SAL-TC377TP-96F300S AA [INFINEON]
AURIX™ Family – TC37xTP;型号: | SAL-TC377TP-96F300S AA |
厂家: | Infineon |
描述: | AURIX™ Family – TC37xTP |
文件: | 总11页 (文件大小:177K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AURIX™ TC37x variants
About this document
Scope and purpose
This document is an addendum to the TC37x Product Data Sheet and User's Manual, listing all planned product
variants, key parameters such as memory size and optional features.
The User's Manual lists functions implemented on the Silicon, but this document counts functions that are
pinning dependent; i.e. functions are counted that are connected to at least one package pin. As pins are
overlaid with several functions the pinning needs to be checked (see Product Data Sheet) to determine the
number of usable functions in an application.
Naming conventions
Prefix:
•
•
SAK: Tambient Temperature Range from -40 °C up to +125 °C.
SAL: Tambient Temperature Range from -40 °C up to +150 °C (packaged device).
Feature Package:
•
•
P: Standard feature.
E: Emulation device with all features of the emulated standard type, additionally full MCDS, overlay
functionality for calibration, AGBT as trace interface for development (depending on the package). Refer to
the Emulation devices Data Sheet for further details.
•
•
•
•
C,I,V,Z: Customer Specific.
A: ADAS ext. Memory.
T: ADAS + emulation.
X: Extended Feature device. These products contain the extended memory (EMEM) of the ADAS subsystem.
The ADAS peripherals SPU and RIF are not available.
•
•
•
•
•
M: MotionWise soꢀware.
F: Extended Flash.
G: Additional Connectivity.
H: ADAS Standard feature.
N: Standard feature with AMU.
Datasheet addendum
Please read the Important Notice and Warnings at the end of this document
v1.5
www.infineon.com
2020-11
OPEN MARKET VERSION
AURIX™ TC37x variants
Table of contents
Table of contents
About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1
1.1
1.2
TC37x AA step variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
TC37x AA step (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
TC37x AA step (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Memory maps of TC37x variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Datasheet addendum
2
v1.5
2020-11
OPEN MARKET VERSION
AURIX™ TC37x variants
1 TC37x AA step variants
1
TC37x AA step variants
1.1
TC37x AA step (part 1)
A table listing the TC37x AA step variants.
Table 1 TC37x_AA step (part 1)
SAL- SAK-
SAL-
SAK-
SAK-
SAL-
SAK-
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F
00S
300W
AA
300S
AA
300W
AA
300S
300S
300W
Step
AA
AA
AA
AA
Production Status
Standard
Standard
Standard
Standard
Customer
Specific
Customer
Specific
Customer
Specific
Package Type
PG-LFBGA-292
Pinout
PG-QFP-176 PG-LFBGA-292
PG-QFP-176 PG-LFBGA-292 PG-LFBGA-292
PG-QFP-176
LFBGA 0.8 mm LQFP 0.5 mm LFBGA 0.8 mm LQFP 0.5 mm LFBGA 0.8 mm LFBGA 0.8 mm LQFP 0.5 mm
Reference Silicon
TC37x
Temperature Range (Ambient)
SAL SAL
TC37x
TC37x
TC37x
TC37x
TC37x
TC37x
SAK
SAK
SAK
SAL
SAK
Chip ID
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.
0x89007780
0x89007580
0x89007780
0x89007580
0xC9007780
0xC9007780
0x89007580
Cores / Checker Cores
3/2
3/2
300
6
3/2
300
6
3/2
300
6
2/2
300
6
2/2
300
6
2/2
300
6
Max. Freq. (MHz)
300
Program Flash (MB)
6
Data Flash0 (single-ended) (KB)
256 256
256
256
992
256
768
0
256
768
0
256
768
0
Total SRAM (without EMEM and Cache) (KB)
992
EMEM Size (KB)
0
992
0
992
0
0
Datasheet addendum
3
v1.5
2020-11
OPEN MARKET VERSION
AURIX™ TC37x variants
1 TC37x AA step variants
Table 1
TC37x_AA step (part 1) (continued)
SAL- SAK-
SAL-
SAK-
SAK-
SAL-
SAK-
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F
00S
300W
300S
300W
300S
300S
300W
DSPR (KB)
240 in CPU0&1;
96 other
240 in
CPU0&1; 96
other
240 in
CPU0&1; 96
other
240 in
CPU0&1; 96
other
240 in
CPU0&1
240 in
CPU0&1
240 in
CPU0&1; 96
other
DLMU (KB)
64 per CPU
PSPR (KB)
64 per CPU
LMU (KB)
0
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
0
32
0
32
0
32
0
32
0
32
0
32
DAM (KB)
32
AMU1)
No
No
No
No
No
No
No
ADC (Primary Groups/Channels)
4/32 4/25
ADC (Secondary Groups/Channels)
4/60 4/45
ADC (Fast Compare Channels)
4/32
4/25
4/45
4
4/32
4/60
4
4/32
4/60
4
4/25
4/45
4
4/60
4
4
4
ADC (EDSADC Channels)
6
CAN (Modules/Nodes)
2/2x4
6
6
6
6
6
6
2/2x4
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
FlexRay (Modules/Channels)
1/1x2
HSSL Modules
1
1/1x2
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI
12/12/11 12/12/10 12/12/11
12/12/10
12/12/11
12/12/11
12/12/10
QSPI Modules / with LVDS
1
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon
Representative
Datasheet addendum
4
v1.5
2020-11
OPEN MARKET VERSION
AURIX™ TC37x variants
1 TC37x AA step variants
Table 1
TC37x_AA step (part 1) (continued)
SAL- SAK-
SAL-
SAK-
SAK-
SAL-
SAK-
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F
00S
300W
300S
300W
300S
300S
300W
5/2
5/2
5/2
5/2
5/2
5/2
5/2
SENT Channels
15
15
2
15
2
15
2
15
15
15
2
MSC Modules
2
2
2
2
2
PSI5 Channels
2
PSI5-S Module
Yes
2
2
2
2
Yes
No
Yes
No
Yes
No
Yes
Yes
Yes
No
SDMMC Module
No
No
No
Max. Ethernet Availability: 1GBit/100Mbit/No
1Gbit/s
100Mbit/s
(RMII)
1Gbit/s
100Mbit/s
(RMII)
1Gbit/s
1Gbit/s
100Mbit/s
(RMII)
MCDS Availability
miniMCDS
miniMCDS
miniMCDS
miniMCDS
miniMCDS
miniMCDS
miniMCDS
ADAS Cluster Available
No
No
No
Yes
No
No
Yes
No
No
Yes
No
No
Yes
No
No
Yes
No
No
Yes
CIF
No
HSM Available
Yes
Datasheet addendum
5
v1.5
2020-11
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AURIX™ TC37x variants
1 TC37x AA step variants
1.2
TC37x AA step (part 2)
A continuation table listing the TC37x AA step variants.
Table 2
TC37x_AA step (part 2)
SAL-TC375DP-96F300W
SAK-TC375TI-96F300W
AA
SAL-TC375TI-96F300W
AA
Step
AA
Customer Specific
PG-QFP-176
Production Status
Package Type
Pinout
Customer Specific
PG-QFP-176
LQFP 0.5 mm
TC37x
Customer Specific
PG-QFP-176
LQFP 0.5 mm
TC37x
LQFP 0.5 mm
TC37x
Reference Silicon
Temperature Range (Ambient)
SAL
SAK
SAL
Chip ID
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.
0x89007580
0xE9007580
0xE9007580
Cores / Checker Cores
Max. Freq. (MHz)
2/2
300
6
3/2
3/2
300
300
Program Flash (MB)
6
6
Data Flash0 (single-ended) (KB)
256
256
256
Total SRAM (without EMEM and Cache) (KB)
768
992
0
992
0
EMEM Size (KB)
0
DSPR (KB)
240 in CPU0&1; 96 other
DLMU (KB)
240 in CPU0&1; 96 other
64 per CPU
240 in CPU0&1; 96 other
64 per CPU
64 per CPU
Datasheet addendum
6
v1.5
2020-11
OPEN MARKET VERSION
AURIX™ TC37x variants
1 TC37x AA step variants
Table 2
TC37x_AA step (part 2) (continued)
SAL-TC375DP-96F300W
SAK-TC375TI-96F300W
SAL-TC375TI-96F300W
PSPR (KB)
LMU (KB)
DAM (KB)
AMU2)
64 per CPU
64 per CPU
64 per CPU
0
32
0
32
0
32
No
No
No
ADC (Primary Groups/Channels)
4/25
4/25
4/45
4
4/25
ADC (Secondary Groups/Channels)
4/45
4/45
ADC (Fast Compare Channels)
4
4
ADC (EDSADC Channels)
6
6
6
CAN (Modules/Nodes)
2/2x4
2/2x4
1/1x2
1
2/2x4
FlexRay (Modules/Channels)
1/1x2
1/1x2
HSSL Modules
1
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI
12/12/10
12/12/10
12/12/10
QSPI Modules / with LVDS
5/2
5/2
15
2
5/2
15
2
SENT Channels
15
MSC Modules
2
PSI5 Channels
2
2
2
2
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon
Representative
Datasheet addendum
7
v1.5
2020-11
OPEN MARKET VERSION
AURIX™ TC37x variants
1 TC37x AA step variants
Table 2
TC37x_AA step (part 2) (continued)
SAL-TC375DP-96F300W
SAK-TC375TI-96F300W
SAL-TC375TI-96F300W
PSI5-S Module
Yes
No
Yes
Yes
SDMMC Module
No
No
Max. Ethernet Availability: 1GBit/100Mbit/No
100Mbit/s (RMII)
100Mbit/s (RMII)
100Mbit/s (RMII)
MCDS Availability
miniMCDS
miniMCDS
miniMCDS
ADAS Cluster Available
No
No
No
Yes
No
No
Yes
CIF
No
HSM Available
Yes
Datasheet addendum
8
v1.5
2020-11
OPEN MARKET VERSION
AURIX™ TC37x variants
2 Memory maps of TC37x variants
2
Memory maps of TC37x variants
This section describes the influence of the available feature variants on the memory map.
Cores / checker cores
Variants:
•
•
3/2: umbrella, see User's Manual.
2/2: reduced CPU variant, not available is CPU2 including its RAMs (DSPR, DCACHE, DTAG, PSPR, PCACHE,
PTAG, DLMU).
HSM
Variants:
•
•
Yes: umbrella, see User's Manual.
No: HSM and DF1 are not available.
Ethernet availability
•
•
1Gbit/s: umbrella, see User's Manual.
100Mbit/s (RMII): due to pin limitations in this package the GETH module can be only used in RMII mode.
ADC availability
Limitation on availability of ADC channels are caused by pin limitations. See Data Sheet for the pinning
•
table of the package.
Datasheet addendum
9
v1.5
2020-11
OPEN MARKET VERSION
AURIX™ TC37x variants
Revision history
Revision history
Document
version
Date of
release
Description of changes
V1.0
V1.1
2019-02-05
2019-03-01
•
First release.
•
•
Removed devices: SAK-TC377T-96F300S and SAK-TC375T-96F300W.
Added devices: SAK-TC377DP-96F300S and SAL-TC377DP-96F300S.
V1.2
V1.3
2019-06-12
2020-01-10
•
•
•
Chapter 1: TC37x AA step variants table format changed to fit all the
contents.
Chapter 1: Added new row in the variant tables called "AMU" with the
footnote for additional details.
Chapter: About this document: Feature package definitions are updated
to consistent with the product naming nomenclature definition.
•
•
•
Chapter 1: New TC37x AA step variants added: SAK-
TC375DP-96F300W,SAL-TC375DP-96F300W .
Page 1: About the document:Feature Package 'X' definition is updated to
remove CIF.
Chapter 1:Added new row in the variant tables called "CIF" indicating the
Camera Interface availability.
V1.4
V1.5
2020-04-30
2020-11-18
•
•
Chapter 1: New TC37x AA step variants added: SAK-TC375TI-96F300W,SAL-
TC375TI-96F300W .
About this document section: Added an additional note for the Feature
package 'E'.
•
Chapter 1: Removed Bare Die Marking variant SAL-TC370TP-96F300.
Datasheet addendum
10
v1.5
2020-11
OPEN MARKET VERSION
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2020-11
IMPORTANT NOTICE
WARNINGS
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2020 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-vxe1559112312940
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
OPEN MARKET VERSION
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