IRF6623 [INFINEON]
HEXFET Power MOSFET; HEXFET功率MOSFET
| 型号： | IRF6623 |
| 厂家： | 
Infineon |
| 描述： | HEXFET Power MOSFET |
| 文件： | 总8页 (文件大小：170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD - 95824B
IRF6623
HEXFET® Power MOSFET
l Application Specific MOSFETs
l Ideal for CPU Core DC-DC Converters
l Low Conduction Losses
VDSS
20V
RDS(on) max
5.7mΩ@VGS = 10V
Qg(typ.)
11nC
l Low Switching Losses
9.7mΩ@VGS = 4.5V
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible
l Compatible with Existing Surface Mount Techniques
DirectFET ISOMETRIC
ST
Applicable DirectFET Outline and Substrate Outline (see p.8,9 for details)
SQ
SX
ST
MQ
MX
MT
Description
The IRF6623 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to
achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The
DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and
vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufac-
turing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power
systems, IMPROVING previous best thermal resistance by 80%.
The IRF6623 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction
and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the
latest generation of processors operating at higher frequencies. The IRF6623 has been optimized for parameters that are
critical in synchronous buck operating from 12 volt buss converters including Rds(on) and gate charge to minimize losses in
the control FET socket.
Absolute Maximum Ratings
Max.
Parameter
Units
VDS
20
Drain-to-Source Voltage
Gate-to-Source Voltage
V
±20
V
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
55
I
I
I
I
@ TC = 25°C
D
D
D
16
@ TA = 25°C
@ TA = 70°C
A
13
120
DM
2.1
P
P
P
@TA = 25°C
@TA = 70°C
@TC = 25°C
Power Dissipation
D
D
D
1.4
Power Dissipation
W
42
43
Power Dissipation
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
12
0.017
Linear Derating Factor
W/°C
°C
-40 to + 150
T
T
Operating Junction and
J
Storage Temperature Range
STG
Thermal Resistance
Parameter
Typ.
–––
12.5
20
Max.
58
Units
Rθ
Rθ
Rθ
Rθ
Rθ
Junction-to-Ambient
JA
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
–––
–––
3.0
JA
°C/W
JA
–––
1.0
JC
Junction-to-PCB Mounted
–––
J-PCB
Notes through are on page 2
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1
4/1/04
IRF6623
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
VGS = 0V, ID = 250µA
BVDSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
20
–––
–––
–––
1.55
–––
–––
–––
–––
–––
34
–––
15
–––
V
∆ΒVDSS/∆TJ
RDS(on)
––– mV/°C Reference to 25°C, ID = 1mA
mΩ
4.4
7.5
–––
-5.4
–––
–––
–––
–––
–––
11
5.7
9.7
VGS = 10V, ID = 15A e
VGS = 4.5V, ID = 12A e
VDS = VGS, ID = 250µA
VGS(th)
Gate Threshold Voltage
2.45
V
∆VGS(th)/∆TJ
IDSS
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
––– mV/°C
1.0
150
100
-100
–––
17
µA VDS = 16V, VGS = 0V
V
V
V
DS = 16V, VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
nA
S
GS = 20V
GS = -20V
gfs
VDS = 10V, ID = 12A
Qg
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Qgs1
Qgs2
Qgd
Qgodr
Qsw
Qoss
td(on)
tr
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Qgs2 + Qgd)
Output Charge
3.3
1.2
4.0
2.5
5.2
8.9
9.7
40
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
VDS = 10V
nC
nC
VGS = 4.5V
ID = 12A
See Fig. 17
VDS = 10V, VGS = 0V
Turn-On Delay Time
VDD = 16V, VGS = 4.5Vꢁe
Rise Time
ID = 12A
td(off)
tf
Turn-Off Delay Time
12
ns Clamped Inductive Load
Fall Time
4.5
Ciss
Coss
Crss
Input Capacitance
––– 1360 –––
VGS = 0V
Output Capacitance
–––
–––
630
240
–––
–––
pF
VDS = 10V
Reverse Transfer Capacitance
ƒ = 1.0MHz
Diode Characteristics
Parameter
Min. Typ. Max. Units
Conditions
IS
D
Continuous Source Current
–––
–––
2.6
MOSFET symbol
(Body Diode)
A
showing the
G
ISM
Pulsed Source Current
(Body Diode)ꢁc
–––
–––
120
integral reverse
S
p-n junction diode.
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
–––
–––
–––
0.81
20
1.0
30
18
V
TJ = 25°C, IS = 12A, VGS = 0V e
ns TJ = 25°C, IF = 12A
di/dt = 100A/µs e
nC
Qrr
12
Notes:
ꢀ Used double sided cooling, mounting pad.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
TC measured with thermal couple mounted to top (Drain) of
part.
Repetitive rating; pulse width limited by
max. junction temperature.
Starting TJ = 25°C, L = 0.61mH,
RG = 25Ω, IAS = 12A.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
Surface mounted on 1 in. square Cu board.
R is measured at TJ of approximately 90°C.
θ
2
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IRF6623
1000
100
10
1000
100
10
VGS
10V
VGS
10V
TOP
TOP
5.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
BOTTOM
BOTTOM
1
2.5V
2.5V
1
≤
60µs PULSE WIDTH
≤
60µs PULSE WIDTH
Tj = 25°C
Tj = 150°C
0.1
1
0.1
10
100
0.1
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1000.0
100.0
10.0
1.0
1.5
1.0
0.5
I
= 15A
D
V
= 10V
GS
T
= 150°C
J
T
= 25°C
J
V
= 10V
DS
≤
60µs PULSE WIDTH
0.1
2.5
3.0
3.5
4.0
4.5
5.0
-60 -40 -20
T
0
20 40 60 80 100 120 140 160
V
, Gate-to-Source Voltage (V)
GS
, Junction Temperature (°C)
J
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance vs. Temperature
10000
12
V
= 0V,
= C
f = 1 MHZ
GS
I = 11A
C
C
C
+ C , C
SHORTED
D
V
= 20V
iss
gs
gd
ds
DS
VDS= 10V
= C
rss
oss
gd
10
8
= C + C
ds
gd
Ciss
1000
6
Coss
4
Crss
2
0
100
0
10
Total Gate Charge (nC)
G
20
30
1
10
, Drain-to-Source Voltage (V)
100
Q
V
DS
Fig 5. Typical Capacitance vs.Drain-to-Source Voltage
Fig 6. Typical Gate Charge vs.Gate-to-Source Voltage
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3
IRF6623
1000.0
1000
100
10
OPERATION IN THIS AREA
LIMITED BY R (on)
DS
100.0
T
J
= 150°C
10.0
1.0
T
= 25°C
V
1
J
100µsec
Tc = 25°C
Tj = 150°C
Single Pulse
1msec
= 0V
GS
10msec
0.1
0.1
0
1
10
100
0.2
0.4
0.6
0.8
1.0
1.2
V
, Drain-toSource Voltage (V)
V
, Source-to-Drain Voltage (V)
DS
SD
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
60
2.5
2.0
1.5
1.0
50
40
30
20
10
0
I
= 250µA
D
25
50
75
100
125
150
-75 -50 -25
0
25
50
75 100 125 150
T
J
, Junction Temperature (°C)
T , Temperature ( °C )
J
Fig 10. Threshold Voltage vs. Temperature
Fig 9. Maximum Drain Current vs. Case Temperature
100
D = 0.50
0.20
10
0.10
0.05
1
0.1
0.02
0.01
R1
R1
R2
R2
R3
R3
R4
R4
Ri (°C/W) τi (sec)
2.023
19.48
21.78
14.71
0.000678
0.240237
2.0167
58
τ
τ
J τJ
τ
Cτ
τ
1τ1
τ
τ
2τ2
3τ3
4τ4
Ci= τi/Ri
0.01
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t
, Rectangular Pulse Duration (sec)
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
4
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IRF6623
200
160
120
80
20
16
12
8
I
I
= 15A
D
5.2A
7.9A
D
TOP
BOTTOM 12A
T
T
= 125°C
= 25°C
J
40
J
4
0
2.0
4.0
6.0
8.0
10.0
25
50
75
100
125
150
V
, Gate-to-Source Voltage (V)
GS
Starting T , Junction Temperature (°C)
J
Fig 12. On-Resistance Vs. Gate Voltage
Fig 13c. Maximum Avalanche Energy Vs. Drain Current
15V
LD
VDS
DRIVER
+
L
V
DS
+
-
VDD
D.U.T
AS
R
G
V
DD
-
D.U.T
I
A
V
GS
VGS
0.01Ω
t
p
Pulse Width < 1µs
Duty Factor < 0.1%
Fig 13a. Unclamped Inductive Test Circuit
Fig 14a. Switching Time Test Circuit
VDS
V
(BR)DSS
t
p
90%
10%
VGS
td(on)
td(off)
tr
tf
I
AS
Fig 14b. Switching Time Waveforms
Fig 13b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
Id
Vds
50KΩ
Vgs
.2µF
12V
.3µF
+
V
DS
D.U.T.
-
V
GS
Vgs(th)
3mA
I
I
D
G
Current Sampling Resistors
Qgs1
Qgs2
Qgd
Qgodr
Fig 15. Gate Charge Test Circuit
Fig 16. Gate Charge Waveform
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5
IRF6623
Driver Gate Drive
P.W.
P.W.
Period
Period
D =
D.U.T
+
*
=10V
V
GS
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
-
D.U.T. I Waveform
SD
+
-
Reverse
Recovery
Current
Body Diode Forward
Current
-
+
di/dt
D.U.T. V Waveform
DS
Diode Recovery
dv/dt
V
DD
VDD
Re-Applied
Voltage
• di/dt controlled by RG
• Driver same type as D.U.T.
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
RG
+
-
Body Diode
Inductor Current
Forward Drop
I
SD
Ripple
≤ 5%
* VGS = 5V for Logic Level Devices
Fig 17. Diode Reverse Recovery Test Circuit for N-Channel
HEXFET® Power MOSFETs
DirectFET Substrate and PCB Layout, ST Outline
(Small Size Can, T-Designation).
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET.
This includes all recommendations for stencil and substrate designs.
1- Drain
2- Drain
3- Source
4- Source
5- Gate
6- Drain
7- Drain
6
7
1
2
3
4
5
6
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IRF6623
DirectFET Outline Dimension, ST Outline
(Small Size Can, T-Designation).
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET.
This includes all recommendations for stencil and substrate designs.
DIMENSIONS
IMPERIAL
METRIC
MAX
CODE
MIN
MIN
4.75
3.70
2.75
0.35
0.58
0.58
0.75
0.53
0.26
O.88
2.18
0.59
0.03
0.08
MAX
0.191
0.156
0.112
0.018
0.024
0.024
0.031
0.022
0.012
0.039
0.090
0.028
0.003
0.007
4.85
3.95
2.85
0.45
0.62
0.62
0.79
0.57
0.30
0.98
2.28
0.70
0.08
0.17
0.187
0.146
0.108
0.014
0.023
0.023
0.030
0.021
0.010
0.035
0.086
0.023
0.001
0.003
A
B
C
D
E
F
Note: Controlling
dimensions are in mm
G
H
J
K
L
M
N
P
DirectFET Part Marking
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7
IRF6623
DirectFET Tape & Reel Dimension (Showing component orientation).
NOTE: Controlling dimensions in mm
Std reel quantity is 4800 parts. (ordered as IRF6618). For 1000 parts on 7" reel,
order IRF6618TR1
REEL DIMENSIONS
STANDARD OPTION (QTY 4800)
TR1 OPTION (QTY 1000)
METRIC
MAX
IMPERIAL
METRIC
MIN MAX
IMPERIAL
CODE
MIN
12.992
0.795
0.504
0.059
3.937
N.C
MAX
N.C
MIN
6.9
MAX
N.C
N.C
0.50
N.C
N.C
0.53
N.C
N.C
MIN
A
B
C
D
E
F
330.0
20.2
12.8
1.5
N.C
N.C
13.2
N.C
N.C
18.4
14.4
15.4
177.77 N.C
0.75
0.53
0.059
2.31
N.C
N.C
19.06
13.5
1.5
N.C
0.520
N.C
12.8
N.C
100.0
N.C
58.72
N.C
N.C
N.C
0.724
0.567
0.606
13.50
12.01
12.01
G
H
0.488
0.469
0.47
0.47
12.4
11.9
11.9
11.9
Loaded Tape Feed Direction
DIMENSIONS
METRIC
IMPERIAL
NOTE: CONTROLLING
DIMENSIONS IN MM
CODE
MIN
7.90
3.90
A
B
C
D
E
F
11.90
5.45
5.10
6.50
1.50
1.50
G
H
Data and specifications subject to change without notice.
This product has been designed and qualified for the Consumer market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.4/04
8
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