TLE493D-P2B6 A1 [INFINEON]
The Infineon TLE493D-P2B6 is our newest magnetic 3D Hall sensor enabled by new and improved accuracy. It is the best product for high performance applications with respect to pricing and package size.;
| 型号： | TLE493D-P2B6 A1 |
| 厂家： | 
Infineon |
| 描述： | The Infineon TLE493D-P2B6 is our newest magnetic 3D Hall sensor enabled by new and improved accuracy. It is the best product for high performance applications with respect to pricing and package size. |
| 文件： | 总21页 (文件大小：978K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Features
•
•
•
•
3D (X, Y, Z) magnetic flux density sensing of ±160 mT
Programmable flux resolution down to 65 µT (typ.)
X-Y angular measurement mode
Diagnostic measurements to check digital parts, analog parts and Hall
probe of the sensor
•
•
•
Wake Up function and Power down mode with 7 nA (typ.) power
consumption
12-bit data resolution for each measurement direction plus 10-bit
temperature sensor
Variable update frequencies and power modes (configurable during
operation)
PG-TSOP6-6-8
•
•
•
Temperature range Tj = -40°C…125°C, supply voltage range = 2.8 V…3.5 V
Triggering by external µC possible via I2C protocol
Interrupt signal to indicate a valid measurement to the microcontroller
Potential applications
The TLE493D-P2B6 is designed for a wide range of magnetic sensing, including the following:
•
•
•
•
Gear stick position
Control elements in the top column module and multi function steering wheel
Multi function knobs
Pedal/valve position sensing
Benefits
•
•
•
•
•
•
Component reduction due to 3D magnetic measurement principle
Wide application range addressable due to high flexibility
Platform adaptability due to device configurability
Supporting functional safety by means of integrated diagnostics
Very low system power consumption due to Wake-Up mode resulting in extended battery runtime
Disturbance of smaller stray fields are neglectable compared to the high magnetic flux measurement range
Product validation
Qualified for Automotive Applications. Product validation according to AEC-Q100.
Datasheet
Please read the Important Notice and Warnings at the end of this document
1.0
www.infineon.com
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Ordering information
Ordering information
Product type
Marking 1)
Ordering code
Package
Default address
write/read
TLE493D-P2B6 A0
TLE493D-P2B6 A1
TLE493D-P2B6 A2
TLE493D-P2B6 A3
P0
P1
P2
P3
SP005557415
SP005557413
SP005557411
SP005557408
PG-TSOP6-6-8
PG-TSOP6-6-8
PG-TSOP6-6-8
PG-TSOP6-6-8
6AH / 6BH
44H / 45H
F0H / F1H
88H / 89H
1
Engineering samples are marked with “SA”
Datasheet
2
1.0
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Table of contents
Table of contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
1.1
1.1.1
1.1.2
1.1.3
1.2
1.3
1.4
1.5
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Power mode control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Wake-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Definition of magnetic field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Sensitive area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Operating range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Magnetic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Overview of modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Interface and timing description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.1
2.2
2.3
2.4
2.5
2.6
2.7
3
3.1
3.2
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Package parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Datasheet
3
1.0
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Functional description
1
Functional description
This three dimensional Hall effect sensor can be configured by the microcontroller. The measurement data is
provided in digital format to the microcontroller. The microcontroller is the master and the sensor is the slave. It
also provides test functions and the capability to Wake-Up a sleeping system.
1.1
General
Description of the block diagram and its functions.
F-OSC
LP-OSC
Power Mode Control
VDD
GND
Bias
Wake-up
SCL; /INT
Lateral
Hall plates
Z-Direction
ADC
Digital tracking,
demodulation &
I²C interface
MUX
SDA
Vertical
Hall plates
Y-Direction
Temperature
Figure 1
Block diagram
The IC consists of three main functional units containing the following building blocks:
•
•
•
The power mode control system, containing a low-power oscillator, basic biasing, accurate restart,
undervoltage detection and a fast oscillator.
The sensing unit, which contains the HALL biasing, HALL probes with multiplexers and successive tracking
ADC, as well as a temperature sensor is implemented.
The I2C interface, containing the register files and I/O pads
1.1.1
Power mode control
The power mode control provides the power distribution in the IC, a power-on reset function and a specialized
low-power oscillator as the clock source. It also manages the start-up behavior.
•
On start-up, this unit:
-
-
activates the biasing, provides an accurate reset detector and fast oscillator
sensor enters low power mode and can be configured via I2C interface
•
Aꢀer re-configuration, a measurement cycle is performed, which consists of the following steps:
-
-
-
activating internal biasing, checking for the restart condition and providing the fast oscillator
HALL biasing
measuring the three HALL probe channels sequentially (including the temperature). This is enabled by
default
-
reentering configured mode
Datasheet
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2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Functional description
In any case functions are only executed if the supply voltage is high enough, otherwise the restart circuit will
halt the state machine until the required level is reached and restart aꢀerwards. The functions are also restarted
if a restart event occurs in between (see parameter ADC restart level ).
1.1.2
Sensing
Measures the magnetic field in X, Y and Z direction. Each X-, Y- and Z-Hall probe is connected sequentially to a
multiplexer, which is then connected to an analog to digital converter (ADC). Optional, the temperature (default
= activated) can be determined as well aꢀer the three Hall channels.
1.1.3
Wake-Up
For each of the three magnetic channels (X/Y/Z), the Wake-Up function has an upper and lower comparison
threshold. Each component of the applied field is compared to the lower and upper threshold. If one of the
results is above or below these thresholds, an interrupt pulse /INT is generated. This is called a Wake-Up
function. The sensor signals a certain field strength change to the microcontroller. As long as all components
of the field stay within the envelope, no interrupt signal will be provided. Note however that the /INT can also
be inhibited during I2C activities, by activated collision avoidance. A Wake-Up interrupt /INT is the logical OR
among all Wake-Up interrupt envelopes of the three channels.
1.2
Pin configuration (top view)
Figure 2 shows the pinout of the TLE493D-P2B6.
Figure 2
Table 1
TLE493D-P2B6 pinout
TSOP6 pin description and configuration (see Figure 2)
Pin no.
Name
Description
1
SCL
Interface serial clock pin (input)
/INT
Interrupt pin, signals a finished measurement cycle, open-drain
2
3
4
5
6
GND
GND
VDD
GND
SDA
Connect to GND
Ground pin
Supply pin
Connect to GND
Interface serial data pin (input/output), open-drain
Datasheet
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2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Functional description
1.3
Definition of magnetic field
A positive field is considered as south-pole facing the corresponding Hall element.
Figure 3 shows the definition of the magnetic directions X, Y, Z of the TLE493D-P2B6.
Figure 3
Definition of magnetic field direction
1.4
Sensitive area
The magnetic sensitive area for the Hall measurement is shown in Figure 4.
Figure 4
Center of sensitive area (dimensions in mm)
Datasheet
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2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Functional description
1.5
Application circuit
The use of an interrupt line is optional, but highly recommended to ensure proper and efficient readout of the
sensor data.
The pull-up resistor values of the I2C bus have to be calculated in such a way as to fulfill the rise and fall time
specification of the interface for the given worst case parasitic (capacitive) load of the actual application setup.
Please note: Too small resistive R1/2 values have to be prevented to avoid unnecessary power consumption
during interface transmissions, especially for low-power applications.
VDD
Power
Supply
R1
R2
GND
RSDA
VDD
VDD
SDA
TLE493D
CBuf
RSCL
C1
µC
SCL
(/INT)
GND
GND
R1 = 1.2kΩ
R2 = 1.2kΩ
C1 = 100nF
Optional (recommended for wire harness ): RSDA, RSCL
SDA, SCL capacitance < 200 pF each, including all stray capacitances
Figure 5
Application circuit with external power supply and µC
For additional EMC precaution in harsh environments, C1 may be implemented by two 100 nF capacitors in
parallel, which should be already given by CBuf near the µC and/or power supply.
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2
Specification
This sensor is intended to be used in an automotive environment. This chapter describes the environmental
conditions required by the device (magnetic, thermal and electrical).
2.1
Absolute maximum ratings
Stresses above those listed under “Absolute maximum ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Furthermore, only single error cases are
assumed. More than one stress/error case may also damage the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During
absolute maximum rating overload conditions the voltage on VDD pin with respect to ground (GND) must not
exceed the values defined by the absolute maximum ratings.
Table 2
Absolute maximum ratings
Symbol
Parameter
Values
Unit
Note or test condition
Min.
-40
-0.3
–
Typ.
Max.
125
3.5
Junction temperature
Voltage on VDD
Tj
–
–
–
–
°C
V
VDD
Bmax
Vmax
Magnetic field
±1
T
Voltage range on any pin to GND
-0.1
3.5
V
open-drain outputs are
not current limited.
Table 3
ESD protection2)
Ambient temperature TA = 25°C
Parameter
Symbol
Values
Unit
Note or test condition
Min.
Typ.
Max.
ESD voltage (HBM)3)
ESD voltage (CDM)4)
VESD
–
–
–
–
–
–
±2.0
±0.75
±0.5
kV
kV
kV
R = 1.5 kΩ, C = 100 pF
for corner pins
all pins
2
Characterization of ESD is carried out on a sample basis, not subject to production test.
Human body model (HBM) tests according to ANSI/ESDA/JEDEC JS-001.
Charged device model (CDM), ESD susceptibility according to JEDEC JESD22-C101.
3
4
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2.2
Operating range
To achieve ultra low power consumption, the chip does not use a conventional, power-consuming restart
procedure. The focus of the restart procedure implemented is to ensure a proper supply for the ADC operation
only. So it inhibits the ADC until the sensor supply is high enough.
Table 4
Operating range
Symbol
Parameter
Values
Typ.
–
Unit
Note or test condition
Min.
-40
Max.
125
3.5
Operating temperature
Supply voltage
Tj
°C
V
Tj = Ta +3 K in fast mode
VDD
2.8
3.3
Supply voltage must be above
restart level
ADC restart level
Vres
2.2
–
2.5
50
–
2.8
–
V
Min. ADC operating level
ADC restart hysteresis
Register stable level
Vres-hys
Vreg
mV
V
–
2.5
Register values are stable above
this voltage level
The sensor relies on a proper supply ramp defined with tPUP, VOUS and IDD-PUP, see Figure 6. The I2C reset
feature of the sensor shall be used by the µC aꢀer power up. If supply monitoring is used in the system (e.g.
brown-out detector etc.), it is also recommended to use the I2C reset of the sensor following events detected by
this monitor.
In any case, an external supply switch (either provided by a system-basis-chip solution which includes a
supply-enable feature, a Bias-resistor-transistor device, a capable µC GPIO pin, etc.) shall allow a power-cycle of
the sensor as backup for high availability applications to cope with any form of VDD ramps (including potential
EMC influences), see Figure 6.
At power up, SDA and SCL shall be pulled to VDD using R1 and R2 of Figure 5 and not be driven to low by any
device or µC on SDA and SCL.
VDD
3.3V
tPUP
tAPC
t
Figure 6
VDD power up and power cycle for high availability
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
Table 5
VDD power up and power cycle
Symbol
Parameter
Values
Unit Note or test condition
Min. Typ. Max.
Power up ramp time
Availability power cycle5)
tPUP
tAPC
VOUS
–
–
3
–
10
µs
µs
150
3.3
400
3.5
Power up over- undershoot
V
Envelope which must not be
exceeded at the end of a power up.
Power up current consumption IDD-PUP
–
–
10
mA
Current consumption during tPUP
2.3
Electrical characteristics
This sensor provides different operating modes and a digital communication interface. The corresponding
electrical parameters are listed in Table 6. Regarding current consumption more information are available in
Chapter 2.6.
Table 6
Electrical setup
Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C (unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or test condition
Min. Typ. Max.
Supply current 6)
IDD_pd
IDD_fm
VIL
–
7
130
5
nA
Tj = 25°C; power down mode
1
3.4
–
mA
Fast mode
Input voltage low threshold7)
Input voltage high threshold7)
Input voltage hysteresis7)
–
30
–
%VDD All input pads
%VDD All input pads
%VDD All input pads
VIH
70
5
–
VIHYS
–
–
Output voltage low level @ 3 mA load VOL
–
–
0.4
V
All output pads, static load
5
Not subject to production test - verified by design.
6
7
Currents at pull up resistors (Figure 5) needs to be considered for power supply dimensioning.
Based on I2C standard 1995 for VDD related input levels
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2.4
Magnetic characteristics
The magnetic parameters are specified for an end of line production scenario and for an application life
time scenario. The magnetic measurement values are provided in the two’s complement with 12 bit or 8 bit
resolution in the registers with the symbols Bx, By and Bz. Two examples, how to calculate the magnetic flux
density are shown in Table 10 and Table 11.
Table 7
Values for VDD = 3.3 V, Tj = 25°C (unless otherwise specified)
Initial magnetic characteristics8)
Parameter
Symbol
Values
Typ.
–
Unit
Note or test
condition
Min.
-160
-100
6
Max.
160
100
10
Magnetic linear range9) (full range)
Magnetic linear range9) (short range) Bxyz_LINSR
Bxyz_LIN
mT
mT
-40°C < Tj < 125°C
–
Sensitivity X, Y, Z (full range)
Sx, Sy, Sz
7.7
LSB12/
mT
Sensitivity X, Y, Z (short range)
Z-Offset (full range and short range)
SxSR, SySR, SzSR 12
B0z -1.8
15.4
±0.2
20
1.8
0.75
5
mT
mT
%
@ 0 mT
@ 0 mT
XY-Offset (full range and short range) B0xy
-0.75 ±0.2
X to Y magnetic matching10)
X/Y to Z magnetic matching10)
MXY
-5
-19
–
±1
-4
MX/YZ
Bineff
11
%
Magnetic initial noise (rms)
(full range and short range)
0.1
0.4
mT
rms = 1 sigma
Magnetic hysteresis9)
(full range and short range)
BHYS
–
1
–
LSB12 due to quantization
effects
Sx − Sy
Sx + Sy
M
= 100 ⋅ 2 ⋅
%
XY
Equation 1
Parameter “X to Y magnetic matching”
Sx + Sy − 2 ⋅ Sz
Sx + Sy + 2 ⋅ Sz
MX/YZ = 100 ⋅ 2 ⋅
%
Equation 2
Parameter “X/Y to Z magnetic matching”
8
Magnetic test on wafer level. It is assumed that initial variations are stored and compensated in the
external µC during module test and calibration.
Not subject to production test - verified by design/characterization.
See the magnetic matching definition in Equation 1 and Equation 2.
9
10
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
Table 8
Sensor driꢀs11) valid for both full range and short range (unless indicated)
Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C, static magnetic field within full magnetic linear range (unless
otherwise specified)
Parameter
Symbol
Values
Unit Note or test condition
Min.
SxD, SyD, SzD -15
Typ.
±5
–
Max.
15
Sensitivity driꢀ X, Y, Z
Offset driꢀ X, Y
%
TC0
BO_DXY
BO_DZ
BO_DZ
MXY_D
-0.45
0.45
1.6
mT
mT
mT
%
@ 0 mT, TC0
Offset driꢀ Z
-1.6
-0.45
-1.9
-12
–
@ 0 mT, TC0
Offset driꢀ Z
X to Y magnetic matching driꢀ12)
–
0.45
1.9
@ 0 mT, TC0, Z Hall spin test
±0.5
±5
TC0
TC0
X/Y to Z magnetic matching driꢀ12) MX/YZ_D
12
%
Table 9
Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C (unless otherwise specified)
Temperature compensation, non-linearity and noise13)
Parameter
Symbol
Values
Typ.
±0
Unit
Note or test condition
Min.
Max.
Temperature compensation14)
(full range and short range)
TC0
TC1
TC2
TC3
DNL
–
–
–
–
–
–
–
–
–
–
–
–
ppm/K Bx, By and Bz (default)
Bx, By and Bz (option 1)
Bx, By and Bz (option 2)
Bx, By and Bz (option 3)
LSB12 Bx, By and Bz
-750
-1500
+350
±2
–
–
–
Differential non linearity (full range)
–
Differential non linearity (short range) DNLSR
±4
–
Integral non linearity (full range)
Integral non linearity (short range)
Magnetic noise (rms)
INL
±2
–
LSB12 Bx, By and Bz
INLSR
BNeff
BNeffZ
BNeffXY
±4
–
–
1
mT
mT
mT
rms = 1 sigma
Z-magnetic noise (rms)
–
0.5
0.25
rms = 1 sigma,
-40°C < Tj < 85°C
XY-magnetic noise (rms)
–
11
Not subject to production test, verified by design/characterization. Driꢀs are changes from the initial
characteristics Table 7 due to external influences.
See the magnetic matching definition in Equation 1 and Equation 2.
Not subject to production test, verified by design/characterization.
12
13
14
TCX must be set before magnetic flux trimming and measurements with the same value.
Datasheet
12
1.0
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
Conversion register value to magnetic field value:
Table 10
Magnetic conversion table for 12 bit
MSB
Bit10 Bit9
Bit8
256
1
Bit7
128
0
Bit6
64
Bit5
32
Bit4
16
Bit3
Bit2
Bit1
LSB
1
[Dec]
-2048 1024
512
1
8
1
4
1
2
1
[Bin] e.g.
1
1
0
0
0
1
The conversion is realized by the two’s complement. Please use following table for transformation:
Example for 12-bit read out: 1111 0000 1111B: -2048 + 1024 + 512 + 256 + 0 + 0 + 0 + 0 + 8 + 4 + 2 +1 = -241 LSB12
Calculation of magnetic flux density: -241 LSB12 x 0.13 mT/LSB12 = -31.3 mT
Table 11
Magnetic conversion table for 8 bit
MSB
-128
0
Bit10
64
Bit9
32
Bit8
16
Bit7
Bit6
Bit5
LSB
1
[Dec]
8
1
4
1
2
0
[Bin] e.g.
0
1
1
1
Example for 8-bit read out: 0011 1101B: 0 + 0 +32 + 16 + 8 + 4 + 0 + 1 = 61 LSB8
Calculation of magnetic flux density (full range): 61 LSB8 x 16 / 7.7 LSB8/mT = 127 mT
2.5
Temperature measurement
By default, the temperature measurement is activated. The temperature measurement can be disabled if it is
not needed and to increase the speed of repetition of the magnetic values.
Table 12
Temperature measurement characteristics15)
Parameter
Symbol
Values
Typ.
1180
0.24
Unit
Note or test condition
Min.
1000
0.21
–
Max.
1360
0.27
–
Digital value @ 25°C
T25
LSB12
Temperature resolution, 12 bit TRes12
Temperature resolution, 8 bit TRes8
K/LSB12
K/LSB8
referring to Tj
referring to Tj
3.84
Table 13
Temperature conversion table for 12 bit
The bits MSB to Bit2 are read out from the temperature value registers. Bit1 and LSB are added to get a 12-bit
value for calculation.
MSB
-2048
0
Bit10
1024
1
Bit9
512
0
Bit8
256
1
Bit7
128
0
Bit6
64
Bit5
32
Bit4
16
Bit3
Bit2
[Dec]
8
1
4
1
[Bin] e.g.
0
1
0
Example for 12-bit calculation: 0110 1010 11B: 0 + 1024 + 0 + 256 + 0 + 0 + 32 + 0 + 8 + 4 = 1324 LSB12
Calculation to temperature: (1324 LSB12 - 1180 LSB12) x 0.24 K/LSB12 + 25°C ≈ 60°C
15
The temperature measurement is not trimmed on the sensor. An external μC can measure the sensor
during module production and implement external trimming to gain higher accuracies. Temperature
values are based on 12 bit resolution. Please note: only bit 11 ... 2 are listed in the bitmap registers.
Datasheet
13
1.0
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2.6
Overview of modes
For a good adaptation on application requirements this sensor is equipped with different modes. An overview is
listed in Table 14.
Table 14
Overview of modes16)
17)
Mode
Measurements
No measurements
Bx, By, Bz, T
Typ. fUpdate
Description
Power down
–
Lowest possible supply current IDD
Low power mode
0.05 Hz - 770 Hz Cyclic measurements and ADC-
conversions with different update rates
(full range and short range)
(8 steps)
Bx, By, Bz
Bx, By
Fast mode
(full range)
Bx, By, Bz, T
Bx, By, Bz
Bx, By
5.8 kHz
7.8 kHz
11.6 kHz
4.5 kHz
5.6 kHz
8.5 kHz
Measurements and ADC conversions are
running continuously.
An I2C clock speed up to 1 MHz and use of
the interrupt /INT is required.
Fast mode
(short range)
Bx, By, Bz, T
Bx, By, Bz
Bx, By
Master controlled mode
(full range and short range)
Bx, By, Bz, T
Bx, By, Bz
Bx, By
Up to fast mode Measurements triggered by the
values
microcontroller via I2C
Typical IDD current consumption estimation formula (e.g. full range and all channels):
I
≈ I
⋅ f
⋅ t + t + t + t
DD
DD_fm
Update
Bx
By
Bz
Temp
Equation 3
IDD estimation formula
16
Not subject to production test - verified by design/characterization.
This is the frequency at which specified measurements are updated.
17
Datasheet
14
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2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2.7
Interface and timing description
This chapter refers to how to set the boundary conditions in order to establish a proper interface
communication.
Table 15
Interface and timing18)
Symbol
Parameter
Values
Typ.
43
Unit
Note or test condition
Min.
Max.
Bx, By and Bz conversion time
(full range)
tBx,
tBy
32
54
μs
,
tBz
Bx, By and Bz conversion time
(short range)
tBx_SR
tBy_SR
tBz_SR
,
,
44
32
59
43
74
54
μs
μs
Temp conversion time
(all ranges)
tTemp
/INT pulse width
tINT
1.8
1.8
2.5
2.5
3.2
3.2
μs
μs
/INT delay
tINT_d
I2C timings
Allowed I2C bit clock frequency19)
Low period of SCL clock
High period of SCL clock
fI2C_clk
tL
–
400
–
1000
kHz
μs
0.5
0.4
0.4
–
–
–
1.3 μs for 400-kHz mode
0.6 μs for 400-kHz mode
0.6 μs for 400-kHz mode
tH
–
μs
SDA fall to SCL fall hold time
tSTA
–
μs
(hold time start condition to clock)
SCL rise to SDA rise setup time
(setup time clock to stop condition)
tSTOP
tWAIT
0.4
0.4
–
–
–
–
μs
μs
0.6 μs for 400-kHz mode
0.6 μs for 400-kHz mode
SDA rise to SDA fall hold time
(wait time from stop to start cond.)
SDA setup before SCL rising
SDA hold aꢀer SCL falling
Fall time SDA/SCL signal20)
Rise time SDA/SCL signal20)
tSU
0.1
0
–
–
μs
μs
µs
µs
tHOLD
tFALL
tRISE
–
–
–
0.25
0.5
0.3
–
–
R = 1.2 kΩ
The fast mode, shown in Figure 7, requires a very strict I2C behavior synchronized with the sensor conversions
and high bit rates. In this mode, a fresh measurement cycle is started immediately aꢀer the previous cycle was
completed.
Other modes are available for more relaxed timing and also for a synchronous microcontroller operation of
sensor conversions. In these modes, a fresh measurement cycle is only started if it is triggered by an internal or
external trigger source.
18
Not subject to production test - verified by design/characterization
Dependent on R-C-combination on SDA and SCL. Ensure reduced capacitive load for speeds above
19
400 kHz.
20
Dependent on used R-C-combination.
Datasheet
15
1.0
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
In the default measurement configuration (Bx, By, Bz and T), shown in Figure 7, the measurement cycle ends
aꢀer the temperature measurement.
In 3-channel measurement configuration (Bx, By and Bz), the temperature channel is not converted and
updated. Thus, the measurement cycle ends aꢀer the Bz measurement.
In X/Y angular measurement configuration (Bx and By), the Bz and temperature channel are not converted and
updated. Thus, the measurement cycle ends aꢀer the By measurement.
*) setup/hold time for i2c readout to register value.
first register
address is 0,
trigger bits are 0
SCL falling edge SCL falling edge SCL falling edge SCL falling edge
shadowed LSBs
from prev.
MSBs read
status output starts
with odd parity bit of
last 6 bytes transmitted
time must be either:
or:
addressing options;
R/W bit is 1
@ ACK bit
@ ACK bit
reads Y[n-1]
@ ACK bit
reads Z[n-1]
@ ACK bit
reads T[n-1]
1
1
reads X[n-1]
tS/H
≥
tS/H
≤
-
fi2c_clk
fi2c_clk
(update after read)
(update before read)
i2c bus protocol
SCL / SDA
transmission direction
X[n-1]LSBs Z[n-1]LSBs
Y[n-1]LSBs T[n-1]LSBs
S
i2c_adr sens_reg X[n-1]MSBs Y[n-1]MSBs Z[n-1]MSBs T[n-1]MSBs
STATUS
P
S
i2c_adr sens_reg X[n-1]MSBs
Mà S Mà S Sà M
Mà S
Mà S
Sà M
Sà M
Sà M
Sà M
Sà M
Sà M
Sà M
t
S/H *)
t
S/H *)
corresponds to 10bit addressing:
two bytes following a S condition
(i2c standard 1995, section 13.1)
µC can start
readout after
/INT is high
again
tS/H *)
t
S/H *)
/INT
tINT
tINT
tINT_d
tINT_d
1 / update_rate (fast mode)
tBy
tBx
X[n-1]
tBz
tTemp
tBx
X value register
X[n]
Y[n-1]
Y[n]
Y value register
Z value register
T value register
Z[n-1]
By
Z[n]
T[n-1]
T[n]
Bx
ADC conversion
chan. (fast mode)
Bx
Bz
T
Figure 7
I2C readout frame, ADC conversion and related timing
tRISE
tFALL
tH
tL
tSTOP
tWAIT
tSTA
70% VDD
30% VDD
SCL
pin
70% VDD
30% VDD
SDA
pin
tHOLD
tSU
1 bit transfer
STOP cond.
START cond .
Figure 8
I2C timing specification
Datasheet
16
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2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Package information
3
Package information
3.1
Package parameters
Table 16
Package parameters
Parameter
Symbol
Values
Min.
–
Unit
Notes
Typ.
Max.
Thermal resistance21)
Junction ambient
RthJA
RthJL
MSL 1
–
200
K/W
K/W
Junction to air for
PG-TSOP-6-6-8
Thermal resistance
Junction lead
Soldering moisture level22)
–
–
100
Junction to lead for
PG-TSOP-6-6-8
260°C
Figure 9
Image of TLE493D-P2B6 in TSOP6
Figure 10
Footprint PG-TSOP6-6-8 (compatible to PG-TSOP6-6-5, all dimensions in mm)
21
According to Jedec JESD51-7
Suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020D.1 (March 2008)
22
Datasheet
17
1.0
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Package information
3.2
Package outlines
Figure 11
Package outlines (all dimensions in mm)
Datasheet
18
1.0
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Package information
Figure 12
Packing (all dimensions in mm)
Further information about the package can be found here:
http://www.infineon.com/cms/en/product/packages/PG-TSOP6/PG-TSOP6-6-8/
Datasheet
19
1.0
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Revision history
Revision history
Document
version
Date of
release
Description of changes
V1.0
2021-01-12
Initial release
Datasheet
20
1.0
2021-01-12
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2021-01-12
Published by
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