IRF3711L
更新时间:2024-09-18 02:21:05
品牌:INFINEON
描述:Power MOSFET(Vdss=20V, Rds(on)max=6.0mohm, Id=110A)
IRF3711L 概述
Power MOSFET(Vdss=20V, Rds(on)max=6.0mohm, Id=110A) 功率MOSFET ( VDSS = 20V , RDS(ON)最大值= 6.0mohm ,ID = 110A )
IRF3711L 数据手册
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PDF下载PD- 94062B
IRF3711
IRF3711S
IRF3711L
SMPS MOSFET
HEXFET® Power MOSFET
Applications
ꢀ High Frequency Isolated DC-DC
VDSS
20V
RDS(on) max
ID
Converters with Synchronous Rectification
for Telecom and Industrial Use
ꢀ
6.0mΩ
110A
ꢀ High Frequency Buck Converters for
Server Processor Power Synchronous FET
ꢀ Optimized for Synchronous Buck
Converters Including Capacitive Induced
Turn-on Immunity
Benefits
ꢀ Ultra-Low Gate Impedance
D2Pak
IRF3711S
TO-262
IRF3711L
TO-220AB
IRF3711
ꢀ Very Low RDS(on) at 4.5V VGS
ꢀ Fully Characterized Avalanche Voltage
and Current
Absolute Maximum Ratings
Symbol
VDS
Parameter
Drain-Source Voltage
Max.
20
Units
V
VGS
Gate-to-Source Voltage
± 20
V
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Currentꢁ
110ꢀ
69
A
440
PD @TC = 25°C
PD @TA = 25°C
Maximum Power Dissipation
Maximum Power Dissipationꢂ
Linear Derating Factor
120
W
W
3.1
0.96
W/°C
°C
TJ , TSTG
Junction and Storage Temperature Range
-55 to + 150
Thermal Resistance
Parameter
Junction-to-Case
Typ.
Max.
1.04
–––
62
Units
RθJC
RθCS
RθJA
RθJA
–––
0.50
–––
–––
Case-to-Sink, Flat, Greased Surface ꢁ
Junction-to-Ambientꢁ
°C/W
Junction-to-Ambient (PCB mount)ꢂ
40
Notes ꢁ through ꢀ are on page 11
www.irf.com
1
11/15/01
IRF3711/3711S/3711L
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
20 ––– –––
––– 0.022 ––– V/°C Reference to 25°C, ID = 1mA
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
V
VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
–––
–––
1.0
4.7
6.2
6.0
8.5
VGS = 10V, ID = 15A
VGS = 4.5V, ID = 12A
VDS = VGS, ID = 250µA
VDS = 16V, VGS = 0V
ꢀ
mΩ
V
RDS(on)
VGS(th)
IDSS
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
ꢀ
––– 3.0
––– ––– 20
––– ––– 100
––– ––– 200
––– ––– -200
µA
Drain-to-Source Leakage Current
VDS = 16V, VGS = 0V, TJ = 125°C
VGS = 16V
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
IGSS
nA
VGS = -16V
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
gfs
Parameter
Forward Transconductance
Total Gate Charge
Min. Typ. Max. Units
Conditions
VDS = 16V, ID = 30A
ID = 15A
53
––– –––
29 44
S
Qg
–––
–––
–––
–––
–––
Qgs
Qgd
Qoss
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Output Gate Charge
Turn-On Delay Time
Rise Time
7.3 –––
8.9 –––
33 –––
12 –––
nC VDS = 10V
VGS = 4.5V
VGS = 0V, VDS = 10V
VDD = 10V
ID = 30A
––– 220 –––
ns
pF
td(off)
tf
Turn-Off Delay Time
Fall Time
–––
–––
17 –––
12 –––
RG = 1.8Ω
VGS = 4.5V ꢀ
VGS = 0V
Ciss
Coss
Crss
Input Capacitance
––– 2980 –––
––– 1770 –––
––– 280 –––
Output Capacitance
Reverse Transfer Capacitance
VDS = 10V
ƒ = 1.0MHz
Avalanche Characteristics
Symbol
EAS
Parameter
Single Pulse Avalanche Energyꢁ
Typ.
–––
Max.
460
30
Units
mJ
IAR
Avalanche Currentꢂ
–––
A
Diode Characteristics
Symbol
IS
Parameter
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
Continuous Source Current
(Body Diode)
––– –––
––– –––
110ꢀ
showing the
A
G
ISM
Pulsed Source Current
(Body Diode) ꢁ
integral reverse
p-n junction diode.
440
S
––– 0.88 1.3
––– 0.82 –––
V
TJ = 25°C, IS = 30A, VGS = 0V ꢂ
TJ = 125°C, IS = 30A, VGS = 0V ꢂ
TJ = 25°C, IF = 16A, VR=10V
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Time
Reverse Recovery Charge
––– 50
––– 61
––– 48
––– 65
75
92
72
98
ns
Qrr
trr
nC di/dt = 100A/µs
ns TJ = 125°C, IF = 16A, VR=10V
nC di/dt = 100A/µs
ꢀ
Qrr
ꢀ
2
www.irf.com
IRF3711/3711S/3711L
1000
1000
100
10
VGS
VGS
15V
TOP
TOP
15V
10V
10V
4.5V
3.7V
3.5V
3.3V
3.0V
4.5V
3.7V
3.5V
3.3V
3.0V
BOTTOM 2.7V
BOTTOM 2.7V
100
2.7V
2.7V
20µs PULSE WIDTH
°
T = 150 C
J
20µs PULSE WIDTH
T = 25 C
J
°
10
0.1
1
10
100
0.1
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1000
2.0
110A
=
I
D
°
T = 25 C
J
1.5
1.0
0.5
0.0
°
T = 150 C
J
100
V
= 25V
DS
V
=10V
GS
20µs PULSE WIDTH
10
2.0
-60 -40 -20
0
20 40 60 80 100 120 140 160
3.0
4.0
5.0
6.0 7.0 8.0
°
T , Junction Temperature ( C)
J
V
, Gate-to-Source Voltage (V)
GS
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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3
IRF3711/3711S/3711L
14
12
10
8
I
D
= 30A
100000
V
V
= 16V
= 10V
V
= 0V,
f = 1 MHZ
DS
DS
GS
C
= C + C
,
C
ds
SHORTED
iss
gs
gd
C
= C
rss
gd
C
= C + C
oss
ds
gd
10000
1000
100
Ciss
Coss
6
4
Crss
2
FOR TEST CIRCUIT
SEE FIGURE 13
1
10
, Drain-to-Source Voltage (V)
100
0
0
20
40
60
80
V
DS
Q , Total Gate Charge (nC)
G
Fig 6. Typical Gate Charge Vs.
Fig 5. Typical Capacitance Vs.
Gate-to-Source Voltage
Drain-to-Source Voltage
1000
100
10
10000
1000
100
10
OPERATION IN THIS AREA
LIMITED BY R
(on)
DS
°
T = 150 C
J
100µsec
1msec
°
T = 25 C
J
1
10msec
Tc = 25°C
Tj = 150°C
Single Pulse
V
= 0 V
GS
1
0.1
0.2
0.8
1.4
2.0
2.6
1
10
, Drain-toSource Voltage (V)
100
V
,Source-to-Drain Voltage (V)
SD
V
DS
Fig 8. Maximum Safe Operating Area
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
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IRF3711/3711S/3711L
RD
120
100
80
60
40
20
0
VDS
LIMITED BY PACKAGE
VGS
D.U.T.
RG
+VDD
-
VGS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
V
DS
90%
25
50
75
100
125
150
°
T , Case Temperature ( C)
C
10%
V
GS
t
t
r
t
t
f
Fig 9. Maximum Drain Current Vs.
d(on)
d(off)
Case Temperature
Fig 10b. Switching Time Waveforms
10
1
D = 0.50
0.20
P
2
DM
0.10
0.05
0.1
0.01
t
1
t
0.02
0.01
2
SINGLE PULSE
(THERMAL RESPONSE)
Notes:
1. Duty factor D =
2. Peak T =P
t / t
1
x Z
+ T
thJC C
J
DM
0.00001
0.0001
0.001
0.01
0.1
t , Rectangular Pulse Duration (sec)
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRF3711/3711S/3711L
1400
1200
1000
800
600
400
200
0
I
15V
D
TOP
13A
19A
BOTTOM 30A
DRIVER
+
L
V
DS
D.U.T
R
G
V
DD
-
I
A
AS
20V
0.01
Ω
t
p
Fig 12a. Unclamped Inductive Test Circuit
V
(BR)DSS
t
p
25
50
75
100
125
150
°
Starting T , Junction Temperature ( C)
J
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
I
AS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
50KΩ
.2µF
12V
.3µF
Q
G
+
VGS
V
DS
D.U.T.
-
Q
Q
GD
GS
V
GS
V
G
3mA
I
I
D
G
Current Sampling Resistors
Charge
Fig 13b. Gate Charge Test Circuit
Fig 13a. Basic Gate Charge Waveform
6
www.irf.com
IRF3711/3711S/3711L
Peak Diode Recovery dv/dt Test Circuit
+
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
D.U.T
ꢀ
-
+
ꢂ
-
ꢁ
-
+
ꢃ
RG
• dv/dt controlled by RG
+
-
• Driver same type as D.U.T.
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
VDD
Driver Gate Drive
P.W.
P.W.
Period
Period
D =
V
=10V
*
GS
D.U.T. I Waveform
SD
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. V Waveform
DS
Diode Recovery
dv/dt
V
DD
Re-Applied
Voltage
Body Diode
Forward Drop
Inductor Curent
I
SD
Ripple ≤ 5%
* VGS = 5V for Logic Level Devices
Fig 14. For N-Channel HEXFET® Power MOSFETs
www.irf.com
7
IRF3711/3711S/3711L
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
10.54 (.415)
3.78 (.149)
- B -
10.29 (.405)
2.87 (.113)
2.62 (.103)
4.69 (.185)
4.20 (.165)
3.54 (.139)
1.32 (.052)
1.22 (.048)
- A -
6.47 (.255)
6.10 (.240)
4
15.24 (.600)
14.84 (.584)
1.15 (.045)
MIN
LEAD ASSIGNMENTS
1 - GATE
1
2
3
2 - DRAIN
3 - SOURCE
4 - DRAIN
14.09 (.555)
13.47 (.530)
4.06 (.160)
3.55 (.140)
0.93 (.037)
0.69 (.027)
0.55 (.022)
0.46 (.018)
3X
3X
1.40 (.055)
3X
1.15 (.045)
0.36 (.014)
M
B A M
2.92 (.115)
2.64 (.104)
2.54 (.100)
2X
NOTES:
1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.
2 CONTROLLING DIMENSION : INCH
3 OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB.
4 HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS.
TO-220AB Part Marking Information
EXAMPLE: THIS IS AN IRF101
0
PART NUMBER
INTERNATIONAL
RECTIFIER
LOGO
LOT CODE
1789
ASSEM
BLED ON WW 19, 1997
IN T
HE ASSEMBLY LINE "C"
DATE CODE
YEAR 7 = 1997
ASSEMBLY
LOT CODE
WEEK 19
LINE C
8
www.irf.com
IRF3711/3711S/3711L
D2Pak Package Outline
IRF3711/3711S/3711L
TO-262 Package Outline
TO-262 Part Marking Information
10
www.irf.com
IRF3711/3711S/3711L
D2Pak Tape & Reel Information
TRR
1.60 (.063)
1.50 (.059)
1.60 (.063)
4.10 (.161)
1.50 (.059)
3.90 (.153)
0.368 (.0145)
0.342 (.0135)
FEED DIRECTION
11.60 (.457)
11.40 (.449)
1.85 (.073)
1.65 (.065)
Notes:
24.30 (.957)
23.90 (.941)
15.42 (.609)
ꢀ Repetitive rating; pulse width limited by
ꢂ Pulse width ≤ 400µs; duty cycle ≤ 2%.
15.22 (.601)
max. junction temperature.
TRL
ꢃ This is only applied to TO-220AB package
1.75 (.069)
1.25 (.049)
ꢁ Starting T = 25°C, L = 1.0mH
10.90 (.429)
J
4.72 (.136)
4.52 (.178)
10.70 (.421)
RG = 25Ω, IAS = 30A.
16.10 (.634)
15.90 (.626)
ꢀ This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
FEED DIRECTION
ꢁ Calculated continuous current based on maximum allowable
junction temperature. Package limitation current is 75A.
13.50 (.532)
12.80 (.504)
27.40 (1.079)
23.90 (.941)
Data and specifications subject to change without notice.
4
This product has been designed and qualified for the industrial market.
Qualification Standards can be found on IR’s Web site.
330.00
(14.173)
MAX.
60.00 (2.362)
MIN.
30.40 (1.197)
MAX.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
NOTES :
1. COMFORMS TO EIA-418.
TAC Fax: (310) 252-7903
26.40 (1.039)
24.40 (.961)
4
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
www.irf.com
Visit us at www.irf.com for sales contact information. 11/01
3
11
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