IRFS4127PBF [INFINEON]
HEXFET Power MOSFET; HEXFET功率MOSFET
| 型号： | IRFS4127PBF |
| 厂家： | 
Infineon |
| 描述： | HEXFET Power MOSFET |
| 文件： | 总10页 (文件大小：356K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD - 96177
IRFS4127PbF
IRFSL4127PbF
HEXFET® Power MOSFET
Applications
l High Efficiency Synchronous Rectification in SMPS
l Uninterruptible Power Supply
l High Speed Power Switching
D
VDSS
200V
18.6m
22m
RDS(on) typ.
G
max.
l Hard Switched and High Frequency Circuits
ID
72A
S
Benefits
l Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
D
D
l Fully Characterized Capacitance and Avalanche
SOA
l Enhanced body diode dV/dt and dI/dt Capability
l Lead-Free
S
D
S
G
G
D2Pak
IRFS4127PbF
TO-262
IRFSL4127PbF
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
Symbol
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Max.
72
Units
A
ID @ TC = 25°C
ID @ TC = 100°C
IDM
51
300
375
2.5
PD @TC = 25°C
W
Maximum Power Dissipation
Linear Derating Factor
W/°C
V
VGS
± 20
57
Gate-to-Source Voltage
Peak Diode Recovery
dv/dt
TJ
V/ns
°C
-55 to + 175
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
300
10lb in (1.1N m)
Mounting torque, 6-32 or M3 screw
Avalanche Characteristics
Single Pulse Avalanche Energy
EAS (Thermally limited)
250
mJ
A
Avalanche Current
IAR
See Fig. 14, 15, 22a, 22b,
Repetitive Avalanche Energy
EAR
mJ
Thermal Resistance
Symbol
Parameter
Typ.
–––
Max.
0.4
Units
RθJC
Junction-to-Case
°C/W
RθJA
–––
40
Junction-to-Ambient
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1
09/16/08
IRFS/SL4127PbF
Static @ TJ = 25°C (unless otherwise specified)
Symbol
V(BR)DSS
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Min. Typ. Max. Units
200 ––– –––
––– 0.23 ––– V/°C Reference to 25°C, ID = 5mA
Conditions
VGS = 0V, ID = 250µA
V
∆V(BR)DSS/∆TJ
RDS(on)
––– 18.6
3.0 –––
––– –––
22
5.0
20
VGS = 10V, ID = 44A
mΩ
V
VGS(th)
VDS = VGS, ID = 250µA
IDSS
Drain-to-Source Leakage Current
VDS = 200V, VGS = 0V
µA
––– ––– 250
––– ––– 100
––– ––– -100
VDS = 200V, VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Internal Gate Resistance
VGS = 20V
GS = -20V
nA
V
RG(int)
–––
3.0
–––
Ω
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
gfs
Qg
Parameter
Forward Transconductance
Total Gate Charge
Min. Typ. Max. Units
Conditions
VDS = 50V, ID = 44A
79
––– –––
S
––– 100 150
ID = 44A
Qgs
Qgd
Qsync
td(on)
tr
Gate-to-Source Charge
–––
–––
–––
–––
–––
–––
–––
30
31
69
17
18
56
22
–––
–––
–––
–––
–––
–––
–––
VDS = 100V
nC
Gate-to-Drain ("Miller") Charge
Total Gate Charge Sync. (Qg - Qgd)
VGS = 10V
ID = 44A, VDS =0V, VGS = 10V
VDD = 130V
Turn-On Delay Time
Rise Time
ID = 44A
ns
td(off)
tf
Turn-Off Delay Time
RG = 2.7Ω
VGS = 10V
Fall Time
Ciss
Coss
Crss
Input Capacitance
––– 5380 –––
––– 410 –––
V
GS = 0V
Output Capacitance
VDS = 50V
Reverse Transfer Capacitance
Effective Output Capacitance (Energy Related)
Effective Output Capacitance (Time Related)
–––
86
–––
pF ƒ = 1.0MHz (See Fig.5)
Coss eff. (ER)
oss eff. (TR)
––– 360 –––
––– 590 –––
V
GS = 0V, VDS = 0V to 160V (See Fig.11)
GS = 0V, VDS = 0V to 160V
C
V
Diode Characteristics
Symbol
Parameter
Continuous Source Current
Min. Typ. Max. Units
Conditions
MOSFET symbol
IS
––– –––
––– ––– 300
––– ––– 1.3
76
D
S
(Body Diode)
showing the
A
ISM
Pulsed Source Current
(Body Diode)
integral reverse
G
p-n junction diode.
TJ = 25°C, IS = 44A, VGS = 0V
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
V
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 125°C
TJ = 25°C
VR = 100V,
IF = 44A
di/dt = 100A/µs
––– 136 –––
––– 139 –––
––– 458 –––
––– 688 –––
ns
Qrr
Reverse Recovery Charge
nC
A
IRRM
ton
Reverse Recovery Current
Forward Turn-On Time
–––
8.3
–––
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by max. junction
temperature.
Limited by TJmax, starting TJ = 25°C, L = 0.26mH
RG = 25Ω, IAS = 44A, VGS =10V. Part not recommended for use
above this value .
ꢀ Coss eff. (TR) is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS
Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS
When mounted on 1" square PCB (FR-4 or G-10 Material). For recom
.
.
ISD ≤ 44A, di/dt ≤ 760A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
mended footprint and soldering techniques refer to application note #AN-994.
Rθ is measured at TJ approximately 90°C
RθJC value shown is at time zero
2
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IRFS/SL4127PbF
1000
100
10
1000
100
10
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
TOP
TOP
BOTTOM
BOTTOM
1
4.5V
1
0.1
0.01
60µs PULSE WIDTH
≤
Tj = 175°C
60µs PULSE WIDTH
Tj = 25°C
≤
4.5V
0.1
0.1
1
10
100
0.1
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
3.5
3.0
2.5
2.0
1.5
1.0
0.5
1000
100
10
I
= 44A
V
= 50V
D
DS
60µs PULSE WIDTH
V
= 10V
≤
GS
T
= 175°C
J
T
= 25°C
J
1
0.1
3.0
4.0
5.0
6.0
7.0
8.0
-60 -40 -20
0
20 40 60 80 100 120 140 160 180
V
, Gate-to-Source Voltage (V)
GS
T
, Junction Temperature (°C)
J
Fig 4. Normalized On-Resistance vs. Temperature
Fig 3. Typical Transfer Characteristics
8000
6000
4000
2000
0
16
V
C
= 0V,
f = 1 MHZ
GS
I = 44A
D
= C + C , C SHORTED
iss
gs
gd ds
V
V
V
= 160V
= 100V
= 40V
C
= C
DS
DS
DS
rss
gd
C
= C + C
oss
ds
gd
12
8
C
iss
4
C
oss
C
rss
0
0
20
40
60
80
100
120
1
10
100
Q
Total Gate Charge (nC)
G
V
, Drain-to-Source Voltage (V)
DS
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
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3
IRFS/SL4127PbF
1000
1000
100
10
OPERATION IN THIS AREA
LIMITED BY R
(on)
DS
100µsec
T
= 175°C
100
10
1
J
1msec
T
= 25°C
J
10msec
1
Tc = 25°C
Tj = 175°C
Single Pulse
V
= 0V
1.2
GS
DC
0.1
0.1
0.0
0.2
V
0.4
0.6
0.8
1.0
1.4
1
10
100
1000
V
, Drain-toSource Voltage (V)
, Source-to-Drain Voltage (V)
DS
SD
Fig 8. Maximum Safe Operating Area
Fig 7. Typical Source-Drain Diode
Forward Voltage
260
80
60
40
20
0
Id = 5mA
240
220
200
180
-60 -40 -20 0 20 40 60 80 100120140160180
25
50
75
100
125
150
175
T
, Temperature ( °C )
T
, Case Temperature (°C)
J
Fig 9. MaxiCmum Drain Current vs.
Fig 10. Drain-to-Source Breakdown Voltage
Case Temperature
8.0
6.0
4.0
2.0
0.0
1000
I
D
TOP
8.2A
13A
44A
800
600
400
200
0
BOTTOM
0
40
80
120
160
200
25
50
75
100
125
150
175
V
Drain-to-Source Voltage (V)
Starting T , Junction Temperature (°C)
J
DS,
Fig 11. Typical COSS Stored Energy
Fig 12. Maximum Avalanche Energy Vs. DrainCurrent
4
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IRFS/SL4127PbF
1
D = 0.50
0.20
0.1
R1
R1
R2
R2
R3
R3
R4
R4
τι
(sec)
Ri (°C/W)
0.02
0.10
0.05
τJ
0.000019
τC
τJ
τ1
τ
0.083333 0.000078
0.181667 0.001716
0.113333 0.008764
τ
τ
3 τ3
τ4
2 τ2
τ1
τ4
0.02
0.01
0.01
Ci= τi/Ri
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t
, Rectangular Pulse Duration (sec)
1
Fig 13. Maximum Effective Transient Thermal Impedance, Junction-to-Case
100
10
1
Allowed avalanche Current vs avalanche
Duty Cycle = Single Pulse
pulsewidth, tav, assuming Tj = 150°C and
∆
Tstart =25°C (Single Pulse)
0.01
0.05
0.10
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming ∆Τ j = 25°C and
Tstart = 150°C.
0.1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 14. Typical Avalanche Current vs.Pulsewidth
250
200
150
100
50
Notes on Repetitive Avalanche Curves , Figures 14, 15:
(For further info, see AN-1005 at www.irf.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 16a, 16b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
TOP
BOTTOM 1% Duty Cycle
= 44A
Single Pulse
I
D
6. Iav = Allowable avalanche current.
7. ∆T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 14, 15).
tav = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
ZthJC(D, tav) = Transient thermal resistance, see Figures 13)
0
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC
25
50
75
100
125
150
175
Iav = 2DT/ [1.3·BV·Zth]
EAS (AR) = PD (ave)·tav
Starting T , Junction Temperature (°C)
J
Fig 15. Maximum Avalanche Energy vs. Temperature
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5
IRFS/SL4127PbF
6.0
50
40
30
20
10
0
I
I
I
= 1.0A
D
D
D
= 1.0mA
= 250µA
5.0
4.0
3.0
2.0
1.0
I
= 29A
F
V
T
= 100V
R
= 125°C
= 25°C
J
T
J
-75 -50 -25
0
J
25 50 75 100 125 150 175
, Temperature ( °C )
100 200 300 400 500 600 700 800 900 1000
T
di / dt - (A / µs)
f
Fig. 17 - Typical Recovery Current vs. dif/dt
Fig 16. Threshold Voltage Vs. Temperature
60
3000
50
40
30
20
2500
2000
1500
1000
500
I
= 44A
I
= 29A
F
F
V
= 100V
V
= 100V
R
R
10
0
T
= 125°C
= 25°C
T
= 125°C
= 25°C
J
J
T
T
J
J
0
100 200 300 400 500 600 700 800 900 1000
100 200 300 400 500 600 700 800 900 1000
di / dt - (A / µs)
f
di / dt - (A / µs)
f
Fig. 18 - Typical Recovery Current vs. dif/dt
Fig. 19 - Typical Stored Charge vs. dif/dt
3000
2500
2000
1500
1000
500
I
= 44A
F
V
= 100V
= 125°C
= 25°C
R
T
J
J
T
0
100 200 300 400 500 600 700 800 900 1000
di / dt - (A / µs)
f
Fig. 20 - Typical Stored Charge vs. dif/dt
6
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IRFS/SL4127PbF
Driver Gate Drive
P.W.
P.W.
Period
D.U.T
Period
D =
+
*
=10V
V
GS
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
-
D.U.T. I Waveform
SD
+
-
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
-
+
D.U.T. V Waveform
DS
Diode Recovery
dv/dt
V
DD
VDD
Re-Applied
Voltage
• dv/dt controlled by RG
RG
+
-
Body Diode
Forward Drop
• Driver same type as D.U.T.
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
Inductor Current
I
SD
Ripple ≤ 5%
* VGS = 5V for Logic Level Devices
Fig 21. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET® Power MOSFETs
V
(BR)DSS
15V
t
p
DRIVER
+
L
V
DS
D.U.T
AS
R
G
V
DD
-
I
A
V
2
GS
Ω
0.01
t
p
I
AS
Fig 22b. Unclamped Inductive Waveforms
Fig 22a. Unclamped Inductive Test Circuit
RD
VDS
V
DS
90%
VGS
D.U.T.
RG
+
VDD
-
VGS
10%
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
V
GS
t
t
r
t
t
f
d(on)
d(off)
Fig 23a. Switching Time Test Circuit
Fig 23b. Switching Time Waveforms
Id
Current Regulator
Same Type as D.U.T.
Vds
Vgs
50KΩ
.2µF
12V
.3µF
+
V
DS
D.U.T.
-
Vgs(th)
V
GS
3mA
I
I
D
G
Qgs1
Qgs2
Qgd
Qgodr
Current Sampling Resistors
Fig 24a. Gate Charge Test Circuit
Fig 24b. Gate Charge Waveform
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7
IRFS/SL4127PbF
D2Pak (TO-263AB) Package Outline
Dimensions are shown in millimeters (inches)
D2Pak (TO-263AB) Part Marking Information
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
8
www.irf.com
IRFS/SL4127PbF
TO-262 Package Outline
Dimensions are shown in millimeters (inches)
TO-262 Part Marking Information
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
www.irf.com
9
IRFS/SL4127PbF
D2Pak (TO-263AB) Tape & Reel Information
Dimensions are shown in millimeters (inches)
TRR
1.60 (.063)
1.50 (.059)
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
0.368 (.0145)
0.342 (.0135)
FEED DIRECTION
1.85 (.073)
11.60 (.457)
11.40 (.449)
1.65 (.065)
24.30 (.957)
23.90 (.941)
15.42 (.609)
15.22 (.601)
TRL
1.75 (.069)
1.25 (.049)
10.90 (.429)
10.70 (.421)
4.72 (.136)
4.52 (.178)
16.10 (.634)
15.90 (.626)
FEED DIRECTION
13.50 (.532)
12.80 (.504)
27.40 (1.079)
23.90 (.941)
4
330.00
(14.173)
MAX.
60.00 (2.362)
MIN.
30.40 (1.197)
MAX.
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
26.40 (1.039)
24.40 (.961)
4
3
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
Data and specifications subject to change without notice.
This product has been designed and qualified for the Industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 09/2008
10
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