IRDC3832W [INFINEON]

USER GUIDE FOR IR3832W EVALUATION BOARD; 用户指南IR3832W评估板


型号：	IRDC3832W
厂家：	Infineon
描述：	USER GUIDE FOR IR3832W EVALUATION BOARD 用户指南IR3832W评估板
文件：	总16页 (文件大小：732K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IRDC3832W

SupIRBuck

USER GUIDE FOR IR3832W EVALUATION BOARD

DESCRIPTION

An output over-current protection function is

implemented by sensing the voltage developed

across the on-resistance of the synchronous

rectifier MOSFET for optimum cost and

performance.

The IR3832W is a synchronous buck

converter, providing compact, high

performance and flexible solution in a small

5mmx6mm Power QFN package.

Key features offered by the IR3832W

include programmable soft-start ramp,

This user guide contains the schematic and bill

of materials for the IR3832W evaluation board.

The guide describes operation and use of the

evaluation board itself. Detailed application

information for IR3832W is available in the

IR3832W data sheet.

Power

Good,

thermal

protection,

programmable switching frequency, tracking

input, enable input, input under-voltage

lockout for proper start-up, and pre-bias

start-up.

BOARD FEATURES

• V_in= +12V (13.2V Max)

• V_cc= +5V (5.5V Max)

• V_out= +0.75V @ 0- ±4A

• F_s= 400kHz

• L = 1.50uH

• C_in= 2x10uF (ceramic 1206) + 330uF (electrolytic)

• C_out= 6x22uF (ceramic 0805)

10/30/09

IRDC3832W

CONNECTIONS and OPERATING INSTRUCTIONS

A well regulated +12V input supply should be connected to VIN+ and VIN-. A maximum ±4A load should be

connected to VOUT+ and VOUT-. The connection diagram is shown in Fig. 1 and inputs and outputs of the

board are listed in Table I.

IR3832W has two input supplies, one for biasing (Vcc) and the other as input voltage (Vin). Separate

supplies should be applied to these inputs. Vcc input should be a well regulated 4.5V-5.5V supply and it

would be connected to Vcc+ and Vcc-.

If single 12V application is required, connect R7 ( zero Ohm resistor) which enables the on board bias

regulator (see schematic). In this case there is no need of external Vcc supply.

The output tracks VDDQ input. The value of R14 and R28 can be selected to provide the desired ratio

between the output voltage and the tracking input. For proper operation of IR3832W, the voltage at Vp pin

should not exceed Vcc.

Table I. Connections

Connection

VIN+

Signal Name

V_in(+12V)

VIN-

Ground of V_in

Vcc input

Vcc+

Vcc-

Ground for Vcc input

Ground of V_out

V_out(+0.75V)

Enable

VOUT-

VOUT+

Enable

V_DDQ

Tracking Input

Power Good Signal

PGood

LAYOUT

The PCB is a 4-layer board. All of layers are 2 Oz. copper. The IR3832W SupIRBuck and all of the

passive components are mounted on the top side of the board.

Power supply decoupling capacitors, the Bootstrap capacitor and feedback components are located

close to IR3832W. The feedback resistors are connected to the output voltage at the point of regulation

and are located close to the SupIRBuck. To improve efficiency, the circuit board is designed to

minimize the length of the on-board power ground current path.

10/30/09

IRDC3832W

Connection Diagram

Vin

GND

Enable

GND

VDDQ

AGND

Vcc

GND

PGood

Fig. 1: Connection diagram of IR383xW evaluation boards

10/30/09

IRDC3832W

Fig. 2: Board layout, top overlay

Fig. 3: Board layout, bottom overlay

10/30/09

IRDC3832W

AGND

Plane

PGND

Plane

Single point

connection

between AGND

and PGND.

Fig. 4: Board layout, mid-layer I

Fig. 5: Board layout, mid-layer II

10/30/09

IRDC3832W

A G n d 3

1 5

o o B t

c V c

1 3

1 4

E n a b l e

P G o o d

10/30/09

IRDC3832W

Bill of Materials

Item Quantity Part Reference

Value

330uF

10uF

Description

Manufacturer

Panasonic

Panasonic - ECG

Panasonic- ECG

Part Number

EEV-FK1E331P

ECJ-3YB1C106M

ECJ-1VB1C223K

1 C1

2 C2 C3

1 C10

SMD Elecrolytic, Fsize, 25V, 20%

1206, 16V, X5R, 20%

0603, 16V, X7R, 10%

0.022uF

1 C34

10uF

0805, 10V, X5R, 20%

Panasonic - ECG

ECJ-GVB1A106M

5 C7 C13 C14 C24 C32

1 C8

1 C11

0.1uF

2200pF

220pF

0603, 25V, X7R, 10%

0603, 50V, NP0, 5%

0805, 6.3V, X5R, 20%

0603, 50V, X7R, 10%

Zener, 5.6V

Panasonic - ECG

Murata

Panasonic- ECG

Panasonic - ECG

Fairchild

Delta

Fairchild

Rohm

Panasonic - ECG

Vishey/Dale

Rohm

Yageo

Rohm

ECJ-1VB1E104K

GRM1885C1H222JA01D

ECJ-1VC1H221J

ECJ-2FB0J226M

ECJ-1VB1H103K

MM3Z5V6B

MPO104-1R5IR

MMBT3904/SOT

MCR03EZPFX3301

MCR03EZPFX4992

ERJ-3EKF2100V

CRCW060320R0FKEA

MCR03EZPFX3572

MCR03EZPFX2741

MCR03EZPFX1002

MCR03EZPFX7501

RC0603FR-100RL

MCR03EZPFX3481

MCR03EZPFX6651

MCR03EZPFX1501

C15 C16 C17 C18 C19 C20

22uF

2 C25, C26

1 D1

1 L1

1 Q1

1 R5

1 R18

1 R4

1 R6

10000pF

MM3Z5V6B

1.5uH

MMBT3904/SOT NPN, 40V, 200mA, SOT-23

3.3k

49.9k

210

35.7k

2.74k

10.0k

7.5k

11.5x10x4mm, 20%, 3.9mOhm

Thick Film, 0603,1/10W,1%

Thick Film, 0603,1/10 W,1%

Thick Film, 0603,1/10W,1%

Thick Film, 0603,1/10 W,1%

Thick Film, 0603,1/10W,1%

4A SupIRBuck, 6mmx5mm

1 R9

1 R12

1 R17

1 R19

1 R10

1 R1

1 R2

2 R14, R28

1 U1

3.48k

6.65k

1.50k

IR3832W

Rohm

International Rectifier IR3832WMPbF

10/30/09

IRDC3832W

TYPICAL OPERATING WAVEFORMS

Vin=12.0V, Vcc=5V, Vo=0.75V, Io=0- ±4A, Room Temperature, No Air Flow

Fig. 7: Start up at 4A, sourcing current

Ch₁:PGood, Ch₂:V_out, Ch₃:V_DDQ, Ch₄:SS

Fig. 8: Start up with Prebias, 0A Load

Ch₁:PGood, Ch₂:V_out,Ch₃:V_DDQ,Ch₄:SS

Fig. 10: Inductor node at -3A, sinking

current, Ch₃:SW , Ch₄:I_out

Fig. 9: Inductor node at 4A, sourcing

current, Ch₃:SW, Ch₄:I_out

Fig. 11: Output Voltage Ripple, 4A,

sourcing current, Ch₂: V_out

Fig. 12: Short (Hiccup) Recovery

Ch₂:V_out, Ch₃:V_SS, Ch₄:PGood

10/30/09

IRDC3832W

TYPICAL OPERATING WAVEFORMS

Vin=12V, Vcc=5V, Vo=0.75V, Room Temperature, No Air Flow

Fig. 14: Tracking -3A load, sinking current,

Ch₂:V_out, Ch₃:V_DDQ, Ch₄:PGood

Fig. 13: Tracking 4A, sourcing current,

Ch₂:V_out, Ch₃:V_DDQ, Ch₄:PGood

Fig. 15: Transient Response, 1A/us

-0.5A to +0.5A load , Ch₂:V_out, Ch₄:I_o

10/30/09

IRDC3832W

TYPICAL OPERATING WAVEFORMS

Vin=12V, Vcc=5V, Vo=0.75V, Io=+4A, Room Temperature, No Air Flow

Fig.16: Bode Plot at 4A load (sourcing current) shows a bandwidth of 65kHz and phase margin of 60 degrees

10/30/09

IRDC3832W

TYPICAL OPERATING WAVEFORMS

Vin=12V, Vo=0.75V, Io=0- +4A, Room Temperature, No Air Flow

100

Load Percentage (%)

Fig.17: Efficiency versus load current

0.55

0.50

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

100

Load Percentage(%)

Fig.18: Power loss versus load current

10/30/09

IRDC3832W

THERMAL IMAGES

Vin=12V, Vo=0.75V, Io=+4A, Room Temperature, No Air Flow

Fig.19: Thermal Image at 4A load

Test Point 1: IR3832W, Test Point 2: Inductor

10/30/09

IRDC3832W

PCB Metal and Components Placement

The lead lands (the 11 IC pins) width should be equal to the nominal part lead width. The minimum

lead to lead spacing should be ≥ 0.2mm to minimize shorting.

Lead land length should be equal to the maximum part lead length + 0.3 mm outboard extension. The

outboard extension ensures a large and inspectable toe fillet.

The pad lands (the 4 big pads other than the 11 IC pins) length and width should be equal to

maximum part pad length and width. However, the minimum metal to metal spacing should be no less

than 0.17mm for 2 oz. Copper; no less than 0.1mm for 1 oz. Copper and no less than 0.23mm for 3 oz.

Copper.

10/30/09

IRDC3832W

Solder Resist

It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder resist

should be pulled away from the metal lead lands by a minimum of 0.025mm to ensure NSMD

pads.

The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist

onto the copper of 0.05mm to accommodate solder resist mis-alignment.

Ensure that the solder resist in between the lead lands and the pad land is ≥ 0.15mm due to the

high aspect ratio of the solder resist strip separating the lead lands from the pad land.

10/30/09

IRDC3832W

Stencil Design

•

The Stencil apertures for the lead lands should be approximately 80% of the area of the

lead lads. Reducing the amount of solder deposited will minimize the occurrences of lead

shorts. If too much solder is deposited on the center pad the part will float and the lead

lands will be open.

•

The maximum length and width of the land pad stencil aperture should be equal to the

solder resist opening minus an annular 0.2mm pull back to decrease the incidence of

shorting the center land to the lead lands when the part is pushed into the solder paste.

10/30/09

IRDC3832W

BOTTOM VIEW

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105

TAC Fax: (310) 252-7903

This product has been designed and qualified for the Consumer market.

Visit us at www.irf.com for sales contact information

Data and specifications subject to change without notice. 11/07

10/30/09

IRDC3832W [INFINEON]

相关型号：

IRDC3840

IRDC3840A

IRDC3840W

IRDC3841

IRDC3841W

IRDC3842

IRDC3842A

IRDC3842W

IRDC3843A

IRDC3843W

IRDC3856W

IRDC3870