IR51H(D)224PBF [INFINEON]
Half Bridge Based MOSFET Driver, BICMOS, PSIP7, SIP-9/7;型号: | IR51H(D)224PBF |
厂家: | Infineon |
描述: | Half Bridge Based MOSFET Driver, BICMOS, PSIP7, SIP-9/7 驱动 信息通信管理 接口集成电路 驱动器 |
文件: | 总8页 (文件大小:66K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Preliminary Data Sheet No. PD-60083H
IR51H(D)XXX (NOTE: For new designs, we
recommend IR’s new products IR53H(D)XXX)
SELF-OSCILLATING HALF BRIDGE
ProductSummary
Features
• Output Power MOSFETs in half-bridge configuration
V
(max) 250V - H(D)214/224
IN
• High side gate drive designed for bootstrap operation
• Bootstrap diode integrated into package (is HD type)
• Accurate timing control for both Power MOSFETs
Matched delay to get 50% duty cycle
Matched deadtime of 1.2us
• Internal oscillator with programmable frequency
300V - H(D)737
400V - H(D)310/320
500V - H(D)420
Duty Cycle
Deadtime
50%
1.2µs
R
ds(on)
0.75Ω - H(D)737
1.1Ω - H(D)224
1.8Ω - H(D)320
2.0Ω - H(D)214
3.0Ω - H(D)420
3.6Ω - H(D)310
1
f =
1. 4 × (RT + 75Ω) × CT
• Zener clamped Vcc for offline operation
• Half-bridge output is out of phase with RT
o
P (T = 25
)
2.0W
C
Description
D
A
The IR51H(D)XXX are complete high voltage, high speed, self-
oscillating half-bridges. Proprietary HVIC and latch immune
CMOS technologies, along with the HEXFET power MOSFET
Package
®
technology, enable ruggedized single package construction. The
front-end features a programmable oscillator which functions simi-
lar to the CMOS 555 timer. The supply to the control circuit has a
zener clamp to simplify offline operation. The output features two
HEXFETs in a half-bridge configuration with an internally set
deadtime designed for minimum cross-conduction in the half-
bridge. Propagation delays for the high and low side power
MOSFETs are matched to simplify use in 50% duty cycle appli-
cations. The device can operate up to the V (max) rating.
IN
TypicalConnection
HV DC Bus
VIN
D 1
IR51HXXX / IR51HDXXX
Note: D1 is not required for HD type
1
2
3
4
6
9
7
Vcc
R T
VB
VIN
R T
C T
C T
V O
TO,
C O M
LOAD
COM
IR51H(D)XXX
AbsoluteMaximumRatings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All
voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any
lead. The thermal resistance and power dissipation ratings are measured under board mounted and
still air conditions.
Symbol
Definition
Minimum Maximum
Units
VIN
High voltage supply
-214
-224
-310
-320
-420
- 0.3
- 0.3
- 0.3
- 0.3
- 0.3
250
250
400
400
500
-737
-214
-224
-310
-320
-420
- 0.3
- 0.3
- 0.3
- 0.3
- 0.3
- 0.3
300
275
275
425
425
525
VB
High side floating supply absolute voltage
V
-737
- 0.3
-0.3
- 0.3
- 0.3
—
325
VIN + 0.3
Vcc + 0.3
Vcc + 0.3
25
VO
Half-bridge output
RT voltage
CT voltage
VRT
VCT
Icc
Supply current (note 1)
RT output current
Peak diode recovery
mA
IRT
- 5
5
dV/dt
PD
—
3.5
V/ns
W
Package power dissipation @ T ≤ +25°C
—
2.00
A
RthJA
TJ
Thermal resistance, junction to ambient
Junction temperature
—
60
oC/W
-55
-55
—
150
oC
TS
Storage temperature
150
TL
Lead temperature (soldering, 10 seconds)
300
NOTE 1:
Because of the IR51H(D)XXX’s application specificity toward off-line supply systems, this IC contains a zener clamp
between VCC and COM which has a nominal breakdown voltage of 15.6V. Therefore, the IC supply voltage is normally
derived by current feeding the Vcc lead (typically by means of a high value resistor connected between the chip Vcc
and the rectified line voltage and a local decoupling capacitor from Vcc to COM) and allowing the internal zener clamp
circuit to determine the nominal supply voltage. Therefore, this circuit should not be driven by a DC, low impedance
source of greater than VCLAMP.
2
IR51H(D)XXX
RecommendedOperatingConditions
The input/output logic timing diagram is shown in figure 1. For proper operation, the device should be used
within the recommended conditions.
Symbol
Definition
Minimum
Maximum
Units
VB
VIN
High side floating supply absolute voltage
High voltage supply
V
+ 10
—
V + V
o
o
clamp
250
-214
-224
-310
-320
-420
—
—
—
—
—
250
400
400
500
V
-737
-214
-224
-310
-320
-420
-737
-214
-224
-310
-320
300
275
275
425
425
525
325
0.85
1.1
VO
Half-bridge output voltage
-5
-5
-5
-5
-5
-5
—
ID
Continuous drain current (T = 25°C)
A
—
—
—
0.7
0.9
-420
-737
-214
-224
-310
-320
-420
-737
—
—
0.7
1.3
0.55
0.7
0.45
0.6
0.5
0.8
5
A
(T = 85°C)
A
—
—
—
—
—
—
—
ICC
TA
Supply current (note 1)
Ambient temperature
mA
°C
-40
125
3
IR51H(D)XXX
DynamicElectricalCharacteristics
VBIAS (VCC, VBS) = 12V, T = 25oC unless otherwise specified.
A
Symbol Definition
Min. Typ. Max. Units TestConditions
t
Reverse recovery time (MOSFET body diode)
I =850mA
F
rr
-214
-224
-310
-320
-420
-737
—
—
190
200
240
270
240
320
—
—
—
—
—
—
—
—
—
—
—
I =1.1A
F
di/dt
=100
A/µs
I
—
—
—
—
F=700mA
ns
I
F=900mA
I
F=700mA
I
F=1.3A
Q
Reverse recovery charge (MOSFET body diode)
I =850mA
F
rr
-214
-224
-310
-320
-420
-737
—
—
0.55
0.7
I =1.1A
F
di/dt
=100
A/µs
—
—
—
—
—
0.45
0.6
I =700mA
F
µC
I =900mA
F
0.5
I =700mA
F
0.8
1.2
—
—
I =1.3A
F
DT
D
Deadtime, LS turn-off to HS turn-on &
HS turn-off to LS turn-on
µs
RT duty cycle
—
50
—
%
fosc = 20 kHz
4
IR51H(D)XXX
StaticElectricalCharacteristics
VBIAS (VCC, VB) = 12V, T = 25oC unless otherwise specified.
A
Symbol Definition
Min. Typ. Max. Units TestConditions
VCCUV+ VCC supply undervoltage positive going
threshold
—
8.4
—
V
V
VCC supply undervoltage negative going
threshold
—
8.0
—
V
CCUV-
I
Quiescent VCC supply current
—
300
—
—
—
50
—
µA VCC > VCCUV
QCC
V
VCC zener shunt clamp voltage
Quiescent VBS supply current
—
—
15.6
30
V
ICC = 5mA
CLAMP
QBS
I
µA
l
Offset supply leakage current
Oscillator frequency
—
—
—
VB = VIN = 500V
RT = 35.7 kΩ
CT = 1 nF
OS
f
20
OSC
kHz
—
100
—
RT = 7.04 kΩ
CT = 1 nF
I
CT input current
—
—
0.001
100
1.0
—
µA
CT
V
CT undervoltage lockout
RT high level output voltage, VCC - RT
Note 2
CTUV
VRT+
—
—
20
200
—
—
IRT = 100µA
IRT = -1mA
mV
VRT-
RT low level output voltage
—
—
20
200
—
—
IRT = 100µA
IRT = -1mA
VRTUV
VCT+
RT undervoltage lockout, VCC - RT
2/3 VCC threshold
—
—
100
8.0
—
—
IRT = 100µA
kHz
VCT-
1/3 VCC threshold
—
4.0
2.0
—
—
Rds(on) Static-drain-to-source on-resistance
I =850mA
F
-214
—
—
I =1.1A
F
-224
-310
-320
-420
-737
1.1
3.6
1.8
—
—
—
—
—
—
—
—
—
—
—
I
I
I
I
F=700mA
F=900mA
F=700mA
F=1.3A
—
—
—
—
Ω
di/dt
=100
A/µs
3.0
0.75
V
Diode forward voltage
I =850mA
F
SD
-214
-224
-310
-320
-420
-737
—
—
0.8
0.85
0.8
0.7
0.8
0.8
I =1.1A
F
I =700mA
F
—
—
—
—
I =900mA
F
V
I =700mA
F
I =1.3A
F
5
IR51H(D)XXX
FunctionalBlockDiagram
V
VIN
B
6
D1
9
1
Vcc
IRFCXXX
H
V
O
S
IR2151
2
7
R
V O
T
L
O
IRFCXXX
3
C
T
4
C O M
Fast recovery diode D1 is
incorporated in IR51HDXXX only
LeadDefinitions
Symbol
LeadDescription
VCC
Logic and internal gate drive supply voltage. An internal zener clamp diode at 15.6 V norminal is included
to allow the VCC to be current fed directly from VIN typically by means of a high value resistor.
RT
CT
Oscillator timing resistor output; a resistor is connected from RT to CT. RT is out of phase with the half-
bridge output (VO).
Oscillator timing capacitor input; a capacitor is connected from CT to COM in order to program the
oscillator frequency according to the following equation:
1
f =
1. 4 × (RT + 75Ω) × CT
CT PIN also invokes shutdown function (see note 2) where 75Ω is the effective impedence of the RT
output stage.
VB
High side gate drive floating supply. For bootstrap operation a high voltage fast recovery diode is needed
to feed from VCC to VB. (HD type circuits incorporate this diode).
High voltage supply
VIN
VO
Half Bridge output
COM
Logic and low side of half bridge return
6
IR51H(D)XXX
Lead Assignments
1
2
3
4
V
R
C
6
7
9
V
B
cc
T
T
VO
V
IN
9
COM
2
1
9 Lead SIP without Leads 5 and 8
Vccuv+
V CLAMP
50%
50%
HIN
Vcc
t
t
t
f
t
on
off
90%
r
90%
RT
HO
CT
10%
10%
V+
0
VO
VO
Figure 2. Switching Time Wave-
form Definitions
Figure 1. Input/Output Timing
Diagram
7
IR51H(D)XXX
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982
2. Controlling Dimension: INCH
3. Dimensions are shown in millimeters (inches)
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Data and specifications subject to change without notice. 12/98
8
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