IRHQ7110 [INFINEON]
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (LCC-28); 抗辐射功率MOSFET表面贴装( LCC -28 )型号: | IRHQ7110 |
厂家: | Infineon |
描述: | RADIATION HARDENED POWER MOSFET SURFACE MOUNT (LCC-28) |
文件: | 总8页 (文件大小:129K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PD - 93785A
IRHQ7110
100V, QUAD N-CHANNEL
RADIATION HARDENED
POWER MOSFET
SURFACE MOUNT (LCC-28)
RAD-Hard™ HEXFET®
MOSFETTECHNOLOGY
Product Summary
Part Number Radiation Level RDS(on)
ID
IRHQ7110
IRHQ3110
IRHQ4110
100K Rads (Si)
300K Rads (Si)
600K Rads (Si)
0.6Ω
0.6Ω
0.6Ω
0.75Ω
3.0A
3.0A
3.0A
3.0A
IRHQ8110 1000K Rads (Si)
LCC-28
International Rectifier’s RAD-HardTM HEXFET® MOSFET
technology provides high performance power MOSFETs
for space applications. This technology has over a de-
cade of proven performance and reliability in satellite
applications. These devices have been characterized
for both Total Dose and Single Event Effects (SEE). The
combination of low RDS(on) and low gate charge reduces
the power losses in switching applications such as DC
to DC converters and motor control. These devices re-
tain all of the well established advantages of MOSFETs
such as voltage control, fast switching, ease of parallel-
ing and temperature stability of electrical parameters.
Features:
n
Single Event Effect (SEE) Hardened
n
n
n
n
n
n
n
n
n
Low RDS(on)
Low Total Gate Charge
Proton Tolerant
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Ceramic Package
Surface Mount
Light Weight
Pre-Irradiation
Absolute Maximum Ratings (Per Die)
Parameter
Units
I
@ V
@ V
= 12V, T = 25°C
Continuous Drain Current
3.0
D
GS
C
A
I
= 12V, T = 100°C Continuous Drain Current
1.9
12
D
GS
C
I
Pulsed Drain Current ➀
Max. Power Dissipation
DM
@ T = 25°C
P
12
W
W/°C
V
D
C
Linear Derating Factor
0.1
V
Gate-to-Source Voltage
±20
GS
E
Single Pulse Avalanche Energy ➀
Avalanche Current ➀
85
mJ
A
AS
I
3.0
AR
E
Repetitive Avalanche Energy ➀
Peak Diode Recovery dv/dt ➀
Operating Junction
1.2
mJ
V/ns
AR
dv/dt
3.0
T
-55 to 150
J
T
Storage Temperature Range
oC
g
STG
Pckg. Mounting Surface Temp.
Weight
300 (for 5s)
0.89 (Typical)
For footnotes refer to the last page
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1
12/27/00
IRHQ7110
Pre-Irradiation
Electrical Characteristics @Tj = 25°C (Unless Otherwise Specified) (Per Die)
Parameter
Min Typ Max Units
Test Conditions
BV
DSS
Drain-to-Source Breakdown Voltage
100
—
—
—
—
V
V
= 0V, I = 1.0mA
D
GS
Reference to 25°C, I = 1.0mA
∆BV
/∆T Temperature Coefficient of Breakdown
0.11
V/°C
DSS
J
D
Voltage
R
V
Static Drain-to-Source On-State
Resistance
—
—
—
—
—
—
—
—
0.62
0.60
4.0
—
V
V
= 12V, I = 3.0A
D
DS(on)
GS
GS
➀
Ω
= 12V, I = 1.9A
D
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
2.0
1.4
—
V
V
DS
= V , I = 1.0mA
GS(th)
fs
GS
D
Ω
g
S ( )
V
> 15V, I
= 1.9A ➀
DS
V
DS
I
25
= 80V, V =0V
DS GS
DSS
µA
—
250
V
= 80V,
DS
= 0V, T = 125°C
V
GS
J
I
I
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6.1
100
-100
11
4.0
5.5
13
V
= 20V
GSS
GSS
GS
nA
nC
V
= -20V
GS
Q
Q
Q
V
= 12V, I = 3.0A
g
gs
gd
d(on)
r
GS D
V
= 50V
DS
t
t
t
t
V
= 50V, I = 3.0A,
= 12V, R = 7.5Ω
DD
GS
D
16
V
G
ns
Turn-Off Delay Time
FallTime
Total Inductance
23
d(off)
15
—
f
L
+ L
S
D
nH
Measured from the center of
drain pad to center of source pad
C
C
C
Input Capacitance
—
—
—
270
110
23
—
—
—
V
= 0V, V
= 25V
f = 1.0MHz
iss
GS DS
Output Capacitance
pF
oss
rss
Reverse Transfer Capacitance
Source-Drain Diode Ratings and Characteristics (Per Die)
Parameter
Min Typ Max Units
Test Conditions
I
I
V
t
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode) ➀
Diode Forward Voltage
—
—
—
—
—
—
—
—
—
—
3.0
12
1.2
173
863
S
A
SM
SD
V
T = 25°C, I = 3.0A, V
= 0V ➀
j
S
GS
Reverse Recovery Time
nS
nC
T = 25°C, I = 3.0A, di/dt ≥ 100A/µs
j
rr
F
Q
Reverse Recovery Charge
V
DD
≤ 25V ➀
RR
t
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .
S D
on
Thermal Resistance (Per Die)
Parameter
Min Typ Max Units
Test Conditions
°C/W
R
Junction-to-Case
—
—
10.4
thJC
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
2
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Radiation Characteristics
IRHQ7110
International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability.
The hardness assurance program at International Rectifier is comprised of two radiation environments.
Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-3 package. Both
pre- and post-irradiation performance are tested and specified using the same drive circuitry and test
conditions in order to provide a direct comparison.
Table 1. Electrical Characteristics @ Tj = 25°C, Post Total Dose Irradiation ➀➀➀(Per Die)
1
Parameter
100KRads(Si)
300K to 1000K Rads (Si)2 Units
Test Conditions
Min
Max
Min
Max
BV
Drain-to-Source Breakdown Voltage
Gate Threshold Voltage
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Zero Gate Voltage Drain Current
100
2.0
—
—
4.0
100
-100
25
100
1.25
—
—
4.5
100
-100
25
V
= 0V, I = 1.0mA
DSS
GS D
V
V
V
= V , I = 1.0mA
GS
DS D
GS(th)
I
V
= 20V
GSS
GS
GS
nA
I
—
—
V
= -20 V
GSS
I
—
—
—
—
µA
Ω
V
V
= 80V, V =0V
GS
= 12V, I = 1.9A
D
DSS
DS
GS
R
DS(on)
Static Drain-to-Source
On-State Resistance (TO-39)
Static Drain-to-Source
On-State Resistance (LCC-28)
Diode Forward Voltage
➀
0.556
0.706
R
DS(on)
➀
—
—
0.60
1.2
—
—
0.75
1.2
Ω
V
= 12V, I = 1.9A
GS
D
V
SD
➀
V
V
= 0V, I = 3.0A
GS S
1. Part numbers IRHQ7110, IRHQ3110, IRHQ4110
2. Part number IRHQ8110
International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for
Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.
Table 2. Single Event Effect Safe Operating Area (Per Die)
VDS (V)
Ion
LET
MeV/(mg/cm2))
28.0
Energy
(MeV)
285
Range
(µm) @VGS=0V @VGS=-5V @VGS=-10V @VGS=-15V @VGS=-20V
Cu
Br
I
43.0
39.0
32.6
100
100
50
100
80
100
70
100
50
70
—
—
36.8
305
59.8
343
40
35
—
120
100
80
60
40
20
0
Cu
Br
I
0
-5
-10
-15
-20
-25
VGS
Fig a. Single Event Effect, Safe Operating Area
For footnotes refer to the last page
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3
IRHQ7110
Pre-Irradiation
100
TOP
100
10
1
VGS
15V
VGS
15V
TOP
12V
12V
10V
10V
9.0V
8.0V
7.0V
6.0V
9.0V
8.0V
7.0V
6.0V
BOTTOM 5.0V
BOTTOM 5.0V
10
1
5.0V
20µs PULSE WIDTH
T = 25 C
J
20µs PULSE WIDTH
T = 150 C
J
°
°
0.1
0.1
0.1
0.1
1
10
100
1
10
100
V
, Drain-to-Source Voltage (V)
DS
V
, Drain-to-Source Voltage (V)
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0A
=
I
D
°
T = 25 C
J
10
°
T = 150 C
J
1
V
= 50V
DS
20µs PULSE WIDTH
V
= 12V
GS
0.1
-60 -40 -20
0
20 40 60 80 100 120 140 160
5
7
9
11 13
15
°
T , Junction Temperature( C)
J
V
, Gate-to-Source Voltage (V)
GS
Fig 4. Normalized On-Resistance
Fig 3. Typical Transfer Characteristics
Vs.Temperature
4
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Pre-Irradiation
IRHQ7110
500
20
16
12
8
V
= 0V,
f = 1MHz
C SHORTED
ds
3.0A
I
D
=
GS
V
V
V
= 80V
= 50V
= 20V
C
= C + C
DS
DS
DS
iss
gs
gd ,
C
= C
rss
gd
C
= C + C
gd
400
300
200
100
0
oss
ds
C
iss
C
C
oss
4
rss
10
FOR TEST CIRCUIT
SEE FIGURE 13
0
1
100
0
2
4
6
8
10
12
14
V
, Drain-to-Source Voltage (V)
DS
Q
, Total Gate Charge (nC)
G
Fig 6. Typical Gate Charge Vs.
Fig 5. Typical Capacitance Vs.
Gate-to-SourceVoltage
Drain-to-SourceVoltage
100
10
1
100
10
1
OPERATION IN THIS AREA LIMITED
BY R
DS(on)
100us
°
T = 150 C
J
1ms
10ms
°
T = 25 C
J
°
T = 25 C
C
°
T = 150 C
Single Pulse
J
V
= 0 V
GS
0.1
0.4
0.1
0.6
0.8
1.0
1.2
1.4
1
10
100
1000
V
,Source-to-Drain Voltage (V)
V
, Drain-to-Source Voltage (V)
SD
DS
Fig 7. Typical Source-Drain Diode
Fig 8. Maximum Safe Operating Area
ForwardVoltage
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5
IRHQ7110
Pre-Irradiation
RD
3.0
2.5
2.0
1.5
1.0
0.5
VDS
VGS
D.U.T.
RG
+VDD
-
VGS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
V
DS
90%
0.0
25
50
T
75
100
125
150
°
, Case Temperature ( C)
C
10%
V
GS
t
t
r
t
t
f
d(on)
d(off)
Fig 9. Maximum Drain Current Vs.
CaseTemperature
Fig 10b. Switching Time Waveforms
100
10
D = 0.50
0.20
0.10
1
0.05
P
DM
0.02
0.01
SINGLE PULSE
(THERMAL RESPONSE)
t
1
0.1
t
2
Notes:
1. Duty factor D =
t
/ t
1 2
2. Peak T = P
x
Z
+ T
C
J
DM
thJC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t , Rectangular Pulse Duration (sec)
1
Fig11. MaximumEffectiveTransientThermalImpedance,Junction-to-Case
6
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Pre-Irradiation
IRHQ7110
200
150
100
50
I
D
TOP
1.3A
1.9A
BOTTOM 3.0A
15V
DRIVER
L
V
D S
D.U.T
R
.
G
+
V
D D
-
I
A
AS
V
2
GS
t
0.01
Ω
p
Fig 12a. Unclamped Inductive Test Circuit
0
25
50
75
100
125
150
°
Starting T , Junction Temperature ( C)
J
V
(BR )D SS
t
p
Fig 12c. Maximum Avalanche Energy
Vs. DrainCurrent
I
AS
Current Regulator
Fig12b. UnclampedInductiveWaveforms
Same Type as D.U.T.
50KΩ
.2µF
12V
Q
G
.3µF
+
12 V
V
DS
D.U.T.
-
Q
Q
GD
GS
V
GS
V
G
3mA
I
I
D
G
Charge
Current Sampling Resistors
Fig 13b. Gate Charge Test Circuit
Fig 13a. Basic Gate Charge Waveform
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7
IRHQ7110
Pre-Irradiation
Footnotes:
➀➀➀Total Dose Irradiation with V
GS
Bias.
➀➀ Repetitive Rating; Pulse width limited by
12 volt V
applied and V = 0 during
maximum junction temperature.
GS
DS
irradiation per MIL-STD-750, method 1019, condition A
➀➀➀V
= 25V, starting T = 25°C, L= 18.7mH,
J
DD
Peak I = 3.0A, V
= 12V
➀➀Total Dose Irradiation with V Bias.
L
GS
DS
= 0 during
80 volt V
applied and V
GS
➀➀ I
≤ 3.0A, di/dt ≤ 165A/µs,
≤ 100V, T ≤ 150°C
J
DS
irradiation per MlL-STD-750, method 1019, condition A
SD
V
DD
➀➀➀Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
Case Outline and Dimensions — LCC-28
Q1
Q4
Q2
Q3
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 12/00
8
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