SPN03N60C3_05 [INFINEON]

Cool MOS Power Transistor Feature; 酷MOS功率晶体管特征
SPN03N60C3_05
型号: SPN03N60C3_05
厂家: Infineon    Infineon
描述:

Cool MOS Power Transistor Feature
酷MOS功率晶体管特征

晶体 晶体管
文件: 总12页 (文件大小:430K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SPN03N60C3  
Cool MOS™ Power Transistor  
Feature  
New revolutionary high voltage technology  
V
@ T  
650  
1.4  
0.7  
V
A
DS  
jmax  
R
DS(on)  
I
D
Ultra low gate charge  
SOT-223  
Extreme dv/dt rated  
Ultra low effective capacitances  
4
3
2
1
VPS05163  
Type  
Package  
Ordering Code  
Marking  
03N60C3  
SPN03N60C3  
SOT-223  
Q67040S4552  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
A
Continuous drain current  
I
D
T = 25 °C  
T = 70 °C  
A
0.7  
0.4  
A
3
Pulsed drain current, t limited by T  
I
D puls  
p
jmax  
T = 25 °C  
A
3.2  
Avalanche current, repetitive t limited by T  
I
AR  
jmax AR  
Gate source voltage static  
V
V
±20  
30  
1.8  
GS  
V
P
Gate source voltage AC (f >1Hz)  
Power dissipation, TA = 25°C  
GS  
tot  
W
°C  
Operating and storage temperature  
T , T  
-55... +150  
j
stg  
Rev. 2.1  
Page 1  
2005-02-21  
SPN03N60C3  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Drain Source voltage slope  
dv/dt  
50  
V/ns  
V
= 480 V, I = 3.2 A, T = 125 °C  
D j  
DS  
Thermal Characteristics  
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
-
25  
-
K/W  
Thermal resistance, junction - soldering point  
SMD version, device on PCB:  
@ min. footprint  
R
thJS  
R
thJA  
-
-
110  
-
-
70  
2
1)  
@ 6 cm cooling area  
Electrical Characteristics, at Tj=25°C unless otherwise specified  
Parameter  
Symbol  
Conditions  
Values  
Unit  
min.  
typ. max.  
V
V
=0V, I =0.25mA 600  
-
-
-
V
Drain-source breakdown voltage  
Drain-Source avalanche  
breakdown voltage  
(BR)DSS GS  
D
V
=0V, I =3.2A  
-
700  
V
GS  
D
(BR)DS  
I =135µΑ, V =V  
2.1  
3
3.9  
Gate threshold voltage  
Zero gate voltage drain current  
V
I
D
GS DS  
GS(th)  
V
=600V, V =0V,  
µA  
DS  
GS  
DSS  
T =25°C,  
-
-
0.5  
-
1
70  
j
T =150°C  
j
V
V
=30V, V =0V  
-
-
100 nA  
Gate-source leakage current  
Drain-source on-state resistance R  
I
GSS  
GS  
DS  
=10V, I =2A,  
GS  
D
DS(on)  
T =25°C  
-
-
-
1.26  
3.8  
10  
1.4  
-
-
j
T =150°C  
j
R
f=1MHz, open Drain  
Gate input resistance  
G
Rev. 2.1  
Page 2  
2005-02-21  
SPN03N60C3  
Electrical Characteristics , at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
S
min.  
Transconductance  
g
V
2*I *R  
DS(on)max  
,
-
3.4  
-
fs  
DS  
D
I =0.4A  
D
Input capacitance  
C
V
=0V, V =25V,  
-
-
-
-
400  
150  
5
-
-
-
-
pF  
iss  
GS  
DS  
f=1MHz  
Output capacitance  
C
oss  
Reverse transfer capacitance  
C
rss  
2)  
V
V
=0V,  
Effective output capacitance,  
energy related  
C
12  
pF  
ns  
GS  
o(er)  
=0V to 480V  
DS  
3)  
Effective output capacitance,  
time related  
C
-
26  
-
o(tr)  
Turn-on delay time  
t
V
=350V, V =0/10V,  
-
-
-
-
7
3
64  
12  
-
-
d(on)  
DD  
GS  
I =0.7A, R =20Ω  
Rise time  
t
D
G
r
Turn-off delay time  
Fall time  
t
100  
20  
d(off)  
t
f
Gate Charge Characteristics  
Gate to source charge  
Q
Q
Q
V
=420V, I =0.7A  
-
-
-
2
6
13  
-
-
17  
nC  
V
gs  
gd  
g
DD  
D
Gate to drain charge  
V
V
=420V, I =0.7A,  
Gate charge total  
DD  
D
=0 to 10V  
GS  
V
=420V, I =0.7A  
-
5.5  
-
Gate plateau voltage  
V(plateau)  
DD  
D
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
2
Co(er) is a fixed capacitance that gives the same stored energy asCoss while VDS is rising from 0 to 80% VDSS  
.
3
Co(tr) is a fixed capacitance that gives the same charging time asCoss while VDS is rising from 0 to 80% VDSS  
.
Rev. 2.1  
Page 3  
2005-02-21  
SPN03N60C3  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
min.  
T =25°C  
A
-
-
0.7  
A
Inverse diode continuous  
forward current  
I
S
Inverse diode direct current,  
I
-
-
3
SM  
pulsed  
V
=0V, I =I  
F S  
-
-
-
-
-
1
250  
1.8  
15  
-
1.2  
400 ns  
-
-
V
Inverse diode forward voltage  
Reverse recovery time  
V
GS  
SD  
t
V =420V, I =I ,  
rr  
R
F S  
di /dt=100A/µs  
Reverse recovery charge  
Peak reverse recovery current  
Q
µC  
A
F
rr  
I
rrm  
540 A/µs  
Peak rate of fall of reverse  
recovery current  
di /dt  
rr  
Rev. 2.1  
Page 4  
2005-02-21  
SPN03N60C3  
1 Power dissipation  
= f (T )  
2 Safe operating area  
I = f ( V  
P
)
DS  
tot  
A
D
parameter : D = 0 , T =25°C  
A
10 1  
SPN03N60C3  
1.9  
W
A
1.6  
1.4  
1.2  
1
10 0  
10 -1  
0.8  
0.6  
0.4  
0.2  
0
tp = 0.001 ms  
tp = 0.01 ms  
10 -2  
tp = 0.1 ms  
tp = 1 ms  
tp = 10 ms  
DC  
10 -3  
0
20  
40  
60  
80 100 120  
160  
10 0  
10 1  
10 2  
10 3  
DS  
°C  
T
V
V
A
3 Transient thermal impedance  
= f (t )  
4 Typ. output characteristic  
I = f (V ); T =25°C  
Z
thJC  
p
D
DS  
j
parameter: D = t /T  
parameter: t = 10 µs, V  
p
p
GS  
10 2  
11  
A
K/W  
20V  
10 1  
10 0  
9
7V  
6.5V  
8
6V  
5.5V  
7
5V  
4.5V  
6
4V  
D = 0.5  
D = 0.2  
5
4
3
2
1
0
10 -1  
D = 0.1  
D = 0.05  
D = 0.02  
D = 0.01  
single pulse  
10 -2  
10 -3  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1  
10 1  
0
4
8
12  
16  
24  
DS  
s
V
t
V
p
Rev. 2.1  
Page 5  
2005-02-21  
SPN03N60C3  
5 Typ. output characteristic  
I = f (V ); T =150°C  
6 Typ. drain-source on resistance  
=f(I )  
R
D
DS  
j
DS(on)  
D
parameter: t = 10 µs, V  
parameter: T =150°C, V  
p
GS  
j
GS  
10  
6
4V  
20V  
A
4.5V  
5V  
7V  
6V  
8
7
6
5
4
3
2
1
5.5V  
6V  
5.5V  
5V  
6.5V  
8V  
4
3
2
1
0
4.5V  
4V  
20V  
3.5V  
0
4
8
12  
16  
24  
DS  
0
1
2
3
4
5
6
8
V
A
I
V
D
7 Drain-source on-state resistance  
= f (T )  
8 Typ. transfer characteristics  
I = f ( V ); V 2 x I x R  
DS(on)max  
R
DS(on)  
j
D
GS  
DS  
D
parameter : I = 0.4 A, V = 10 V  
parameter: t = 10 µs  
D
GS  
p
SPN03N60C3  
8
11  
A
25°C  
9
8
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
150°C  
98%  
typ  
°C  
-60  
-20  
20  
60  
100  
180  
0
2
4
6
8
10 12 14 16  
20  
V
V
T
GS  
j
Rev. 2.1  
Page 6  
2005-02-21  
SPN03N60C3  
9 Typ. gate charge  
= f (Q  
10 Forward characteristics of body diode  
V
)
I = f (V  
)
GS  
Gate  
F
SD  
parameter: I = 0.7 A pulsed  
parameter: T , tp = 10 µs  
D
j
10 1  
SPN03N60C3  
SPN03N60C3  
16  
V
A
12  
10 0  
0.2 VDS max  
10  
0.8 VDS max  
8
6
4
2
0
10 -1  
Tj = 25 °C typ  
Tj = 150 °C typ  
Tj = 25 °C (98%)  
Tj = 150 °C (98%)  
10 -2  
nC  
0
2
4
6
8
10 12 14 16  
20  
0
0.4  
0.8  
1.2  
1.6  
2
2.4  
3
V
Q
V
Gate  
SD  
11 Typ. drain current slope  
di/dt = f(R ), inductive load, T = 125°C  
12 Typ. switching time  
t = f (R ), inductive load, T =125°C  
G
j
G
j
par.: V =380V, V =0/+13V, I =0.7A  
par.: V =380V, V =0/+13V, I =0.7 A  
DS  
GS  
D
DS  
GS  
D
1500  
500  
A/µs  
ns  
1200  
1050  
900  
750  
600  
450  
300  
150  
0
400  
350  
300  
250  
200  
150  
100  
50  
td(off)  
tf  
td(on)  
tr  
di/dt(on)  
120  
di/dt(off)  
80  
0
0
40  
160  
220  
0
20 40 60 80 100 120 140 160  
200  
R
R
G
G
Rev. 2.1  
Page 7  
2005-02-21  
SPN03N60C3  
13 Typ. switching time  
t = f (I ), inductive load, T =125°C  
14 Typ. drain source voltage slope  
dv/dt = f(R ), inductive load, T = 125°C  
D
j
G
j
par.: V =380V, V =0/+13V, R =20Ω  
par.: V =380V, V =0/+13V, I =0.7A  
D
DS  
GS  
G
DS  
GS  
100  
90  
ns  
V/ns  
80  
70  
60  
50  
40  
30  
20  
10  
0
70  
60  
50  
40  
30  
20  
10  
0
dv/dt(on)  
td(off)  
tf  
td(on)  
tr  
dv/dt(off)  
0
0.5  
1
1.5  
2
2.5  
3.5  
0
20 40 60 80 100 120 140 160  
200  
A
I
R
D
G
15 Typ. switching losses  
E = f (I ), inductive load, T =125°C  
16 Typ. switching losses  
E = f(R ), inductive load, T =125°C  
D
j
G
j
par.: V =380V, V =0/+13V, R =20Ω  
par.: V =380V, V =0/+13V, I =0.7A  
DS  
GS  
G
DS  
GS  
D
0.01  
0.06  
*) E includes SDP06S60  
on  
diode commutation losses.  
*) E includes SDP06S60  
on  
diode commutation losses.  
mWs  
mWs  
0.008  
0.007  
0.006  
0.005  
0.004  
0.003  
0.002  
0.001  
0
0.048  
0.042  
0.036  
0.03  
Eoff  
Eon*  
Eon*  
Eoff  
0.024  
0.018  
0.012  
0.006  
0
0
0.5  
1
1.5  
2
2.5  
3.5  
0
40  
80  
120  
160  
220  
A
R
I
D
G
Rev. 2.1  
Page 8  
2005-02-21  
SPN03N60C3  
17 Drain-source breakdown voltage  
= f (T )  
18 Typ. capacitances  
C = f (V  
V
)
DS  
(BR)DSS  
j
parameter: V =0V, f=1 MHz  
GS  
10 4  
SPN03N60C3  
720  
V
pF  
10 3  
680  
660  
640  
620  
600  
580  
560  
540  
Ciss  
10 2  
Coss  
10 1  
Crss  
10 0  
-60  
-20  
20  
60  
100  
180  
0
100  
200  
300  
400  
600  
DS  
°C  
V
V
T
j
19 Typ. C  
stored energy  
oss  
E
=f(V  
)
oss  
DS  
2.5  
µJ  
1.5  
1
0.5  
0
0
100  
200  
300  
400  
600  
DS  
V
V
Rev. 2.1  
Page 9  
2005-02-21  
SPN03N60C3  
Definition of diodes switching characteristics  
Rev. 2.1  
Page 10  
2005-02-21  
SPN03N60C3  
SOT-223  
Rev. 2.1  
Page 11  
2005-02-21  
SPN03N60C3  
Published by  
Infineon Technologies AG,  
81726 Munich, Germany  
© Infineon Technologies AG 2000  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Rev. 2.1  
Page 12  
2005-02-21  

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