TLE5014P16D [INFINEON]
Giant Magneto Resistance (GMR)-based principle;
| 型号： | TLE5014P16D |
| 厂家： | 
Infineon |
| 描述： | Giant Magneto Resistance (GMR)-based principle |
| 文件： | 总13页 (文件大小：438K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLE5014D
Preface
This document is an addendum to the TLE5014 datasheet and describes the
TLE5014D dual die angle sensor. For all parameters which are not specified
here, the TLE5014 datasheet is valid.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Giant Magneto Resistance (GMR)-based principle
Two identical dies in one package (providing channel 1 and channel 2 output)
Fully redundant 2-channel solution for highest functional safety requirements
High voltage and reverse polarity capability
EEPROM for storage of configuration (e.g. zero angle) and customer specific ID
12 bit representation of absolute angle value on the output
Max. 1° angle error over lifetime and temperature range
Developed according to ISO26262 with process complying to ASIL-D
Internal safety mechanisms with diagnostic coverage >97% for each channel
Interfaces: PWM, SPC, SENT (based on SAE J2716-2010)
32 point look-up table to correct for systematic angle errors (e.g. magnetic circuit)
112 bit customer ID (programmable)
Automotive qualified Q100, Grade 1: -40°C to 125°C (ambient temperature)
Functional Safety
Safety Manual and Safety Analysis Summary Report available on request
•
Applications
The TLE5014 GMR-based angle sensor is designed for angular position sensing in automotive applications.
Fully redundancy of two chips in one package supporting highest functional safety requirements.
Description
Table 0-1 Derivative Ordering codes (see Chapter 4 for description of derivatives)
Product Type
TLE5014S16D
TLE5014C16D
TLE5014P16D
Marking
014SD
014CD
014PD
Ordering Code
SP001410046
SP001410042
SP001673472
Package
Comment
PG-TDSO-16
PG-TDSO-16
PG-TDSO-16
SENT Interface
SPC Interface
PWM Interface
Final Datasheet
www.infineon.com
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TLE5014D
Table of Contents
1
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Pin Description 3
2
3
Dual Sensor Angle Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Pre-Configured Derivatives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1
4.2
4.3
TLE5014C16D 6
TLE5014S16D 6
TLE5014P16D 7
5
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1
5.2
5.3
5.4
5.5
Package Parameters 8
Package Outline 9
Footprint 10
Packing 10
Marking 11
6
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Final Datasheet
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TLE5014D
Pin Configuration
1
Pin Configuration
16
15
14
13
12
11
10
9
Center of
Sensitive area
1
2
3
4
5
6
7
8
Figure 1-1 Pin configuration (top view)
1.1
Pin Description
The following table describes the pin-out of the chip. Pins 1-8 correspond to channel 1 of the sensor (top IC in
the package). Pins 9-16 correspond to channel 2 (bottom IC in the package). The two sensors are galvanically
decoupled.
Table 1-1 Pin Description
Pin No.
1
Symbol
IF1-1
In/Out
I
Function
address coding for programming in bus mode,
channel 1 (see TLE5014 datasheet)
connect to GND for SENT / PWM interface
2
IF2-1
I
address coding for programming in bus mode,
channel 1 (see TLE5014 datasheet)
connect to GND for SENT / PWM interface
3
4
5
6
7
8
IF3-1
I
connect to IFC
VDD-1
GND-1
IFA-1
IFB-1
IFC-1
-
supply voltage, positive for channel 1
supply voltage, ground for channel 1
connect to GND
-
-
I/O
O
SENT / SPC / PWM / SICI interface for channel 1
address coding for programming in bus mode,
channel 1 (see TLE5014 datasheet)
connect to IF3
Final Datasheet
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TLE5014D
Dual Sensor Angle Output
Table 1-1 Pin Description (cont’d)
Pin No.
9
Symbol
IFC-2
In/Out
O
Function
address coding for programming in bus mode,
channel 2 (see TLE5014 datasheet)
connect to IF3
10
11
12
13
14
15
IFB-2
IFA-2
GND-2
VDD-2
IF3-2
I/O
SENT / SPC / PWM / SICI interface for channel 2
connect to GND
-
-
-
I
supply voltage, ground for channel 2
supply voltage, positive for channel 2
connect to IFC
IF2-2
I
address coding for programming in bus mode,
channel 2 (see TLE5014 datasheet)
connect to GND for SENT / PWM interface
16
IF1-2
I
address coding for programming in bus mode,
channel 2 (see TLE5014 datasheet)
connect to GND for SENT / PWM interface
2
Dual Sensor Angle Output
The bottom sensor element of the Product_Short is flipped relative to the orientation of the top sensor
element Therefore the rotation direction sensed by the bottom element is opposite to the top element. This
is advantageous for safety critical applications, as the two sensor elements do generally not output the same
angle. Figure 2-1 shows the output of the two sensor ICs for a given external magnetic field orientation.
360°
top sensor output
bottom sensor output
270°
180°
90°
0°
90°
180°
270°
360°
external magnetic field angle
Figure 2-1 Dual die angle output
For applications where an identical angle output of both ICs is desired, the rotation direction and angle offset
of one sensor IC can be reconfigured by changing the settings in the ANG_BASE register of the EEPROM.
Final Datasheet
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TLE5014D
Absolute Maximum Ratings
3
Absolute Maximum Ratings
Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure
to absolute maximum rating conditions for extended periods may affect device reliability. Maximum
ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to
the device.
Table 3-1 ESD protection
Parameter
Symbol
Values
Unit
Notes
Min.
Max.
±4.0 kV
Electro-Static-Discharge VHBM
voltage (HBM), according
to
HBM contact discharge
for pins VDD, GND, IFB;
ground pins connected
ANSI/ESDA/JEDEC JS-001
VHBM
±2.0 kV
HBM contact discharge
for all pins,
ground pins not connected
Electro-Static-Discharge
voltage (CDM), according
to JESD22-C101
VCDM
±0.5 kV
for all pins except corner pins
for corner pins only
±0.75 kV
Final Datasheet
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TLE5014D
Pre-Configured Derivatives
4
Pre-Configured Derivatives
Derivatives of the TLE5014D are available with different pre-configured register settings for specific
application (“settings”). For each derivative with such settings, the interface type is locked and cannot be
changed. Only the derivatives with such settings have been released for production by Infineon.
Other settings/parameters for other applications could be adjusted but such adjusted settings would not have
been released for production by Infineon.
Furthermore, the available safety analysis and safety manual does only include these preconfigured
derivatives.
4.1
TLE5014C16D
The sensor has SPC as predefined interface which is locked and cannot be changed.
The predefined SPC configuration of TLE5014C16D is shown below:
Table 4-1 SPC Derivative Configuration TLE5014C16D
Interface
SPC
SPC unit time
2.5µs
SPC low time
5UT
SPC Trigger
Short Serial Message
enabled
constant 90UT
Table 4-2 SPC Derivative Configuration TLE5014C16D
Rolling Counter
enabled
Rolling Counter in CRC Look-up Table
disabled
SPC ID
Output driver
enabled, preconfigured 00B
open drain w/
controlled slope
Following parameters and values are allowed to modify:
•
•
•
•
SPC unit time: 1.5µs / 2.5µs
Short serial message: enable / disable
Rolling counter in CRC: enable /disable
SPC ID: 0 / 1 / 2 / 3
4.2
TLE5014S16D
The sensor has SENT as predefined interface which is locked and cannot be changed.
The predefined SENT configuration of TLE5014S16D is shown below:
Table 4-3 SENT Derivative Configuration TLE5014S16D
Interface
SENT
SENT unit time
3.0µs
SENT low time
5UT
SENT Protocol Type Short Serial Message
single secure sensor enabled
Table 4-4 SENT Derivative Configuration TLE5014S16D
SENT Error Indication
SENT Data Range Pause Pulse Look-up Table
Output driver
error code 4091 enabled 1 ... 4088
enabled
enabled, preconfigured push/pull
Following parameters and values are allowed to modify:
•
•
•
Short serial message: enable / disable
Pause pulse: enable /disable
SENT Protocol Type: Standard / Single Secure Sensor
Final Datasheet
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TLE5014D
Pre-Configured Derivatives
•
SENT Error Indication: enable (data range: 1 ... 4088 , error code: 4091) / disable (data range: 0 ... 4095, no
error code)
4.3
TLE5014P16D
The sensor has PWM as predefined interface which is locked and cannot be changed.
Table 4-5 PWM Derivative Configuration TLE5014P16D
Interface
PWM
PWM Frequency
200Hz
PWM Data Range
12.5% ... 87.5%
PWM Fault
indication
PWM BIST Error or
Reset Indication
5%
95%
Table 4-6 PWM Derivative Configuration TLE5014P16D
PWM Starting Level
high (rising edge)
Look-up Table
Output driver
push/pull
enabled, preconfigured
•
To be compliant with the existing safety analysis no change of above parameters is allowed unless
authorized by Infineon
Final Datasheet
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Rev. 1.0
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TLE5014D
Package Information
5
Package Information
The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant.
5.1
Package Parameters
Table 5-1 Package Parameters
Parameter
Symbol Limit Values
Min. Typ. Max.
Unit
Notes
Thermal resistance
RthJA
120 K/W
Junction to air1), only one
chip is active
100 K/W
Junction to air1), both chips
are active
RthJC
RthJL
45
70
K/W
K/W
Junction to case
Junction to lead
260°C2)
Moisture Sensitively Level MSL 3
Lead Frame
Cu
Plating
Sn 100%
> 7 μm
1) according to Jedec JESD51-7
2) suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020E (December 2014)
Table 5-2 Position of the die in the package
Parameter
Tilt
Symbol Limit Values
Min. Typ. Max.
Unit
°
Notes
±3
in respect to the z-axis and
reference plane (see
Figure 5-1),
Rotational displacement
±3
°
in respect to the reference
axis (see Figure 5-1)
Placement tolerance in
package
±100 µm
in x and y direction, for each
die in the package
z
y
Tilt angle
Chip
Package
Chip
Reference plane
x
Die pad
Rotational
displacement
x
Figure 5-1 Tolerance of the die in the package
Final Datasheet
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TLE5014D
Package Information
5.2
Package Outline
Figure 5-2 PG-TDSO-16 package dimension
0.2
0.2
Figure 5-3 Position of sensing element
Final Datasheet
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Rev. 1.0
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TLE5014D
Package Information
5.3
Footprint
Figure 5-4 Footprint of PG TDSO-16
5.4
Packing
Figure 5-5 Tape and Reel
Final Datasheet
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Rev. 1.0
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TLE5014D
Package Information
5.5
Marking
Position
1st Line
2nd Line
3rd Line
Marking
Gxxxx
Description
G..green, 4-digit..date code
Interface type and version ( see Table 0-1, Marking)
Lot code
xxxxxxxx
xxx
Figure 5-6 Marking of PG-TDSO-16
Final Datasheet
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Rev. 1.0
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TLE5014D
Revision History
6
Revision History
Revision Date
Changes
1.0
2018-03-26
initial version
Final Datasheet
12
Rev. 1.0
2018-04-04
Please read the Important Notice and Warnings at the end of this document
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The information given in this document shall in no For further information on technology, delivery terms
Edition 2018-04-04
Published by
Infineon Technologies AG
81726 Munich, Germany
event be regarded as a guarantee of conditions or and conditions and prices, please contact the nearest
characteristics ("Beschaffenheitsgarantie").
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hereby disclaims any and all warranties and liabilities
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In addition, any information given in this document is
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