SPB160N04S2L03DTMA1 [INFINEON]
Power Field-Effect Transistor, 160A I(D), 40V, 0.0037ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, TO-263, 6 PIN;
| 型号： | SPB160N04S2L03DTMA1 |
| 厂家： | 
Infineon |
| 描述： | Power Field-Effect Transistor, 160A I(D), 40V, 0.0037ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, TO-263, 6 PIN 局域网 开关 脉冲 晶体管 |
| 文件： | 总8页 (文件大小：299K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPB160N04S2L-03
OptiMOS Power-Transistor
Product Summary
Feature
V
40
2.7
V
DS
• N-Channel
R
DS(on)
max. SMD version
mΩ
A
• Enhancement mode
• Logic Level
I
D
160
P- TO263 -7-3
• High Current Rating
• Low On-Resistance R
DS(on)
• 175°C operating temperature
• Avalanche rated
• dv/dt rated
Type
Package
Ordering Code
Marking
SPB160N04S2L-03 P- TO263 -7-3 Q67060-S6138
P2N04L03
Maximum Ratings, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Value
Unit
1)
A
Continuous drain current
I
D
T =25°C
160
160
640
C
T =100°C
C
Pulsed drain current
I
D puls
T =25°C
C
810
mJ
Avalanche energy, single pulse
E
AS
I =80A, V =25V, R =25Ω
D
DD
GS
2)
30
6
Repetitive avalanche energy, limited by T
Reverse diode dv/dt
E
jmax
AR
kV/µs
dv/dt
I =160A, V =32V, di/dt=200A/µs, T =175°C
jmax
S
DS
V
Gate source voltage
Power dissipation
V
P
±20
300
GS
tot
W
T =25°C
C
°C
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
T , T
j
-55... +175
55/175/56
stg
Page 1
2003-05-22
SPB160N04S2L-03
Thermal Characteristics
Parameter
Symbol
Values
typ. max.
Unit
min.
Characteristics
-
-
-
-
0.5 K/W
62
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
SMD version, device on PCB:
@ min. footprint
R
R
R
thJC
thJA
thJA
-
-
-
-
62
40
2
3)
@ 6 cm cooling area
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
40
typ. max.
Static Characteristics
-
-
V
Drain-source breakdown voltage
V
(BR)DSS
V
=0V, I =1mA
GS
D
1.2
1.6
2
Gate threshold voltage, V = V
V
GS
DS
GS(th)
I
=250µA
D
µA
Zero gate voltage drain current
I
DSS
V
V
=40V, V =0V, T =25°C
GS
-
-
0.01
1
1
DS
j
=40V, V =0V, T =125°C
DS GS
100
j
-
-
-
1
100 nA
Gate-source leakage current
I
GSS
V
=20V, V =0V
GS DS
2.7
2.1
3.7
2.7
Drain-source on-state resistance
R
mΩ
DS(on)
DS(on)
V
=4.5V, I =80A
GS
D
Drain-source on-state resistance
R
V
=10V, I =80A
GS
D
1
Current limited by bondwire ; with an R
= 0.5K/W the chip is able to carry I = 243A at 25°C, for detailed
D
thJC
information see app.-note ANPS071E available at www.infineon.com/optimos
2
Defined by design. Not subject to production test.
3
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2003-05-22
SPB160N04S2L-03
Electrical Characteristics
Parameter
Symbol
Conditions
Values
Unit
min. typ. max.
Dynamic Characteristics
V
DS
≥2*I *R ,
DS(on)max
115
230
-
S
Transconductance
g
fs
D
I =160A
D
V
=0V, V =25V,
-
-
-
-
-
-
-
6000 8000 pF
1900 2530
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
C
iss
GS
DS
f=1MHz
C
C
t
oss
rss
460
12
690
V
DD
=20V, V =10V,
18 ns
120
GS
d(on)
I =160A,
D
80
t
r
R =1.1Ω
G
93
140
Turn-off delay time
Fall time
t
d(off)
72
110
t
f
Gate Charge Characteristics
Gate to source charge
Gate to drain charge
V
=32V, I =160A
-
-
-
21
60
28 nC
90
Q
DD
D
gs
Q
gd
V
DD
=32V, I =160A,
170
230
Gate charge total
Q
g
D
V
GS
=0 to 10V
V
=32V, I =160A
-
-
3.7
-
-
V
Gate plateau voltage
V
I
DD
D
(plateau)
Reverse Diode
T =25°C
C
160 A
640
Inverse diode continuous
forward current
S
-
-
-
-
-
Inv. diode direct current, pulsed
Inverse diode forward voltage
Reverse recovery time
I
SM
V
=0V, I =80A
0.9
62
1.3
V
V
GS
F
SD
V =20V, I =l ,
78 ns
t
rr
R
F S
di /dt=100A/µs
145
180 nC
Reverse recovery charge
Q
F
rr
Page 3
2003-05-22
SPB160N04S2L-03
1 Power dissipation
= f (T )
2 Drain current
I = f (T )
P
tot
D
C
C
parameter: V ≥ 4 V
parameter: V ≥ 10 V
GS
SPB160N04S2L-03
GS
SPB160N04S2L-03
320
170
A
W
140
120
100
80
240
200
160
120
80
60
40
40
20
0
0
°C
0
20 40 60 80 100 120 140 160
190
0
20 40 60 80 100 120 140 160 °C 190
T
T
C
C
3 Safe operating area
4 Max. transient thermal impedance
Z = f (t )
thJC
I = f ( V
)
D
DS
p
parameter : D = 0 , T = 25 °C
parameter : D = t /T
p
C
3 SPB160N04S2L-03
SPB160N04S2L-03
1
10
10
K/W
t
= 7.2µs
p
10 µs
A
0
10
10
10
10
10
10
100 µs
2
-1
-2
-3
-4
-5
10
1 ms
D = 0.50
0.20
1
10
0.10
0.05
single pulse
0.02
0.01
0
10
10 -1
10 0
10 1
10 2
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2
10 0
V
s
V
DS
t
p
Page 4
2003-05-22
SPB160N04S2L-03
5 Typ. output characteristic
I = f (V ); T =25°C
6 Typ. drain-source on resistance
= f (I )
R
D
DS(on)
D
DS
j
parameter: t = 80 µs
parameter: V
GS
p
SPB160N04S2L-03
SPB160N04S2L-03
10
380
Ptot = 300W
A
i
Ω
h
V
[V]
GS
320
280
240
200
160
120
80
d
e
f
g
a
b
c
d
e
f
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.5
10.0
8
7
6
5
4
3
2
1
0
g
e
f
g
h
i
h
d
i
c
a
V
[V] =
e
3.4 3.6 3.8
GS
d
b
40
f
g
h
i
4.0 4.5 10.0
0
V
A
0
0.5
1
1.5
2
2.5
3
3.5
4
5
0
40
80
120 160 200 240
300
V
DS
I
D
7 Typ. transfer characteristics
8 Typ. forward transconductance
I = f ( V ); V ≥ 2 x I x R
g = f(I ); T =25°C
D
GS
DS
D
DS(on)max
D
fs
j
parameter: t = 80 µs
parameter: g
p
fs
200
260
S
A
220
200
180
160
140
120
100
80
160
140
120
100
80
60
60
40
40
20
20
0
0
0
0.5
1
1.5
2
2.5
3
4
0
20 40 60 80 100 120 140 160
200
V
A
V
GS
I
D
Page 5
2003-05-22
SPB160N04S2L-03
9 Drain-source on-state resistance
= f (T )
10 Typ. gate threshold voltage
V = f (T )
GS(th)
R
DS(on)
j
j
parameter : I = 80 A, V = 10 V
parameter: V = V
DS
D
GS
GS
SPB160N04S2L-03
8
2.4
V
Ω
2
1.8
1.6
1.4
6
5
4
3
2
1
0
1.25 mA
250 µA
1.2
1
98%
0.8
0.6
0.4
0.2
0
typ
°C
-60
-20
20
60
100
140
200
-60
-20
20
60
100
180
°C
T
T
j
j
11 Typ. capacitances
12 Forward character. of reverse diode
I = f (V )
C = f (V )
F
SD
DS
parameter: V =0V, f=1 MHz
parameter: T , tp = 80 µs
GS
j
5
3 SPB160N04S2L-03
10
10
pF
A
4
2
10
10
C
C
iss
oss
3
1
10
10
C
rss
Tj = 25 °C typ
Tj = 175 °C typ
Tj = 25 °C (98%)
Tj = 175 °C (98%)
2
0
10
10
V
0
5
10
15
20
V
30
DS
0
0.4
0.8
1.2
1.6
2
2.4
3
V
V
SD
Page 6
2003-05-22
SPB160N04S2L-03
13 Typ. avalanche energy
= f (T )
14 Typ. gate charge
= f (Q
E
V
)
Gate
AS
j
GS
par.: I = 80 A, V = 25 V, R = 25 Ω
parameter: I = 160 A pulsed
D
D
DD
GS
SPB160N04S2L-03
850
16
mJ
V
700
600
500
400
300
200
100
0
12
10
0,2 VDS max
0,8 VDS max
8
6
4
2
0
25
45
65
85
105 125 145 °C 185
0
40
80
120
160
200
260
Gate
nC
T
j
Q
15 Drain-source breakdown voltage
= f (T )
V
(BR)DSS
j
parameter: I =10 mA
D
SPB160N04S2L-03
48
V
46
45
44
43
42
41
40
39
38
37
36
°C
-60
-20
20
60
100
140
200
T
j
Page 7
2003-05-22
SPB160N04S2L-03
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Further information
Please notice that the part number is BSPB160N04S2L-03, for simplicity the device is referred to by the term
SPB160N04S2L-03 throughout this documentation.
Page 8
2003-05-22
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