IRHNJ8130SCS [INFINEON]

Power Field-Effect Transistor,;
IRHNJ8130SCS
型号: IRHNJ8130SCS
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor,

文件: 总8页 (文件大小:428K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD-93820C  
IRHNJ7130  
JANSR2N7380U3  
100V, N-CHANNEL  
REF: MIL-PRF-19500/614  
RAD-Hard HEXFET TECHNOLOGY  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-0.5)  
Product Summary  
Part Number  
IRHNJ7130  
IRHNJ3130  
IRHNJ5130  
IRHNJ8130  
Radiation Level  
100 kRads(Si)  
300 kRads(Si)  
500 kRads(Si)  
1000 kRads(Si)  
RDS(on)  
ID  
QPL Part Number  
14.4A  
14.4A  
14.4A  
14.4A  
JANSR2N7380U3  
JANSF2N7380U3  
JANSG2N7380U3  
JANSH2N7380U3  
0.18  
0.24  
0.24  
0.24  
Description  
Features  
IR HiRel RAD-Hard HEXFET technology provides high  
performance power MOSFETs for space applications.  
This technology has over a decade of proven performance  
and reliability in satellite applications. These devices have  
been characterized for both Total Dose and Single Event  
Effects (SEE). The combination of low Rdson and low gate  
charge reduces the power losses in switching applications  
such as DC to DC converters and motor control. These  
devices retain all of the well established advantages of  
MOSFETs such as voltage control, fast switching and  
temperature stability of electrical parameters.  
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Hermetically Sealed  
Ceramic package  
Light Weight  
Surface Mount  
ESD Rating: Class 1C per MIL-STD-750,  
Method 1020  
Absolute Maximum Ratings  
Pre-Irradiation  
Symbol  
Value  
Parameter  
Units  
ID1 @ VGS = 12V, TC = 25°C Continuous Drain Current  
ID2 @ VGS = 12V, TC = 100°C Continuous Drain Current  
14.4  
A
9.1  
57.6  
75  
IDM @TC = 25°C  
PD @TC = 25°C  
Pulsed Drain Current  
W
W/°C  
V
Maximum Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
0.6  
VGS  
EAS  
IAR  
± 20  
150  
14.4  
7.5  
mJ  
A
mJ  
V/ns  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt   
Operating Junction and  
Storage Temperature Range  
Lead Temperature  
6.0  
-55 to + 150  
TSTG  
°C  
g
300 (5 sec)  
Weight  
1.0 (Typical)  
For Footnotes, refer to the page 2.  
1
International Rectifier HiRel Products, Inc.  
2019-02-05  
IRHNJ7130  
JANSR2N7380U3  
Pre-Irradiation  
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)  
Symbol  
BVDSS  
Parameter  
Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Min. Typ. Max. Units  
Test Conditions  
VGS = 0V, ID = 1.0mA  
100 ––– –––  
––– 0.11 –––  
V
BVDSS/TJ  
V/°C Reference to 25°C, ID = 1.0mA  
Static Drain-to-Source On-State  
Resistance  
––– ––– 0.18  
VGS = 12V, ID = 9.1A   
  
RDS(on)  
––– –––  
0.20  
4.0  
VGS = 12V, ID = 14.4A   
VGS(th)  
Gate Threshold Voltage  
Forward Transconductance  
2.0  
2.5  
–––  
V
S
VDS = VGS, ID = 1.0mA  
DS = 15V, ID = 9.1A   
VDS = 80V, VGS = 0V  
DS = 80V,VGS = 0V,TJ =125°C  
VGS = 20V  
GS = -20V  
Gfs  
IDSS  
––– –––  
25  
V
––– –––  
Zero Gate Voltage Drain Current  
µA  
nA  
––– ––– 250  
––– ––– 100  
––– ––– -100  
V
IGSS  
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Total Gate Charge  
V
QG  
QGS  
QGD  
td(on)  
tr  
––– –––  
––– –––  
––– –––  
––– –––  
––– –––  
––– –––  
––– –––  
40  
10  
20  
35  
75  
70  
30  
ID = 14.4A  
VDS = 50V  
Gate-to-Source Charge  
Gate-to-Drain (‘Miller’) Charge  
Turn-On Delay Time  
Rise Time  
Turn-Off Delay Time  
Fall Time  
nC  
ns  
VGS = 12V  
VDD = 50V  
ID = 14.4A  
RG = 7.5  
td(off)  
tf  
VGS = 12V  
Measured from center of Drain  
pad to center of Source pad  
Ls +LD  
Total Inductance  
–––  
4.0  
–––  
nH  
pF  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
––– 960 –––  
––– 340 –––  
VGS = 0V  
VDS = 25V  
ƒ = 1.0MHz  
Reverse Transfer Capacitance  
–––  
85  
–––  
Source-Drain Diode Ratings and Characteristics  
Symbol  
Parameter  
Continuous Source Current (Body Diode)  
Pulsed Source Current (Body Diode)   
Diode Forward Voltage  
Min. Typ. Max. Units  
Test Conditions  
IS  
––– ––– 14.4  
A
ISM  
––– ––– 57.6  
VSD  
trr  
––– –––  
––– ––– 275  
––– ––– 2.5  
1.5  
V
TJ = 25°C,IS =14.4A,VGS = 0V  
TJ = 25°C, IF=14.4A, VDD 25V  
di/dt = 100A/µs   
Reverse Recovery Time  
ns  
µC  
Qrr  
Reverse Recovery Charge  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
ton  
Forward Turn-On Time  
Thermal Resistance  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Units  
Junction-to-Case  
–––  
–––  
1.67  
RJC  
°C/W  
Footnotes:  
Repetitive Rating; Pulse width limited by maximum junction temperature.  
VDD = 25V, starting TJ = 25°C, L =1.4mH, Peak IL = 14.4A, VGS = 12V  
ISD 14.4A, di/dt 395A/µs, VDD 100V, TJ 150°C  
Pulse width 300 µs; Duty Cycle 2%  
Total Dose Irradiation with VGS Bias. 12 volt VGS applied and VDS = 0 during irradiation per MIL-STD-750, Method 1019, condition A.  
Total Dose Irradiation with VDS Bias. 80 volt VDS applied and VGS = 0 during irradiation per MlL-STD-750, Method 1019, condition A.  
2
International Rectifier HiRel Products, Inc.  
2019-02-05  
IRHNJ7130  
JANSR2N7380U3  
Radiation Characteristics  
IR HiRel Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance  
program at IR Hirel is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose  
(per notes 5 and 6) using the TO-3 package. Both pre- and post-irradiation performance are tested and specified using  
the same drive circuitry and test conditions in order to provide a direct comparison.  
Table1. Electrical Characteristics @ Tj = 25°C, Post Total Dose Irradiation   
100 kRads (Si)1  
Up to  
Symbol  
Parameter  
Units  
Test Conditions  
Min.  
100  
2.0  
Max.  
–––  
4.0  
Min.  
100  
1.25  
–––  
–––  
–––  
Max.  
–––  
4.5  
BVDSS  
VGS(th)  
IGSS  
Drain-to-Source Breakdown Voltage  
Gate Threshold Voltage  
V
V
VGS = 0V, ID = 1.0mA  
VDS = VGS, ID = 1.0mA  
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Zero Gate Voltage Drain Current  
–––  
–––  
–––  
100  
-100  
25  
100  
-100  
50  
nA VGS = 20V  
IGSS  
nA VGS = -20V  
IDSS  
µA VDS = 80V, VGS = 0V  
Static Drain-to-Source   
On-State Resistance (TO-3)  
RDS(on)  
–––  
0.18  
–––  
0.24  
VGS = 12V, ID2 = 9.1A   
  
Static Drain-to-Source   
On-State Resistance (SMD-0.5)  
RDS(on)  
VSD  
–––  
–––  
0.18  
1.5  
–––  
–––  
0.24  
1.5  
VGS = 12V, ID2 = 9.1A   
VGS = 0V, IS = 14.4A   
  
Diode Forward Voltage   
V
1. Part number IRHNJ7130 (JANSR2N7380U3)  
2. Part numbers IRHNJ3130 (JANSF2N7380U3), IRHNJ5130 (JANSG2N7380U3), IRHNJ8130 (JANSH2N7380U3)  
IR HiRel radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects  
(SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.  
Table 2. Typical Single Event Effect Safe Operating Area  
VDS (V)  
LET  
Energy  
(MeV)  
Range  
(µm)  
(MeV/(mg/cm2))  
@VGS = 0V @VGS = -5V @VGS = -10V @VGS = -15V @VGS = -20V  
28 ± 5%  
37 ± 5%  
283.3 ± 7.5% 42.8 ± 5%  
100  
100  
100  
90  
100  
70  
80  
50  
60  
-
305 ± 5%  
39 ± 5%  
120  
100  
80  
60  
40  
20  
0
LET = 28 ± 5%  
LET = 37 ± 5%  
0
-5  
-10  
Bias VGS (V)  
-15  
-20  
Fig a. Typical Single Event Effect, Safe Operating Area  
For Footnotes, refer to the page 2.  
3
International Rectifier HiRel Products, Inc.  
2019-02-05  
IRHNJ7130  
JANSR2N7380U3  
Pre-Irradiation  
100  
10  
1
100  
10  
1
VGS  
15V  
12V  
10V  
9.0V  
8.0V  
7.0V  
6.0V  
VGS  
15V  
12V  
10V  
9.0V  
8.0V  
7.0V  
6.0V  
TOP  
TOP  
BOTTOM 5.0V  
BOTTOM 5.0V  
5.0V  
5.0V  
20µs PULSE WIDTH  
20µs PULSE WIDTH  
T = 150  
J
°
°
C
T = 25  
J
C
0.1  
0.1  
0.1  
0.1  
1
10  
100  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
DS  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 2. Typical Output Characteristics  
Fig 1. Typical Output Characteristics  
2.5  
100  
10  
1
14.4A  
=
I
D
°
T = 25 C  
J
2.0  
1.5  
1.0  
0.5  
0.0  
°
T = 150 C  
J
V
= 50V  
DS  
20µs PULSE WIDTH  
V
=12V  
GS  
0.1  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
5
7
9
11 13  
T , Junction Temperature ( C)  
J
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance Vs. Temperature  
2000  
1500  
1000  
500  
0
20  
V
= 0V,  
f = 1MHz  
C
I
D
= 14 A  
GS  
C
= C + C  
SHORTED  
iss  
gs  
gd ,  
gd  
ds  
V
V
V
= 80V  
= 50V  
= 20V  
DS  
DS  
DS  
C
= C  
gd  
rss  
C
= C + C  
ds  
16  
12  
8
oss  
C
iss  
C
4
oss  
FOR TEST CIRCUIT  
SEE FIGURE 13  
C
rss  
0
0
10  
20  
30  
40  
50  
60  
1
10  
100  
Q , Total Gate Charge (nC)  
G
V
, Drain-to-Source Voltage (V)  
DS  
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
4
International Rectifier HiRel Products, Inc.  
2019-02-05  
IRHNJ7130  
JANSR2N7380U3  
Pre-Irradiation  
100  
10  
1
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R (on)  
DS  
°
T = 150 C  
J
°
T = 25 C  
J
100 s  
1ms  
10ms  
DC  
1
Tc = 25°C  
Tj = 150°C  
Single Pulse  
V
= 0 V  
GS  
2.0  
0.1  
0.0  
0.1  
0.5  
1.0  
1.5  
2.5  
1
10  
100  
1000  
V
,Source-to-Drain Voltage (V)  
SD  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode Forward Voltage  
15  
12  
9
6
3
0
25  
50  
75  
100  
125  
150  
°
T , Case Temperature ( C)  
C
Fig 10. Maximum Avalanche Energy  
Fig 9. Maximum Drain Current Vs. Case Temperature  
Vs. Drain Current  
10  
1
D =0.50  
0.20  
0.10  
0.05  
P
2
DM  
0.1  
t
1
0.02  
0.01  
t
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D = t / t  
1
2.Peak T =P  
x Z  
+ T  
C
J
DM  
thJ C  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
5
International Rectifier HiRel Products, Inc.  
2019-02-05  
IRHNJ7130  
JANSR2N7380U3  
Pre-Irradiation  
V
(BR)DSS  
15V  
t
p
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
20V  
0.01  
t
p
I
AS  
Fig 12a. Unclamped Inductive Test Circuit  
Fig 12b. Unclamped Inductive Waveforms  
Fig 13b. Gate Charge Test Circuit  
Fig 13a. Gate Charge Waveform  
Fig 14a. Switching Time Test Circuit  
International Rectifier HiRel Products, Inc.  
Fig 14b. Switching Time Waveforms  
6
2019-02-05  
IRHNJ7130  
JANSR2N7380U3  
Pre-Irradiation  
Case Outline and Dimensions SMD-0.5  
PAD ASSIGNMENTS  
1 = DRAIN  
2 = GATE  
3 = SOURCE  
www.infineon.com/irhirel  
Infineon Technologies Service Center: USA Tel: +1 (866) 951-9519 and International Tel: +49 89 234 65555  
Leominster, Massachusetts 01453, USA Tel: +1 (978) 534-5776  
San Jose, California 95134, USA Tel: +1 (408) 434-5000  
Data and specifications subject to change without notice.  
7
International Rectifier HiRel Products, Inc.  
2019-02-05  
IRHNJ7130  
JANSR2N7380U3  
IMPORTANT NOTICE  
The information given in this document shall be in no event regarded as guarantee of conditions or characteristic. The  
data contained herein is a characterization of the component based on internal standards and is intended to  
demonstrate and provide guidance for typical part performance. It will require further evaluation, qualification and  
analysis to determine suitability in the application environment to confirm compliance to your system requirements.  
With respect to any example hints or any typical values stated herein and/or any information regarding the application of  
the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind including without  
limitation warranties on non- infringement of intellectual property rights and any third party.  
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this  
document and any applicable legal requirements, norms and standards concerning customer’s product and any use of  
the product of Infineon Technologies in customer’s applications.  
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of any  
customer’s technical departments to evaluate the suitability of the product for the intended applications and the  
completeness of the product information given in this document with respect to applications.  
For further information on the product, technology, delivery terms and conditions and prices, please contact your local  
sales representative or go to (www.infineon.com/hirel).  
WARNING  
Due to technical requirements products may contain dangerous substances. For information on the types in question,  
please contact your nearest Infineon Technologies office.  
8
International Rectifier HiRel Products, Inc.  
2019-02-05  

相关型号:

IRHNJ8230

RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-0.5)
INFINEON

IRHNJ9130

RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-0.5)
INFINEON

IRHNJ9130PBF

Power Field-Effect Transistor, 11A I(D), 100V, 0.34ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-0.5, 3 PIN
INFINEON

IRHNJ9230

Power Field-Effect Transistor
INFINEON

IRHNJ93130

RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-0.5)
INFINEON

IRHNJ93130PBF

Power Field-Effect Transistor, 11A I(D), 100V, 0.34ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-0.5, 3 PIN
INFINEON

IRHNJ93230

Power Field-Effect Transistor
INFINEON

IRHNJ9A3034

Rad hard, 60V, 40A, single, N-channel MOSFET, R9 in a SMD-0.5 package - SMD-0.5, 300 krad TID, COTS
INFINEON

IRHNJ9A3034SCS

Rad hard, 60V, 40A, single, N-channel MOSFET, R9 in a SMD-0.5 package - SMD-0.5, 300 krad TID, QIRL
INFINEON

IRHNJ9A3130

Rad hard, 100V, 35A, single, N-channel MOSFET, R9 in a SMD-0.5 package - SMD-0.5, 300 krad TID, COTS
INFINEON

IRHNJ9A3130SCS

Rad hard, 100V, 35A, single, N-channel MOSFET, R9 in a SMD-0.5 package - SMD-0.5, 300 krad TID, QIRL
INFINEON

IRHNJ9A7034

Power Field-Effect Transistor,
INFINEON