Q67040S4726 [INFINEON]
Low Loss IGBT in Trench and Fieldstop technology; 低损耗IGBT的沟槽场终止和技术型号: | Q67040S4726 |
厂家: | Infineon |
描述: | Low Loss IGBT in Trench and Fieldstop technology |
文件: | 总12页 (文件大小:371K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IGW75N60T
q
TrenchStop Series
Low Loss IGBT in Trench and Fieldstop technology
C
•
•
•
•
Very low VCE(sat) 1.5 V (typ.)
Maximum Junction Temperature 175 °C
Short circuit withstand time – 5µs
Designed for :
G
E
- Frequency Converters
- Uninterrupted Power Supply
•
Trench and Fieldstop technology for 600 V applications offers :
- very tight parameter distribution
- high ruggedness, temperature stable behavior
- very high switching speed
P-TO-247-3-1
(TO-220AC)
- low VCE(sat)
•
•
•
•
Positive temperature coefficient in VCE(sat)
Low EMI
Low Gate Charge
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/
Type
VCE
IC
VCE(sat),Tj=25°C
Tj,max
Marking Code Package
Ordering Code
Q67040S4726
IGW75N60T
600V
75A
1.5V
G75T60
TO-247
175°C
Maximum Ratings
Parameter
Symbol
Value
Unit
Collector-emitter voltage
DC collector current, limited by Tjmax
TC = 25°C
VCE
IC
600
V
A
150
75
TC = 100°C
Pulsed collector current, tp limited by Tjmax
ICpuls
-
VGE
tSC
225
225
±20
5
Turn off safe operating area (VCE ≤ 600V, Tj ≤ 175°C)
Gate-emitter voltage
V
Short circuit withstand time1)
µs
V
GE = 15V, VCC ≤ 400V, Tj ≤ 150°C
Ptot
Tj
Tstg
-
428
W
Power dissipation TC = 25°C
Operating junction temperature
Storage temperature
Soldering temperature, 1.6mm (0.063 in.) from case for 10s
-40...+175
-55...+175
260
°C
1) Allowed number of short circuits: <1000; time between short circuits: >1s.
1
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
Thermal Resistance
Parameter
Symbol
Conditions
TO-247
Max. Value
Unit
Characteristic
IGBT thermal resistance,
junction – case
Thermal resistance,
junction – ambient
RthJC
RthJA
0.35
40
K/W
TO-247 AC
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified
Value
Typ.
Parameter
Symbol
Conditions
Unit
min.
max.
Static Characteristic
Collector-emitter breakdown voltage V(BR)C ES
V
GE=0V, IC=0.2mA
600
-
-
V
Collector-emitter saturation voltage
VC E(sa t) VGE = 15V, IC=75A
Tj=25°C
-
-
1.5
1.9
2.0
-
Tj=175°C
Gate-emitter threshold voltage
Zero gate voltage collector current
VGE(th )
IC ES
IC=1.2mA,VCE=VGE
4.1
4.9
5.7
V
C E=600V,
µA
V
GE=0V
Tj=25°C
Tj=175°C
-
-
-
-
-
-
-
41
-
40
1000
100
-
Gate-emitter leakage current
Transconductance
IGES
gfs
V
V
C E=0V,VGE=20V
C E=20V, IC=75A
nA
S
Integrated gate resistor
RGint
Ω
Dynamic Characteristic
Input capacitance
Output capacitance
Reverse transfer capacitance
Gate charge
Ciss
Coss
Crss
V
V
C E=25V,
GE=0V,
-
-
-
-
-
-
-
-
pF
4620
288
137
470
f=1MHz
V
V
QGa te
CC=480V, IC=75A
GE=15V
nC
nH
A
Internal emitter inductance
LE
TO-247-3-1
-
-
7
-
-
measured 5mm (0.197 in.) from case
Short circuit collector current1)
IC (SC)
687.5
V
GE=15V,tSC ≤5µs
VCC = 400V,
Tj ≤ 150°C
1) Allowed number of short circuits: <1000; time between short circuits: >1s.
2
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
Switching Characteristic, Inductive Load, at Tj=25 °C
Value
Unit
Parameter
Symbol
Conditions
min.
Typ.
max.
IGBT Characteristic
Turn-on delay time
Rise time
td (on)
tr
td (off)
tf
Eon
Eo ff
Ets
-
-
-
-
-
-
-
33
36
330
35
2.0
2.5
4.5
-
-
-
-
-
-
-
ns
Tj=25°C,
V
V
CC=400V,IC=75A,
GE=0/15V,
Turn-off delay time
Fall time
RG=5Ω,
Lσ 2)=100nH,
Cσ 2)=39pF
Turn-on energy1)
Turn-off energy
Total switching energy
mJ
Energy losses include
“tail” and diode
reverse recovery.
Switching Characteristic, Inductive Load, at Tj=175 °C
Value
Typ.
Parameter
Symbol
Conditions
Unit
min.
max.
IGBT Characteristic
Turn-on delay time
Rise time
td (on)
tr
td (off)
tf
Eon
Eo ff
Ets
-
-
-
-
-
-
-
32
37
363
38
2.9
2.9
5.8
-
-
-
-
-
-
-
ns
Tj=175°C,
V
V
CC=400V,IC=75A,
GE=0/15V,
Turn-off delay time
Fall time
RG= 5Ω
Lσ 2)=100nH,
Cσ 2)=39pF
Turn-on energy1)
Turn-off energy
Total switching energy
mJ
Energy losses include
“tail” and diode
reverse recovery.
1) Includes Reverse Recovery Losses from IKW75N60T due to dynamic test circuit in Figure E.
2) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.
3
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
tp=1µs
200A
50A
00A
50A
0A
100A
10A
10µs
50µs
TC=80°C
TC=110°C
1ms
Ic
10ms
DC
1A
1V
Ic
10V
100V
1000V
10Hz
100Hz
1kHz
10kHz 100kHz
f, SWITCHING FREQUENCY
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 1. Collector current as a function of
Figure 2. Safe operating area
switching frequency
(D = 0, TC = 25°C, Tj ≤175°C;
(Tj ≤ 175°C, D = 0.5, VCE = 400V,
VGE=15V)
V
GE = 0/+15V, RG = 5Ω)
400W
350W
300W
250W
200W
150W
100W
50W
120A
90A
60A
30A
0A
0W
25°C
75°C
125°C
25°C
50°C
75°C 100°C 125°C 150°C
TC, CASE TEMPERATURE
TC, CASE TEMPERATURE
Figure 3. Power dissipation as a function of
case temperature
Figure 4. DC Collector current as a function
of case temperature
(Tj ≤ 175°C)
(VGE ≥ 15V, Tj ≤ 175°C)
4
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
120A
90A
60A
30A
0A
120A
V
GE=20V
15V
V
GE=20V
15V
90A
60A
30A
0A
13V
11V
9V
13V
11V
9V
7V
7V
0V
1V
2V
3V
0V
1V
2V
3V
VCE, COLLECTOR-EMITTER VOLTAGE
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 5. Typical output characteristic
Figure 6. Typical output characteristic
(Tj = 25°C)
(Tj = 175°C)
2.5V
2.0V
1.5V
1.0V
0.5V
0.0V
IC=150A
80A
60A
IC=75A
40A
IC=37.5A
TJ=175°C
20A
25°C
0A
0°C
50°C
100°C
150°C
0V
2V
4V
6V
8V
V
GE, GATE-EMITTER VOLTAGE
Figure 7. Typical transfer characteristic
TJ, JUNCTION TEMPERATURE
Figure 8. Typical collector-emitter
(VCE=20V)
saturation voltage as a function of
junction temperature
(VGE = 15V)
5
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
td(off)
td(off)
100ns
100ns
tf
tf
tr
td(on)
td(on)
tr
40A
IC, COLLECTOR CURRENT
10ns
10ns
0A
80A
120A
5Ω
10Ω
15Ω
RG, GATE RESISTOR
Figure 9. Typical switching times as a
function of collector current
(inductive load, TJ=175°C,
Figure 10. Typical switching times as a
function of gate resistor
(inductive load, TJ = 175°C,
V
CE = 400V, VGE = 0/15V, RG = 5ꢀ,
VCE= 400V, VGE = 0/15V, IC = 75A,
Dynamic test circuit in Figure E)
Dynamic test circuit in Figure E)
7V
6V
5V
4V
3V
2V
1V
0V
td(off)
max.
typ.
min.
100ns
tf
tr
td(on)
25°C
50°C
75°C 100°C 125°C 150°C
-50°C
0°C
50°C
100°C
150°C
TJ, JUNCTION TEMPERATURE
TJ, JUNCTION TEMPERATURE
Figure 11. Typical switching times as a
function of junction temperature
(inductive load, VCE = 400V,
Figure 12. Gate-emitter threshold voltage as
a function of junction temperature
(IC = 1.2mA)
V
GE = 0/15V, IC = 75A, RG=5ꢀ,
Dynamic test circuit in Figure E)
6
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
*) Eon and Ets include losses
due to diode recovery
*) Eon and Ets include losses
Ets*
due to diode recovery
Ets*
8.0mJ
6.0mJ
4.0mJ
2.0mJ
0.0mJ
12.0mJ
8.0mJ
4.0mJ
0.0mJ
Eon*
Eon
*
Eoff
Eoff
0A 20A 40A 60A 80A 100A 120A 140A
0Ω
5Ω
10Ω
15Ω
IC, COLLECTOR CURRENT
RG, GATE RESISTOR
Figure 13. Typical switching energy losses
as a function of collector current
(inductive load, TJ = 175°C,
Figure 14. Typical switching energy losses
as a function of gate resistor
(inductive load, TJ = 175°C,
V
CE = 400V, VGE = 0/15V, RG = 5ꢀ,
VCE = 400V, VGE = 0/15V, IC = 75A,
Dynamic test circuit in Figure E)
Dynamic test circuit in Figure E)
*) Eon and Ets include losses
due to diode recovery
*) Eon and Ets include losses
Ets*
due to diode recovery
5.0mJ
4.0mJ
3.0mJ
2.0mJ
1.0mJ
0.0mJ
8mJ
6mJ
4mJ
2mJ
0mJ
Eon
*
Ets*
Eoff
Eoff
Eon*
25°C 50°C
75°C 100°C 125°C 150°C
300V 350V 400V 450V 500V 550V
TJ, JUNCTION TEMPERATURE
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 15. Typical switching energy losses
as a function of junction
temperature
Figure 16. Typical switching energy losses
as a function of collector emitter
voltage
(inductive load, VCE = 400V,
(inductive load, TJ = 175°C,
V
GE = 0/15V, IC = 75A, RG = 5ꢀ,
VGE = 0/15V, IC = 75A, RG = 5ꢀ,
Dynamic test circuit in Figure E)
Dynamic test circuit in Figure E)
7
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
Ciss
15V
10V
5V
1nF
120V
480V
Coss
Crss
100pF
0V
0V
10V
20V
0nC
100nC 200nC 300nC 400nC
GE, GATE CHARGE
Q
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 17. Typical gate charge
Figure 18. Typical capacitance as a function
(IC=75 A)
of collector-emitter voltage
(VGE=0V, f = 1 MHz)
12µs
10µs
8µs
1000A
750A
500A
250A
0A
6µs
4µs
2µs
0µs
10V
11V
12V
13V
14V
12V
14V
16V
18V
V
GE, GATE-EMITTETR VOLTAGE
VGE, GATE-EMITETR VOLTAGE
Figure 19. Typical short circuit collector
current as a function of gate-
emitter voltage
Figure 20. Short circuit withstand time as a
function of gate-emitter voltage
(VCE=600V, start at TJ=25°C,
T
Jmax<150°C)
(VCE ≤ 400V, Tj ≤ 150°C)
8
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
D=0.5
10-1K/W
10-2K/W
10-3K/W
0.2
0.1
R , ( K / W )
0.1968
τ , ( s )
0.115504
0.009340
0.000823
0.000119
R2
0.05
0.0733
0.0509
0.02
0.01
0.0290
R1
C1=τ1/R1 C2=τ2/R2
single pulse
1µs 10µs 100µs 1ms 10ms 100ms
tP, PULSE WIDTH
Figure 21. IGBT transient thermal resistance
(D = tp / T)
9
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
dimensions
TO-247AC
symbol
[mm]
[inch]
min
4.78
2.29
1.78
1.09
1.73
2.67
max
5.28
2.51
2.29
1.32
2.06
3.18
min
max
A
B
C
D
E
F
0.1882 0.2079
0.0902 0.0988
0.0701 0.0902
0.0429 0.0520
0.0681 0.0811
0.1051 0.1252
0.0299 max
G
H
K
L
0.76 max
20.80
21.16
16.15
5.72
0.8189 0.8331
0.6161 0.6358
0.2051 0.2252
0.7799 0.8142
0.1402 0.1941
0.1421
15.65
5.21
M
N
19.81
3.560
20.68
4.930
3.61
P
Q
6.12
6.22
0.2409 0.2449
10
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
i,v
tr r =tS +tF
diF /dt
Qr r =QS +QF
tr r
IF
tS
tF
t
QS
10% Ir r m
QF
Ir r m
dir r /dt
VR
90% Ir r m
Figure C. Definition of diodes
switching characteristics
τ1
τ2
r 2
τn
r1
r n
T (t)
j
p(t)
r 2
r1
rn
Figure A. Definition of switching times
T
C
Figure D. Thermal equivalent
circuit
Figure E. Dynamic test circuit
Figure B. Definition of switching losses
11
Rev. 2.1 Dec-04
Power Semiconductors
IGW75N60T
q
TrenchStop Series
Published by
Infineon Technologies AG,
Bereich Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 2004
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).
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Due to technical requirements components may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies Office.
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that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or
systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
12
Rev. 2.1 Dec-04
Power Semiconductors
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