JANTXV2N7334PBF [INFINEON]

Power Field-Effect Transistor, 1A I(D), 100V, 0.8ohm, 4-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MO-036AB, HERMETIC SEALED PACKAGE-14;
JANTXV2N7334PBF
型号: JANTXV2N7334PBF
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 1A I(D), 100V, 0.8ohm, 4-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MO-036AB, HERMETIC SEALED PACKAGE-14

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PD-90396H  
IRFG110  
JANTX2N7334  
JANTXV2N7334  
POWER MOSFET  
THRU-HOLE (MO-036AB)  
REF:MIL-PRF-19500/597  
100V, QUAD N-CHANNEL  
HEXFET® MOSFET TECHNOLOGY  
Product Summary  
Part Number  
RDS(on)  
ID  
IRFG110  
0.7 Ω  
1.0A  
HEXFET® MOSFET technology is the key to International  
Rectifier’s advanced line of power MOSFET transistors.  
The efficient geometry design achieves very low on-state  
resistance combined with high transconductance. HEXFET  
transistors also feature all of the well-established advantages  
of MOSFETs, such as voltage control, very fast switching,  
ease of paralleling and electrical parameter temperature  
stability. They are well-suited for applications such as  
switching power supplies, motor controls, inverters,  
choppers, audio amplifiers, high energy pulse circuits, and  
virtually any application where high reliability is required.  
The HEXFET transistor’s totally isolated package eliminates  
the need for additional isolating material between the device  
and the heatsink. This improves thermal efficiency and  
reduces drain capacitance.  
MO-036AB  
Features:  
n
n
n
n
n
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Electrically Isolated  
Dynamic dv/dt Rating  
n Light-weight  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
= 10V, T = 25°C  
Continuous Drain Current  
1.0  
0.6  
D
D
GS  
GS  
C
A
I
= 10V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
4.0  
DM  
@ T = 25°C  
P
D
1.4  
W
W/°C  
V
C
Linear Derating Factor  
0.011  
±20  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
GS  
E
75  
mJ  
A
AS  
I
1.0  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
0.14  
5.5  
mJ  
V/ns  
AR  
dv/dt  
T
-55 to 150  
J
°C  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.63 in./1.6 mm from case for 10s)  
1.3 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
03/01/10  
IRFG110  
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)  
Parameter  
Min Typ Max Units  
Test Conditions  
BV  
Drain-to-Source Breakdown Voltage  
100  
V
V
= 0V, I = 1.0mA  
D
DSS  
GS  
V/°C Reference to 25°C, I = 1.0mA  
BV  
/T Temperature Coefficient of Breakdown  
0.13  
DSS  
J
D
Voltage  
R
V
Static Drain-to-Source On-State  
Resistance  
Gate Threshold Voltage  
Forward Transconductance  
Zero Gate Voltage Drain Current  
2.0  
0.86  
0.7  
0.8  
4.0  
25  
250  
V
V
= 10V, I = 0.6A  
D
Ã
DS(on)  
GS  
GS  
= 10V, I = 1.0A  
D
V
S
V
DS  
= V , I = 250µA  
GS(th)  
fs  
GS  
D
g
V
> 15V, I  
= 0.6A Ã  
DS  
V
DS  
I
= 80V ,V =0V  
DSS  
DS GS  
µA  
V
= 80V,  
DS  
= 0V, T = 125°C  
V
GS  
J
I
I
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain (‘Miller’) Charge  
Turn-On Delay Time  
Rise Time  
Turn-Off Delay Time  
Fall Time  
Total Inductance  
10  
100  
-100  
15  
7.5  
7.5  
20  
25  
40  
40  
V
= 20V  
= -20V  
GSS  
GSS  
GS  
nA  
nC  
V
GS  
Q
Q
Q
V
=10V, I = 1.0A  
g
gs  
gd  
d(on)  
r
GS D  
V
= 50V  
DS  
t
t
t
t
V
= 50V, I = 1.0A,  
=10V, R = 7.5Ω  
DD  
GS  
D
G
V
ns  
d(off)  
f
L
+ L  
S
D
Measured from drain lead (6mm/  
0.25in. from package) to source  
lead (6mm/0.25in. from package)  
nH  
C
C
C
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
180  
82  
15  
V
= 0V, V  
= 25V  
f = 1.0MHz  
iss  
oss  
rss  
GS DS  
pF  
Source-Drain Diode Ratings and Characteristics  
Parameter  
Min Typ Max Units  
Test Conditions  
I
I
V
t
Q
Continuous Source Current (Body Diode)  
Pulse Source Current (Body Diode) À  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
1.0  
4.0  
1.5  
200  
S
SM  
SD  
rr  
A
V
ns  
T = 25°C, I = 1.0A, V  
= 0V Ã  
j
S
GS  
T = 25°C, I = 1.0A, di/dt 100A/µs  
j
F
0.83 µC  
V
30V Ã  
RR  
DD  
t
on  
Forward Turn-On Time  
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .  
S D  
Thermal Resistance  
Parameter  
Min Typ Max Units  
Test Conditions  
R
R
Junction-to-Case  
Junction-to-Ambient  
17  
90  
thJC  
thJA  
°C/W  
Typical socket mount  
Note: Corresponding Spice and Saber models are available on International Rectifier Website.  
For footnotes refer to the last page  
2
www.irf.com  
IRFG110  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs.Temperature  
www.irf.com  
3
IRFG110  
13a & b  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-SourceVoltage  
Drain-to-SourceVoltage  
10  
OPERATION IN THIS AREA LIMITED  
BY R (on)  
DS  
1ms  
1
0.1  
10ms  
Tc = 25°C  
Tj = 150°C  
Single Pulse  
DC  
0.01  
0.1  
1
10  
100  
1000  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
ForwardVoltage  
4
www.irf.com  
IRFG110  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
VGS  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
Fig 9. Maximum Drain Current Vs.  
d(on)  
d(off)  
CaseTemperature  
Fig 10b. Switching Time Waveforms  
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
www.irf.com  
5
IRFG110  
15V  
DRIVER  
+
L
V
DS  
.
D.U.T  
R
G
V
DD  
-
I
A
AS  
V
2
GS  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
Fig 12c. Maximum Avalanche Energy  
Vs. DrainCurrent  
I
AS  
Current Regulator  
Same Type as D.U.T.  
Fig 12b. Unclamped Inductive Waveforms  
50KΩ  
.2µF  
10  
V  
Q
G
.3µF  
10 V  
+
V
DS  
D.U.T.  
-
Q
Q
GD  
GS  
V
GS  
V
G
3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 13b. Gate Charge Test Circuit  
Fig 13a. Basic Gate Charge Waveform  
6
www.irf.com  
IRFG110  
Footnotes:  
 I  
1.0A, di/dt 75A/µs,  
À
Repetitive Rating; Pulse width limited by  
maximum junction temperature.  
SD  
DD  
V
100V, T 150°C  
J
à Pulse width 300 µs; Duty Cycle 2%  
Á
V
= 25V, starting T = 25°C, L= 150mH  
J
DD  
Peak I = 1.0A, V  
= 10V  
L
GS  
Case Outline and Dimensions — MO-036AB  
G4  
G1  
G3  
G2  
G3  
G2  
G4  
G1  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
IR LEOMINSTER : 205 Crawford St., Leominster, Massachusetts 01453, USA Tel: (978) 534-5776  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.  
Data and specifications subject to change without notice. 03/2010  
www.irf.com  
7

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