Q67007-A9466 [INFINEON]
Multi-Voltage Processor Power Supply; 多电压处理器供电型号: | Q67007-A9466 |
厂家: | Infineon |
描述: | Multi-Voltage Processor Power Supply |
文件: | 总57页 (文件大小:698K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLE 6361 G
Multi-Voltage Processor Power Supply
Data Sheet
1
Overview
Features
1.1
• High efficiency regulator system
• Wide input voltage range, up to 60V
• Stand-by mode with low current consumption
• Suitable for standard 12V, 24V and 42V PowerNets
• Step down converter as pre-regulator:
5.5V / 1.5A
P-DSO-36-12
• Step down slope control for lowest EME
• Switching loss minimization
• Three high current linear post-regulators with
selectable output voltages:
5V / 800mA
3.3V or 2.6V / 500mA
5V or 3.3V / 350mA
• Six independent voltage trackers (followers):
5V / 17mA each
• Stand-by regulator with 1mA current capability
• Three independent undervoltage detection circuits
(e.g. reset, early warning) for each linear post-regulator
• Power on reset functionality
• Window watchdog triggered by SPI
• Tracker control and diagnosis by SPI
• All outputs protected against short-circuit
• Power-DSO-36 package
Type
Ordering Code Package
Q 67007-A9466 P-DSO-36-12
TLE 6361 G
SMD = Surface Mounted Device
Data Sheet, Rev. 1.31
1
2004-10-12
TLE 6361 G
1.2
Short functional description
The TLE 6361 G is a multi voltage power supply system especially designed for
automotive applications using a standard 12V or 24V battery as well as the new 42V
powernet. The device is intended to supply 32 bit micro-controller systems which require
different supply voltage rails such as 5V, 3.3V and 2.6V. The regulators for external
sensors are also provided.
The TLE 6361 G cascades a Buck converter block with a linear regulator and tracker
block on a single chip to achieve lowest power dissipation thus being able to power the
application even at very high ambient temperatures.
The step-down converter delivers a pre-regulated voltage of 5.5V with a minimum
current capability of 1.5A.
Supplied by this step down converter three low drop linear post-regulators offer 5V, 3.3V,
or 2.6V of output voltages depending on the configuration of the device with current
capabilities of 800mA, 500mA and 350mA.
In addition the inputs of six voltage trackers are connected to the 5.5V bus voltage. Their
outputs follow the main 5V linear regulator (Q_LDO1) with high accuracy and are able to
drive a current of 17mA each. The trackers can be turned on and off individually by a 16
bit serial peripheral interface (SPI). Through this interface also the status information of
each tracker (i.e. short circuit) can be read out.
To monitor the output voltage levels of each of the linear regulators three independent
undervoltage detection circuits are available which can be used to implement the reset
or an early warning function. The supervision of the µC is managed by the SPI-triggered
window watchdog.
For energy saving reasons while the motor is turned off, the TLE 6361 G offers a stand-
by mode, where the quiescent current does not exceed 30µA typically. In this stand-by
mode just the stand-by regulator remains active.
The TLE 6361 G is based on Infineon Power technology SPT which allows bipolar ,
CMOS and Power DMOS circuitry to be integrated on the same monolithic circuitry.
Data Sheet, Rev. 1.31
2
2004-10-12
TLE 6361 G
1.3
Pin configuration
P-DSO-36-12
GND
CLK
CS
GND
1
2
3
4
5
6
7
36
35
34
33
32
31
30
29
SLEW
WAKE
BOOST
DI
DO
IN
ERR
SW
IN
Q_STB
SW
Q_T1
Q_T2
Q_T3
8
28
27
Bootstrap
9
10
11
12
13
14
15
16
Q_LDO1
FB/L_IN
FB/L_IN
Q_LDO2
SEL
Q_T4
Q_T5
26
25
24
23
22
21
20
19
Q_T6
Q_LDO3
CCP
R3
R2
C+
C-
R1
17
18
GND
GND
Figure 1 Pin Configuration (Top View),
bottom heatslug and GND corner pins are connected
Data Sheet, Rev. 1.31
3
2004-10-12
TLE 6361 G
1.4
Pin definitions and functions
Pin No. Symbol
Function
1,18,19, GND
36
Ground; to reduce thermal resistance place cooling areas on
PCB close to this pins. Those pins are connected internally to the
heatslug at the bottom.
2
3
CLK
CS
SPI Interface Clock input; clocks the shiftregister; CLK has an
internal active pull down and requires CMOS logic level
inputs;see also chapter SPI
SPI Interface chip select input; CS is an active low input; serial
communication is enabled by pulling the CS terminal low; CS
input should only be switched when CLK is low; CS has an
internal active pull up and requires CMOS logic level inputs ;see
also chapter SPI
4
5
DI
SPI Interface Date input; receives serial data from the control
device; serial data transmitted to DI is a 16 bit control word with
the Least Significant Bit (LSB) being transferred first; the input
has an active pull down and requires CMOS logic level inputs; DI
will accept data on the falling edge of CLK-signal; see also
chapter SPI
SPI Interface Data output; this tristate output transfers
diagnosis data to the controlling device; the output will remain 3-
stated unless the device is selected by a low on Chip-Select CS;
see also the chapter SPI
DO
6
7
8
ERR
Error output; push-pull output. Monitors failures in parallel to the
SPI diagnosis word, reset via SPI. ERR is a latched output.
Q_STB
Q_T1
Standby Regulator Output; the output is active even when the
buck regulator and all other circuitry is in off mode
Voltage Tracker Output T1 tracked to Q_LDO1; bypass with a
1µF ceramic capacitor for stability. It is switched on and off by
SPI command. Keep open, if not needed.
9
Q_T2
Q_T3
Voltage Tracker Output T2 tracked to Q_LDO1; bypass with a
1µF ceramic capacitor for stability. It is switched on and off by
SPI command. Keep open, if not needed.
Voltage Tracker Output T3 tracked to Q_LDO1; bypass with a
1µF ceramic capacitor for stability. It is switched on and off by
SPI command. Keep open, if not needed.
10
Data Sheet, Rev. 1.31
4
2004-10-12
TLE 6361 G
1.4
Pin definitions and functions (cont’d)
Function
Pin No. Symbol
11
12
13
14
15
16
17
Q_T4
Q_T5
Q_T6
Voltage Tracker Output T4 tracked to Q_LDO1; bypass with a
1µF ceramic capacitor for stability. It is switched on and off by
SPI command. Keep open, if not needed.
Voltage Tracker Output T5 tracked to Q_LDO1; bypass with a
1µF ceramic capacitor for stability. It is switched on and off by
SPI command. Keep open, if not needed.
Voltage Tracker Output T6 tracked to Q_LDO1; bypass with a
1µF ceramic capacitor for stability. It is switched on and off by
SPI command. Keep open, if not needed.
Q_LDO3 Voltage Regulator Output 3; 5V or 3.3V output; ouput voltage
is selected by pin SEL (see also 3.4.2); For stability a ceramic
capacitor of 470nF to GND is sufficient.
R3
R2
R1
Reset output 3, undervoltage detection for output Q_LDO3;
open collector output; an external pullup resistor of 10kΩ is
required
Reset output 2, undervoltage detection for output Q_LDO2;
open collector output; an external pullup resistor of 10kΩ is
required
Reset output 1, undervoltage detection for output Q_LDO1 and
watchdog failure reset; open collector output ; an external pullup
resistor of 10kΩ is required
20
21
22
23
24
C-
Charge pump capacitor connection; Add the fly-capacitor of
100nF between C+ and C-
C+
Charge pump capacitor connection; Add the fly-capacitor of
100nF between C+ and C-
CCP
SEL
Charge Pump Storage Capacitor Output; Add the storage
capacitor of 220nF between pin CCP and GND.
Select Pin for output voltage adjust of Q_LDO2 and Q_LDO3
(see also 2.2.2)
Q_LDO2 Voltage Regulator Output 2; 3.3V or 2.6V output; output
voltage is selected by pin SEL (see also 3.4.2); For stability a
ceramic capacitor of 470nF to GND is sufficient.
25, 26
FB/L_IN
Feedback and Linear Regulator Input; input connection for
the Buck converter output
Data Sheet, Rev. 1.31
5
2004-10-12
TLE 6361 G
1.4
Pin definitions and functions (cont’d)
Function
Pin No. Symbol
27
Q_LDO1 Voltage Regulator Output 1; 5V output; acts as the reference
for the voltage trackers.The SPI and window watchdog logic is
supplied from this voltage. For stability a ceramic capacitor of
470nF to GND is sufficient.
28
Bootstrap Bootstrap Input; add the bootstrap capacitor between pin SW
and pin Bootstrap, the capcitance value should be not lower
than 2% of the Buck converter output capacitance
29, 31
SW
Switch Output; connect both pins externally through short lines
directly to the cathode of the catch diode and the Buck circuit
inductance.
30, 32
33
IN
Supply Voltage Input; connect both pins externally through
short lines to the input filter/the input capacitors.
BOOST
Boost Input; for switching loss minimization connect a diode
(cathode directly to boost pin) in series with a 100nF ceramic
capacitor to the IN pin and from the anode of the diode to the
buck converter output a 22Ω resistor. Recommended for 42V
applications, in 12/24V applications connect boost directly to IN
34
35
WAKE
SLEW
Wake Up Input; a positive voltage applied to this pin turns on
the device
Slew control Input; a resistor to GND defines the current slope
in the buck switch for reduced EME
Data Sheet, Rev. 1.31
6
2004-10-12
TLE 6361 G
1.5
Basic block diagram
TLE 6361
Standby
Regulator
2.5V
Q_STB
Boost
SW
2*
IN
2*
BUCK
REGULATOR
Slew
Bootstrap
Driver
PWM
Internal
Error-
Amplifier
Reference
OSZ
feedback
FB/L_IN
2*
C+
C-
Charge
Pump
CCP
Protection
Power
Down
Logic
Wake
R1
SEL
Q_LDO1
Linear
Reg. 1
µ-controller /
memory
Reset
Logic
R2
R3
Q_LDO2
Q_LDO3
Linear
Reg. 2
supply
Linear
Reg. 3
ref
Q_T1
Q_T2
Q_T3
Q_T4
Q_T5
Q_T6
Tracker
5V
Window
Watchdog
ref
Tracker
5V
ref
CLK
CS
Tracker
5V
Sensor
supplies
(off board
supplies)
ref
Tracker
5V
SPI
16 bit
ref
DI
Tracker
5V
ref
DO
ERR
Tracker
5V
GND
4*
Figure 2 Block Diagram
Data Sheet, Rev. 1.31
7
2004-10-12
TLE 6361 G
2
Detailed circuit description
In the following major buck regulator blocks, the linear voltage regulators and trackers,
the undervoltage reset function, the watchdog and the SPI are described in more detail.
For applications information e.g. choice of external components, please refer to
section .
2.1
Buck Regulator
The diagram below shows the internal implemented circuit of the Buck converter, i. e. the
internal DMOS devices, the regulation loop and the other major blocks.
IN
5V
14V
Int. voltage
regulator
Int. charge
pump
150µA
to
8 to 10V
current sense
amplifier
FB/L_IN
C+
C-
CCP
Gate driver
Main switch ON/OFF
Main
DMOS
IN
under-
voltage
lockout
SW
BOOT-
STRAP
Slope switch
charge signal
BOOST
SW
switching frequency 330kHz
Divider
Slope
DMOS
Slope switch
discharge signal
Oscillator
1.4MHz
Slope
compensation
Gate off signal
from overtemp or
sleep command
Trigger for
gate on
Lowpass
Lowpass
Voltage
feedback
amplifier
Zero cross
detection
PWM logic
Slope logic
Delay unit
Current
comparator
Trigger for
gate off
Vref=6V
Current
sense
from
+
current sensing
amplifier
Slope
control
SLEW
external components
pins
Figure 3 Detailed Buck regulator diagram
The 1.5A Buck regulator consists of two internal DMOS power stages including a current
mode regulation scheme to avoid external compensation components plus additional
blocks for low EME and reduced switching loss. Figure 3 indicates also the principle how
Data Sheet, Rev. 1.31
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TLE 6361 G
the gate driver supply is managed by the combination of internal charge pump, external
charge pump and bootstrap capacitor.
2.1.1
Current mode control scheme
The regulation loop is located at the left lower corner in the schematic, there you find the
voltage feedback amplifier which gives the actual information of the actual output voltage
level and the current sense amplifier for the load current information to form finally the
regulation signal. To avoid subharmonic oscillations at duty cycles higher than 50% the
slope compensation block is necessary.
The control signal formed out of those three blocks is finally the input of the PWM
regulator for the DMOS gate turn off command, which means this signal determines the
duty cycle. The gate turn on signal is set by the oscillator periodically every 3µs which
leads to a Buck converter switching frequency around 330kHz.
With decreasing input voltage the device changes to the so called pulse skipping mode
which means basically that some of the oscillator gate turn off signals are ignored. When
the input voltage is still reduced the DMOS is turned on statically (100% duty cycle) and
its gate is supplied by the internal charge pump. Below typical 4.5V at the feedback pin
the device is turned off.During normal switching operation the gate driver is supplied by
the bootstrap capacitor.
2.1.2
Start-up procedure
To guarantee a device startup even under full load condition at the linear regulator
outputs a special start up procedure is implemented. At first the bootstrap capacitor is
charged by the internal charge pump. Afterwards the outpuput capacitor is charged
where the driver supply in that case is maintained only by the bootstrap capacitor. Once
the output capacitor of the buck converter is charged the external charge pump is
activated being able to supply the linear regulators and finally the linear regulators are
released to supply the loads.
2.1.3
Reduction of electromagnetic emission
In figure 3 it is recognized that two internal DMOS switches are used, a main switch and
an auxiliary switch. The second implemented switch is used to adjust the current slope
of the switching current. The slope adjustment is done by a controlled charge and
discharge of the gate of this DMOS. By choosing the external slew resistor appropriate
the current transition time can be adjusted between 20ns and 100ns.
2.1.4
Reducing the switching losses
The second purpose of the slope DMOS is to minimise the switching losses. Once being
in freewheeling mode of the buck regulator the output voltage level is sufficient to force
the load current to flow, the input voltage level is not needed in the first moment. By a
feedback network consisting of a resistor and a diode to the boost pin (connection see
Data Sheet, Rev. 1.31
9
2004-10-12
TLE 6361 G
section ) the output voltage level is present at the drain of the switch. As soon as the
voltage at the SW pin passes zero volts the handover to the main switch occurs and the
traditional switching behaviour of the Buck switch can be observed.
2.2
Linear Voltage Regulators
The Linear regulators offer voltage rails of 5V, 3.3V and 2.6V which can be determined
by a hardware connection (see table at 2.2.2) for proper power up procedure. Being
supplied by the output of the Buck pre-regulator the power loss within the three linear
regulators is minimized.
All voltage regulators are short circuit protected which means that each regulator
provides a maximum current according to its current limit when shorted. Together with
the external charge pump the NPN pass elements of the regulators allow low dropout
voltage operation. By using this structure the linear regulators work stable even with a
minimum of 470nF ceramic capacitors at their output.
Q_LDO1 has 5V nominal output voltage, Q_LDO2 has a hardware programmable
output voltage of 3.3V or 2.6V and Q_LDO3 is programmable to 5V or 3.3V (see 2.2.2).
All three regulators are on all the time, if one regulator is not needed a base load resistor
in parallel to the output capacitance for controlled power down is recommended.
2.2.1
Startup Sequence Linear Regulators
When acting as 32 bit µC supply the so-called power sequencing (the dependency of the
different voltage reails to each other) is important. Within the TLE 6361 G the following
Startup-Sequence is defined (see also figure 4):
V
Q_LDO2 ≤ VQ_LDO1;
and
Q_LDO2 ≤ VQ_LDO1 with VQ_LDO1=5V, VQ_LDO2 = 2.6V/3.3V and VQ_LDO3 = 5V
VQ_LDO3 ≤ VQ_LDO1 with VQ_LDO1=5V, VQ_LDO2 = 2.6V and VQ_LDO3 = 3.3V
V
The power sequencing refers to the regulator itself, externally voltages applied at
Q_LDO2 and Q_LDO3 are not pulled down actively by the device if Q_LDO1 is lower
than those outputs.
That means for the power down sequencing if different output capacitors and different
loads at the three outputs of the linear regulators are used the voltages at Q_LDO2 and
Q_LDO3 might be higher than at Q_LDO1 due to slower discharging. To avoid this
behaviour three Schottky diodes have to be connected between the three outputs of the
linear regulators in that way that the cathodes of the diodes are always connected to the
higher nominal rail.
Data Sheet, Rev. 1.31
10
2004-10-12
TLE 6361 G
Power Sequencing
VFB/L_IN
VLDO_EN
t
t
VQ_LDO1
5V
VRth5
3.3V
2.6V
VQ_LDO2 (2.6V Mode)
0.7V
5V LDO
5V LDO
2.6V
VRth2.6
0.7V
t
VQ_LDO3 (3.3V Mode)
5V LDO
+/- 50mV
5V LDO
3.3V
VRth3.3
+/- 50mV
t
Figure 4 Power-up and -down sequencing of the regulators
2.2.2
Q_LDO2 and Q_LDO3 output voltage selection*
To determine the output voltage levels of the three linear regulators, the selection pin
(SEL, pin 23) has to be connected according to the matrix given in the table below.
Definition of Output voltage Q_LDO2 and Q_LDO3
Select Pin SEL Q_LDO2
Q_LDO3
connected to
output voltage output voltage
GND
3.3 V
2.6 V
2.6 V
5 V
Q_LDO1
Q_LDO2
3.3 V
5 V
* for different output voltages please refer to the multi voltage supply TLE6368
Data Sheet, Rev. 1.31
11
2004-10-12
TLE 6361 G
2.3
Voltage Trackers
For off board supplies i.e. sensors six voltage trackers Q_T1 to Q_T6 with 17mA output
current capability each are available. The output voltages match Q_LDO1 within
+5 / -15mV. They can be individually turned on and off by the appropriate SPI command
word sent by the microcontroller. A ceramic capacitor with the value of 1µF at the output
of each tracker is sufficient for stable operation without oscillation.
The tracker outputs can be connected in parallel to obtain a higher output current
capability, no matter if only two or up to all six trackers are tied together. For uniformly
distributed current density in each tracker internal balance resistors at each output are
foreseen internally. By connecting twice three trackers in parallel two sensors with more
than 50mA each can be supplied, all six in parallel give more than 100mA.
The tracker outputs can withstand short circuits to GND or battery in a range from -5 to
+60V. A short circuit to GND at is detected and indicated individually for each tracker in
the SPI status word. Also an open load condition might be recognised and indicated as
a failure condition in the SPI status word. A minimum load current of 2mA is required to
avoid open load failure indication. In case of connecting several trackers to a common
branch balancing currents can prevent proper operation of the failure indication.
2.4
Standby Regulator
The standby regulator is an ultra low power 2.5V linear voltage regulator with 1mA output
current which is on all the time. It is intended to supply the microcontroller in stop mode
and requires then only a minimum of quiescent current (<30µA) to extend the battery
lifetime.
2.5
Charge Pump
The 1.6 MHz charge pump with the two external capacitors will serve to supply the base
of the NPN linear regulators Q_LDO1 and Q_LDO3 as well as the gate of the Buck
DMOS transistor in 100% duty cycle operation at low battery condition. The charge pump
voltage in the range of 8 to 10V can be measured at pin 22 (CCP) but is not intended to
be used as a supply for additional circuitry.
2.6
Power On Reset
A power on reset is available for each linear voltage regulator output. The reset output
lines R1, R2 and R3 are active (low) during start up and turn inactive with a reset delay
time after Q_LDO1, Q_LDO2 and Q_LDO3 have reached their reset threshold. The
reset outputs are open collector, three pull up resistors of 10kΩ each have to be
connected to the I/O rail (e.g. Q_LDO1) of the µC. All three reset outputs can be linked
in parallel to obtain a wired-OR.
The reset delay time is 64 ms by default and can be set to lower values as 8 ms, 16 ms
or 32 ms by SPI command. At each power up of the device when the output voltage at
Data Sheet, Rev. 1.31
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2004-10-12
TLE 6361 G
Q_LDO1 has decreased below 3.3V (max.) the default settings are valid, means the
64ms delay time. If the voltage on Q_LDO1 during sleep or power off mode was kept
above 3.3V the delay time set by the last SPI command is valid.
VFB/L_IN
< trr
t
VQ_LDOx
VRTH,Q_LDOx
trr
t
t
tRES
tRES
tRES
VRx
tRES
thermal
under
over
load
shutdown
voltage
Figure 5 Undervoltage reset timing
2.7 RAM good flag
A RAM good flag will be set within the SPI status word when the Q_LDO1 voltage drops
below 2.3V. A second one will be set if Q_LDO2 drops below typical 1.4V. Both RAM
good flags can be read after power up to determine if a cold or warm start needs to be
processed. Both RAM good flags will be reset after each SPI cycle.
2.8
ERR Pin
An hardware error pin indicates any fault conditions on the chip. It should be connected
to an interrupt input of the microcontroller. A low signal indicates an error condition. The
microcontroller can read the root cause of the error by reading the SPI register.
2.9
Window Watchdog
The on board window watchdog for supervision of the µC works in combination with the
SPI. The window watchdog logic is triggered when CS is low and Bit WD-Trig in the SPI
command word is set to “1”. The watchdog trigger is recognized with the low to high
transition of the CS signal. To allow reading the SPI at any time without getting a reset
due to misinterpretation the WD-Trig bit has to be set to “0” to avoid false trigger
conditions. To disable the window watchdog the WD-OFF bits need to be set to “010”.
Data Sheet, Rev. 1.31
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TLE 6361 G
tSR = tOW/2
tWDR = tRES
tCW=tCW
tOW=tCW
(not the same scale)
(not the same scale)
closed window
open window
reset delay time without trigger
definition
definition
reset start delay time after window
watchdog timeout
reset duration time after window
watchdog time-out
tECW
t
EOW = end of open window
Example with:
tCW=128ms
fOSC=fOSCmax t EOW, w.c.= ( tCW+tOW )(1-∆)
∆=25% (oscillator deviation)
worst cases
fOSC=fOSCmin t ECW, w.c.= tCW (1+∆)
tECW, w.c. = 128(1.25) = 160ms
tEOW, w.c = (128+128)(0.75) = 192ms
towmin
= 32ms
t OWmin
Minimum open window time: t OWmin= tOW - ∆ * ( tOW + 2* tCW
)
Figure 6 Window watchdog timing definition
Figure 6 shows some guidelines for designing the watchdog trigger timing taking the
oscillator deviation of different devices into account. Of importance is the maximum
(w.c.) of the closed window and the minimum of the open window in which the trigger has
to occur.
The length of the OW and CW can be modified by SPI command. If a change of the
window length is desired during the Watchdog function is operating please send the SPI
command with the new timing with a ’Watchdog trigger Bit’ D15=1.In this case the next
CW will directly start with the new length.
A minimum time gap of > 1/48 of the actual OW/CW time between a ’Watchdog disable’
and ’Watchdog enable’ SPI-command should be maintained. This allows the internal
Watchdog counters to be resetted. Thus after the enable command the Watchdog will
start properly with a full CW of the adjusted length.
Data Sheet, Rev. 1.31
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2004-10-12
TLE 6361 G
Perfect triggering after Power on Reset
VQ_LDO1
VRth1
1V
t
t
t
t
t
tRES
R1
tCW
tSR
Watchdog
window
CW
OW
CW
OW
CW
CW
OW
CS
with WD-
trig=1
ERR
Incorrect triggering
Watchdog
window
CW
OW
t
t
CS
with WD-
trig=1
1)
2)
1) Pretrigger
2) Missing trigger
Legend:
OW = Open window
CW = Closed window
Figure 7 Window watchdog timing
Figure 7 gives some timing information about the window watchdog. Looking at the
upper signals the perfect triggering of the watchdog is shown. When the 5V linear
regulator Q_LDO1 reaches its reset threshold, the reset delay time has to run off before
Data Sheet, Rev. 1.31
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2004-10-12
TLE 6361 G
the closed window (CW) starts. Then three valid watchdog triggers are shown, no effect
on the reset line and/or error pin is observed. With the missing watchdog trigger signal
the error signal turns low immediately where the reset is asserted after another delay of
half the closed window time.
Also shown in the figure are two typical failure modes, one pretrigger and one missing
signal. In both cases the error signal will go low immediately the failure is detected with
the reset following after the half closed window time.
2.10
Overtemperature Protection
At a chip temperature of more than 130° an error and temperature flag is set and can be
read through the SPI. The device is switched off if the device reaches the
overtemperature threshold of 170°C. The overtemperature shutdown has a hysteresis to
avoid thermal pumping.
2.11
Power Down Mode
The TLE 6361 G is started by a static high signal at the wake input or a high pulse with
a minimum of 50µs duration at the Wake input (pin 34). In order to avoid instabilities of
the device voltages applied to the Wake pin (pin 34) have to have a certain slope, i.e.
1V/3µs. Voltages in the range between the turn on and turn off thresholds for a few 100µs
must be avoided!
By SPI command (“Sleep”-bit, D8, equals zero) all voltage regulators including the
switching regulator except the standby regulator can be turned off completely only if the
wake input is low. In the case the Wake input is permanently connected to battery the
device cannot be turned off by SPI command, it will always turn on again.
For stable “on” operation of the device the “Sleep”-bit, D8 has to be set to high at each
SPI cycle!
When powering the device again after power down the status of the SPI controlled
devices (e.g. trackers, watchdog etc.) depends on the output voltage on Q_LDO1. Did
the voltage at Q_LDO1 decrease below 3.3V the default status (given in the next section)
is set otherwise the last SPI command defines the status.
2.12
Serial Peripheral Interface
A standard 16bit SPI is available for control and diagnostics. It is capable to operate in a
daisy chain. It can be written or read by a 16 bit SPI interface as well as by an 8 bit SPI
interface.
The 16-bit control word (write bit assignment, see figure 8) is read in via the data input DI,
synchronous to the clock input CLK supplied by the µC. The diagnosis word appears in
the same way synchronously at the data output DO (read bit assignment, see figure 9),
so with the first bit shifted on the DI line the first bit appears on the DO line.
Data Sheet, Rev. 1.31
16
2004-10-12
TLE 6361 G
The transmission cycle begins when the TLE 6361 G is selected by the “not chip select”
input CS (H to L). After the CS input returns from L to H, the word that has been read in
at the DI line becomes the new control word. The DO output switches to tristate status at
this point, thereby releasing the DO bus circuit for other uses. For details of the SPI
timing please refer to figures 10 to 13.
The SPI will be reset to default values given in the following table “write bit meaning” if
the RAM good flag of Q_LDO1 indicates a cold start (lower output voltage than 3.3V).
The reset will be active as long as the power on reset is present so during the reset delay
time at power up no SPI commands are acceptable.
The register content of the SPI - including watchdog timings and reset delay timings - is
maintained if the RAM good flag of Q_LDO1 indicates a warm start (i.e. Q_LDO1 did not
decrease below 3.3V).
2.12.1 Write mode
The following tables show the bit assignment to the different control functions, how to
change settings with the right bit combination and also the default status at power up.
2.12.2 Write mode bit assignment
BIT
DO
D1
D2
D3
D4
D5
D6
D7
D8
sleep
1
D9
D10
reset 1
0
D11
reset 2
0
D12
WD 1
0
D13
WD 2
0
D14
D 15
WD-Trig
0
WD_OF
F1
NOT
T1-
T2-
T6-
T4-
T5-
T6-
WD_OF
F2
WD_OF
F3
Name
assigned control
control
control
control
control
control
Default
1
X
0
0
0
0
0
0
1
1
Figure 8 Write Bit assignment
Write Bit meaning
Function
Bit
Combination Default
Not assigned
D1
X
X
0
Tracker 1 to 6 - control:
turn on/off the individual trackers
D2
D3
D4
D5
D6
D7
0: OFF
1: ON
Power down:
D8
0: SLEEP
1
send device to sleep
1: NORMAL
Data Sheet, Rev. 1.31
17
2004-10-12
TLE 6361 G
Write Bit meaning
Function
Bit
Combination Default
Reset timing:
Reset delay time tRES valid at warm start
D10D11
00: 64ms
10: 32ms
01: 16ms
11: 8ms
00
Window watchdog timing:
Open window time tOW and
closed window time tCW valid at warm start
D12D13
00: 128ms
10: 64ms
01: 32ms
11: 16ms
00
Window watchdog function:
Enable /disable window watchdog
D0D9D14 010: OFF
1xx: ON
111
x0x: ON
xx1: ON
Window watchdog trigger:
Enable / disable window watchdog trigger
D15
0: not triggered 1
1: triggered
2.12.3 Read mode
Below the status information word and the bit assignments for diagnosis are shown.
2.12.3.1 Read mode bit assignment
BIT
DO
ERROR
0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
WD
D11
D12
D13
D14
D 15
temp_
warn
T1-
T2-
T3-
T4-
T5-
T6-
RAM
RAM
WD
DC/DC
status
Name
R-Error1 R-Error2 R-Error3
status
status
status
status
status
status
Good 1 Good 2 Window
Error
Default
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
Figure 9 Read Bit assignment
Error bit D0:
The error bit indicates fail function and turns high if the temperature prewarning, the
watchdog error is active, further if one RAM good indicates a cold start or if a voltage
tracker does not settle within 1ms when it is turned on.
In addition to the error indication by software the ERR pin atcs as a hardware error flag.
Data Sheet, Rev. 1.31
18
2004-10-12
TLE 6361 G
Read Bit meaning
Function
Type
Bit
Combination
Default
Error indication,
explanation see below this
table
Latched
D0
0: normal operation 0
1: fail function
Overtemperature warning Not latched D1
0: normal operation 0
1: prewarning
Status of Tracker Output
Q_T[1:6],only if output is
ON
Not latched D2
1: settled output
voltage
0:Tracker turned
off or
shorted output.
Also open load
may possibly be
indicated as 0.1)
0
D3
D4
D5
D6
D7
Indication of cold start/
warm start, Q_LDO1
Latched
Latched
D8
D9
0: cold start
1: warm start
0
0
0
Indication of cold start/
warm start, Q_LDO2
0: cold start
1: warm start
Indication for open or
closed window
Not latched D10
Not latched D11
Not latched D12
Not latched D13
0: open window
1: closed window
Reset condition at output
Q_LDO1
0: normal operation 0
1: Reset R1
Reset condition at output
Q_LDO2
0: normal operation 0
1: Reset R2
Reset condition at output
Q_LDO3
0: normal operation 0
1: Reset R3
Watchdog Error
Latched
D14
0: normal operation 0
1: WD error
DC/DC converter status
Not latched D15
0: off
1: on
1
1)
Min. load current to avoid ’0’ signal caused by open load is 2mA.
Data Sheet, Rev. 1.31
19
2004-10-12
TLE 6361 G
2.12.4 SPI Timings
CS High to Low & rising edge of CLK: DO is enabled.
Status information is transferred to Output Shift Register
CS
CLK
DI
CS Low to High: Data from Register
are transferred to e.g. Trackers
time
0
1
2
3
13 14 15
0
1
Data In (N)
Data In (N+1)
D1
+
D0
+
D13 D14 D15
D0
D1 D2 D3
DI: Data will be accepted on the falling edge of CLK-Signal
Data Out (N)
Data Out (N-1)
D13 D14 D15
D1
D0 D1 D2 D3
D0
DO
DO: State will change on the rising edge of CLK-Signal
e.g.
Tracker-
Setting (N)
Setting (N-1)
control
e.g.
Tracker-
Status (N)
Status (N-1)
status
Figure 10 SPI Data Transfer Timing
Data Sheet, Rev. 1.31
20
2004-10-12
TLE 6361 G
Figure 11 SPI-Input Timing
trIN
tfIN <10ns
0.7 VQ_LDO1
50%
0.2 VQ_LDO1
CLK
trDO
90%
10%
(low to high)
DO
tVADO
tfDO
90%
10%
(high to low)
DO
Figure 12 DO Valid Data Delay Time and Valid Time
Data Sheet, Rev. 1.31
21
2004-10-12
TLE 6361 G
tfIN
trIN <10ns
0.7 VQ_LDO1
50%
0.2 VQ_LDO1
CS
DO
DO
10k
Ω
Pullup
50%
50%
to VQ_LDO1
tENDO
tDISDO
10k
Ω
Pulldown
to GND
Figure 13 DO Enable and Disable Time
Data Sheet, Rev. 1.31
22
2004-10-12
TLE 6361 G
3
Characteristics
3.1
Absolute Maximum Ratings
Item Parameter Symbol Limit Values
Unit
Test Condition
Min.
Max.
3.1.1 Supply Voltage Input IN
Voltage
Current
VVS
IVS
-0.5
–
60
–
–
–
V
–
–
3.1.2 Buck-Switch Output SW
Voltage
Current
VSW
ISW
-2
–
VS+0.5
V
–
–
3.1.3 Feedback and Linear Voltage Regulator Input
Voltage
Current
VFB/L_IN
IFB/L_IN
-0.5
8
V
–
–
–
3.1.4 Bootstrap Connector Bootstrap
Voltage
VBootstrap VSW-
VSW+
10V
V
0.5V
Voltage
Current
VBootstrap -0.5
70
–
V
–
IBootstrap
–
Internally Limited
3.1.5 Boost Input
Voltage
VBoost
IBoost
-0.5
–
60
–
–
V
–
Current
Internally Limited
3.1.6 Slope Control Input Slew
Voltage
Current
VSlew
ISlew
-0.5
–
6
–
–
V
–
Internally Limited
3.1.7 Charge Pump Capacitor Connector C-
Voltage
VCL
-0.5
VFB/L_IN
+0.5
V
Current
ICL
-150
+150
mA
Data Sheet, Rev. 1.31
23
2004-10-12
TLE 6361 G
3.1.8 Charge Pump Capacitor Connector C+
Voltage
Current
VCH
ICH
-0.5
13
V
-150
+150
mA
3.1.9 Charge Pump Storage Capacitor CCP
Voltage
Current
VCCP
ICCP
-0.5
12
–
V
-150
mA
3.1.10 Standby Voltage Regulator output Q_STB
Voltage
Current
VQ_Stb
IQ_Stb
-0.5
6
–
–
V
–
–
Internally limited
3.1.11 Voltage Regulator output voltage Q_LDO1
Voltage
Current
VQ_LDO1
IQ_LDO1
-0.5
6
–
–
V
–
–
Internally limited
3.1.12 Voltage Regulator output voltage Q_LDO2
Voltage
Current
VQ_LDO2
IQ_LDO2
-0.5
6
–
V
–
–
–
Internally limited
3.1.13 Voltage Regulator output voltage Q_LDO3
Voltage
Current
VQ_LDO3
IQ_LDO3
-0.5
6
–
–
V
–
–
Internally limited
3.1.14 Voltage Tracker output voltage Q_T1
Voltage
Current
VQ_T1
IQ_T1
-5
60
–
V
–
–
Internally limited
mA
3.1.15 Voltage Tracker output voltage Q_T2
Voltage
Current
VQ_T2
IQ_T2
-5
60
–
V
–
–
Internally limited
mA
3.1.16 Voltage Tracker output voltage Q_T3
Voltage
Current
VQ_T3
IQ_T3
-5
60
–
V
–
–
Internally limited
mA
3.1.17 Voltage Tracker output voltage Q_T4
Voltage
Current
VQ_T4
IQ_T4
-5
60
–
V
–
–
Internally limited
mA
Data Sheet, Rev. 1.31
24
2004-10-12
TLE 6361 G
3.1.18 Voltage Tracker output voltage Q_T5
Voltage
Current
VQ_T5
IQ_T5
-5
60
–
V
–
–
Internally limited
mA
3.1.19 Voltage Tracker output voltage Q_T6
Voltage
Current
VQ_T6
IQ_T6
-5
60
–
V
–
–
Internally limited
mA
3.1.20 Select Input SEL
Voltage
Current
VSEL
ISEL
-0.5
6
–
V
–
–
–
Internally limited
3.1.21 Wake Up Input Wake
Voltage
Current
VWake
IWake
-0.5
60
–
–
–
–
–
V
–
–
–
3.1.22 Reset Output R1
Voltage
Current
VR1
IR1
-0.5
6
V
–
–
–
3.1.23 Reset Output R2
Voltage
Current
VR2
IR2
-0.5
6
V
–
–
–
3.1.24 Reset Output R3
Voltage
Current
VR3
IR3
-0.5
6
–
V
–
–
3.1.25 SPI Data Input DI
Voltage
Current
VDI
IDI
-0.5
6
–
V
–
–
3.1.26 SPI Data Output DO
Voltage
Current
VDO
IDO
-0.5
6
–
–
V
–
–
Internally limited
3.1.27 SPI Clock Input CLK
Voltage
Current
VCLK
ICLK
-0.5
6
–
V
–
–
–
Data Sheet, Rev. 1.31
25
2004-10-12
TLE 6361 G
3.1.28 SPI Chip Select Not Input CS
Voltage
Current
VCS
ICS
-0.5
6
–
–
V
–
–
–
3.1.29 Error Output Pin
Voltage
Current
VError
IError
-0.5
6
V
–
–
–
Internally limited
3.1.30 Thermal Resistance
Junction-
ambient
Rthja
Rthja
Rthjc
37
29
2
1)PCB heat sink area
300mm2
K/W
K/W
K/W
Junction-
ambient
1)PCB heat sink area
600mm2
Junction-
case
–
3.1.31 Temperature
Junction
temperature
Tj
-40
150
175
°C
°C
Junction
Tjt
lifetime=TBD
temperature
transient
Storage
Tstg
-50
150
°C
temperature
3.1.32 ESD - Protection (Human Body Model; 1.5kΩ; C=100pF)
Electrostatic VESD
discharge
-1
1
kV
All pins
voltage
1) Package mounted on FR4 47x50x1.5mm3; 70µ Cu, zero airflow
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
Data Sheet, Rev. 1.31
26
2004-10-12
TLE 6361 G
3.2
Functional Range
-40°C < Tj < 150 °C
Item Parameter
Symbol
Limit Values
Unit
Condition
min.
5.5
max.
Supply
Voltage
VIN
V
To achieve VIN,min an
initial startup with
VIN >8V is required;
Supply
VIN
60
V
Voltage
Ripple at
FB/L_IN
VFB/L_IN
0
150
mVPP
ripple
Note: Within the functional range the IC can be operated . The electrical characteristics,
however, are not guaranteed over this full functional range
Data Sheet, Rev. 1.31
27
2004-10-12
TLE 6361 G
3.3
Recommended Operation Range
-40°C < Tj < 150 °C
Item Parameter
Symbol
Limit Values
typ. max.
100
Unit
Condition
min.
1)
Buck
Inductor
LB
18
µH
µF
Buck
Capacitor
CB
10
ESR <0.15 Ω,
ceramic
capacitor (X7R)
recommended1)
Bootstrap
Capacitor
CBTP
2
0
% of CB
kΩ
SLEW
RSLEW
20
resistor
Linear
CQ_LDO1-3 470
nF
ceramic
regulator
capacitors
capacitor (X7R)
Tracker
bypass
capacitors
CQ_T1-6
1
µF
ns
ceramic
capacitor (X7R)
SPI rise and tr,f
200
fall timings,
CS, DI, CLK
1)
CB, min needs a Buck inductance LB=47µH to avoid instabilities
Data Sheet, Rev. 1.31
28
2004-10-12
TLE 6361 G
3.4
Electrical Characteristics
The electrical characteristics involve the spread of values guaranteed within the
specified supply voltage and ambient temperature range. Typical values represent the
median values at room temperature, which are related to production processes.
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
Buck regulator
3.4.1 Switching
frequency
fSW
280
370
20
425
kHz
ns
3.4.2 Current
transition
tr_I_SW
RSL=0Ω 1)
RSL=20kΩ 1)
RSL=0Ω 1)
time, min.,
rising edge
3.4.3 Current
transition
tr_I_SW
tf_I_SW
tf_I_SW
100
20
ns
ns
ns
time, max.,
rising edge
3.4.4 Current
transition
time, min.,
falling edge
3.4.5 Current
transition
100
RSL=20kΩ 1)
time, max.,
falling edge
1)
3.4.6 Voltage rise / tf_V_SW
fall time
25
ns
3.4.7 Static on
resistance
RON
160
280
mΩ
mΩ
Tj=25°C
in static operation
3.4.8 Static on
resistance
RON
400
Tj=150°C
in static operation
3.4.9 Current limit IMAX
1.5
5.4
3.2
6.3
A
V
VFB/L_IN=5.4V
3.4.10 Output
voltage
VOUT
IOUT=0.1A
VIN=13.5 V
3.4.11 Output
voltage
VOUT
5.4
6.05
V
IOUT=1.5A
VIN=13.5 V
Data Sheet, Rev. 1.31
29
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
3.4.12 Bootstrap
charging
IBTSTR
80
160
220
17
µA
current at
start-up
3.4.13 Bootstrap
voltage
VBTSTR
10
5
V
V
VFB/L_IN=6.5V,
Buck converter
off
(internal
charge
pump)
3.4.14 Bootstrap
undervoltage
lockout, Buck
turn on
VBTSTR,
9
turn on
threshold
3.4.15 Bootstrap
undervoltage
lockout,
VBTSTR,
2.5
V
V
-
turn on
VBTSTR,
hysteresis
turn off
3.4.16 Charge
pump
VCCP
7.9
11.0
IQ_LDO1 = 800mA,
VFB/L_IN=6.0V,
voltage
CFLY=100nF,
CCCP=220nF
3.4.17 Max. Duty
Cycle
dutymax
dutymin
95
%
%
Switching
operation
3.4.18 Min. Duty
Cycle
0
Static-off
operation
Voltage Regulator Q_LDO1
3.4.19 Output
voltage
VQ1
4.9
5.1
V
100mA < IQ_LDO1
< 800mA
3.4.20 Output
voltage
VQ1
5.0
40
V
IQ_LDO1 = 800mA
3.4.21 Load
∆VQ_LDO1
mV
100mA< IQ_LDO1
<800mA;
Regulation
VFB/L_IN=5,5V
3.4.22 Current limit IQ_LDO1limit 800
Data Sheet, Rev. 1.31
1050
30
1400
mA
VQ_LDO1=4V
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
3.4.23 Ripple
rejection
PSRR1
26
40
dB
nF
f=330kHz; 1)
3.4.24 Output
Capacitor
CQ_LDO1 470
Ceramic type,
value for stability
Voltage Regulator Q_LDO2
3.4.25 Output
voltage 3.3V
VQ_LDO2
3.14
3.46
V
50mA < IQ_LDO2
400mA;
<
3.3V mode
3.4.26 Output
voltage 3.3V
3.4.27 Output
voltage 2.6V
VQ_LDO2
VQ_LDO2
3.32
V
V
IQ_LDO2 =400mA;
3.3V mode
2.500
2.750
50mA < IQ_LDO2
400mA;
<
2.6V mode
3.4.28 Output
voltage 2.6V
3.4.29 Load
Regulation
VQ_LDO2
2.62
50
V
IQ_LDO2 =400mA;
2.6V mode
∆VQ_LDO2
mV
50mA< IQ_LDO3
<400mA;
VFB/L_IN=5.5V
3.3V mode
3.4.30 Load
Regulation
∆VQ_LDO2
50
mV
50mA< IQ_LDO2
<400mA;
VFB/L_IN=5.5V
2.6V mode
3.4.31 Current limit IQ_LDO2limit 500
3.4.32 Current limit IQ_LDO2limit 500
650
650
40
850
850
mA
mA
dB
VQ_LDO2= 2.8V;
3.3V mode
VQ_LDO2= 2V;
2.6V mode
f=330kHz; 1)
3.4.33 Ripple
rejection
3.4.34 Output
Capacitor
Voltage Regulator Q_LDO3
PSRR2
26
CQ_LDO2 470
nF
Ceramic type,
value for stability
Data Sheet, Rev. 1.31
31
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
3.4.35 Output
voltage 5V
VQ_LDO3
4.8
5.2
V
20mA < IQ_LDO3
300mA;
<
5V mode
3.4.36 Output
voltage 5V
VQ_LDO3
VQ_LDO3
5.0
V
V
IQ_LDO3 =300mA;
5V mode
3.4.37 Output
voltage 3.3V
3.14
3.46
20mA < IQ_LDO3
300mA;
<
3.3V mode
3.4.38 Output
voltage 3.3V
VQ_LDO3
3.32
100
V
IQ_LDO3 =300mA;
3.3V mode
3.4.39 Load
Regulation
∆VQ_LDO3
mV
20mA< IQ_LDO3
<300mA;
VFB/L_IN=5,5V
5V mode
3.4.40 Load
Regulation
∆VQ_LDO3
50
mV
20mA< IQ_LDO3
<300mA;
VFB/L_IN=5,5V
3.3V mode
3.4.41 Current limit IQ_LDO3
350
350
26
500
500
40
600
600
mA
mA
dB
VQ_LDO3=4V;
5V mode
limit
3.4.42 Current limit IQ_LDO3
limit
VQ_LDO3=2.8V;
3.3V mode
f=330kHz; 1)
3.4.43 Ripple
rejection
3.4.44 Output
Capacitor
Voltage Tracker Q_T1
3.4.45 Output ∆VQ_T1
PSRR3
CQ_LDO3 470
nF
Ceramic type,
value for stability
-15
5
mV
mV
VQ_T1-VQ_LDO1
;
voltage
tracking
accuracy
1mA < IQ_T1
17mA
<
3.4.46 Output
voltage
∆VQ_T1
-10
32
VQ_T1-VQ_LDO1
Q_T1 = 17mA
;
I
tracking
accuracy
Data Sheet, Rev. 1.31
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter Symbol Limit Values
Unit
Test Conditions
min.
typ.
max.
3.4.47 Overvoltage VOVQ_T1
threshold
VQ_T1,
mV
mV
IQ_T1 = 0mA; 1)
nom
1)
3.4.48 Undervoltage VUVQ_T1
threshold
VQ_T1-
15mV
3.4.49 Current limit IQ_T1 limit 17
30
mA
dB
VQ_T1=4V
f=330kHz; 1)
3.4.50 Ripple
rejection
PSRR
26
3.4.51 Tracker load CQ_T1
capacitor
1
µF
Ceramic type,
minimum for
stability
Voltage Tracker Q_T2
3.4.52 Output
voltage
∆VQ_T2
-15
5
mV
mV
VQ_T2-VQ_LDO1
;
;
1mA < IQ_T2
17mA
<
tracking
accuracy
3.4.53 Output
voltage
∆VQ_T2
-10
VQ_T2-VQ_LDO2
IQ_T2 = 17mA
tracking
accuracy
3.4.54 Overvoltage VOVQ_T2
threshold
VQ_T2,
mV
mV
IQ_T2 = 0mA;1)
nom
1)
3.4.55 Undervoltage VUVQ_T2
threshold
VQ_T2-
15mV
3.4.56 Current limit IQ_T2 limit 17
30
mA
dB
VQ_T2=4V
f=330kHz; 1)
3.4.57 Ripple
rejection
PSRR
26
3.4.58 Tracker load CQ_T2
capacitor
1
µF
Ceramic type,
minimum for
stability
Voltage Tracker Q_T3
Data Sheet, Rev. 1.31
33
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
3.4.59 Output
voltage
∆VQ_T3
-15
5
mV
VQ_T3-VQ_LDO1
;
1mA < IQ_T3
17mA
<
tracking
accuracy
3.4.60 Output
voltage
∆VQ_T3
-10
mV
VQ_T3-VQ_LDO3
IQ_T3 = 17mA
;
tracking
accuracy
3.4.61 Overvoltage VOVQ_T3
threshold
VQ_T3,
mV
mV
IQ_T3 = 0mA; 1)
nom
1)
3.4.62 Undervoltage VUVQ_T3
threshold
VQ_T3-
15mV
3.4.63 Current limit IQ_T3 limit 17
30
mA
dB
VQ_T3=4V
f=330kHz; 1)
3.4.64 Ripple
rejection
PSRR
26
3.4.65 Tracker load CQ_T3
capacitor
1
µF
Ceramic type,
minimum for
stability
Voltage Tracker Q_T4
3.4.66 Output
voltage
∆VQ_T4
-15
5
mV
mV
VQ_T4-VQ_LDO1;
1mA < IQ_T4
17mA
<
tracking
accuracy
3.4.67 Output
voltage
∆VQ_T4
-10
VQ_T4-VQ_LDO4
;
I
Q_T4 = 17mA
tracking
accuracy
3.4.68 Overvoltage VOVQ_T4
threshold
VQ_T4,
mV
mV
IQ_T4 = 0mA; 1)
nom
1)
3.4.69 Undervoltage VUVQ_T4
threshold
VQ_T4-
15mV
3.4.70 Current limit IQ_T4 limit 17
3.4.71 Ripple PSSR 26
rejection
30
mA
dB
VQ_T4=4V
f=330kHz; 1)
Data Sheet, Rev. 1.31
34
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter Symbol Limit Values
Unit
Test Conditions
min.
typ.
max.
3.4.72 Tracker load CQ_T4
capacitor
1
µF
Ceramic type,
minimum for
stability
Voltage Tracker Q_T5
3.4.73 Output
voltage
∆VQ_T5
-15
5
mV
mV
VQ_T5-VQ_LDO1
;
;
1mA < IQ_T5
17mA
<
tracking
accuracy
3.4.74 Output
voltage
∆VQ_T5
-10
VQ_T5-VQ_LDO5
Q_T5 = 17mA
I
tracking
accuracy
3.4.75 Overvoltage VOVQ_T5
threshold
VQ_T5,
mV
mV
IQ_T5 = 0mA; 1)
nom
1)
3.4.76 Undervoltage VUVQ_T5
threshold
VQ_T5-
15mV
3.4.77 Current limit IQ_T5 limit 17
30
mA
dB
VQ_T5=4V
f=330kHz; 1)
3.4.78 Ripple
rejection
PSRR
26
3.4.79 Tracker load CQ_T5
capacitor
1
µF
Ceramic type,
minimum for
stability
Voltage Tracker Q_T6
3.4.80 Output
voltage
∆VQ_T6
-15
5
mV
mV
mV
VQ_T6-VQ_LDO1;
1mA < IQ_T6
17mA
<
tracking
accuracy
3.4.81 Output
voltage
∆VQ_T6
-10
VQ_T6-VQ_LDO6
Q_T6 = 17mA
;
I
tracking
accuracy
3.4.82 Overvoltage VOVQ_T6
threshold
VQ_T6,
IQ_T6 = 0mA; 1)
nom
Data Sheet, Rev. 1.31
35
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter Symbol Limit Values
Unit
Test Conditions
min.
typ.
max.
1)
3.4.83 Undervoltage VUVQ_T6
threshold
VQ_T6
15mV
-
mV
3.4.84 Current limit IQ_T6 limit 17
30
mA
dB
VQ_T6=4V
f=330kHz; 1)
3.4.85 Ripple
rejection
PSRR
26
3.4.86 Tracker load CQ_T6
capacitor
1
µF
Ceramic type,
minimum for
stability
Standby Regulator
3.4.87 Output
voltage
VQ_STB
2.2
2.4
3
2.6
6
V
0µA
<IQ_STB<500µA
3.4.88 Current limit IQ_STB limit
1
mA
nF
VQ_STB=2V
3.4.89 Standby
load
CQ_STB
100
Ceramic type,
minimum for
stability
capacitor
Off-Mode
3.4.90 Supply
current from
battery
Iq,off
10
30
30
2.8
µA
µA
V
VIN=13.5V,
Vwake=0V,
I
Q_STB=0µA
3.4.91 Supply
current from
battery
Iq,off
10
VIN=42V,
Vwake=0V
I
Q_STB=0µA
3.4.92 Turn on
Wake-up
Vwake th, on
2.4
2.35
Vwake increasing
Vwake decreasing
Vwake=5V
threshold
3.4.93 Turn off
Wake-up
Vwake th, off 1.8
V
threshold
3.4.94 Wake-up
input current
Iwake
twake,min
50
10
150
50
µA
µs
3.4.95 Wake up
input on time
4
Vwake
>
1)
Vwake th, on max
;
Reset R1
Data Sheet, Rev. 1.31
36
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
3.4.96 Reset
threshold
Q_LDO1
VRTH
4.5
4.65
4.8
V
VQ_LDO1
decreasing
Q_LDO1, de
3.4.97 Reset
threshold
Q_LDO1
VRTH
4.55
4.70
4.9
V
VQ_LDO1
increasing
Q_LDO1, in
3.4.98 Reset output VR1 L
low voltage
0.4
0.3
1
V
IR1=1.6mA;
VQ_LDO1 =5V
3.4.99 Reset output VR1 L
low voltage
V
IR1=0.3mA;
VQ_LDO1 =1V
3.4.100 Reset High
leakage
IR1 H
µA
current
Reset R2
3.4.101 Reset
threshold
Q_LDO2
VRTH
2.6
2.3
2.8
40
3.0
2.5
V
3.3V mode;
VQ_LDO2
decreasing
Q_LDO2, de
3.4.102 Reset
threshold
hysteresis
Q_LDO2
VRTH
mV
3.3V mode
-
-
Q_LDO2, in
VRTH
Q_LDO2, de
VRTH
3.4.103 Reset
threshold
Q_LDO2
2.4
40
V
2.6V mode;
VQ_LDO2
decreasing
Q_LDO2, de
3.4.104 Reset
threshold
hysteresis
Q_LDO2
VRTH
mV
2.6V mode
Q_LDO2, in
VRTH
Q_LDO2, de
3.4.105 Reset output VR2 L
low voltage
0.4
0.3
1
V
IR2=1.6mA;
VQ_LDO2 =2.5V
3.4.106 Reset output VR2 L
low voltage
V
IR2=0.3mA;
VQ_LDO2 =1V
3.4.107 Reset High
leakage
IR2 H
µA
current
Data Sheet, Rev. 1.31
37
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
Reset R3
3.4.108 Reset
threshold
Q_LDO3
VRTH
2.7
2.85
3.0
V
3.3V mode;
VQ_LDO3
decreasing
Q_LDO3, de
3.4.109 Reset
threshold
hysteresis
Q_LDO3
VRTH
40
mV
3.3V mode
-
-
Q_LDO3, in
VRTH
Q_LDO3, de
VRTH
3.4.110 Reset
threshold
Q_LDO3
4.0
4.2
40
4.5
V
5V mode;
VQ_LDO3
decreasing
Q_LDO3, de
3.4.111 Reset
threshold
hysteresis
Q_LDO3
VRTH
mV
5V mode
Q_LDO3, in
VRTH
Q_LDO3, de
3.4.112 Reset output VR3 L
low voltage
0.4
0.3
1
V
IR3=1.6mA;
VQ_LDO3 =3.3V
3.4.113 Reset output VR3 L
low voltage
V
IR3=0.3mA;
VQ_LDO3 =1V
3.4.114 Reset High
leakage
IR3 H
µA
current
1)
3.4.115 Reset
reaction time
trr
1
2
10
µs
1
Valid for R1, R2
and R3
3.4.116 Reset Delay tNORM,RES 0.75
Norm factor
1
1
1.25
1.25
3.4.117 Reset Delay tRES
time
0.75
tRES(SPI) Valid for R1, R2
and R3; tRES (SPI)
is defined by the
SPI word (see
section 2.12)
RAM Good
3.4.118 VQ1 threshold VTh Q1
2.3
2.8
38
3.3
V
Data Sheet, Rev. 1.31
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter Symbol Limit Values
Unit
Test Conditions
min.
1.2
typ.
1.4
1.4
max.
3.4.119 VQ2 threshold VTh Q2
3.4.120 VQ2 threshold VTh Q2
Window Watchdog
1.7
1.7
V
V
3.3V mode
2.6V mode; 1)
1.2
3.4.121 Closed
window time
tolerance
tCW_tol
0.75
0.75
1
1.25
1.25
Multiply with
watchdog
window time set
by SPI to obtain
the limits (2.12)
3.4.122 Open
tOW_tol
1
Multiply with
window time
tolerance
watchdog
window time set
by SPI to obtain
the limits (2.12)
3.4.123 Watchdog
reset low
tWRL
tRES
time
3.4.124 Watchdog
reset delay
time
tSR
tCW/2
Error Output ERR
3.4.125 H-output
VERR,H
VQ_LDO1 VQ_LDO1
–
V
V
IERR, H = 1 mA
voltage level
– 2.0
–
– 0.7
0.3
3.4.126 L-output
VERR,L
0.5
IERR, L = – 1.6 mA
voltage level
SPI
3.4.127 SPI clock
frequency
fCLK
0
2.5
MHz
Production test
up to 1MHz;
2.5MHz 1)
SPI Input DI
Data Sheet, Rev. 1.31
39
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
–
3.4.128 H-input
voltage
VIH
–
40
70
% of
VQ_LDO1
threshold
–
3.4.129 L-input
voltage
VIL
20
36
–
% of
VQ_LDO1
threshold
1)
3.4.130 Hysteresis of VIHY
50
5
200
25
10
–
500
100
15
mV
µA
pF
ns
input voltage
3.4.131 Pull down
II
VDI = 0.2 *
VQ_LDO1
current
3.4.132 Input
CI
–
0 V < VQ_LDO1 <
5.25 V
1)
capacitance
3.4.133 Input signal tr
–
200
200
rise time
1)
–
3.4.134 Input signal tf
–
–
ns
fall time
SPI Clock Input CLK
3.4.135 H-input
VIH
–
40
36
70
–
% of
VQ_LDO1
voltage
threshold
–
3.4.136 L-input
voltage
VIL
20
% of
VQ_LDO1
threshold
1)
3.4.137 Hysteresis of VIHY
50
5
200
25
10
–
500
100
15
mV
µA
pF
ns
input voltage
3.4.138 Pull down
II
VCLK = 0.2 *
VQ_LDO1
current
3.4.139 Input
CI
–
0 V < VQ_LDO1 <
5.25 V
1)
capacitance
3.4.140 Input signal tr
–
200
200
rise time
1)
3.4.141 Input signal tf
–
–
ns
fall time
SPI Chip Select Input CS
Data Sheet, Rev. 1.31
40
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
–
3.4.142 H-input
voltage
VIH
–
39
70
–
% of
VQ_LDO1
threshold
–
3.4.143 L-input
voltage
VIL
20
35
% of
VQ_LDO1
threshold
1)
3.4.144 Hysteresis of VIHY
50
200
500
– 5
mV
input voltage
3.4.145 Pull up
II, CS
– 100
– 25
µA
VCS = 0.2 *
VQ_LDO1
current at pin
CS
3.4.146 Input
CI
–
–
–
10
–
15
pF
ns
ns
0 V < VQ_LDO1 <
5.25 V
1)
capacitance
3.4.147 Input signal tr
200
200
rise time
1)
3.4.148 Input signal tf
–
fall time
Logic Output DO
3.4.149 H-output
voltage level
3.4.150 L-output
voltage level
VDOH
VQ_LDO1 VQ_LDO1
–
V
IDOH = 1 mA
– 1.0
–
– 0.8
0.2
VDOL
0.4
10
V
IDOL = – 1.6 mA
3.4.151 Tri-state
leakage
IDO_TRI
– 10
–
µA
VCS = VQ_LDO1;
0 V < VDO
VQ_LDO1
<
current
3.4.152 Tri-state
CDO
–
10
15
pF
ns
VCS = VQ_LDO1
input
0 V < VQ_LDO1
5.25 V
<
capacitance
Data Input Timing
1)
3.4.153 Clock period tpCLK
1000
–
–
Data Sheet, Rev. 1.31
41
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
1)
3.4.154 Clock high
tCLKH
tCLKL
tbef
500
–
–
–
–
ns
ns
ns
time
1)
1)
3.4.155 Clock low
time
500
500
–
–
3.4.156 Clock low
before CS
low
1)
1)
1)
3.4.157 CS setup
time
tlead
tlag
500
500
500
–
–
–
–
–
–
ns
ns
ns
3.4.158 CLK setup
time
3.4.159 Clock low
after CS high
tbeh
1)
1)
3.4.160 DI setup time tDISU
3.4.161 DI hold time tDIHO
250
250
–
–
–
–
ns
ns
Data Output Timing
CL = 100 pF
CL = 100 pF
low impedance
3.4.162 DO rise time trDO
3.4.163 DO fall time tfDO
–
–
–
50
50
–
100
100
250
ns
ns
ns
3.4.164 DO enable
time
tENDO
high impedance
3.4.165 DO disable
time
tDISDO
–
–
–
250
250
ns
ns
VDO < 10%
VDO > 90%
CL = 100 pF
3.4.166 DO valid time tVADO
100
General
2)
3.4.167 Temperature TJ,Flag
warning flag
140
170
°C
°C
3.4.168 Over
Temperature
TJ,Shutdown 150
200
shutdown
Data Sheet, Rev. 1.31
42
2004-10-12
TLE 6361 G
-40 < Tj <150 °C; VIN=13.5V unless otherwise specified
Item Parameter
Symbol
Limit Values
Unit
Test Conditions
min.
typ.
max.
3.4.169 Over-
Temperature
shutdown
∆Tsd_hys
30
K
Hysteresis
3.4.170 DeltaTW to
TSD
TJ,Shutdown
- TJ,Flag
20
K
1)
Specified by design, not subject to production test
2)
Simulated at wafer test only, not absolutely measured
4
Typical performance charcteristics
Buck converter switching frequency
vs. junction temperature
420
fSW
kHz
400
380
360
340
320
300
280
-50
-20
10
40
70
100 130 160
Tj
°C
Data Sheet, Rev. 1.31
43
2004-10-12
TLE 6361 G
Buck converter output voltage at 1.5A load Buck converter current limit
vs. junction temperature
vs. junction temperature
6.0
4.0
VFB/L_IN
IMAX
V
A
5.9
3.5
5.8
5.7
5.6
5.5
5.4
5.3
3.0
2.5
2.0
1.5
1.0
0.5
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Buck converter DMOS on-resistance
vs. junction temperature
Start-up bootstrap charging current
vs. junction temperature
280
400
IBTSTR
RON
µA
mΩ
240
350
300
250
200
150
100
50
200
160
120
80
40
0
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Data Sheet, Rev. 1.31
44
2004-10-12
TLE 6361 G
Bootstrap UV lockout, turn on threshold
vs. junction temperature
Q_LDO1 output voltage at 800mA load
vs. junction temperature
VBTSTR,
turn on
8.5
8.0
7.5
7.0
6.5
6.0
5.5
5.0
5.20
VQ_LDO1
V
V
5.15
5.10
5.05
5.00
4.95
4.90
4.85
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Device wake up thresholds
vs. junction temperature
Reset1 threshold at drecreasing V_LDO1
vs. junction temperature
2.8
VRTH
4.80
Vwake th
Q_LDO1, de
V
V
2.7
4.75
2.6
2.5
4.70
4.65
4.60
4.55
4.50
4.45
Vwake th, on
2.4
2.3
Vwake th, off
2.2
2.1
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Data Sheet, Rev. 1.31
45
2004-10-12
TLE 6361 G
Q_LDO1 current limit
Q_LDO2 current limit (2.6V mode)
vs. junction temperature
vs. junction temperature
1400
850
IQ_LDO1
IQ_LDO2
V
V
1300
800
1200
1100
1000
900
750
700
650
600
550
500
800
700
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Q_LDO2 output voltage at 400mA load
(2.6V mode) vs. junction temperature
Q_LDO3 output voltage at 300mA load
(3.3V mode) vs. junction temperature
2.80
3.50
VQ_LDO2
VQ_LDO3
V
V
2.75
3.45
2.70
2.65
2.60
2.55
2.50
2.45
3.40
3.35
3.30
3.25
3.20
3.15
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Data Sheet, Rev. 1.31
46
2004-10-12
TLE 6361 G
Reset2 threshold at decreasing V_LDO2
(2.6V mode) vs. junction temperature
Reset3 threshold at decreasing V_LDO3
(3.3V mode) vs. junction temperature
VRTH
VRTH
2.60
3.00
Q_LDO2, de
Q_LDO3, de
V
V
2.55
2.95
2.50
2.45
2.40
2.35
2.30
2.25
2.90
2.85
2.80
2.75
2.70
2.65
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Q_LDO3 current limit (3.3V mode)
vs. junction temperature
Tracker current limit
vs. junction temperature
32
600
IQ_Tx
IQ_LDO3
mA
30
V
550
28
26
24
22
20
18
500
450
400
350
300
250
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Data Sheet, Rev. 1.31
47
2004-10-12
TLE 6361 G
Tracker accuracy with respect to V_LDO1 Q_STB current limit
vs. junction temperature
vs. junction temperature
4
4.0
dVQ_Tx
IQ_STB
mV
2
mA
3.5
0
-2
3.0
2.5
2.0
1.5
1.0
0.5
-4
-6
-8
-10
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Q_STB output voltage at 500µA load
vs. junction temperature
Device current consumption in off mode
vs. junction temperature
2.8
35
VQ_STB
Iq, off
V
µA
30
2.7
2.6
2.5
2.4
2.3
2.2
2.1
25
20
15
10
5
0
-50
-20
10
40
70
100 130 160
-50
-20
10
40
70
100 130 160
Tj
Tj
°C
°C
Data Sheet, Rev. 1.31
48
2004-10-12
TLE 6361 G
5
Application Information
Application Diagram
5.1
RBoost
22 Ω
TLE 6361
DBOOST
Standby
Q_STB
Regulator
2.5 V
CSTB
100 nF
CBOOST
LI
BOOST
Buck
100 nF
LB
Up to
47 µH
SW 2*
Output
2* IN
47 µH
C
Battery
CBTSTR
CI3
+
DB
>B10 µF
Buck
CI1
100 nF
+
CI2
47 µF
680 nF
3 A,
Regulator
10 to
ceramic or
60 V
100 nF
SLEW
BOOTSTRAP
> 20 µF
low ESR
tantalum
Driver
PWM
RSlew
0 to
20 kΩ
Error-
Amplifier
Internal
Reference
Feedback
OSZ
To
FB/L_IN 2*
IGN
C+
CFLY
Protection
10 kΩ
100 nF
C-
Charge
Pump
Q_LDO1
Power
Down
Logic
CCP
WAKE
CCCP
220 nF
10 kΩ
10 kΩ
10 kΩ
SEL
R1
R2
R3
Q_LDO1
Lin. Reg.
5 V
CLDO1,1
CLDO1,2
+
+
470 nF
4.7 µF
To
Reset
Logic
Q_LDO2
Q_LDO3
Lin. Reg.
3.3/2.6 V
µ-Controller/
µC
CLDO2,1
CLDO2,2
Memory
Supply
470 nF
4.7 µF
Lin. Reg.
5/3.3 V
CLDO3,1
470 nF
CLDO3,2
4.7 µF
+
Ref
Ref
Ref
Ref
Ref
Ref
Q_T1
Q_T2
Q_T3
Q_T4
Q_T5
Q_T6
Tracker
5 V
Window
CT1
Watchdog
1 µF
Tracker
5 V
CT2
1 µF
10 kΩ
CLK
CS
DI
Tracker
5 V
CT3
1 µF
Sensor
10 kΩ
10 kΩ
1 kΩ
Supplies
(off board
supplies)
Tracker
5 V
CT4
SPI
1 µF
16 Bit
To
Tracker
5 V
µC
CT5
1 µF
DO
Tracker
5 V
CT6
1 µF
ERR
GND
4*
AEA03380_6361ZR.VSD
Figure 14 Application Diagram
Data Sheet, Rev. 1.31
49
2004-10-12
TLE 6361 G
5.2
Buck converter circuit
A typical choice of external components for the buck converter is given in figure 14. For
basic operation of the buck converter the input capacitor CI2, the bootstrap capacitor
CBTP, the catch diode DB, the induuctance LB, the output capacitor CB and the charge
pump capacitors CFLY and CCCP are necessary.
The additional components shown on top of the circuit lower the electromagnetic
emission (LI, CI1, CI3, RSlew) and the switching losses (RBoost, CBoost, DBoost). For 12V
battery systems the switching loss minimization feature might not be used. In that case
the Boost pin (33) is connected directly to the IN pins (32, 30) and the components
R
Boost, CBoost and DBoost are left away
5.2.1 Buck inductance (LB) selection:
The inductance value determines together with the input voltage, the output voltage and
the switching frequency the current ripple which occurs during normal operation of the
step down converter. This current ripple is important for the all over ripple at the output
of the switching converter.
As a rule of thumb this current ripple ∆I is chosen between 10% and 50% of the load
current.
(VI – VOUT) VOUT
L = --------------------------------------------------
fSW VI ∆I
For optimum operation of the control loop of the Buck converter the inductance value
should be in the range indicated in section 3.3, recommended operation range.
When picking finally the inductance of a certain supplier (Epcos, Coilcraft etc.) the
saturation current has to be considered. With a maximum current limit of the Buck
converter of 3.2A an inductance with a minimum saturation current of 3.2A has to be
chosen.
Data Sheet, Rev. 1.31
50
2004-10-12
TLE 6361 G
5.2.2
Buck output capacitor (CB) selection:
The choice of the output capacitor effects straight to the minimum achievable ripple
which is seen at the output of the buck converter. In continuous conduction mode the
ripple of the output voltage equals:
1
VRipple = ∆I
R
ESRCB + ----------------------------
8 fSW CB
From the formula it is recognized that the ESR has a big influence in the total ripple at
the output, so ceramic types or low ESR tantalum capacitors are recommended for the
application.
One other important thing to note are the requirements for the resonant frequency of the
output LC-combination. The choice of the components L and C have to meet also the
specified range given in section 3.3 otherwise instabilities of the regulation loop might
occur.
5.2.3
Input capacitor (CI2) selection:
At high load currents, where the current through the inductance flows continuously, the
input capacitor is exposed to a square wave current with its duty cycle VOUT/VI. To
prevent a high ripple to the battery line a capacitor with low ESR should be used. The
maximum RMS current which the capacitor has to withstand is calculated to:
2
VOUT
IRMS = ILOAD -------------- 1 +
VIN
1
3
∆I
2 ILOAD
-- -----------------------
5.2.4
Freewheeling diode / catch diode (DB)
For lowest power loss in the freewheeling path Schottky diodes are recommended. With
those types the reverse recovery charge is negligible and a fast handover from
freewheeling to forward conduction mode is possible. Depending on the application (12V
battery systems) 40V types could be also used instead of the 60V diodes.
A fast recovery diode with recovery times in the range of 30ns can be also used if smaller
junction capacitance values (smaller spikes) are desired, the slew resistor should be set
in this case between 10 and 20kΩ.
Data Sheet, Rev. 1.31
51
2004-10-12
TLE 6361 G
5.2.5
Bootstrap capacitor (CBTP)
The voltage at the Bootstrap capacitor does not exceed 15V, a ceramic type with a
minimum of 2% of the buck output capacitance and voltage class 16V would be
sufficient.
5.2.6
External charge pump capacitors (CFLY, CCCP)
Out of the feedback voltage the charge pump generates a voltage between 8 and 10V.
The fly capacitor connected between C+ and C- is charged with the feedback voltage
level and discharged to achieve the (almost) double voltage level at CCP. CFLY is chosen
to 100nF and CCCP to 220nF, both ceramic types.
The connection of CCP to a voltage source of e.g. 7V (take care of the maximum
ratings!) via a diode improves the start-up behavior at very low battery voltage. The diode
with the cathode on CCP has to be used in order to avoid any influence of the voltage
source to the device’s operation and vice versa.
5.2.7
Input filter components for reduced EME (CI1, CI2, CI3, LI, RSlew)
At the input of Buck converters a square wave current is observed causing
electromagnetical interference on the battery line. The emission to the battery line
consists on one hand of components of the switching frequency (fundamental wave) and
its harmonics and on the other hand of the high frequency components derived from the
current slope. For proper attenuation of those interferers a π-type input filter structure is
recommended which is built up with inductive (LI) and capacitive components (CI1, CI2,
CI3). The inductance can be chosen up to the value of the Buck converter inductance,
higher values might not be necessary, CI1 and CI3 should be ceramic types and for CI2 an
input capacitance with very low ESR should be chosen and placed as close to the input
of the Buck converter as possible.
Inexpensive input filters show due to their parasitrics a notch filter characteristic, which
means basically that the lowpass filter acts from a certain frequency as a highpass filter
and means further that the high frequency components are not attenuated properly. For
that reason the TLE 6361 G offers the possibility of current slope adjustment. The current
transistion time can be set by the external slew resistor to times between 20ns and 80ns
by varying the resistor value bewteen 0Ω (fastest transition) and 20kΩ (slowest
transistion).
5.2.8
Feedback circuit for minimum switching loss (RBoost, CBoost, DBoost)
To decrease the switching losses to a mininum the external components RBoost, CBoost
and DBoost are needed. The current through the feedback resistor RBoost is about a few
mA where the Diode DBoost and the capacitor CBoost run a part of the load current.
If this feature is not needed the three components are not needed and the Boost pin (33)
can be connected directly to the IN pins(32, 30).
Data Sheet, Rev. 1.31
52
2004-10-12
TLE 6361 G
5.3
Reverse polarity protection
The Buck converter is due to the parasitic source drain diode of the DMOS not reverse
polarity protected. Therefore, as an example, the reverse polarity diode is shown in the
application circuit, in general the reverse polarity protection can be done in different
ways.
5.4
Linear voltage regulators (CLDO1, 2, 3)
As indicated before the linear regulators show stable operation with a minimum of 470nF
ceramic capacitors. To avoid a high ripple at the output due to load steps this output cap
might have to be increased to some few µF capacitors.
5.5
Linear voltage trackers (CT1,2,3,4,5,6)
The voltage trackers require at their outputs 1µF ceramic capacitors each to avoid some
oscillation at the output. If needed the tracker outputs can be connected in parallel, in
that the output capacitor increases linear according to the number of parallel outputs.
5.6
Reset outputs (R1,2,3)
The undervoltage/watchdog reset outputs are open drain structures and require external
pull up resistors in the range of 10kΩ to the µC I/O voltage rail.
Data Sheet, Rev. 1.31
53
2004-10-12
TLE 6361 G
5.7
Components recommendation - overview
Device Type
Supplier
EPCOS
EPCOS
Coilcraft
Coilcraft
Coilcraft
TDK
Remark
LI
B82479 series
10-1000µH; 4.3-0.56A
1-1000µH; 6.8-0.3A
10-1000µH; 8.0-0.8A
1-1000µH; 20.0-1.0A
10-1000µH; 8.0-0.8A
33µH, 3.2A
B82464-A4 series
DO3340P series
DO5022P series
DS5022P series
SLF1275T-330M3R2
Ceramic
CI1
various
various
various
various
EPCOS
EPCOS
Coilcraft
Coilcraft
Coilcraft
various
Motorola
Motorola
various
EPCOS
100nF, 60V
CI2
Low ESR tantalum
Ceramic
47µF, 60V
CI3
10nF to 100nF, 60V
DBoost
LB
S3B
B82479 series
B82464-A4 series
DO3340P series
DO5022P series
DS5022P series
Ceramic
10-1000µH; 4.3-0.56A
1-1000µH; 6.8-0.3A
10-1000µH; 8.0-0.8A
1-1000µH; 20.0-1.0A
10-1000µH; 8.0-0.8A
100nF, 10V
CBTP
DB
MBRD360
Schottky, 60V, 3A
Schottky, 40V, 3A
Schottky, 40V, 3A
MBRD340
SS34
CB
B45197-A2226
Low ESR Tantalum, 22µF, 10V,
C-case
2 * LMK316BJ475ML
C3216X7R1C106M
TPSC476K010R350
Taiyo Yuden
TDK
Ceramic X7R, 4.7µF, 10V
Ceramic X7R, 10µF, 16V
AVX
Low ESR Tantalum, 47µF, 10V,
C-case
CLDOx
CTx
Ceramic
Ceramic
various
various
470nF, 10V
1µF, 60V
Data Sheet, Rev. 1.31
54
2004-10-12
TLE 6361 G
5.8
Layout recommendation
The most sensitive points for Buck converters - when considering the layout - are the
nodes at the input and the output of the Buck switch, the DMOS transistor.
For proper operation the external catch diode and Buck inductance have to be
connected as close as possible to the SW pins (29, 31). Best suitable for the connection
of the cathode of the Schottky diode and one terminal of the inductance would be a small
plain located next to the SW pins.
The GND connection of the catch diode must be also as short as possible. In general the
GND level should be implemented as surface area over the whole PCB as second layer,
if necessary as third layer.
The pin FB/L_IN is sensitive to noise. With an appropriate layout the Buck output
capacitor helps to avoid noise coupling to this pin. Also filtering of steep edges at the
supply voltage pin e.g. as shown in the application diagram is mandatory. CI2 may either
be a low ESR Tantalum capacitor or a ceramic capacitor. A minimum capacitance of
10µF is recommended for CI2.
To obtain the optimum filter capability of the input π-filter it has to be located also as
close as possible to the IN pins, at least the ceramic capacitor CI3 should be next to those
pins.
Data Sheet, Rev. 1.31
55
2004-10-12
TLE 6361 G
Package Outlines
P-DSO-36-12
SMD = Surface Mounted Device
Dimensions in mm
1)
±0.15
11
B
2.8
±0.1
1.1
±0.1
15.74
6.3
(Heatslug)
Heatslug
0.65
0.1 C
(Mold)
±0.15
0.95
36x
0.25 A B C
0.25 +0.13
M
±0.3
14.2
0.25 B
Bottom View
36
19
19
36
Index Marking
Heatslug
1
18
1
10
13.7 -0.2
(Metal)
1 x 45˚
1)
±0.1
15.9
A
(Mold)
1) Does not include plastic or metal protrusion of 0.15 max. per side
see also: http://www.infineon.com -> Products -> Packages
Data Sheet, Rev. 1.31
56
2004-10-12
TLE 6361 G
Published by Infineon Technologies AG ,
Bereichs Kommunikation, St.-Martin-Strasse 53
D-81541 München
© Infineon Technologies AG 2003
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted char-
acteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologiesis an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest In-
fineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address
list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the fail-
ure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life sup-
port devices or systems are intended to be implanted in the human body, or to support and/or maintain and sus-
tain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons
may be endangered.
Data Sheet, Rev. 1.31
57
2004-10-12
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