SPD09P06PL [INFINEON]

SIPMOS Power-Transistor; SIPMOS功率三极管
SPD09P06PL
型号: SPD09P06PL
厂家: Infineon    Infineon
描述:

SIPMOS Power-Transistor
SIPMOS功率三极管

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总8页 (文件大小:232K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SPD09P06PL  
SPU09P06PL  
Final data  
SIPMOS =Power-Transistor  
Product Summary  
Feature  
V
-60  
0.25  
-9.7  
V
DS  
P-Channel  
Enhancement mode  
Logic Level  
R
DS(on)  
I
A
D
P-TO251-3-1  
P-TO252  
175°C operating temperature  
Avalanche rated  
dv/dt rated  
Drain  
pin 2  
Gate  
pin1  
Type  
SPD09P06PL  
Package  
P-TO252  
Ordering Code  
Q67042-S4007  
Source  
pin 3  
SPU09P06PL  
P-TO251-3-1 Q67042-S4020  
Maximum Ratings,at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
A
Continuous drain current  
I
D
T =25°C  
-9.7  
-6.8  
C
T =100°C  
C
-38.8  
Pulsed drain current  
I
D puls  
T =25°C  
C
70  
mJ  
Avalanche energy, single pulse  
E
AS  
I =-9.7 A , V =-25V, R =25  
D
DD GS  
E
4.2  
6
Avalanche energy, periodic limited by T  
Reverse diode dv/dt  
AR  
jmax  
dv/dt  
kV/µs  
I =-9.7A, V =-48, di/dt=200A/µs, T  
DS jmax  
=175°C  
S
Gate source voltage  
Power dissipation  
V
V
W
±20  
42  
GS  
P
tot  
T =25°C  
C
°C  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
T , T  
-55... +175  
55/175/56  
j
stg  
Page 1  
2001-07-02  
SPD09P06PL  
SPU09P06PL  
Final data  
Thermal Characteristics  
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
Characteristics  
R
-
-
-
-
3.6 K/W  
100  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
thJC  
R
thJA  
R
thJA  
-
-
-
-
75  
50  
2
@ 6 cm cooling area 1)  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
-60  
-1  
typ. max.  
Static Characteristics  
Drain-source breakdown voltage  
V
-
-
V
(BR)DSS  
V
=0V, I =-250µA  
GS  
D
-1.5  
-2  
Gate threshold voltage, V = V  
V
GS(th)  
GS  
DS  
I =-250µA  
D
µA  
Zero gate voltage drain current  
I
DSS  
V
=-60V, V =0V, T =25°C  
-
-
-
-0.1  
-10  
-10  
-1  
-100  
-100 nA  
0.4  
DS  
GS  
j
V
=-60V, V =0V, T =150°C  
GS  
DS  
j
Gate-source leakage current  
I
GSS  
V
=-20V, V =0V  
GS  
DS  
-
-
0.3  
0.2  
Drain-source on-state resistance  
R
DS(on)  
V
=-4.5V, I =-5.4A  
GS  
D
0.25  
Drain-source on-state resistance  
R
DS(on)  
V
=-10V, I =-6.8A  
GS  
D
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
2001-07-02  
SPD09P06PL  
SPU09P06PL  
Final data  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
Transconductance  
g
fs  
V
DS  
2*I *R ,  
DS(on)max  
1.8  
3.5  
-
S
D
I =-5.4  
D
Input capacitance  
C
V
=0V, V =-25V,  
DS  
-
-
-
-
360  
103  
40  
450 pF  
130  
50  
iss  
GS  
f=1MHz  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
C
oss  
C
rss  
t
V
=-30V, V =-4.5V,  
GS  
11  
17  
ns  
d(on)  
DD  
I =-5.4, R =6  
D
G
Rise time  
t
V
=-30V, V =-4.5V,  
-
-
-
168  
49  
89  
252  
74  
134  
r
DD GS  
I =-5.4A, R =6  
Turn-off delay time  
Fall time  
t
D
G
d(off)  
t
f
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Q
V
=-48V, I =-9.7A  
-
-
-
1.3  
5.1  
14  
2
7.5  
21  
nC  
gs  
DD  
D
Q
gd  
V
=-48V, I =-9.7A,  
Gate charge total  
Q
DD  
D
g
V
=0 to -10V  
GS  
V
=-48V, I =-9.7A  
-
-4.1  
-
V
A
Gate plateau voltage  
V
DD  
D
(plateau)  
Reverse Diode  
Inverse diode continuous  
forward current  
T =25°C  
-
-
-
-
-9.7  
I
C
S
Inverse diode direct current,  
I
-38.8  
SM  
pulsed  
V
=0V, I =-9.7A  
-
-
-
-1.1  
52  
64  
-1.4  
76  
96  
V
ns  
nC  
Inverse diode forward voltage V  
GS  
F
SD  
Reverse recovery time  
t
V =-30V, I =l ,  
rr  
R
F S  
di /dt=100A/µs  
Reverse recovery charge  
Q
F
rr  
Page 3  
2001-07-02  
SPD09P06PL  
SPU09P06PL  
Final data  
2 Drain current  
1 Power dissipation  
= f (T )  
P
I = f (T )  
tot  
C
D
C
parameter: V  
10 V  
GS  
SPD09P06PL  
SPD09P06PL  
50  
-11  
A
W
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-1  
0
40  
35  
30  
25  
20  
15  
10  
5
0
0
20 40 60 80 100 120 140 160  
190  
0
20 40 60 80 100 120 140 160  
190  
°C  
°C  
T
T
C
C
3 Safe operating area  
I = f ( V  
4 Transient thermal impedance  
Z = f (t )  
thJC  
)
D
DS  
p
parameter : D = 0 , T = 25 °C  
parameter : D = t /T  
C
p
10 1  
-10 2  
SPD09P06PL  
SPD09P06PL  
K/W  
t
= 11.0µs  
p
A
10 0  
-10 1  
100 µs  
10 -1  
10 -2  
D = 0.50  
0.20  
1 ms  
-10 0  
0.10  
10 ms  
0.05  
DC  
single pulse  
10 -3  
0.02  
0.01  
-10 -1  
10 -4  
-10 -1  
-10 0  
-10 1  
-10 2  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
V
s
t
V
DS  
p
Page 4  
2001-07-02  
SPD09P06PL  
SPU09P06PL  
Final data  
5 Typ. output characteristic  
I = f (V ); T =25°C  
6 Typ. drain-source on resistance  
= f (I )  
R
D
DS  
j
DS(on)  
D
parameter: t = 80 µs  
parameter: V  
p
GS  
SPD09P06PL  
SPD09P06PL  
-24  
A
0.8  
Ptot = 42W  
c
d
e
f
g
h
i
V
[V]  
GS  
a
k
j
-20  
-18  
-16  
-14  
-12  
-10  
-8  
-2.0  
-2.5  
-3.0  
-3.5  
-4.0  
-4.5  
-5.0  
-5.5  
-6.0  
-7.0  
-8.0  
b
c
d
e
f
i
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
h
g
h
i
g
e
j
f
k
-6  
j
-4  
k
d
b
V
[V] =  
GS  
c
d
e
f
g
h
i
j
k
-2  
c
a
-3.0 -3.5 -4.0 -4.5 -5.0 -5.5 -6.0 -7.0 -8.0  
0
0
-2  
-4  
-6  
-8  
-12  
0
-2 -4 -6 -8 -10 -12 -14 -16  
-20  
V
A
I
V
D
DS  
7 Typ. transfer characteristics  
I = f ( V ); V 2 x I x R  
8 Typ. forward transconductance  
g = f(I ); T =25°C  
D
GS  
DS  
D
DS(on)max  
fs  
D
j
parameter: t = 80 µs  
parameter: g  
p
fs  
25  
4
S
A
3
2.5  
2
15  
10  
5
1.5  
1
0.5  
0
0
0
1
2
3
4
5
6
8
0
1
2
3
4
5
6
7
8
10  
V
V
V
D
I
GS  
Page 5  
2001-07-02  
SPD09P06PL  
SPU09P06PL  
Final data  
10 Gate threshold voltage  
9 Drain-source on-state resistance  
= f (T )  
R
V
= f (T )  
DS(on)  
j
GS(th)  
j
parameter : I = -6.8 A, V = -10 V  
parameter: V = V , I = -250 µA  
GS DS D  
D
GS  
SPD09P06PL  
2.4  
V
0.75  
98 %  
2
1.8  
1.6  
1.4  
1.2  
1
0.6  
0.55  
0.5  
typ.  
2 %  
0.45  
0.4  
0.35  
0.3  
98%  
0.8  
0.6  
0.4  
0.2  
0
0.25  
0.2  
typ  
0.15  
0.1  
0.05  
0
°C  
-60  
-20  
20  
60  
100  
140  
200  
-60  
-20  
20  
60  
100  
180  
°C  
T
T
j
j
11 Typ. capacitances  
C = f (V )  
12 Forward character. of reverse diode  
I = f (V )  
DS  
F
SD  
parameter: V =0V, f=1 MHz  
parameter: T , tp = 80 µs  
GS  
j
10 3  
-10 2  
SPD09P06PL  
A
C
iss  
pF  
-10 1  
C
C
oss  
rss  
10 2  
-10 0  
Tj = 25 °C typ  
Tj = 175 °C typ  
Tj = 25 °C (98%)  
Tj = 175 °C (98%)  
10 1  
-10 -1  
0
-5  
-10  
-15  
-20  
-30  
DS  
0
-0.4 -0.8 -1.2 -1.6  
-2  
-2.4  
-3  
V
V
V
V
SD  
Page 6  
2001-07-02  
SPD09P06PL  
SPU09P06PL  
Final data  
14 Typ. gate charge  
13 Typ. avalanche energy  
= f (T )  
E
V
= f (Q  
)
AS  
j
GS  
Gate  
par.: I = -9.7 A , V = -25 V, R = 25  
parameter: I = -9.7 A pulsed  
D
DD  
GS  
D
SPD09P06PL  
80  
-16  
mJ  
V
60  
50  
40  
30  
20  
10  
0
-12  
-10  
-8  
-6  
-4  
-2  
0
V
0,2  
DS max  
0,8 VDS max  
25  
45  
65  
85 105 125 145  
185  
0
4
8
12  
16  
20  
28  
Gate  
°C  
T
nC  
Q
j
15 Drain-source breakdown voltage  
V
= f (T )  
(BR)DSS  
j
SPD09P06PL  
-72  
V
-68  
-66  
-64  
-62  
-60  
-58  
-56  
-54  
-60  
-20  
20  
60  
100  
140  
200  
°C  
T
j
Page 7  
2001-07-02  
SPD09P06PL  
SPU09P06PL  
Final data  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Page 8  
2001-07-02  

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