IRFPC60LC [INFINEON]

Power MOSFET(Vdss=600V, Rds(on)=0.40ohm, Id=16A); 功率MOSFET ( VDSS = 600V , RDS(ON) = 0.40ohm ,ID = 16A)
IRFPC60LC
型号: IRFPC60LC
厂家: Infineon    Infineon
描述:

Power MOSFET(Vdss=600V, Rds(on)=0.40ohm, Id=16A)
功率MOSFET ( VDSS = 600V , RDS(ON) = 0.40ohm ,ID = 16A)

文件: 总8页 (文件大小:299K)
中文:  中文翻译
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PD - 9.1234  
IRFPC60LC  
HEXFET® Power MOSFET  
Ultra Low Gate Charge  
Reduced Gate Drive Requirement  
Enhanced 30V Vgs Rating  
Reduced Ciss, Coss, Crss  
Isolated Central Mounting Hole  
Dynamic dv/dt Rated  
VDSS = 600V  
RDS(on) = 0.40Ω  
ID = 16A  
Repetitive Avalanche Rated  
Description  
This new series of Low Charge HEXFET Power MOSFETs achieve significantly  
lower gate charge over conventional MOSFETs. Utilizing advanced Hexfet  
technology the device improvements allow for reduced gate drive requirements,  
faster switching speeds and increased total system savings. These device  
improvements combined with the proven ruggedness and reliability of HEXFETs  
offer the designer a new standard in power transistors for switching applications.  
The TO-247 package is preferred for commercial-industrial applications where  
higher power levels preclude the use of TO-220 devices. The TO-247 is similar  
but superior to the earlier TO-218 package because of its isolated mounting hole.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, V GS @ 10V  
Continuous Drain Current, V GS @ 10V  
Pulsed Drain Current  
16  
10  
A
64  
280  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
2.2  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
±30  
Single Pulse Avalanche Energy  
Avalanche Current  
1000  
16  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
28  
mJ  
V/ns  
3.0  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw.  
°C  
300 (1.6mm from case)  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Min.  
––––  
––––  
Typ.  
––––  
0.24  
Max.  
0.45  
Units  
RθJC  
RθCS  
RθJA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
––––  
––––  
°C/W  
40  
––––  
To Order  
Revision 0  
 
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IRFPC60LC  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
600 ––– –––  
––– 0.63 ––– V/°C Reference to 25°C, I D = 1mA  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
VGS = 0V, ID = 250µA  
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient  
RDS(ON)  
VGS(th)  
gfs  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
––– ––– 0.40  
2.0 ––– 4.0  
11 ––– –––  
––– ––– 25  
––– ––– 250  
––– ––– 100  
––– ––– -100  
––– ––– 120  
––– ––– 29  
––– ––– 48  
––– 17 –––  
––– 57 –––  
––– 43 –––  
––– 38 –––  
V
S
VGS = 10V, ID = 9.6A  
VDS = VGS, ID = 250µA  
VDS = 50V, ID = 9.6A  
VDS = 600V, VGS = 0V  
VDS = 480V, VGS = 0V, TJ = 125°C  
VGS = 20V  
Forward Transconductance  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
µA  
nA  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
VGS = -20V  
Qg  
ID = 16A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
nC  
ns  
VDS = 360V  
VGS = 10V, See Fig. 6 and 13  
VDD = 300V  
ID = 16A  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 4.3Ω  
RD = 18Ω, See Fig. 10  
Between lead,  
LD  
LS  
Internal Drain Inductance  
Internal Source Inductance  
––– 5.0 –––  
6mm (0.25in.)  
nH  
pF  
from package  
––– 13  
–––  
and center of die contact  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
––– 3500 –––  
––– 400 –––  
––– 39 –––  
Output Capacitance  
VDS = 25V  
Reverse Transfer Capacitance  
ƒ = 1.0MHz, See Fig. 5  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFET symbol  
IS  
––– –––  
16  
showing the  
A
ISM  
Pulsed Source Current  
(Body Diode)  
integral reverse  
––– –––  
64  
p-n junction diode.  
TJ = 25°C, IS = 16A, VGS = 0V  
TJ = 25°C, IF = 16A  
di/dt = 100A/µs  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
––– ––– 1.8  
––– 650 980  
V
ns  
µC  
Qrr  
ton  
––– 6.0  
9.0  
Intrinsic turn-on time is negligible (turn-on is dominated by L S+LD)  
Notes:  
Repetitive rating; pulse width limited by  
max. junction temperature. ( See fig. 11 )  
I
SD 16A, di/dt 140A/µs, VDD V(BR)DSS,  
TJ 150°C  
VDD = 25V, starting T J = 25°C, L = 7.2mH  
Pulse width 300µs; duty cycle 2%.  
RG = 25, IAS = 16A. (See Figure 12)  
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IRFPC60LC  
1 00  
1 00  
10  
VGS  
VGS  
15V  
TOP  
15V  
TOP  
10V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
10  
BOTTOM 4.5V  
BOTTOM 4.5V  
4.5V  
1
1
0.1  
0.01  
0.1  
0.01  
4.5V  
20µs PULSE WIDTH  
20µs PULSE WIDTH  
T
C
= 25°C  
T
= 150°C  
C
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics,  
Fig 2. Typical Output Characteristics,  
TC = 25oC  
TC = 150oC  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
100  
10  
I
= 16A  
D
T
= 150°C  
J
1
T
= 25°C  
J
0.1  
0.01  
V
= 100V  
D S  
20µs PU LS E W ID TH  
V
GS  
= 10V  
-60 -40 -20  
0
20  
40  
60  
80 100 120 140 1 60  
4
5
6
7
8
9
10  
T
J
, Junction Temperature (°C)  
V
, G ate-to-Source V oltage (V)  
G S  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
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IRFPC60LC  
20  
16  
12  
8
7000  
I
= 16A  
D
V
C
C
C
= 0V,  
f = 1MHz  
GS  
iss  
rss  
oss  
= C + C  
,
C
SHORTED  
gs  
gd  
ds  
= C  
gd  
6000  
5000  
4000  
3000  
2000  
1000  
0
V
V
V
= 360V  
= 240V  
= 120V  
= C + C  
ds  
gd  
DS  
DS  
DS  
C
iss  
4
C
C
oss  
FOR TEST CIRCUIT  
SEE FIGURE 13  
rss  
0
0
30  
60  
90  
120  
1
10  
100  
Q
, Total Gate Charge (nC)  
V
, Drain-to-Source Voltage (V)  
DS  
G
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
100  
10  
1
1000  
100  
10  
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
10µs  
T = 150°C  
J
T = 25°C  
J
100µs  
1ms  
T
T
= 25°C  
C
J
= 150°C  
Single Pulse  
10ms  
V
GS  
= 0V  
1
0
0.4  
0.8  
1.2  
1.6  
2
1
10  
100  
1000  
100 00  
V
, Drain-to-Source Voltage (V)  
V
, Source-to-Drain Voltage (V)  
DS  
SD  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
Forward Voltage  
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IRFPC60LC  
RD  
VDS  
VGS  
16  
12  
8
D.U.T.  
RG  
VDD  
10 V  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
4
0
25  
50  
75  
100  
125  
150  
T
C
, Case Temperature (°C)  
Fig 9. Maximum Drain Current Vs.  
Fig 10b. Switching Time Waveforms  
Case Temperature  
1
D
= 0.5 0  
0.20  
0.1  
0.1 0  
0.0 5  
P
DM  
0.02  
0.01  
0.01  
t
1
SING LE PUL SE  
t
(T HERM AL RESPO NSE)  
2
N o tes :  
1 . Du ty fa ctor D  
=
t
/ t  
1 2  
2 . Pe ak T = P  
x Z  
+ T  
C
D M  
J
thJC  
1
0.001  
0.00001  
0.0001  
0.001  
0.01  
0 .1  
10  
t1 , Rectangular Pulse Duration (sec)  
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
To Order  
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IRFPC60LC  
10 V  
Index  
Next Data Sheet  
2400  
2000  
1600  
1200  
800  
I
D
TOP  
7.2A  
10A  
BOTTOM 16A  
Fig 12a. Unclamped Inductive Test Circuit  
400  
V
= 50V  
DD  
0
25  
50  
75  
100  
125  
150  
Starting T , Juntion Temperature (°C)  
J
Fig 12c. Maximum Avalanche Energy  
Vs. Drain Current  
Fig 12b. Unclamped Inductive Waveforms  
10 V  
Fig 13a. Basic Gate Charge Waveform  
Fig 13b. Gate Charge Test Circuit  
To Order  
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IRFPC60LC  
Peak Diode Recovery dv/dt Test Circuit  
Circuit Layout Considerations  
Low Stray Inductance  
Ground Plane  
D.U.T  
Low Leakage Inductance  
Current Transformer  
RG  
dv/dt controlled by R G  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
VDD  
*
* VGS = 5V for Logic Level Devices  
Fig 14. For N-Channel HEXFETS  
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IRFPC60LC  
Package Outline  
TO-247AC  
Part Marking Information  
TO-247AC  
EXAMPLE : THIS IS AN IRFPE30  
WITH ASSEMBLY  
A
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
LOT CODE 3A1Q  
IRFPE30  
3A1Q 9302  
DATE CODE  
(YYWW)  
ASSEMBLY  
LOT CODE  
YY = YEAR  
WW WEEK  
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331  
EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: (44) 0883 713215  
IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 3L1, Tel: (905) 475 1897 IR GERMANY:  
Saalburgstrasse 157, 61350 Bad Homburg Tel: 6172 37066 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: (39) 1145  
10111 IR FAR EAST: K&H Bldg., 2F, 3-30-4 Nishi-Ikeburo 3-Chome, Toshima-Ki, Tokyo 171 Tel: (03)3983 0641 IR  
SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, 0316 Tel: 65 221 8371  
Data and specifications subject to change without notice.  
To Order  

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