IRF7466PBF [INFINEON]

SMPS MOSFET; 开关电源MOSFET
IRF7466PBF
型号: IRF7466PBF
厂家: Infineon    Infineon
描述:

SMPS MOSFET
开关电源MOSFET

晶体 开关 晶体管 功率场效应晶体管 脉冲 光电二极管
文件: 总8页 (文件大小:132K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD- 95730  
IRF7466PbF  
SMPS MOSFET  
Applications  
HEXFET® Power MOSFET  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Industrial Use  
l High Frequency Buck Converters for  
Computer Processor Power  
VDSS  
30V  
RDS(on) max(mW)  
ID  
12.5@VGS = 10V  
11A  
l Lead-Free  
A
A
D
1
2
3
4
8
S
S
S
G
Benefits  
7
D
l Ultra-Low Gate Impedance  
l Very Low RDS(on)  
6
D
5
D
l Fully Characterized Avalanche Voltage  
and Current  
SO-8  
Top View  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-to-Source Voltage  
± 20  
V
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
11  
9.0  
90  
A
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipationƒ  
Maximum Power Dissipationƒ  
Linear Derating Factor  
2.5  
W
W
1.6  
0.02  
mW/°C  
°C  
TJ , TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
Thermal Resistance  
Symbol  
RθJL  
Parameter  
Junction-to-Drain Lead  
Typ.  
–––  
Max.  
20  
Units  
RθJA  
Junction-to-Ambient „  
–––  
50  
°C/W  
Notes  through „ are on page 8  
www.irf.com  
1
8/11/04  
IRF7466PbF  
Static @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
30 ––– –––  
Conditions  
VGS = 0V, ID = 250µA  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– 0.028 ––– V/°C Reference to 25°C, ID = 1mA  
––– 9.8 12.5  
––– 13 17  
VGS = 10V, ID = 11A  
VGS = 4.5V, ID = 8.8A  
VDS = VGS, ID = 250µA  
VDS = 24V, VGS = 0V  
ƒ
ƒ
mΩ  
V
RDS(on)  
VGS(th)  
IDSS  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
1.0 ––– 3.0  
––– ––– 20  
––– ––– 100  
––– ––– 200  
––– ––– -200  
Drain-to-Source Leakage Current  
µA  
VDS = 24V, VGS = 0V, TJ = 125°C  
VGS = 16V  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
IGSS  
nA  
VGS = -16V  
Dynamic @ TJ = 25°C (unless otherwise specified)  
Symbol  
gfs  
Parameter  
Forward Transconductance  
Total Gate Charge  
Min. Typ. Max. Units  
Conditions  
22 ––– –––  
––– 16 23  
––– 7.4 11  
––– 5.3 8.0  
––– 19 29  
––– 10 –––  
––– 2.8 –––  
––– 13 –––  
––– 3.6 –––  
––– 2100 –––  
––– 710 –––  
––– 52 –––  
S
VDS = 15V, ID = 8.8A  
ID = 8.8A  
Qg  
Qgs  
Qgd  
Qoss  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Output Gate Charge  
Turn-On Delay Time  
Rise Time  
nC VDS = 15V  
VGS = 4.5V ƒ  
VGS = 0V, VDS = 15V  
VDD = 15V  
ID = 8.8A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 1.8Ω  
VGS = 4.5V ƒ  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
VDS = 15V  
pF ƒ = 1.0MHz  
Avalanche Characteristics  
Symbol  
EAS  
Parameter  
Single Pulse Avalanche Energy‚  
Avalanche Current  
Typ.  
–––  
Max.  
230  
Units  
mJ  
IAR  
–––  
8.8  
A
Diode Characteristics  
Symbol  
IS  
Parameter  
Min. Typ. Max. Units  
Conditions  
D
Continuous Source Current  
(Body Diode)  
MOSFET symbol  
2.3  
––– –––  
––– –––  
showing the  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
p-n junction diode.  
90  
S
––– 0.8 1.3  
––– 0.66 –––  
––– 42 63  
––– 59 89  
––– 42 63  
––– 61 92  
V
TJ = 25°C, IS = 8.8A, VGS = 0V  
ƒ
VSD  
Diode Forward Voltage  
TJ = 125°C, IS = 8.8A, VGS = 0V ƒ  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Time  
Reverse Recovery Charge  
ns TJ = 25°C, IF = 8.8A, VR=15V  
nC di/dt = 100A/µs ƒ  
ns TJ = 125°C, IF = 8.8A, VR=15V  
nC di/dt = 100A/µs ƒ  
Qrr  
trr  
Qrr  
2
www.irf.com  
IRF7466PbF  
1000  
100  
10  
1000  
100  
10  
VGS  
10V  
VGS  
10V  
TOP  
TOP  
5.0V  
4.5V  
4.0V  
3.5V  
3.3V  
3.0V  
5.0V  
4.5V  
4.0V  
3.5V  
3.3V  
3.0V  
BOTTOM 2.7V  
BOTTOM2.7V  
1
2.7V  
0.1  
0.01  
2.7V  
20µs PULSE WIDTH  
T = 150 C  
J
20µs PULSE WIDTH  
T = 25 C  
J
°
°
1
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
100  
2.0  
11A  
=
I
D
°
T = 150 C  
J
1.5  
1.0  
0.5  
0.0  
10  
°
T = 25 C  
J
1
V
= 15V  
DS  
20µs PULSE WIDTH  
V
=10V  
GS  
0.1  
2.5  
3.0  
3.5  
4.0 4.5  
5.0  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
V
, Gate-to-Source Voltage (V)  
T , Junction Temperature( C)  
J
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
www.irf.com  
3
IRF7466PbF  
10  
8
100000  
I
D
=
8.8A  
V
V
= 24V  
= 15V  
V
= 0V,  
f = 1 MHZ  
DS  
DS  
GS  
C
= C + C  
,
C
ds  
SHORTED  
iss  
gs gd  
C
= C  
rss  
gd  
C
= C + C  
ds gd  
oss  
10000  
1000  
100  
6
Ciss  
Coss  
4
Crss  
10  
2
10  
0
0
5
10  
15  
20  
25  
30  
1
100  
Q , Total Gate Charge (nC)  
G
V
, Drain-to-Source Voltage (V)  
DS  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
1000  
100  
10  
100  
10  
1
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
°
T = 150 C  
J
10us  
100us  
1ms  
°
T = 25 C  
J
°
T = 25 C  
A
10ms  
°
T = 150 C  
Single Pulse  
J
V
= 0 V  
GS  
1
0.1  
0.2  
0.1  
1
10  
100  
0.6  
1.0  
1.4  
1.8  
2.2  
V
, Drain-to-Source Voltage (V)  
V
,Source-to-Drain Voltage (V)  
DS  
SD  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
Forward Voltage  
4
www.irf.com  
Fig 6. On-Resistance Vs. Drain Current  
IRF7466PbF  
12  
10  
8
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
4.5V  
6
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
4
Fig 10a. Switching Time Test Circuit  
2
V
DS  
90%  
0
25  
50  
75  
100  
125  
150  
°
T , Case Temperature ( C)  
C
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 10b. Switching Time Waveforms  
100  
10  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
1
P
2
DM  
t
1
SINGLE PULSE  
0.1  
0.01  
(THERMAL RESPONSE)  
t
2
Notes:  
1. Duty factor D =  
2. Peak T =P  
J
t / t  
1
x Z  
+ T  
thJA A  
DM  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t , Rectangular Pulse Duration (sec)  
1
Fig 10. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
www.irf.com  
5
IRF7466PbF  
0.06  
0.025  
0.020  
0.015  
0.010  
0.005  
0.000  
0.04  
I
= 11A  
D
0.02  
V
= 4.5V  
V
GS  
= 10V  
GS  
0.00  
3.0  
4.0  
V
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0
20  
40  
60  
80  
100  
Gate -to -Source Voltage (V)  
I
, Drain Current (A)  
GS,  
D
Fig 12. On-Resistance Vs. Drain Current  
Fig 13. On-Resistance Vs. Gate Voltage  
Current Regulator  
Same Type as D.U.T.  
Q
G
50KΩ  
.3µF  
VGS  
.2µF  
12V  
Q
Q
GD  
GS  
+
600  
V
DS  
D.U.T.  
I
-
D
V
G
TOP  
3.9A  
7.0A  
BOTTOM 8.8A  
V
GS  
3mA  
Charge  
500  
400  
300  
200  
100  
0
I
I
D
G
Current Sampling Resistors  
Fig 13a&b. Basic Gate Charge Test Circuit  
and Waveform  
15V  
V
(BR)DSS  
DRIVER  
+
L
t
p
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
25  
50  
75  
100  
125  
150  
I
A
20V  
°
Starting T , Junction Temperature ( C)  
0.01  
t
p
J
I
AS  
Fig 14c. Maximum Avalanche Energy  
Fig 14a&b. Unclamped Inductive Test circuit  
Vs. Drain Current  
and Waveforms  
6
www.irf.com  
IRF7466PbF  
SO-8 Package Outline  
Dimensions are shown in millimeters (inches)  
INCHES  
MILLIMETERS  
DIM  
A
D
B
MIN  
.0532  
MAX  
.0688  
.0098  
.020  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
5
A
E
A1 .0040  
b
c
.013  
8
1
7
2
6
3
5
.0075  
.189  
.0098  
.1968  
.1574  
6
H
D
E
e
0.25 [.010]  
A
.1497  
4
.050 BASIC  
1.27 BASIC  
e 1 .025 BASIC  
0.635 BASIC  
H
K
L
y
.2284  
.0099  
.016  
0°  
.2440  
.0196  
.050  
8°  
5.80  
0.25  
0.40  
0°  
6.20  
0.50  
1.27  
8°  
e
6X  
e1  
K x 45°  
A
C
y
0.10 [.004]  
8X c  
A1  
B
8X L  
8X b  
0.25 [.010]  
7
C
A
F OOT PRINT  
8X 0.72 [.028]  
NOT ES :  
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.  
2. CONT ROLLING DIMENS ION: MILLIMET ER  
3. DIMENS IONS ARE SHOWN IN MILLIMETERS [INCHES].  
4. OUT L INE CONF OR MS T O JE DE C OU T L INE MS -012AA.  
5
6
7
DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS .  
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].  
6.46 [.255]  
DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS .  
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].  
DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO  
ASUBSTRATE.  
3X 1.27 [.050]  
8X 1.78 [.070]  
SO-8 Part Marking  
EXAMPLE: THIS IS AN IRF7101 (MOSFET)  
DATE CODE (YWW)  
P = DE S I GNAT E S L E AD-F R E E  
PRODUCT (OPTIONAL)  
Y= LAST DIGIT OF THE YEAR  
XXXX  
F7101  
WW = WEEK  
INTERNATIONAL  
RECTIFIER  
LOGO  
A = ASSEMBLYSITE CODE  
LOT CODE  
PART NUMBER  
www.irf.com  
7
IRF7466PbF  
SO-8 Tape and Reel  
Dimensions are shown in millimeters (inches)  
TERMINAL NUMBER 1  
12.3 ( .484 )  
11.7 ( .461 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
NOTES:  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
330.00  
(12.992)  
MAX.  
14.40 ( .566 )  
12.40 ( .488 )  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
Notes:  
 Repetitive rating; pulse width limited by  
ƒ Pulse width 400µs; duty cycle 2%.  
max. junction temperature.  
„ When mounted on 1 inch square copper board, t<10 sec  
‚ Starting TJ = 25°C, L = 5.9mH  
RG = 25, IAS = 8.8A.  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the Consumer market.  
Qualifications Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.08/04  
8
www.irf.com  

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