V23818-N15-L356_技术文档

Fiber Optics

Small Form Factor

V23818-N15-Lxx/Lxxx

Single Mode 1300 nm

Multirate up to 2.5 Gbit/s Transceiver

2x5/2x10 Pinning with LC™ Connector

Features

• Small Form Factor transceiver

• RJ-45 style LC™ connector system

• Half the size of SC Duplex 1x9 transceiver

• Optimized for SDH STM-16 / SONET OC-48

• Single power supply (3.3 V)

• Extremely low power consumption

• Loss of optical signal indicator

File: 1119

• Laser disable input

• LVPECL differential inputs and outputs

• Suitable for multirate applications up to 2.5 Gbit/s

• Distance up to 2 km on single mode fiber (SMF)

• Class 1 FDA and IEC laser safety compliant

• Multisource footprint

• Small footprint for high channel density

• UL 94 V-0 certified

File: 1120

• Compliant with FCC (Class B) and EN 55022

• Tx and Rx power monitor

For ordering information see next page.

LC™ is a trademark of Lucent.

Data Sheet

1

2003-08-18

V23818-N15-Lxx/Lxxx

Ordering Information

Part Number

Pinning Signal

Detect

Operating

Temperature if SD is Low

Data Outputs

Collar In- Out-

put put

V23818-N15-L17

V23818-N15-L16

V23818-N15-L353

V23818-N15-L356

V23818-N15-L354

V23818-N15-L355

V23818-N15-L37

V23818-N15-L36

V23818-N15-L47

V23818-N15-L46

V23818-N15-L457

2x10

LVPECL –5...70°C

–40...85°C

Switched to Low yes

DC DC

LVTTL

–5...70°C

–40...85°C

–5...70°C

AC AC

LVTTL

no

2x5

LVPECL –5...70°C

–40...85°C

Switched to Low yes

DC DC

AC AC

LVTTL

–5...70°C

–40...85°C

–5...70°C

–40...85°C

2x10

LVTTL

Active

yes

AC AC

V23818-N15-L356-C 2x10

Switched to Low yes¹⁾

1)

Incorporates non-standard collar type (see Figure 20 on Page 26).

Data Sheet

2

2003-08-18

V23818-N15-Lxx/Lxxx

Pin Configuration

HL

MS

Tx

Rx

HL

20 19 18 17 16 15 14 13 12 11

TOP VIEW

1

2 3 4 5 6 7 8 9 10

HL

File: 1335

Figure 1

2x10 Pin Connect Diagram

2x10 Pin Description

No.

Symbol Level/Logic

Description

1

PDBias DC current

PIN photo detector bias current

Receiver signal ground

Not connected

2

V_EEr

Ground

3

4

NC

5

NC

Not connected

6

V_EEr

Ground

Receiver signal ground

7

V_CCr

SD

Power supply

Receiver power supply

8

LVTTL or LVPECL output¹⁾Receiver optical input level monitor

9

RD–

RD+

V_CCt

LVPECL output

Power supply

Ground

Receiver data out bar

10

11

12

13

14

15

16

17

18

19

20

MS

Receiver data out

Transmitter power supply

Transmitter signal ground

Transmitter disable

V_EEt

TDis

TD+

TD–

LVTTL input

LVPECL input

Ground

Transmitter data in

Transmitter data in bar

Transmitter signal ground

Laser diode bias current monitor

Laser diode optical power monitor

Mounting studs

V_EEt

BMon–

BMon+

PMon–

PMon+

DC voltage

HL

Housing leads

1)

LVPECL output active high for V23818-N15-L17/L16/L417/L373.

LVTTL output active high for V23818-N15-L353/L356/L457/L355/L354.

Data Sheet

3

2003-08-18

V23818-N15-Lxx/Lxxx

Pin Configuration

HL

MS

Tx

Rx

HL

10 9 8 7 6

TOP VIEW

1 2 3 4 5

HL

File: 1331

Figure 2

2x5 Pin Connect Diagram

2x5 Pin Description

No.

Symbol Level/Logic

Description

1

V_EEr

V_CCr

SD

Ground

Receiver signal ground

Receiver power supply

2

Power supply

3

LVTTL or LVPECL output¹⁾Receiver optical input level monitor

4

RD–

RD+

V_CCt

V_EEt

TDis

TD+

TD–

LVPECL output

Power supply

Ground

Receiver data out bar

Receiver data out

5

6

Transmitter power supply

Transmitter signal ground

Transmitter disable

Transmitter data in

Transmitter data in bar

Mounting studs

7

8

LVTTL input

LVPECL input

9

10

MS

HL²⁾

Housing leads

1)

LVPECL output active high for V23818-N15-L37/L36.

LVTTL output active high for V23818-N15-L47/L46.

2)

Housing leads removed for V23818-N15-L46WH. Due to possible EMI performance issues, use of this

transceiver should be restricted to applications where the chassis is completely sealed and the transceiver

encapsulated within.

V

_EEr/ V_EEt

For 2x10 transceivers, connect pins 2, 3, 6, 12 and 16 to signal ground. For 2x5

transceivers, connect pins 1 and 7 to signal ground.

Data Sheet

4

2003-08-18

V23818-N15-Lxx/Lxxx

Pin Configuration

V

_CCr/ V_CCt

For 2x10 transceivers a 3.3 V DC power supply must be applied at pins 7 and 11. For

2x5 transceivers a 3.3 V DC power supply must be applied at pins 2 and 6. A

recommended power supply filter network is given in the termination scheme. Locate

power supply filtering directly at the transceiver power supply pins. Proper power supply

filtering is essential for good EMI performance.

TD+ / TD–

Transmitter data LVPECL level inputs. For V23818-N15-L353/L356/L457/L354/L355/

L47/L46/L373 terminated and AC coupled internally. For V23818-N15-L17/L16/L417/

L37/L36 use termination and coupling as shown in the termination scheme.

RD– / RD+

Receiver data LVPECL level outputs. For V23818-N15-L353/L356/L457/L354/L355/

L47/L46/L373 biased and AC coupled internally. For V23818-N15-L17/L16/L417/L37/

L36 use termination and coupling as shown in the termination scheme.

TDis

A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input

must be applied. Leave pin unconnected if feature not required.

SD

LVTTL output for V23818-N15-L353/L356/L457/L354/L355/L47/L46.

LVPECL output for V23818-N15-L17/L16/L417/L37/L36/L373.

A logical high output indicates normal optical input levels to the receiver. Low optical

input levels at the receiver result in a low output. Signal Detect can be used to determine

a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source.

However it is not a detection of a bad link due to data-related errors.

MS

Mounting studs are provided for transceiver mechanical attachment to the circuit board.

They also provide an optional connection of the transceiver to the equipment chassis

ground. The holes in the circuit board must be tied to chassis ground.

HL

Housing leads are provided for additional signal grounding. The holes in the circuit board

must be included and tied to signal ground.

Data Sheet

5

2003-08-18

V23818-N15-Lxx/Lxxx

Pin Configuration

2x10 Transceiver Additional Functionality

PDBias

Connect pin 1 to V_CCthrough a bias resistor, of a value not exceeding 2 kΩ, as shown in

Figure 3 to monitor PIN photo detector bias current. Leave pin floating if not used.

Typical behaviour is shown in Figure 4 and Figure 5 using a 2 kΩ load.

V

CC

≤ 2 kΩ

V

bias

Pin 1

File: 1307

Figure 3

Photo Detector Bias Interface

Data Sheet

6

2003-08-18

V23818-N15-Lxx/Lxxx

Pin Configuration

Typical Responsitivity of PIN Photo Detector Bias Current Monitor

400

300

200

100

0

100

200

300

400

Received Optical Power (µW)

File: 1308

Figure 4

Linear Response

400

300

200

100

0

−30

−24

−18

−12

−6

0

Received Optical Power (dBm)

File: 1309

Figure 5

Logarithmic Response

Data Sheet

7

2003-08-18

V23818-N15-Lxx/Lxxx

Pin Configuration

BMon– / BMon+

The DC voltage measured across pins 17 and 18 is proportional to the laser bias current.

Use the equation:

I_bias= V_bias/10 Ω

Use this output to monitor laser performance and EOL conditions. A schematic and

typical behaviour are shown in Figure 6 and Figure 7. I_bias@ ambient 25°C < 60 mA.

Leave pins floating if function is not required.

V

CC

Pin 18

3 kΩ

10 Ω

Pin 17

3 kΩ

V

EE

File: 1310

Figure 6

Bias Monitor – Transceiver Internal

0.36

0.32

0.28

0.24

0.2

0.16

0.12

0.08

0.04

0

10

20

30

40

50

60

70

Temperature (˚C)

File: 1312

Figure 7

Typical Variations of Bias Monitor Voltage over Temperature

Data Sheet

8

2003-08-18

V23818-N15-Lxx/Lxxx

Pin Configuration

PMon– / PMon+

The DC voltage that can be measured across pins 19 and 20 is proportional to the laser

monitor diode current through a 200 Ω resistor in its path. This output remains constant

and can be used to monitor correct operation of laser control circuitry, a deviation

indicates faulty behaviour. A schematic and typical behaviour are shown in Figure 8 and

Figure 9. The SFF MSA defines that V_monmust be in the range of 0.01 V and 0.2 V. The

Infineon OC-48 transceiver has a nominal range of 0.04 to 0.08 V. Leave pins

unconnected if feature is not required.

V

CC

Pin 20

3 kΩ

200 Ω

Pin 19

3 kΩ

R

V

EE

File: 1311

Figure 8

Power Monitor – Transceiver Internal

0.08

0.07

0.06

0.05

0.04

0.03

0.02

0.01

0.00

0

10

20

30

40

50

60

70

Temperature (˚C)

File: 1313

Figure 9

Typical Behaviour of Power Monitor Voltage over Temperature

Data Sheet

9

2003-08-18

V23818-N15-Lxx/Lxxx

Description

The Infineon 2.5 Gigabit single mode transceiver – part of the Infineon Small Form Factor

transceiver family – is based on the Physical Medium Depend (PMD) sublayer and

baseband medium, type 2000 Base-LX, compliant with ITU-T G.957 STM-16, S-16.1 and

SONET OC-48 SR-1.

This transceiver is also suitable for multirate applications. The performance at lower

datarates may vary from application to application and is link dependent. Refer to

Infineon Application Note 97 for more information.

The appropriate fiber optic cable is 9 µm single mode fiber with LC connector.

The Infineon OC-48 single mode transceiver is a single unit comprised of a transmitter,

a receiver, and an LC receptacle. This design frees the customer from many alignment

and PC board layout concerns.

This transceiver supports the LC connectorization concept, which competes with UTP/

CAT 5 solutions. It is compatible with RJ-45 style backpanels for fiber-to-the-desktop

applications while providing the advantages of fiber optic technology. The transmission

distance is up to 2 km.

The module is designed for low cost LAN, WAN, and up to 2.5 Gbit/s applications. It can

be used as the network end device interface in mainframes, workstations, servers, and

storage devices, and in a broad range of network devices such as bridges, routers, hubs,

and local and wide area switches.

This transceiver operates at up to 2.5 Gbit/s from a single power supply (+3.3 V). The

full differential data inputs and outputs are LVPECL compatible.

Data Sheet

10

2003-08-18

V23818-N15-Lxx/Lxxx

Description

Functional Description of SFF Transceiver

This transceiver is designed to transmit serial data via single mode fiber.

BMon-

BMon+

Automatic

Shut-Down

Tx

TDis

Coupling Unit

3k

e/o

Laser

Driver

TD-

10

TD+

o/e

Power

Control

200

Monitor

Single

Mode

Fiber

PMon-

3k

Rx

PMon+

Coupling Unit

Receiver

RD-

o/e

RD+

SD

PDBias

File: 1357

Figure 10

Functional Diagram 2x10 Pin Rows

Automatic

Shut-Down

Tx

TDis

Coupling Unit

e/o

Laser

TD−

TD+

Laser

Driver

o/e

Power

Control

Monitor

Single

Mode

Fiber

Rx

Coupling Unit

RD−

RD+

SD

o/e

Limiting

Amp

TIA

File: 1351

Figure 11

Functional Diagram 2x5 Pin Rows

Data Sheet

11

2003-08-18

V23818-N15-Lxx/Lxxx

Description

The receiver component converts the optical serial data into an electrical data (RD+ and

RD–). The Signal Detect output (SD) shows whether an optical signal is present.

The transmitter part converts electrical LVPECL compatible serial data (TD+ and TD–)

into optical serial data.

The module has an integrated shutdown function that switches the laser off in the event

of an internal failure.

Reset is only possible if the power is turned off, and then on again. (V_CCtswitched below

V_TH).

The transmitter contains a laser driver circuit that drives the modulation and bias current

of the laser diode. The currents are controlled by a power control circuit to guarantee

constant output power of the laser over temperature and aging. The power control uses

the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a

controlling signal, to prevent the laser power from exceeding the operating limits.

Data Sheet

12

2003-08-18

V23818-N15-Lxx/Lxxx

Description

Regulatory Compliance

Feature

Standard

Comments

ESD:

EIA/JESD22-A114-B

Class 1C

Electrostatic Discharge (MIL-STD 883D

to the Electrical Pins

Method 3015.7)

Immunity:

EN 61000-4-2

IEC 61000-4-2

Discharges ranging from ±2 kV to

±15 kV on the receptacle cause no

damage to transceiver (under

recommended conditions).

Against Electrostatic

Discharge (ESD) to the

Duplex LC Receptacle

Immunity:

Against Radio

Frequency

EN 61000-4-3

IEC 61000-4-3

With a field strength of 3 V/m, noise

frequency ranges from 10 MHz to

2 GHz. No effect on transceiver

performance between the

Electromagnetic Field

specification limits.

Emission:

FCC 47 CFR Part 15, Noise frequency range:

Electromagnetic

Interference (EMI)

Class B

EN 55022 Class B

CISPR 22

30 MHz to 18 GHz

*)

(13.97)

.550

*) min. pitch between SFF transceiver according to MSA.

Dimensions in (mm) inches

File: 1501

Figure 12

Transceiver Pitch

Data Sheet

13

2003-08-18

V23818-N15-Lxx/Lxxx

Technical Data

Absolute Maximum Ratings

Parameter

Symbol

Limit Values

Unit

min.

max.

Package Power Dissipation

Supply Voltage

0.9

W

V

V_CC–V_EE

V_IDpk-pk

4

Data Input Levels

V_CC+0.5 V_EE–0.5

V

Differential Data Input Voltage Swing

PIN PDBias Voltage

5

4

V

Storage Ambient Temperature

–40

85

°C

°C/s

Hand Lead Soldering

Temp/Time

260/10

Wave Soldering Temp/Time

Aqueous Wash Pressure

260/10

< 110

°C/s

psi

Exceeding any one of these values may destroy the device immediately.

Data Sheet

14

2003-08-18

V23818-N15-Lxx/Lxxx

Technical Data

Recommended Operating Conditions

Parameter

Symbol

Limit Values

Unit

°C

min.

–40

–5

typ.

max.

85

Ambient Temperature^{1), 3)}

Ambient Temperature^{2), 3)}

Power Supply Voltage

Transmitter

T_AMB

70

V_CC–V_EE3.14

3.3

3.46

V

Supply Current Tx

I_CCt

110

mA

mV

Data Input High Voltage

V_IH–V_CC–1165

–880

3200

Differential Data Input Voltage V_IDpk-pk 500

Swing⁴⁾

Data Input Low Voltage

V_IL–V_CC

–1810

–1475

120

mV

ps

Data Input Rise/Fall Time

(20% - 80%)

t_i

Receiver

Supply Current Rx

Input Center Wavelength

I_CCr

120

mA

nm

λ_Rx

1260

1580

1)

Only for V23818-N15-Lx6/Lxx6.

Not for V23818-N15-Lx6/Lxx6.

Ambient operating temperature requires a 2 ms^–1airflow over the device.

2)

3)

4)

V23818-N15-L353/L356/L457/L354/L355/L47/L46/L373 are internally AC coupled. External coupling

capacitors required only for V23818-N15-L17/L16/L417/L37/L36.

The electro-optical characteristics described in the following tables are valid only for use

under the recommended operating conditions.

Data Sheet

15

2003-08-18

V23818-N15-Lxx/Lxxx

Technical Data

Transmitter Electro-Optical Characteristics

Transmitter

Symbol

Limit Values

typ.

Unit

min.

–10

–8

max.

–3

Output Power (Average)¹⁾

Output Power (Average)²⁾

Center Wavelength

P_O

dBm

–3

λ_C

1266

1360

4

nm

dB

Spectral Width (RMS)

Side Mode Suppression Ratio

Extinction Ratio (Dynamic)

Optical Eye Mask

σ

SMSR

ER

30

8.2

ED

Compliant with ITU-T G.957

3)

Reset Threshold for V_CCt

V_TH

2.2

2.99

V

Power on Delay³⁾

Jitter Generation⁴⁾

Rise Time⁵⁾

t_DEL

J_GEp-p

J_GERMS

t_R

30

ms

UI

ps

V

0.04

0.004

70

Fall Time⁵⁾

t_F

225

T_DisAssert Voltage TTL

T_DisDeassert Voltage TTL

T_DisAssert Time⁶⁾

T_DisDeassert Time⁷⁾

V_TDH

V_TDL

t_ASS

t_DAS

2

0.8

1

V

0.4

ms

µs

0.06

10

1)

Not for V23818-N15-L354/L355.

Only for V23818-N15-L354/L355.

2)

3)

Laser power is shut down if power supply is below V_THand switched on if power supply is above V_THafter t_DEL

Jitter Generation under worst case conditions reaches a maximum value of 0.06 UI pk-pk/0.006 UI RMS.

Measured using 20% - 80% levels without bandwidth filtering.

.

4)

5)

6)

7)

T

_Disassertion to laser shutdown.

_Disreassertion to laser startup.

Data Sheet

16

2003-08-18

V23818-N15-Lxx/Lxxx

Technical Data

Jitter

The transceiver is specified to meet the SONET Jitter performance as outlined in ITU-T

G.958 and Telcordia GR-253.

Jitter Generation is defined as the amount of jitter that is generated by the transceiver.

The Jitter Generation specifications are referenced to the optical OC-48 signals. If no or

minimum jitter is applied to the electrical inputs of the transmitter, then Jitter Generation

can simply be defined as the amount of jitter on the Tx optical output. The SONET

specifications for Jitter Generation are 0.01 UI RMS, maximum and 0.1 UI pk-pk,

maximum. Both are measured with a 12 kHz - 20 MHz filter in line. A UI is a Unit Interval,

which is equivalent to one bit slot. At OC-48, the bit slot is 400 ps, so the Jitter Generation

specification translates to 4 ps RMS, max. and 40 ps pk-pk, max.

Data Sheet

17

2003-08-18

V23818-N15-Lxx/Lxxx

Technical Data

Receiver Electro-Optical Characteristics

Receiver

Symbol

Limit Values

Unit

min.

–3

typ.

max.

Sensitivity (Average Power)¹⁾

Saturation (Average Power)

Signal Detect Assert Level²⁾

P_IN

–19

dBm

dB

P_SAT

P_SDA

–19

Signal Detect Deassert Level³⁾P_SDD

–30

Signal Detect Hysteresis

P_SDA

3

–P_SDD

Signal Detect Assert Time²⁾

Signal Detect Deassert Time³⁾t_DAS

Data Output High Voltage⁴⁾

t_ASS

0.1

ms

mV

0.35

–650

1000

V_OH–V_CC–1110

V_ODpk-pk 500

Differential Data Output

Voltage Swing

Data Output Low Voltage⁴⁾

V_OL–V_CC

–1800

–1300

mV

Signal Detect Output High

Voltage PECL^{5), 6)}

V_SDHV_EEV_CC

–

V_CC

–820

–1200

_SDL–V_EEV_CC

–1900

2.4

Signal Detect Output Low

Voltage PECL^{5), 6)}

V

V_CC

–1580

mV

V

Signal Detect Output High

Voltage TTL^{5), 7)}

V_SDH

V_SDL

Signal Detect Output Low

Voltage TTL^{5), 7)}

0.5

1

V

Photo Detector Bias

Responsivity⁸⁾

PDBias_RES0.5

A/W

Photo Detector Bias Offset

PDBias_OFF

5

15

µA

dB

Reflectance

P_REF

–33

–27

1)

Minimum average optical power at which the BER is less than 1x10^–10. Measured with a 2²³–1 NRZ PRBS as

recommended by ANSI T1E1.2, SONET OC-48, and ITU-T G.957 S-16.1.

An increase in optical power above the specified level will cause the Signal Detect to switch from a low state

to a high state (high active output).

A decrease in optical power below the specified level will cause the Signal Detect to switch from a high state

to a low state.

2)

3)

4)

5)

Load is 100 Ω differential.

Internal load is 510 Ω to GND, no external load necessary. Signal Detect is a high active output. High level

means signal is present, low level means loss of signal.

For V23818-N15-L17/L16/L417/L37/L36/L373.

6)

7)

8)

For V23818-N15-L353/L356/L457/L354/L355/L47/L46.

Monitor current needs to be sunk to V_CC

.

Data Sheet

18

2003-08-18

V23818-N15-Lxx/Lxxx

Eye Safety

This laser based single mode transceiver is a Class 1 product.

It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11.

The transceiver has been certified with FDA under accession number 9520890.

To meet laser safety requirements the transceiver shall be operated within the Absolute

Maximum Ratings.

Attention: All adjustments have been made at the factory prior to shipment of the

devices. No maintenance or alteration to the device is required.

Tampering with or modifying the performance of the device will result

in voided product warranty.

Note: Failure to adhere to the above restrictions could result in a modification that is

considered an act of “manufacturing”, and will require, under law, recertification of

the modified product with the U.S. Food and Drug Administration (ref. 21 CFR

1040.10 (i)).

Laser Data

Wavelength

1300 nm

< 2 mW

Total Output Power

(as defined by IEC: 7 mm aperture at 14 mm distance)

Total Output Power

(as defined by FDA: 7 mm aperture at 20 cm distance)

< 180 µW

6°

Beam Divergence

FDA

IEC

Complies with 21 CFR

1040.10 and 1040.11

Class 1 Laser Product

File: 1401

Figure 13

Required Labels

Indication of

laser aperture

and beam

20 19 18 17 16 15 14 13 12 11

Tx

Rx

Top view

1

2 3 4 5 6 7 8 9 10

File: 1334

Figure 14

Laser Emission

Data Sheet

19

2003-08-18

V23818-N15-Lxx/Lxxx

EMI-Recommendations

To avoid electromagnetic radiation exceeding the required limits please take note of the

following recommendations.

When Gigabit switching components are found on a PCB (multiplexers, clock recoveries

etc.) any opening of the chassis may produce radiation also at chassis slots other than

that of the device itself. Thus every mechanical opening or aperture should be as small

as possible.

On the board itself every data connection should be an impedance matched line (e.g.

strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should

be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched

line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In

DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows:

for 3.3 V: 125 Ω to V_CCand 82 Ω to V_EE, for 5 V: 82 Ω to V_CCand 125 Ω to V_EEat Data

and Datanot. Please consider whether there is an internal termination inside an IC or a

transceiver.

In certain cases signal GND is the most harmful source of radiation. Connecting chassis

GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic

transceiver may result in a large amount of radiation. Even a capacitive coupling

between signal GND and chassis may be harmful if it is too close to an opening or an

aperture.

If a separation of signal GND and chassis GND is not planned, it is strongly

recommended to provide a proper contact between signal GND and chassis GND at

every location where possible. This concept is designed to avoid hotspots. Hotspots are

places of highest radiation which could be generated if only a few connections between

signal and chassis GND exist. Compensation currents would concentrate at these

connections, causing radiation.

By use of Gigabit switching components in a design, the return path of the RF current

must also be considered. Thus a split GND plane of Tx and Rx portion may result in

severe EMI problems.

A recommendation is to connect the housing leads to signal GND. However, in certain

applications it may improve EMI performance by connecting them to chassis GND.

The cutout should be sized so that all contact springs make good contact with the face

plate.

Please consider that the PCB may behave like a waveguide. With an ε_rof 4, the

wavelength of the harmonics inside the PCB will be half of that in free space. In this

scenario even the smallest PCBs may have unexpected resonances.

Data Sheet

20

2003-08-18

V23818-N15-Lxx/Lxxx

Recommended Termination Schemes

2x10 DC/DC Transceiver

18

20

19 17

V_CCSerDes

12,16

14

V_EEt

V_CC

TD+

C6

+

SerDat Out

ECL/

Laser

Driver

PECL

Driver

100 Ω

C8

TD− 15

C7

SerDat Out −

TDis 13

TDis

C1

11

L1

L2

V_CCt

V_CC

3.3 V

SFF Transceiver

Serializer/

Deserializer

V_CCr

7

C3 C10

C2

Signal

Detect

SD

8

1

SD

PDBias

Limiting

Amplifier

RD−

9

C4

RD−

Pre-

Amp

SerDat In −

Receiver

PLL etc.

C9

RD+ 10

2,3,6

C5

RD+

SerDat In +

V_EEr

C1/2/3

= 4.7 ... 10 µF

C4/5/6/7 = 100 nF

C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the

capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.

L1/2^*)

R1

= 1 ... 4.7 µH

= 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to V_EEor

100 Ω differential is provided. Check for termination inside of SerDes chip).

= 150 Ω

R2/3

R4/5

= Biasing (depends on SerDes chip).

Place R1/4/5 close to SerDes chip.

Place R2/3 close to Infineon transceiver.

*)

The inductors may be replaced by appropriate Ferrite beads.

File: 1390

Figure 15

Data Sheet

21

2003-08-18

V23818-N15-Lxx/Lxxx

Recommended Termination Schemes

2x10 AC/AC Transceiver

V_CCSerDes

20

19 17

18

V_EEt12,16

14

V_CC

TD+

SerDat Out +

ECL/

Laser

Driver

PECL

Driver

100 Ω

C4

TD− 15

SerDat Out −

TDis

13

11

TDis

L1

V_CCt

V_CC

3.3 V

C1

SFF Transceiver

Serializer/

Deserializer

L2

V_CCr

7

C3 C6

C2

Signal

Detect

SD

8

1

SD

PDBias

Limiting

Amplifier

RD−

9

Pre-

Amp

SerDat In −

Receiver

PLL etc.

C5

RD+ 10

2,3,6

SerDat In +

V_EEt

C1/2/3

C4/5/6

= 4.7 ... 10 µF

= Design criterion is the resonance frequency only. The self resonant frequency of the

capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.

= 1 ... 4.7 µH

L1/2^*)

R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to V_EEor 100 Ω

differential is provided. Check for termination inside of SerDes chip.

R5/6

= Biasing (depends on SerDes chip).

Place R1/2/3/4/5/6 close to SerDes chip.

*)

The inductors may be replaced by appropriate Ferrite beads.

File: 1391

Figure 16

Data Sheet

22

2003-08-18

V23818-N15-Lxx/Lxxx

Recommended Termination Schemes

2x5 DC/DC Transceiver

V_CCSerDes

7

9

V_EEt

V_CC

TD+

C6

+

SerDat Out

ECL/

Laser

100 Ω

Driver

PECL

Driver

C8

TD− 10

C7

SerDat Out −

TDis

8

6

TDis

C1

L1

L2

V_CCt

V_CC

3.3 V

SFF Transceiver

Serializer/

Deserializer

V_CCr

2

C3 C10

C2

Signal

Detect

SD

3

4

SD

Limiting

Amplifier

RD−

C4

RD−

Pre-

Amp

SerDat In −

Receiver

PLL etc.

C9

RD+

5

1

C5

RD+

SerDat In +

V_EEr

C1/2/3

= 4.7 ... 10 µF

C4/5/6/7 = 100 nF

C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the

capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.

L1/2^*)

R1

= 1 ... 4.7 µH

= 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to V_EEor

100 Ω differential is provided. Check for termination inside of SerDes chip).

= 150 Ω

R2/3

R4/5

= Biasing for outputs depending on Serializer.

Place R1/4/5 close to SerDes chip.

Place R2/3 close to Infineon transceiver.

*)

The inductors may be replaced by appropriate Ferrite beads.

File: 1392

Figure 17

Data Sheet

23

2003-08-18

V23818-N15-Lxx/Lxxx

Recommended Termination Schemes

2x5 AC/AC Transceiver

V_CCSerDes

7

9

V_EEt

V_CC

TD+

+

SerDat Out

ECL/

PECL

Driver

Laser

100 Ω

Driver

C4

TD− 10

SerDat Out −

TDis

8

6

TDis

C1

L1

L2

V_CCt

V_CC

3.3 V

SFF Transceiver

Serializer/

Deserializer

V_CCr

2

C3 C6

C2

Signal

Detect

SD

3

4

SD

Limiting

Amplifier

RD−

Pre-

Amp

SerDat In −

Receiver

PLL etc.

C5

RD+

5

1

RD+

SerDat In +

V_EEr

C1/2/3

C4/5/6

= 4.7 ... 10 µF

= Design criterion is the resonance frequency only. The self resonant frequency of the

capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.

= 1 ... 4.7 µH

L1/2^*)

R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to V_EEor 100 Ω

differential is provided. Check for termination inside of SerDes chip.

R5/6

= Biasing (depends on SerDes chip).

Place R1/2/3/4/5/6 close to SerDes chip.

*)

The inductors may be replaced by appropriate Ferrite beads.

File: 1393

Figure 18

Data Sheet

24

2003-08-18

V23818-N15-Lxx/Lxxx

Package Outlines

a) recommended bezel position

Drawing shown is 2x10 pinning with collar

Dimensions in mm [inches]

File: 1213

Figure 19

Data Sheet

25

2003-08-18

V23818-N15-Lxx/Lxxx

Package Outlines

Advanced Collar

Dimensions in mm [inches]

File: 1505

Figure 20

Non-standard Collar

Data Sheet

26

2003-08-18

V23818-N15-Lxx/Lxxx

Revision History:

2003-08-18

DS1

Previous Version:

2003-03-10

Page

Subjects (major changes since last revision)

“Preliminary Data Sheet” deleted

V23818-N15-L373, V23818-N15-L417, V23818-N15-L46WH deleted

For questions on technology, delivery and prices please contact the Infineon

Technologies Offices in Germany or the Infineon Technologies Companies and

Representatives worldwide: see our webpage at http://www.infineon.com.

Edition 2003-08-18

Published by Infineon Technologies AG,

St.-Martin-Strasse 53,

D-81541 München, Germany

Attention please!

The information herein is given to describe certain components and shall not be considered as warranted

characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding

circuits, descriptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in

question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support

devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.


型号：	V23818-N15-L356
厂家：	Infineon
描述：	Small Form Factor Single Mode 1300 nm Multirate up to 2.5 Gbit/s Transceiver 2x5/2x10 Pinning with LCâ¢ Connector 小巧的外形单模1300 nm的多速率高达2.5 Gbit / s的收发器2× / 2×10与LCA钢钉?? ¢连接器连接器
文件：	总27页 (文件大小：765K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

V23818-N15-L356 [INFINEON]

相关型号：

V23818-N15-L356-C

V23818-N15-L356C

V23818-N15-L36

V23818-N15-L37

V23818-N15-L373

V23818-N15-L457

V23818-N15-L46

V23818-N15-L46WH

V23818-N15-L47

V23818-N15-L616

V23818-N15-L653

V23818-N15-L656