as possible to the IC. A low value series resistor to Vcc may also be added if extra filtering is
required. This pin is internally clamped to 20V.
GND: Ground
This is the IC ground reference connected to the SR MOSFET source.
MOT: Minimum On Time
The MOT programming pin controls the amount of minimum on time. Once VTH2 is crossed for the first time, the
gate signal will transition high and turn on the power MOSFET. Spurious ringing and oscillations can falsely trigger
the input comparator to switch the output off. The MOT prevents this by blanking the input comparator to keep the
SR MOSFET on for a minimum time. The MOT is typically programmed between 500ns and 2us by using an
external resistor referenced to GND.
VD: Drain Voltage Sense
VD is the voltage sense pin for the SR MOSFET drain. This is a high voltage pin therefore particular care must be
taken in properly routing the connection.
An additional RC filter can be placed at this input to improve noise immunity, however only small values (e.g. 100Ω
+ 100pF) may be used to avoid introducing significant delay to the control input.
GATE: Gate Drive Output
The gate drive output provides 1A source and 2.5A sink current capability. Although this output may be directly
connected to the power MOSFET gate the use of a minimal gate resistor is recommended, especially when using
multiple MOSFETs in parallel.
Care must be taken to keep the gate loop as short and as small as possible in order to minimize inductance and
achieve optimal switching performance.
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IR1161LPBF
Application Information and Additional Details
State Diagram
POWER ON
Gate Inactive
UVLO MODE
VCC < VCC on
ICC < ICC start
Gate Inactive
VCC > VCCon,
& VDS>VTH3
VCC < VCCuvlo
NORMAL
Gate Active
Gate PW ≥ MOT
Cycle by Cycle MOT Check Enabled
VDS>VTH1 @ MOT
VDS<VTH1 @ MOT
MOT PROTECTION
MODE
Gate Output Disabled
UVLO Mode
The IC remains in the under-voltage lockout condition until VCC exceeds the turn on threshold voltage, VCC ON
During the time the IC remains in the UVLO state, the gate drive circuit is inactive and only a very small quiescent
.
current ICC START is consumed. UVLO mode is accessible from any other operating state whenever VCC < VCC UVLO
.
Normal Mode and Synchronized Enable Function
The IC enters into normal operating mode once the UVLO voltage has been exceeded. When the IC enters the
Normal Mode, the GATE output remains disabled (stays low) for a start-up delay time in the range of 100us, then
VDS must transition above VTH3 two times to enable synchronous rectification. This ensures that the GATE output
can never be enabled in the middle of a switching cycle. The first gate pulse after activation is blocked and the
cycle by cycle MOT protection circuit is enabled. This logic avoids reverse currents through the SR MOSFET from
occurring during startup. The gate will continuously drive the SR MOSFET after completing this startup sequence.
MOT Protection Mode
If the secondary current conduction time is shorter than the MOT (Minimum On Time), the following driver output
pulse is disabled. This function can avoid reverse current from occurring when the system is switching at very low
duty-cycles under very light or zero load conditions. System standby power consumption is reduced by disabling
the GATE output. The cycle by cycle MOT check circuit is always activated under Normal Mode and MOT
Protection Mode so that the IC will automatically resume normal operation only once the load increases to a level
where the secondary current conduction time exceeds MOT.
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IR1161LPBF
General Description
The direction of the rectified current in the SR MOSFET is sensed by the IR1161 through its high voltage drain
sensing input VD, which monitors the drain to source voltage drop. Conduction occurs through the body diode
when the MOSFET is switched off and when it is switched on, the RDSon acts as a shunt resistance. The GATE
drive to the MOSFET is switched on only when current is flowing from source to drain. Internal blanking logic is
used to prevent spurious transitions and guarantee correct operation under different load conditions.
The IR1161 is suitable for DCM or CrCM Flyback and Resonant Half-Bridge topologies.
VGate
VDS
VTH2
VTH1
VTH3
Figure 1: Input comparator thresholds
Flyback Application
The typical application circuit of IR1161 in Flyback converter is shown on page 1.
Turn-on phase
When the conduction phase of the SR MOSFET is initiated, current will start flowing through its body diode
producing a negative VDS voltage across it. The body diode has a much higher forward voltage drop than that
created by the MOSFET on resistance and will therefore becoming more negative than the turn-on threshold VTH2
.
At that point the IR1161 will drive the gate high, which will in turn cause VDS to transition to a much smaller
negative voltage. This voltage step is usually accompanied by some amount of ringing that could potentially trigger
the IR1161 to turn off prematurely. To prevent this, a Minimum On Time (MOT) blanking period is maintains the
SR MOSFET on for a minimum period of time, which is externally adjustable.
Turn-off phase
At the end of the conduction period the current reduces to zero, causing VDS to cross the turn-off threshold VTH1
.
The IR1161 will then turn the SR MOSFET gate off and current will start flowing again through the body diode
causing a negative going VDS voltage step. Depending on the amount of residual current, VDS could potentially
trigger the turn on threshold once again. For this reason VTH2 is blanked for a certain amount of time (TBLANK) after
VTH1 has been triggered. The blanking time is internally set and is reset only by VDS crossing the positive threshold
VTH3 and remaining above this threshold for more than reset blanking time tBRST. Once reset the IR1161 is ready for
next conduction cycle.
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IR1161LPBF
IPRIM
VPRIM
time
T3
T1
T2
ISEC
VSEC
time
Figure 2: Flyback Primary and secondary currents and voltages for DCM mode
IPRIM
VPRIM
time
T2
T1
ISEC
VSEC
time
Figure 3: Flyback Primary and secondary currents and voltages for CrCM mode
VTH3
ISEC
VDS
T1
T2
time
VTH1
VTH2
TDoff
TDon
Gate Drive
Blanking
time
MOT
Tblanking
Figure 4: Flyback secondary side DCM/CrCM operation
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IR1161LPBF
Resonant Half-Bridge Application
The typical application circuit of IR1161 in LLC half-bridge is shown in Figure 5.
MOT
4
3
VD
GND
2
GATE
5
1
VCC
LOAD
VCC
1
5
GATE
2
3
GND
MOT
VD
4
Figure 5: Resonant half-bridge application circuit
In the resonant half-bridge converter the turn-on phase and turn-off phase are similar to the Flyback except that
the current shape is sinusoidal. The typical operating waveform is seen below in figure 6.
VTH3
IDS
VDS
T1
T2
VTH1
VTH2
Gate Drive
Blanking
MOT
tBLANK
time
Figure 6: Resonant half-bridge operation waveform
Setting the MOT Time
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IR1161LPBF
The MOT time is set by an external resistor connected from the MOT pin to GND.
MOT = 2 x 10-11 x RMOT
T
MOT Protection Mode
The MOT protection function is designed to avoid reverse current occurring in the SR MOSFET. This could
happen at light load if the MOT time is set longer that the actual conduction time. The IR1161 disables the gate
drive output in MOT protection mode as described in the previous section and automatically resumes normal
operation when the load increases to a level where the current conduction time is longer than MOT.
This function works in both Flyback and resonant half-bridge topologies. Figure 7 illustrates operation in a DCM
Flyback converter.
VDS
ISEC
Gate Drive
time
MOT
Sensed VD>VTH1 at
Disable the next gate output
the end of MOT
Figure 7: MOT Protection Mode
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IR1161LPBF
Synchronized Enable Function
This function guarantees that the GATE drive always switches high at the beginning of a switching cycle. This is
essential since mid-cycle switch on with the MOT function would force the MOSFET to remain on past the
conduction period leading to reverse conduction.
This function works in both Flyback and resonant half-bridge topologies. Figure 8 is an example in resonant half-
bridge converter.
VGATE
VDS
UVLO
Idrain
Vth3
IC activated in the middle
of a conduction cycle,
VGATE stays low.
The first GATE pulse is blanked.
Enable MOT protection.
Vgate has output
from the 4th cycle
VD exceeds Vth3
for 2 cycles
Figure 8: Synchronized Enable Function (resonant half-bridge)
Driving a Logic Level MOSFET
An external gate drive pull down circuit is recommended when driving a logic level MOSFET.
This is because during power up and power down the drain may be switching while the IR1161 remains in UVLO.
SR MOSFET drain to gate capacitance causes voltage pulses to appear at the gate that could have sufficient
amplitude to reach the turn on threshold because the IR1161 gate sink capability is limited when VCC < 2V.
The following circuit ensures that the gate voltage remains below 1V under all conditions:
GATE
5
Dg
Rg
VCC
GND
SR MOSFET
1
2
3
CVcc
VD
4
MOT
Qsink
Rb
RMOT
Figure 9: Gate drive circuit for logic level SR MOSFET
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IR1161LPBF
Vcc Clamping Circuit
The IR1161 can be directly biased by the converter output voltage VOUT if this falls within the recommended range
of Vcc although a low value series resistor may be required for optimal noise filtering. For higher system output
voltages a clamping circuit is recommended to limit Vcc. This also lowers the gate drive voltage and reduces
losses if VOUT is above 15V.
Many clamping circuits are available from simple zener diode clamping to bipolar linear regulators. Figure 10 is
one example; in this circuit the Vcc voltage will be clamped to a voltage of VOUT - VZD1 - VBE. The circuit also
provides turn-on delay to the IR1161, which will activate only when the output voltage exceeds VCCON + VZD1 + VBE.
R1 and R2 are optional for more precise control of the Vcc clamping voltage.
Vout
R1
Optional
ZD1
GATE
VCC
1
2
3
5
R2
R3 CVcc
GND
MOT
VD
4
Figure 10: Vcc clamping circuit
Shutdown Circuit
The IR1161 can be disabled by pulling VCC below the VCC UVLO threshold.
Vout
R1
ZD1
GATE
5
VCC
GND
MOT
Shutdown
1
2
3
CVcc
R3
VD
4
Figure 11: IR1161 Enable/Disable circuit
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IR1161LPBF
General Timing Waveform
VTH1
VDS
VTH2
tDon
tDoff
VGate
90%
10%
trise
tfall
Figure 12: Timing waveform
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IR1161LPBF
4.7
4.6
4.5
4.4
4.3
IQCC
0.70
0.65
0.60
0.55
0.50
VCC ON
VCC UVLO
-50 °C
0 °C
50 °C
Temperature
100 °C
150 °C
-50 °C
0 °C
50 °C
100 °C
150 °C
Temperature
Figure 13: Undervoltage Lockout vs. Temperature
Figure 14: Icc Quiescent Current vs. Temperature
Icc @300KHz, CLOAD=1nF
5.6
ICC START
13.0
5.5
5.4
5.3
5.2
5.1
5.0
4.9
4.8
4.7
4.6
12.0
11.0
10.0
9.0
8.0
7.0
6.0
-50 °C
0 °C
50 °C
100 °C
150 °C
-50 °C
0 °C
50 °C
100 °C
150 °C
Temperature
Temperature
Figure 15: Icc Supply Current @1nF Load vs.
Temperature
Figure 16: Icc Startup Current vs. Temperature
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IR1161LPBF
-2.0
-3.0
-4.0
-5.0
-6.0
-200.0
-210.0
-220.0
-230.0
-240.0
-250.0
-260.0
-50 °C
0 °C
50 °C
Temperature
100 °C
150 °C
-50 °C
0 °C
50 °C
Temperature
100 °C
150 °C
Figure 17: VTH1 vs. Temperature
Figure 18: VTH2 vs. Temperature
3
2
1
1.20
RMOT=100k
RMOT=50k
RMOT=24k
1.18
1.16
1.14
1.12
1.10
0
-50 °C
0 °C
50 °C
100 °C
150 °C
-50 °C
0 °C
50 °C
Temperature
100 °C
150 °C
Temperature
Figure 19: VTH3 vs. Temperature
Figure 20: MOT Time vs. Temperature
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IR1161LPBF
13.5
13.0
12.5
12.0
30 ns
25 ns
20 ns
15 ns
10 ns
5 ns
Tr
Tf
0 ns
-50 °C
0 °C
50 °C
100 °C
150 °C
-50 °C
0 °C
50 °C
100 °C
150 °C
Temperature
Temperature
Figure 22: Tr and Tf vs. Temperature
Figure 21: Blanking Time vs. Temperature
75 ns
70 ns
65 ns
60 ns
55 ns
50 ns
45 ns
14
12
10
8
6
Rup
Rdown
4
Turn-on Propagation Delay
40 ns
2
Turn-off Propagation Delay
35 ns
0
-50 °C
0 °C
50 °C
100 °C
150 °C
-50 °C
0 °C
50 °C
Temperature
100 °C
150 °C
Temperature
Figure 24: RUP and RDOWN vs. Temperature
Figure 23: TDON and TDOFF vs. Temperature
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IR1161LPBF
Package Details: 5 Lead SOT23
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IR1161LPBF
Tape and Reel Details: 5 Lead SOT23
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Tape and Reel Details: 5 Lead SOT23
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IR1161LPBF
Part Marking Information: 5 Lead SOT23
Top Marking
YW LC
Lot Code
Date Code
Bottom Marking
G
IR Logo
Part no.
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IR1161LPBF
Qualification Information†
Industrial††
Comments: This family of ICs has passed JEDEC’s
Industrial qualification. Infineon’s Consumer qualification
level is granted by extension of the higher Industrial level.
Qualification Level
MSL1†††
SOT-23 5L
Moisture Sensitivity Level
(per IPC/JEDEC J-STD-020)
Class A
Machine Model
Human Body Model
(per JEDEC standard JESD22-A115)
ESD
Class 1A
(per EIA/JEDEC standard EIA/JESD22-A114)
Class I, Level A
(per JESD78)
Yes
IC Latch-Up Test
RoHS Compliant
†
Qualification standards can be found at Infineon’s web site www.infineon.com
†† Higher qualification ratings may be available should the user have such requirements. Please contact your
Infineon sales representative for further information.
††† Higher MSL ratings may be available for the specific package types listed here. Please contact your
Infineon sales representative for further information.
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Revision History
Major changes since the last revision
Date
Description of change
June 1, 2015
First release
May 24, 2016
July 1, 2016
Changed MSL to level 1.
Changed format template with Infineon logo
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2015
All Rights Reserved.
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated
herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims
any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of
intellectual property rights of any third party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated
in this document and any applicable legal requirements, norms and standards concerning customer’s products
and any use of the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of
customer’s technical departments to evaluate the suitability of the product for the intended application and the
completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications
where a failure of the product or any consequences of the use thereof can reasonably be expected to result in
personal injury.
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