IRLML5203TRPBF-1 [INFINEON]

Small Signal Field-Effect Transistor;
IRLML5203TRPBF-1
型号: IRLML5203TRPBF-1
厂家: Infineon    Infineon
描述:

Small Signal Field-Effect Transistor

文件: 总9页 (文件大小:240K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IRLML5203PbF-1  
HEXFET® Power MOSFET  
VDS  
-30  
98  
V
RDS(on) max  
(@VGS = -10V)  
RDS(on) max  
(@VGS = -4.5V)  
Qg (typical)  
ID  
G
S
1
2
m
Ω
3
D
165  
9.5  
nC  
A
Micro3TM  
-3.0  
(@TA = 25°C)  
Features  
Benefits  
Industry-standard pinout SOT-23 Package  
Compatible with Existing Surface Mount Techniques  
RoHS Compliant, Halogen-Free  
Multi-Vendor Compatibility  
Easier Manufacturing  
Environmentally Friendlier  
Increased Reliability  
MSL1, Industrial qualification  
Standard Pack  
Base Part Number  
Package Type  
Micro3 (SOT-23)  
Orderable Part Number  
Form  
Quantity  
IRLML5203TRPbF-1  
Tape and Reel  
3000  
IRLML5203TRPbF-1  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain- Source Voltage  
-30  
-3.0  
-2.4  
-24  
V
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
A
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
1.25  
0.80  
10  
W
Power Dissipation  
Linear Derating Factor  
mW/°C  
V
VGS  
Gate-to-Source Voltage  
± 20  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
100  
Units  
°C/W  
RθJA  
1
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November 25, 2013  
IRLML5203PbF-1  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
-30 ––– –––  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
VGS = 0V, ID = -250μA  
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient  
––– 0.019 ––– V/°C Reference to 25°C, ID = -1mA  
––– –––  
98  
VGS = -10V, ID = -3.0A ‚  
VGS = -4.5V, ID = -2.6A ‚  
VDS = VGS, ID = -250μA  
VDS = -10V, ID = -3.0A  
RDS(on)  
Static Drain-to-Source On-Resistance  
mΩ  
––– ––– 165  
-1.0 ––– -2.5  
3.1 ––– –––  
––– ––– -1.0  
––– ––– -5.0  
––– ––– -100  
––– ––– 100  
VGS(th)  
gfs  
Gate Threshold Voltage  
V
S
Forward Transconductance  
V
DS = -24V, VGS = 0V  
IDSS  
Drain-to-Source Leakage Current  
µA  
nA  
VDS = -24V, VGS = 0V, TJ = 70°C  
VGS = -20V  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
IGSS  
VGS = 20V  
Qg  
––– 9.5  
14  
ID = -3.0A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
––– 2.3 3.5  
––– 1.6 2.4  
––– 12 –––  
––– 18 –––  
––– 88 –––  
––– 52 –––  
––– 510 –––  
––– 71 –––  
––– 43 –––  
nC VDS = -24V  
VGS = -10V ‚  
VDD = -15V ‚  
ID = -1.0A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 6.0Ω  
VGS = -10V  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
pF  
VDS = -25V  
ƒ = 1.0MHz  
Reverse Transfer Capacitance  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFET symbol  
showing the  
D
S
IS  
–––  
–––  
––– -1.3  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
p-n junction diode.  
-24  
–––  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
––– ––– -1.2  
V
TJ = 25°C, IS = -1.3A, VGS = 0V ‚  
TJ = 25°C, IF = -1.3A  
––– 17  
––– 12  
26  
18  
ns  
nC  
Qrr  
di/dt = -100A/μs ‚  
Notes:  
 Repetitive rating; pulse width limited by  
ƒ Surface mounted on FR-4 board, t 5sec.  
max. junction temperature.  
‚ Pulse width 400μs; duty cycle 2%.  
2
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November 25, 2013  
IRLML5203PbF-1  
100  
10  
100  
10  
1
VGS  
-15V  
-10V  
-7.0V  
-5.5V  
-4.5V  
-4.0V  
-3.5V  
VGS  
-15V  
-10V  
-7.0V  
-5.5V  
-4.5V  
-4.0V  
-3.5V  
TOP  
TOP  
BOTTOM -2.7V  
BOTTOM-2.7V  
1
-2.70V  
-2.70V  
0.1  
20μs PULSE WIDTH  
20μs PULSE WIDTH  
°
T = 150 C  
J
°
T = 25 C  
J
0.1  
0.1  
0.01  
1
10  
100  
0.1  
1
10  
100  
-V , Drain-to-Source Voltage (V)  
DS  
-V , Drain-to-Source Voltage (V)  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
100  
2.0  
3.0A  
=
I
D
1.5  
1.0  
0.5  
0.0  
10  
°
T = 150 C  
J
1
°
T = 25 C  
J
V
= -15V  
DS  
20μs PULSE WIDTH  
V
=-10V  
GS  
0.1  
2.0  
3.0  
4.0  
5.0 6.0  
7.0  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
-V , Gate-to-Source Voltage (V)  
GS  
T , Junction Temperature ( C)  
J
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
3
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November 25, 2013  
IRLML5203PbF-1  
20  
16  
12  
8
800  
600  
400  
200  
0
I
D
=
-3.0A  
V
= 0V,  
f = 1MHz  
gd , ds  
GS  
V
V
=-24V  
=-15V  
C
= C + C  
gs  
C
SHORTED  
DS  
DS  
iss  
C
= C  
gd  
rss  
C
= C + C  
ds  
oss  
gd  
C
iss  
4
C
oss  
C
rss  
0
0
4
8
12  
16  
1
10  
100  
Q , Total Gate Charge (nC)  
-V , Drain-to-Source Voltage (V)  
DS  
G
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
100  
100  
10  
1
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
10us  
10  
°
T = 150 C  
J
100us  
1ms  
1
°
T = 25 C  
J
10ms  
°
T = 25 C  
A
°
T = 150 C  
Single Pulse  
J
V
= 0 V  
GS  
1.6  
0.1  
0.1  
0.4  
0.1  
1
10  
100  
0.6  
0.8  
1.0  
1.2  
1.4  
1.8  
-V , Drain-to-Source Voltage (V)  
DS  
-V ,Source-to-Drain Voltage (V)  
SD  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
4
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November 25, 2013  
IRLML5203PbF-1  
3.0  
2.0  
1.0  
0.0  
RD  
VDS  
VGS  
D.U.T.  
RG  
-
+
VDD  
VGS  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
t
t
r
t
t
f
d(on)  
d(off)  
V
GS  
10%  
25  
50  
75  
100  
125  
150  
°
T , Case Temperature ( C)  
C
90%  
Fig 9. Maximum Drain Current Vs.  
V
DS  
Case Temperature  
Fig 10b. Switching Time Waveforms  
1000  
100  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
P
2
DM  
0.02  
0.01  
t
1
t
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D =  
t / t  
1
2. Peak T =P  
J
x Z  
+ T  
A
DM  
thJA  
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
5
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November 25, 2013  
IRLML5203PbF-1  
0.14  
0.13  
0.12  
0.11  
0.10  
0.09  
0.08  
0.07  
0.40  
0.30  
0.20  
0.10  
0.00  
V
= -4.5V  
GS  
I
= -3.0A  
D
V
= -10V  
GS  
4.0  
6.0  
-V  
8.0  
10.0  
12.0  
14.0  
16.0  
Gate -to -Source Voltage (V)  
0
4
8
12  
16  
GS,  
-I , Drain Current (A)  
D
Fig 12. Typical On-Resistance Vs. Drain  
Fig 11. Typical On-Resistance Vs. Gate  
Current  
Voltage  
Current Regulator  
Same Type as D.U.T.  
50KΩ  
Q
G
.2μF  
12V  
.3μF  
-
V
+
DS  
Q
Q
GD  
D.U.T.  
GS  
V
GS  
V
G
-3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 13a. Basic Gate Charge Waveform  
Fig 13b. Gate Charge Test Circuit  
6
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November 25, 2013  
IRLML5203PbF-1  
30  
20  
10  
0
2.5  
2.0  
1.5  
I
= -250μA  
D
0.001  
0.010  
0.100  
1.000  
10.000  
100.000  
-75 -50 -25  
0
25  
50  
75 100 125 150  
Time (sec)  
T , Temperature ( °C )  
J
Fig 15. Typical Power Vs. Time  
Fig 14. Threshold Voltage Vs. Temperature  
7
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November 25, 2013  
IRLML5203PbF-1  
Micro3 (SOT-23) (Lead-Free) Package Outline  
Dimensions are shown in millimeters (inches)  
S
Y
DIMENSIONS  
M
B
6
MIL L IME T E RS  
INCHES  
O
L
D
5
MIN  
0.89  
0.01  
0.88  
0.30  
0.08  
2.80  
2.10  
1.20  
MAX  
1.12  
0.10  
1.02  
0.50  
0.20  
3.04  
2.64  
1.40  
MIN  
MAX  
.044  
A
A1  
A2  
b
.036  
.0004  
.035  
.0039  
.040  
3
6
.0119  
.0032  
.111  
.0196  
.0078  
.119  
E
c
E1  
B
ccc  
C B A  
D
E
1
2
.083  
.048  
.103  
.055  
E1  
e
0.95 BSC  
1.90 BSC  
0.40 0.60  
0.25 BS C  
0° 8°  
.0375 BSC  
.075 BSC  
.0158 .0236  
.0118 BSC  
0° 8°  
5
e1  
L
e
e1  
L1  
0
aaa  
0.10  
0.20  
0.15  
.004  
.008  
.006  
bbb  
ccc  
4
H
A2  
A
L1  
3X b  
bbb  
A1  
aaa  
C
C
A B  
3 S URF  
0
7
3X L  
RE COMME NDE D FOOT PRINT  
NOT ES  
1. DIMENSIONING AND TOLERANCINGPER ASME Y14.5M-1994.  
2. DIMENSIONS ARE SHOWN IN MILLIMETERS AND INCHES.  
3. CONTROLLING DIMENSION: MILLIMETER.  
0.972  
[.038]  
3X  
2.742  
[.1079]  
4
5
6
7
DATUM PLANE H IS LOCATED AT THE MOLD PARTINGLINE.  
DATUM AAND B TO BE DETERMINED AT DATUM PLANE H.  
DIME NS IONS D AND E 1 AR E ME AS UR ED AT DAT UM PL ANE H .  
DIMENSION L IS THE LEAD LENGTH FOR SOLDERINGTOA SUBSTRATE.  
8. OUTLINE CONFORMS TOJEDECOUTLINE TO-236AB.  
0.802  
3X  
[.031]  
0.95  
[.0375]  
1.90  
[.075]  
Micro3 (SOT-23 / TO-236AB) Part Marking Information  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
8
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November 25, 2013  
IRLML5203PbF-1  
Micro3Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
2.05 ( .080 )  
1.95 ( .077 )  
1.6 ( .062 )  
1.5 ( .060 )  
1.32 ( .051 )  
1.12 ( .045 )  
1.85 ( .072 )  
1.65 ( .065 )  
4.1 ( .161 )  
3.9 ( .154 )  
TR  
3.55 ( .139 )  
3.45 ( .136 )  
8.3 ( .326 )  
7.9 ( .312 )  
FEED DIRECTION  
4.1 ( .161 )  
3.9 ( .154 )  
0.35 ( .013 )  
0.25 ( .010 )  
1.1 ( .043 )  
0.9 ( .036 )  
178.00  
( 7.008 )  
MAX.  
9.90 ( .390 )  
8.40 ( .331 )  
NOTES:  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/  
Qualification information†  
Industrial  
(per JEDEC JESD47F†† guidelines)  
Qualification level  
MS L 1  
Micro3 (SOT-23)  
Moisture Sensitivity Level  
RoHS compliant  
(per JEDEC J-STD-020D††  
Yes  
)
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability  
†† Applicable version of JEDEC standard at the time of product release  
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA  
To contact International Rectifier, please visit http://www.irf.com/whoto-call/  
9
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November 25, 2013  

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