Q67040S4726 [INFINEON]

Low Loss IGBT in Trench and Fieldstop technology; 低损耗IGBT的沟槽场终止和技术
Q67040S4726
型号: Q67040S4726
厂家: Infineon    Infineon
描述:

Low Loss IGBT in Trench and Fieldstop technology
低损耗IGBT的沟槽场终止和技术

双极性晶体管
文件: 总12页 (文件大小:371K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IGW75N60T  
q
TrenchStop Series  
Low Loss IGBT in Trench and Fieldstop technology  
C
Very low VCE(sat) 1.5 V (typ.)  
Maximum Junction Temperature 175 °C  
Short circuit withstand time – 5µs  
Designed for :  
G
E
- Frequency Converters  
- Uninterrupted Power Supply  
Trench and Fieldstop technology for 600 V applications offers :  
- very tight parameter distribution  
- high ruggedness, temperature stable behavior  
- very high switching speed  
P-TO-247-3-1  
(TO-220AC)  
- low VCE(sat)  
Positive temperature coefficient in VCE(sat)  
Low EMI  
Low Gate Charge  
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/  
Type  
VCE  
IC  
VCE(sat),Tj=25°C  
Tj,max  
Marking Code Package  
Ordering Code  
Q67040S4726  
IGW75N60T  
600V  
75A  
1.5V  
G75T60  
TO-247  
175°C  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Collector-emitter voltage  
DC collector current, limited by Tjmax  
TC = 25°C  
VCE  
IC  
600  
V
A
150  
75  
TC = 100°C  
Pulsed collector current, tp limited by Tjmax  
ICpuls  
-
VGE  
tSC  
225  
225  
±20  
5
Turn off safe operating area (VCE 600V, Tj 175°C)  
Gate-emitter voltage  
V
Short circuit withstand time1)  
µs  
V
GE = 15V, VCC 400V, Tj 150°C  
Ptot  
Tj  
Tstg  
-
428  
W
Power dissipation TC = 25°C  
Operating junction temperature  
Storage temperature  
Soldering temperature, 1.6mm (0.063 in.) from case for 10s  
-40...+175  
-55...+175  
260  
°C  
1) Allowed number of short circuits: <1000; time between short circuits: >1s.  
1
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
Thermal Resistance  
Parameter  
Symbol  
Conditions  
TO-247  
Max. Value  
Unit  
Characteristic  
IGBT thermal resistance,  
junction – case  
Thermal resistance,  
junction – ambient  
RthJC  
RthJA  
0.35  
40  
K/W  
TO-247 AC  
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified  
Value  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Static Characteristic  
Collector-emitter breakdown voltage V(BR)C ES  
V
GE=0V, IC=0.2mA  
600  
-
-
V
Collector-emitter saturation voltage  
VC E(sa t) VGE = 15V, IC=75A  
Tj=25°C  
-
-
1.5  
1.9  
2.0  
-
Tj=175°C  
Gate-emitter threshold voltage  
Zero gate voltage collector current  
VGE(th )  
IC ES  
IC=1.2mA,VCE=VGE  
4.1  
4.9  
5.7  
V
C E=600V,  
µA  
V
GE=0V  
Tj=25°C  
Tj=175°C  
-
-
-
-
-
-
-
41  
-
40  
1000  
100  
-
Gate-emitter leakage current  
Transconductance  
IGES  
gfs  
V
V
C E=0V,VGE=20V  
C E=20V, IC=75A  
nA  
S
Integrated gate resistor  
RGint  
Dynamic Characteristic  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Gate charge  
Ciss  
Coss  
Crss  
V
V
C E=25V,  
GE=0V,  
-
-
-
-
-
-
-
-
pF  
4620  
288  
137  
470  
f=1MHz  
V
V
QGa te  
CC=480V, IC=75A  
GE=15V  
nC  
nH  
A
Internal emitter inductance  
LE  
TO-247-3-1  
-
-
7
-
-
measured 5mm (0.197 in.) from case  
Short circuit collector current1)  
IC (SC)  
687.5  
V
GE=15V,tSC 5µs  
VCC = 400V,  
Tj 150°C  
1) Allowed number of short circuits: <1000; time between short circuits: >1s.  
2
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
Switching Characteristic, Inductive Load, at Tj=25 °C  
Value  
Unit  
Parameter  
Symbol  
Conditions  
min.  
Typ.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
td (on)  
tr  
td (off)  
tf  
Eon  
Eo ff  
Ets  
-
-
-
-
-
-
-
33  
36  
330  
35  
2.0  
2.5  
4.5  
-
-
-
-
-
-
-
ns  
Tj=25°C,  
V
V
CC=400V,IC=75A,  
GE=0/15V,  
Turn-off delay time  
Fall time  
RG=5,  
Lσ 2)=100nH,  
Cσ 2)=39pF  
Turn-on energy1)  
Turn-off energy  
Total switching energy  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.  
Switching Characteristic, Inductive Load, at Tj=175 °C  
Value  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
td (on)  
tr  
td (off)  
tf  
Eon  
Eo ff  
Ets  
-
-
-
-
-
-
-
32  
37  
363  
38  
2.9  
2.9  
5.8  
-
-
-
-
-
-
-
ns  
Tj=175°C,  
V
V
CC=400V,IC=75A,  
GE=0/15V,  
Turn-off delay time  
Fall time  
RG= 5Ω  
Lσ 2)=100nH,  
Cσ 2)=39pF  
Turn-on energy1)  
Turn-off energy  
Total switching energy  
mJ  
Energy losses include  
“tail” and diode  
reverse recovery.  
1) Includes Reverse Recovery Losses from IKW75N60T due to dynamic test circuit in Figure E.  
2) Leakage inductance Lσ and Stray capacity Cσ due to dynamic test circuit in Figure E.  
3
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
tp=1µs  
200A  
50A  
00A  
50A  
0A  
100A  
10A  
10µs  
50µs  
TC=80°C  
TC=110°C  
1ms  
Ic  
10ms  
DC  
1A  
1V  
Ic  
10V  
100V  
1000V  
10Hz  
100Hz  
1kHz  
10kHz 100kHz  
f, SWITCHING FREQUENCY  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 1. Collector current as a function of  
Figure 2. Safe operating area  
switching frequency  
(D = 0, TC = 25°C, Tj 175°C;  
(Tj 175°C, D = 0.5, VCE = 400V,  
VGE=15V)  
V
GE = 0/+15V, RG = 5)  
400W  
350W  
300W  
250W  
200W  
150W  
100W  
50W  
120A  
90A  
60A  
30A  
0A  
0W  
25°C  
75°C  
125°C  
25°C  
50°C  
75°C 100°C 125°C 150°C  
TC, CASE TEMPERATURE  
TC, CASE TEMPERATURE  
Figure 3. Power dissipation as a function of  
case temperature  
Figure 4. DC Collector current as a function  
of case temperature  
(Tj 175°C)  
(VGE 15V, Tj 175°C)  
4
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
120A  
90A  
60A  
30A  
0A  
120A  
V
GE=20V  
15V  
V
GE=20V  
15V  
90A  
60A  
30A  
0A  
13V  
11V  
9V  
13V  
11V  
9V  
7V  
7V  
0V  
1V  
2V  
3V  
0V  
1V  
2V  
3V  
VCE, COLLECTOR-EMITTER VOLTAGE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 5. Typical output characteristic  
Figure 6. Typical output characteristic  
(Tj = 25°C)  
(Tj = 175°C)  
2.5V  
2.0V  
1.5V  
1.0V  
0.5V  
0.0V  
IC=150A  
80A  
60A  
IC=75A  
40A  
IC=37.5A  
TJ=175°C  
20A  
25°C  
0A  
0°C  
50°C  
100°C  
150°C  
0V  
2V  
4V  
6V  
8V  
V
GE, GATE-EMITTER VOLTAGE  
Figure 7. Typical transfer characteristic  
TJ, JUNCTION TEMPERATURE  
Figure 8. Typical collector-emitter  
(VCE=20V)  
saturation voltage as a function of  
junction temperature  
(VGE = 15V)  
5
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
td(off)  
td(off)  
100ns  
100ns  
tf  
tf  
tr  
td(on)  
td(on)  
tr  
40A  
IC, COLLECTOR CURRENT  
10ns  
10ns  
0A  
80A  
120A  
5Ω  
10Ω  
15Ω  
RG, GATE RESISTOR  
Figure 9. Typical switching times as a  
function of collector current  
(inductive load, TJ=175°C,  
Figure 10. Typical switching times as a  
function of gate resistor  
(inductive load, TJ = 175°C,  
V
CE = 400V, VGE = 0/15V, RG = 5,  
VCE= 400V, VGE = 0/15V, IC = 75A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
7V  
6V  
5V  
4V  
3V  
2V  
1V  
0V  
td(off)  
max.  
typ.  
min.  
100ns  
tf  
tr  
td(on)  
25°C  
50°C  
75°C 100°C 125°C 150°C  
-50°C  
0°C  
50°C  
100°C  
150°C  
TJ, JUNCTION TEMPERATURE  
TJ, JUNCTION TEMPERATURE  
Figure 11. Typical switching times as a  
function of junction temperature  
(inductive load, VCE = 400V,  
Figure 12. Gate-emitter threshold voltage as  
a function of junction temperature  
(IC = 1.2mA)  
V
GE = 0/15V, IC = 75A, RG=5,  
Dynamic test circuit in Figure E)  
6
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
*) Eon and Ets include losses  
due to diode recovery  
*) Eon and Ets include losses  
Ets*  
due to diode recovery  
Ets*  
8.0mJ  
6.0mJ  
4.0mJ  
2.0mJ  
0.0mJ  
12.0mJ  
8.0mJ  
4.0mJ  
0.0mJ  
Eon*  
Eon  
*
Eoff  
Eoff  
0A 20A 40A 60A 80A 100A 120A 140A  
0Ω  
5Ω  
10Ω  
15Ω  
IC, COLLECTOR CURRENT  
RG, GATE RESISTOR  
Figure 13. Typical switching energy losses  
as a function of collector current  
(inductive load, TJ = 175°C,  
Figure 14. Typical switching energy losses  
as a function of gate resistor  
(inductive load, TJ = 175°C,  
V
CE = 400V, VGE = 0/15V, RG = 5,  
VCE = 400V, VGE = 0/15V, IC = 75A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
*) Eon and Ets include losses  
due to diode recovery  
*) Eon and Ets include losses  
Ets*  
due to diode recovery  
5.0mJ  
4.0mJ  
3.0mJ  
2.0mJ  
1.0mJ  
0.0mJ  
8mJ  
6mJ  
4mJ  
2mJ  
0mJ  
Eon  
*
Ets*  
Eoff  
Eoff  
Eon*  
25°C 50°C  
75°C 100°C 125°C 150°C  
300V 350V 400V 450V 500V 550V  
TJ, JUNCTION TEMPERATURE  
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 15. Typical switching energy losses  
as a function of junction  
temperature  
Figure 16. Typical switching energy losses  
as a function of collector emitter  
voltage  
(inductive load, VCE = 400V,  
(inductive load, TJ = 175°C,  
V
GE = 0/15V, IC = 75A, RG = 5,  
VGE = 0/15V, IC = 75A, RG = 5,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
7
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
Ciss  
15V  
10V  
5V  
1nF  
120V  
480V  
Coss  
Crss  
100pF  
0V  
0V  
10V  
20V  
0nC  
100nC 200nC 300nC 400nC  
GE, GATE CHARGE  
Q
VCE, COLLECTOR-EMITTER VOLTAGE  
Figure 17. Typical gate charge  
Figure 18. Typical capacitance as a function  
(IC=75 A)  
of collector-emitter voltage  
(VGE=0V, f = 1 MHz)  
12µs  
10µs  
8µs  
1000A  
750A  
500A  
250A  
0A  
6µs  
4µs  
2µs  
0µs  
10V  
11V  
12V  
13V  
14V  
12V  
14V  
16V  
18V  
V
GE, GATE-EMITTETR VOLTAGE  
VGE, GATE-EMITETR VOLTAGE  
Figure 19. Typical short circuit collector  
current as a function of gate-  
emitter voltage  
Figure 20. Short circuit withstand time as a  
function of gate-emitter voltage  
(VCE=600V, start at TJ=25°C,  
T
Jmax<150°C)  
(VCE 400V, Tj 150°C)  
8
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
D=0.5  
10-1K/W  
10-2K/W  
10-3K/W  
0.2  
0.1  
R , ( K / W )  
0.1968  
τ , ( s )  
0.115504  
0.009340  
0.000823  
0.000119  
R2  
0.05  
0.0733  
0.0509  
0.02  
0.01  
0.0290  
R1  
C1=τ1/R1 C2=τ2/R2  
single pulse  
1µs 10µs 100µs 1ms 10ms 100ms  
tP, PULSE WIDTH  
Figure 21. IGBT transient thermal resistance  
(D = tp / T)  
9
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
dimensions  
TO-247AC  
symbol  
[mm]  
[inch]  
min  
4.78  
2.29  
1.78  
1.09  
1.73  
2.67  
max  
5.28  
2.51  
2.29  
1.32  
2.06  
3.18  
min  
max  
A
B
C
D
E
F
0.1882 0.2079  
0.0902 0.0988  
0.0701 0.0902  
0.0429 0.0520  
0.0681 0.0811  
0.1051 0.1252  
0.0299 max  
G
H
K
L
0.76 max  
20.80  
21.16  
16.15  
5.72  
0.8189 0.8331  
0.6161 0.6358  
0.2051 0.2252  
0.7799 0.8142  
0.1402 0.1941  
0.1421  
15.65  
5.21  
M
N
19.81  
3.560  
20.68  
4.930  
3.61  
P
Q
6.12  
6.22  
0.2409 0.2449  
10  
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
i,v  
tr r =tS +tF  
diF /dt  
Qr r =QS +QF  
tr r  
IF  
tS  
tF  
t
QS  
10% Ir r m  
QF  
Ir r m  
dir r /dt  
VR  
90% Ir r m  
Figure C. Definition of diodes  
switching characteristics  
τ1  
τ2  
r 2  
τn  
r1  
r n  
T (t)  
j
p(t)  
r 2  
r1  
rn  
Figure A. Definition of switching times  
T
C
Figure D. Thermal equivalent  
circuit  
Figure E. Dynamic test circuit  
Figure B. Definition of switching losses  
11  
Rev. 2.1 Dec-04  
Power Semiconductors  
IGW75N60T  
q
TrenchStop Series  
Published by  
Infineon Technologies AG,  
Bereich Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 2004  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,  
descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon  
Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in question  
please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of  
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or  
systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect  
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.  
12  
Rev. 2.1 Dec-04  
Power Semiconductors  

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