XMC6521SC-Q040X AA [INFINEON]
The XMCXXXXSC devices are members of the XMC1000 Family of microcontrollers based on the ARM Cortex-M0 processor core. The XMCXXXXSC series addresses the real-time control needs of wireless power systems. The XMC6521SC-Q040X is a Qi single coil 15W inductive MP-A11 desktop transmitter.;
| 型号： | XMC6521SC-Q040X AA |
| 厂家： | 
Infineon |
| 描述： | The XMCXXXXSC devices are members of the XMC1000 Family of microcontrollers based on the ARM Cortex-M0 processor core. The XMCXXXXSC series addresses the real-time control needs of wireless power systems. The XMC6521SC-Q040X is a Qi single coil 15W inductive MP-A11 desktop transmitter. |
| 文件： | 总41页 (文件大小：1270K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
XMCxxxxSC
Wireless Power Controller Series
for Commercial and
Industrial Applications
XMC1000 Family
ARM® Cortex®-M0
32-bit processor core
Data Sheet
V1.3, 2019-05
Edition 2016-10
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2016 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
XMCxxxxSC
Wireless Power Controller Series
for Commercial and
Industrial Applications
XMC1000 Family
ARM® Cortex®-M0
32-bit processor core
Data Sheet
V1.3, 2019-05
XMCxxxxSC-Q040X
XMC1000 Family
XMCXXXXSC Data Sheet
Revision History: V0.5 2019-03
Previous Versions:
Page
Subjects
Data Sheet
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSC-Q040X
XMC1000 Family
Trademarks
C166™, TriCore™, XMC™ and DAVE™ are trademarks of Infineon Technologies AG.
ARM®, ARM Powered®, Cortex®, Thumb® and AMBA® are registered trademarks of
ARM, Limited.
CoreSight™, ETM™, Embedded Trace Macrocell™ and Embedded Trace Buffer™ are
trademarks of ARM, Limited.
We Listen to Your Comments
Is there any information in this document that you feel is wrong, unclear or missing?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com
Data Sheet
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSC-Q040X
XMC1000 Family
Table of Contents
Table of Contents
1
Summary of Features.................................................................................. 9
Device Overview ..........................................................................................11
Ordering Information ................................................................................... 12
Device Types .............................................................................................. 13
Chip Identification Number.......................................................................... 15
1.1
1.2
1.3
1.4
2
2.1
2.2
2.2.1
2.2.2
2.2.3
2.2.4
General Device Information...................................................................... 18
Logic Symbols............................................................................................. 18
Pin Configuration and Definition.................................................................. 22
Package Pin Summary............................................................................ 26
Port Pin for Boot Modes ...........................................................................30
Port I/O Function Description ...................................................................31
Hardware Controlled I/O Function Description ........................................ 32
3
3.1
Electrical Parameter.................................................................................. 41
General Parameters.................................................................................... 41
Parameter Interpretation ......................................................................... 41
Absolute Maximum Ratings..................................................................... 42
Pin Reliability in Overload ....................................................................... 43
Operating Conditions................................................................................45
DC Parameters ........................................................................................... 46
Input/Output Characteristics.....................................................................46
Analog to Digital Converters (ADC)......................................................... 50
Out of Range Comparator (ORC) Characteristics ....................................54
Analog Comparator Characteristics......................................................... 56
Temperature Sensor Characteristics....................................................... 57
Oscillator Pins ......................................................................................... 58
Power Supply Current ..............................................................................62
Flash Memory Parameters...................................................................... 68
AC Parameters............................................................................................ 70
Testing Waveforms ..................................................................................70
Power-Up and Supply Threshold Characteristics.................................... 71
On-Chip Oscillator Characteristics .......................................................... 73
Serial Wire Debug Port (SW-DP) Timing................................................. 74
SPD Timing Requirements...................................................................... 75
Peripheral Timings .................................................................................. 76
Synchronous Serial Interface (USIC SSC) Timing .............................. 76
Inter-IC (IIC) Interface Timing.............................................................. 79
Inter-IC Sound (IIS) Interface Timing....................................................81
3.1.1
3.1.2
3.1.3
3.1.4
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
3.2.8
3.3
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.6.1
3.3.6.2
3.3.6.3
4
Package and Reliability ............................................................................ 83
4.1
Package Parameters................................................................................... 83
Data Sheet
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XMCxxxxSC-Q040X
XMC1000 Family
Table of Contents
4.1.1
4.2
Thermal Considerations .......................................................................... 83
Package Outlines ........................................................................................ 85
5
Quality Declaration.................................................................................... 88
Data Sheet
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XMCxxxxSC-Q040X
XMC1000 Family
About this Document
About this Document
This Data Sheet is addressed to embedded hardware and software developers. It
provides the reader with detailed descriptions about the ordering designations, available
features, electrical and physical characteristics of the XMCXXXXSC series devices.
The document describes the characteristics of a superset of the XMCXXXXSC series
devices. For simplicity, the various device types are referred to by the collective term
XMCXXXXSC throughout this document.
XMC1000 Family User Documentation
The set of user documentation includes:
•
Data Sheets
–
list the complete ordering designations, available features and electrical
characteristics of derivative devices.
•
API Interface Document
list details regarding API interface and registers.
–
Attention: Please consult all parts of the documentation set to attain consolidated
knowledge about your device.
Application related guidance is provided by Users Guides and Application Notes.
Please refer to http://www.infineon.com/xmc1000 to get access to the latest versions
of those documents.
Data Sheet
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XMCxxxxSC-Q040X
XMC1000 Family
Summary of Features
1
Summary of Features
The XMCXXXXSC devices are members of the XMC1000 Family of microcontrollers
based on the ARM Cortex-M0 processor core. The XMCXXXXSC series addresses the
real-time control needs of wireless power systems.
Figure 1 Block Diagram
Data Sheet
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XMCxxxxSC-Q040X
XMC1000 Family
Features
CPU subsystem
Analog Frontend Peripherals
•
•
32-bit ARM Cortex-M0 CPU Core
MATH coprocessor
•
A/D converters for voltage and current sensing
•
Temperature Sensor
On-Chip Memories
Industrial Control Peripherals
•
•
SRAM (with parity)
Flash (with ECC)
•
•
2 PWM channels for full bridge coil driver
1 PWM channel for step-up or step-down
bridge supply control
Supply, Reset and Clock
•
3.3 V or 5 V supply with power on reset
and brownout detector
On-chip clock monitor
External crystal oscillator support (8 to 20
MHz)
Up to 13 Input/Output Ports
3.3 V or 5 V capable
Programming Support
Secure bootloader
Packages
•
•
•
•
•
VQFN-40 (55 mm2)
System Control
•
•
•
Window watchdog
Real time clock module
Pseudo random number generator
Tools
•
Easy to use GUI for programming and
debugging
Communication Peripherals
•
Four USIC channels, usable as
–
–
UART (115.2 kb/s)
IIC (up to 400 kb/s)
Data Sheet
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XMCxxxxSC-Q040X
XMC1000 Family
1.1
Device Overview
The following table lists the available features per device type for the XMCXXXXSC series.
Table 1
Features of XMCXXXXSC Device Types
Features
Operating temperature
(ambient)
-40 to 105 °C
3.3 V or 5.5 V
Operating voltage
GPIOs
GPIs
27
8
Packages
VQFN-40
1.2
Ordering Information
The ordering code for an Infineon microcontroller provides an exact reference to a
specific product. The code “XMC<DDDD>SC-<Z><PPP><T>” identifies:
•
•
<DDDD> the derivatives function set
<Z> the package variant
–
Q: VQFN
•
•
<PPP> package pin count
<T> the temperature range:
– X: -40°C to 105°C
For ordering codes for the XMCXXXXSC please contact your sales representative or
local distributor.
This document describes several derivatives of the XMCXXXXSC series, some
descriptions may not apply to a specific product. Please see Table 2.
For simplicity the term XMCXXXXSC is used for all derivatives throughout this document.
Data Sheet
11
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XMCxxxxSC-Q040X
XMC1000 Family
1.3
Device Types
These device types are available and can be ordered through Infineon’s direct and/or
distribution channels.
Table 2
Synopsis of XMCXXXXSC Device Types
Description
Derivative
XMC0001SC-Q040X
XMC6521SC-Q040X
XMC6511SC-Q040X
XMC7501SC-Q040X
XMC7531SC-Q040X
XMC7541SC-Q040X
XMC8511SC-Q040X
XMC8531SC-Q040X
Evaluation device to be programmed by the customer
Qi single coil 15W inductive MP-A11 desktop transmitter
Qi single coil 10W sub-surface infrastructure transmitter
Single coil low power inductive transmitter
Single coil 30W Telecom and Security transmitter
Single coil 80W high power inductive transmitter
Low power resonant multi-device transmitter
30W resonant transmitter
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
General Device Information
2
General Device Information
This section summarizes the package pin configurations with a detailed list of the
functional I/O mapping.
2.1
Pin Configuration and Definition
The following figures summarize all pins, showing their locations.
30
VSW2
CAP2
HIRES
VBR
GPIO7 / BUZ
1
2
3
4
5
29
28
27
26
25
24
23
22
21
GPIO6 / BRIDGE_EN
GPIO5 / PWM0
GPIO4 / GAIN1
GPIO3 / GAIN0
GPIO2 / COIL3_EN
GPIO1 / COIL2_EN
GPIO0 / COIL1_EN
PMW1H
VIN
41 Ext. Pad
VSSP
TEMP
CAP1
CMP
6
7
8
9
VAC
PMW1L
CAP0
10
Figure 7
XMCXXXXSC PG-VQFN-40-17 Pin Configuration (top view)
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
General Device Information
2.1.1
Package Pin Summary
The following columns list the package pin number to which the respective function is
mapped in that package.
The “Pad Type” indicates the employed pad type:
•
•
•
•
•
•
STD_INOUT (standard bi-directional pads)
STD_INOUT/AN (standard bi-directional pads with analog input)
STD_INOUT/clock (standard bi-directional pads with oscillator function)
High Current (high current bi-directional pads)
STD_IN/AN (standard input pads with analog input)
Power (power supply)
Details about the pad properties are defined in the Electrical Parameter chapter.
Table 5 Package Pin Mapping
Function VQFN
40
Pad Type
Notes
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
23
24
25
26
27
28
29
30
33
STD_INOUT GPIO0 or COIL1_EN (coil #1 enable)
STD_INOUT GPIO1 or COIL2_EN (coil #2 enable)
STD_INOUT GPIO2 or COIL3_EN (coil #3 enable)
STD_INOUT GPIO3 or GAIN0 (measurement gain control)
STD_INOUT GPIO4 or GAIN1 (measurement gain control)
STD_INOUT GPIO5 or PWM0 (bridge supply PWM)
STD_INOUT GPIO6 or BRIDGE_EN (bridge enable)
STD_INOUT GPIO7 or BUZ (buzzer)
GPIO6
GPIO7
GPIO8
STD_INOUT GPIO8 or PWM3H (PWM channel #3)
GPIO9
34
35
STD_INOUT GPIO9 or PWM3L (PWM channel #3)
GPIO10
STD_INOUT GPIO10 or XI (crystal input)
/clock_IN
GPIO11
36
STD_INOUT GPIO11 or XO (crystal output)
/clock_O
GPIO12
GPIO13
37
38
STD_INOUT GPIO12 or PWM4L (PWM channel #4)
STD_INOUT GPIO13 or PWM4H (PWM channel #4)
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
General Device Information
Table 5
Package Pin Mapping (cont’d)
Function VQFN
40
Pad Type
Notes
RXD
39
40
22
21
20
19
18
17
16
1
STD_INOUT UART receive
STD_INOUT UART transmit
High Current PWM channel #1
High Current PWM channel #1
High Current PWM channel #2
High Current PWM channel #2
High Current LED control
TXD
PWM1H
PWM1L
PWM2H
PWM2L
LED3
LED2
High Current LED control
LED1
High Current LED control
VSW2
STD_INOUT PWM channel #2 switch node voltage
/AN
CAP2
2
STD_INOUT High Resolution PWM capacitor
/AN
HIRES
VBR
3
4
5
6
7
8
STD_IN/AN High Resolution PWM input
STD_IN/AN Bridge voltage measurement
STD_IN/AN Input voltage measurement
STD_IN/AN Coil thermistor (optional)
STD_IN/AN BIAS/Peak Capacitor
VIN
TEMP
CAP1
CMP
STD_IN/AN Current sense/Peak detector
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
General Device Information
Table 5
Package Pin Mapping (cont’d)
Function VQFN
40
Pad Type
Notes
VAC
9
STD_IN/AN Coil AC measurement
CAP0
VSW1
10
11
STD_IN/AN Communication demodulator input B
STD_INOUT PWM channel #1 switch node voltage
/AN
COMM
12
STD_INOUT Communication demodulator input
/AN
VSS
VDD
13
14
Power
Power
Supply GND, ADC reference GND
Supply VDD, ADC reference voltage/ ORC
reference voltage
VDDP
15
Power
When VDD is supplied, VDDP has to be supplied
with the same voltage.
VDDP
VSSP
VSSP
32
31
Power
Power
Power
I/O port supply
I/O port ground
Exposed Die Pad The exposed die pad is
connected internallytoVSSP. For proper
operation, it is mandatory to connect the
exposed pad to the board ground. For thermal
aspects, please refer to the Package and
Reliability chapter.
Exp.
Pad
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3
Electrical Parameter
This section provides the electrical parameter which are implementation-specific for the
XMCXXXXSC.
3.1
General Parameters
3.1.1
Parameter Interpretation
The parameters listed in this section represent partly the characteristics of the
XMCXXXXSC and partly its requirements on the system. To aid interpreting the
parameters easily when evaluating them for a design, they are indicated by the
abbreviations in the “Symbol” column:
•
CC
Such parameters indicate Controller Characteristics, which are distinctive feature of
the XMCXXXXSC and must be regarded for a system design.
SR
•
Such parameters indicate System Requirements, which must be provided by the
application system in which the XMCXXXXSC is designed in.
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.1.2
Absolute Maximum Ratings
Stresses above the values listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Table 11 Absolute Maximum Rating Parameters
Parameter
Symbol
Values
Unit Note /
Test
Min Typ. Max.
.
Condition
Junction temperature
Storage temperature
TJ
TST
SR -40
–
–
–
115
125
6
C
C
V
–
SR -40
–
–
VDDP
Voltage on power supply pin
SR -0.3
with respect to VSSP
VIN
Voltage on digital pins with
respect to VSSP
SR -0.5
SR -0.3
–
–
V
V
whichever
is lower
V
DDP + 0.5
or max. 6
1)
VINP2
Voltage on analog
V
DDP + 0.3
–
input pins with respect
2)
to V
SSP
VAIN
Voltage on analog input pins
with respect to VSSP
-0.5
–
–
–
V
whichever
is lower
V
DDP + 0.5
V
AREF SR
or max. 6
10
IIN
Input current on any pin
during overload condition
SR -10
mA
mA
–
Absolute maximum sum of all IIN SR -50
inputcurrents during overload
condition
+50
–
1) Excluding pins CAP2, HIRES, CAP1, CMP, VAC, CAP0, COMM.
1) Applicable to pins CAP2, HIRES, CAP1, CMP, VAC, CAP0, COMM.
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.1.3
Pin Reliability in Overload
When receiving signals from higher voltage devices, low-voltage devices experience
overload currents and voltages that go beyond their own IO power supplies specification.
Table 12 defines overload conditions that will not cause any negative reliability impact if
all the following conditions are met:
•
•
full operation life-time is not exceeded
Operating Conditions are met for
–
–
pad supply levels (VDDP)
temperature
If a pin current is outside of the Operating Conditions but within the overload
conditions, then the parameters of this pin as stated in the Operating Conditions can no
longer be guaranteed. Operation is still possible in most cases but with relaxed
parameters.
Note: An overload condition on one or more pins does not require a reset.
Note: A series resistor at the pin to limit the current to the maximum permitted overload
current is sufficient to handle failure situations like short to battery.
Table 12
Overload Parameters
Symbol
Parameter
Values
Unit Note /
Test Condition
Min. Typ. Max.
Input current on any port pin
during overload condition
I
OV SR -5
–
5
mA
mA
Absolute sum of all input
circuit currents during
overload condition
I
OVS SR
–
–
25
Figure 11 shows the path of the input currents during overload via the ESD protection
structures. The diodes against VDDP and ground are a simplified representation of these
ESD protection structures.
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
VDDP
VDDP
IOVx
Pn.y
GND
GND
ESD
Pad
Figure 11
Input Overload Current via ESD structures
Table 13 and Table 14 list input voltages that can be reached under overload conditions.
Note that the absolute maximum input voltages as defined in the Absolute Maximum
Ratings must not be exceeded during overload.
Table 13 PN-Junction Characteristics for positive Overload
Pad Type
IOV =5 mA
Standard, High-current,
AN/DIG_IN
VIN = VDDP + 0.5 V
V
V
AIN = VDDP + 0.5 V
AREF = VDDP + 0.5 V
CAP2, HIRES, CAP1,
CMP, VAC, CAP0,
COMM
V
INP2 = VDDP + 0.3 V
Table 14 PN-Junction Characteristics for negative Overload
Pad Type
IOV =5 mA
Standard, High-current,
AN/DIG_IN
VIN = VSS - 0.5 V
V
V
AIN = VSS - 0.5 V
AREF = VSS - 0.5 V
CAP2, HIRES, CAP1,
CMP, VAC, CAP0,
COMM
V
INP2 = VSS - 0.3 V
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.1.4
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation and reliability of the XMCXXXXSC. All parameters specified in the following
tables refer to these operating conditions, unless noted otherwise.
Table 15 Operating Conditions Parameters
Parameter
Symbol
Values
Typ.
Unit Note /
Test Condition
Min.
SR -40
Max.
105
5.5
5
Ambient Temperature TA
Digital supply voltage1)
°C
V
Temp. Range X
VDDP
SR 3.3
SR -5
Short circuit current of ISC
mA
digital outputs
Absolute sum of short ISC_D SR
circuit currents of the
device
25
mA
1) See also the Supply Monitoring thresholds, Chapter 3.3.2.
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.2
DC Parameters
3.2.1
Input/Output Characteristics
Table 16 provides the characteristics of the input/output pins of the XMCXXXXSC.
Note: These parameters are not subject to production test, but verified by design and/or
characterization.
Note: Unless otherwise stated, input DC and AC characteristics, including peripheral
timings, assume that the input pads operate with the standard hysteresis.
Table 16
Input/Output Characteristics (Operating Conditions apply)
Symbol Limit Values Unit Test Conditions
Parameter
Min.
Max.
Output low voltage on
port pins
(with standard pads)
V
OLP CC
–
1.0
V
V
V
I
I
OL = 11 mA (5 V)
OL = 7 mA (3.3 V)
–
–
0.4
1.0
I
I
OL = 5 mA (5 V)
OL = 3.5 mA (3.3 V)
Output low voltage on
high current pads
V
OLP1 CC
I
I
OL = 50 mA (5 V)
OL = 25 mA (3.3 V)
–
–
0.32
0.4
–
V
V
V
I
I
OL = 10 mA (5 V)
OL = 5 mA (3.3 V)
VDDP
1.0
-
-
-
-
-
Output high voltage on
port pins
(with standard pads)
V
V
OHP CC
I
I
OH = -10 mA (5 V)
OH = -7 mA (3.3 V)
VDDP
0.4
–
–
–
–
V
V
V
V
V
I
I
OH = -4.5 mA (5 V)
OH = -2.5 mA (3.3 V)
OHP1 CC
VDDP
0.32
Output high voltage on
high current pads
I
I
I
OH = -6 mA (5 V)
OH = -8 mA (3.3 V)
OH = -4 mA (3.3 V)
VDDP
1.0
VDDP
0.4
V
ILPS SR
0.19
VDDP
Input low voltage on port
pins
–
CMOS Mode
(5 V, 3.3 V)
(Standard Hysteresis)
0.7
VDDP
Input high voltage on
port pins
V
IHPS SR
–
V
CMOS Mode
(5 V, 3.3 V)
(Standard Hysteresis)
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
Table 16
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values Unit Test Conditions
Min.
Max.
0.08
Input low voltage on port
pins
(Large Hysteresis)
V
ILPL SR
–
V
V
CMOS Mode
(5 V, 3.3 V)
VDDP
Input high voltage on
port pins
V
IHPL SR
0.85
VDDP
–
CMOS Mode
(5 V, 3.3 V)
(Large Hysteresis)
Rise/fall time on High
Current Pad1)
–
–
–
–
9
ns
ns
ns
ns
V
50 pF @ 5 V2)
50 pF @ 3.3 V3)
50 pF @ 5 V5)
50 pF @ 3.3 V6).
t
HCPR, CC
tHCPF
12
12
15
–
Rise/fall time on
Standard Pad1)
tR, tF CC
0.08
VDDP
HYS CC
Input Hysteresis on port
pin except VBR, VIN,
TEMP, CAP1, CMP,
VAC, CAP08)
CMOS Mode (5 V),
Standard Hysteresis
0.03
VDDP
–
V
V
V
CMOS Mode (3.3 V),
Standard Hysteresis
0.5 0.75
VDDP
VDDP
CMOS Mode(5 V),
Large Hysteresis
0.4 0.75
VDDP VDDP
CMOS Mode(3.3 V),
Large Hysteresis
Data Sheet
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XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
Table 16
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values Unit Test Conditions
Min.
Max.
HYS_ CC
P2
0.08
Input Hysteresis on port
pin VBR, VIN, TEMP,
CAP1, CMP, VAC,
CAP08)
–
V
CMOS Mode (5 V),
Standard Hysteresis
VDDP
0.03
VDDP
–
V
CMOS Mode (3.3 V),
Standard Hysteresis
0.35 0.75
V
CMOS Mode(5 V),
Large Hysteresis
VDDP
VDDP
0.25 0.75
V
CMOS Mode(3.3 V),
Large Hysteresis
VDDP
VDDP
Pin capacitance (digital CIO
inputs/outputs)
CC
CC
–
10
pF
V
V
V
IH,min (5 V)
IL,max (5 V)
IH,min (3.3 V)
Pull-up current on port IPUP
pins
–
-80
–
A
A
A
A
A
A
A
A
A
-95
–
-50
–
-65
–
V
V
V
IL,max (3.3 V)
IL,max (5 V)
IH,min (5 V)
Pull-down current on
port pins
IPDP
CC
40
–
95
–
30
–
V
V
IL,max (3.3 V)
IH,min (3.3 V)
60
Input leakage current
except GPIO119)
IOZP
CC -1
OZP1 CC
SR
1
0 < VIN < VDDP
TA 105 C
,
,
I
0 < VIN < VDDP
TA 105 C
10)
Input leakage current for
GPIO119)
-10
1
A
V
Voltage on any pin
during VDDP power off
VPO
IMP
–
0.3
11
Maximum current per
pin (excluding high
current pins, VDDP and
VSS)
SR -10
mA
–
–
Maximum current per
high current pins
I
MP1A SR
-10
50
mA
Data Sheet
48
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
Table 16
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values Unit Test Conditions
Min.
Max.
Maximum current into
I
MVDD3 SR
MVSS3 SR
–
260
mA
mA
V
DDP (VQFN40)
Maximum current out of
SS (VQFN40)
I
–
260
V
1) Rise/Fall time parameters are taken with 10% - 90% of supply.
2) Additional rise/fall time valid for CL = 50 pF - CL = 100 pF @ 0.150 ns/pF at 5 V supply voltage.
3) Additional rise/fall time valid for CL = 50 pF - CL = 100 pF @ 0.205 ns/pF at 3.3 V supply voltage.
4)
.
5) Additional rise/fall time valid for CL = 50 pF - CL = 100 pF @ 0.225 ns/pF at 5 V supply voltage.
6) Additional rise/fall time valid for CL = 50 pF - CL = 100 pF @ 0.288 ns/pF at 3.3 V supply voltage.
7)
.
8) Hysteresis is implemented to avoid meta stable states and switching due to internal ground bounce. It cannot
be guaranteed that it suppresses switching due to external system noise.
9) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
10) However, for applications with strict low power-down current requirements, it is mandatory that no active
voltage source is supplied at any GPIO pin when VDDP is powered off.
Data Sheet
49
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.2.2
Oscillator Pins
Note: It is strongly recommended to measure the oscillation allowance (negative
resistance) in the final target system (layout) to determine the optimal parameters
for the oscillator operation. Please refer to the limits specified by the crystal or
ceramic resonator supplier.
Note: These parameters are not subject to production test, but verified by design and/or
characterization.
The oscillator pins can be operated with an external crystal/resonator (see Figure 15) or
in direct input mode (see Figure 16).
XTAL1
fOSC
GND
XTAL2
Damping resistor
maybe needed for
some crystals
V
VPPX_min
VPPX
VPPX_min
≤ VPPX≤ VPPX_max
tOSCS
t
Figure 15
Oscillator in Crystal Mode
Data Sheet
50
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
External Clock
Source
Direct Input Mode
XTAL1
XTAL2
not connected
V
VIHBX_max
VIHBX_min
VILBX_max
VSS
VILBX_min
t
Figure 16
Oscillator in Direct Input Mode
Data Sheet
51
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Table 21
OSC_XTAL Parameters
Parameter
Symbol
Min.
Values
Typ.
Unit Note /
Test Condition
Max.
48
Input frequency
fOSC SR
4
4
MHz Direct Input Mode
20
MHz External Crystal
Mode
tOSCS
CC
Oscillator start-up
time1)2)
10
ms
Input voltage at GPIO10 VIX SR
-0.3
1.5
V
External Crystal
Mode
-0.3
5.5
1.7
V
V
Direct Input Mode
Input amplitude (peak-
to-peak) at GPIO102)3)
V
PPX SR 0.6
External Crystal
Mode
1)
t
OSCS is defined from the moment the oscillator is enabled wih SCU_ANAOSCHPCTRL.MODE until the
oscillations reach an amplitude at XTAL1 of 0.9 * VPPX
.
2) The external oscillator circuitry must be optimized by the customer and checked for negative resistance and
amplitude as recommended and specified by crystal suppliers.
3) If the shaper unit is enabled and not bypassed.
Data Sheet
52
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.2.3
Power Supply Current
The total power supply current defined below consists of a leakage and a switching
component.
Application relevant values are typically lower than those given in the following tables,
and depend on the customer's system operating conditions (e.g. thermal connection or
used application configurations).
Note: These parameters are not subject to production test, but verified by design and/or
characterization.
Table 23 Power Supply parameter table; VDDP = 5V
Parameter
Symbol
Values
Min. Typ.1)
DDPAE CC
14.1
Unit Note /
Test Condition
Max.
Active mode current
Peripherals
I
20
mA 48 / 96
enabled2)
Data Sheet
53
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
Table 23
Power Supply parameter table; VDDP = 5V
Parameter
Symbol
Values
Min. Typ.1)
Unit Note /
Test Condition
Max.
IDDPSR
CC
Sleep mode current
Peripherals clock
disabled
1.1
mA 1 / 1
Flash powered down6)
IDDPDS
CC
Deep Sleep mode
current7)
0.27
6
mA
Wake-up time from Sleep tSSA CC
cycl
es
to Active mode8)
Wake-up time from Deep
Sleep to Active mode9)
tDSA CC
290
sec
1) The typical values are measured at TA =+ 25 C and VDDP =5 V.
2) CPU and all peripherals clock enabled, Flash is in active mode.
3)
4)
5)
.
.
.
6) CPU in sleep, Flash is powered down and code executed from RAM after wake-up.
7) CPU in sleep, peripherals clock disabled, Flash is powered down and code executed from RAM after wake-up.
8) CPU in sleep, Flash is in active mode during sleep mode.
9) CPU in sleep, Flash is in powered down mode during deep sleep mode.
Data Sheet
54
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.3
AC Parameters
3.3.1
Testing Waveforms
VDDP
90%
90%
10%
10%
VSS
tR
tF
Figure 20
Rise/Fall Time Parameters
VDDP
VDDP / 2
VDDP / 2
Test Points
VSS
Figure 21
Testing Waveform, Output Delay
VLOAD + 0.1V
VOH - 0.1V
Timing
Reference
Points
VLOAD - 0.1V
VOL + 0.1V
Figure 22
Testing Waveform, Output High Impedance
Data Sheet
55
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.3.2
Power-Up and Supply Threshold Characteristics
Table 26 provides the characteristics of the supply threshold in XMCXXXXSC.
The guard band between the lowest valid operating voltage and the brownout reset
threshold provides a margin for noise immunity and hysteresis. The electrical
parameters may be violated while VDDP is outside its operating range.
The brownout detection triggers a reset within the defined range. The prewarning
detection can be used to trigger an early warning and issue corrective and/or fail-safe
actions in case of a critical supply voltage drop.
Note: These parameters are not subject to production test, but verified by design and/or
characterization.
Table 26
Power-Up and Supply Threshold Parameters (Operating Conditions
apply)
Parameter
Symbol
Values
Typ. Max.
Unit Note /
Test Condition
Min.
107
0.1
10
s
VDDP
SVDDPrise
/
V
V
DDP ramp-up time
DDP slew rate
t
RAMPUP SR
S
S
VDDPOP SR
VDDP10 SR
0
V/s Slope during
normal operation
0
0
V/s Slope during fast
transient within +/-
10% of VDDP
S
VDDPrise SR
10
V/s Slope during
power-on or
restart after
brownout event
SVDDPfa 1) SR
0
0.25 V/s Slope during
supply falling out
of the +/-10%
ll
limits2)
V
DDP prewarning
V
DDPPW CC 2.1
2.25 2.4
V
ANAVDEL.VDEL_
SELECT = 00B
voltage
Data Sheet
56
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
Table 26
Power-Up and Supply Threshold Parameters (Operating Conditions
apply) (cont’d)
Parameter
Symbol
Values
Typ. Max.
1.62 1.75
Unit Note /
Test Condition
Min.
V
DDP brownout reset
V
V
DDPBO CC
1.55
V
calibrated, before
user code starts
running
voltage
V
DDP voltage to
1.0
V
DDPPA CC
ensure defined pad
states
Start-up time from
power-on reset
tSSW SR
260
–
s
Time to the first
user code
instruction3)
1) A capacitor of at least 100 nF has to be added between VDDP and VSSP to fulfill the requirement as stated for
this parameter.
2) Valid for a 100 nF buffer capacitor connected to supply pin where current from capacitor is forwarded only to
the chip. A larger capacitor value has to be chosen if the power source sink a current.
3) This values does not include the ramp-up time. During startup firmware execution, MCLK is running at 48 MHz
and the clocks to peripheral as specified in register CGATSTAT0 are gated.
5.0V
VDDPPW
}
VDDP
VDDPBO
Figure 23
Supply Threshold Parameters
Data Sheet
57
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.3.3
Peripheral Timings
Note: These parameters are not subject to production test, but verified by design and/or
characterization.
Data Sheet
58
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
3.3.3.1
Inter-IC (IIC) Interface Timing
The following parameters are applicable for a USIC channel operated in IIC mode.
Note: Operating Conditions apply.
Table 33
USIC IIC Standard Mode Timing1)
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
Typ.
Max.
Fall time of both SDA and
SCL
-
-
300
ns
ns
µs
ns
µs
µs
µs
µs
µs
µs
t1
CC/SR
Rise time of both SDA and
SCL
-
-
-
-
-
-
-
-
-
-
1000
t2
CC/SR
Data hold time
0
-
-
-
-
-
-
-
-
t3
CC/SR
Data set-up time
250
4.7
4.0
4.0
4.7
4.0
4.7
t4
CC/SR
LOW period of SCL clock
HIGH period of SCL clock
t5
CC/SR
t6
CC/SR
Hold time for (repeated)
START condition
t7
CC/SR
Set-up time for repeated
START condition
t8
CC/SR
Set-up time for STOP
condition
t9
CC/SR
t10
CC/SR
Bus free time between a
STOP and START
condition
Capacitive load for each
bus line
Cb SR
-
-
400
pF
1) Due to the wired-AND configuration of an IIC bus system, the port drivers of the SCL and SDA signal lines
need to operate in open-drain mode. The high level on these lines must be held by an external pull-up device,
approximalely 10 kOhm for operation at 100 kbit/s, approximately 2 kOhm for operation at 400kbit/s.
Data Sheet
59
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
Table 34
USIC IIC Fast Mode Timing1)
Parameter
Symbol
Min.
Values
Typ.
-
Unit Note /
Test Condition
Max.
Fall time of both SDA and
SCL
20 +
300
ns
t1
CC/SR
0.1*Cb
2)
Rise time of both SDA and
SCL
20 +
CC/SR 0.1*Cb
-
-
-
-
-
-
-
-
-
300
ns
µs
ns
µs
µs
µs
µs
µs
µs
t2
Data hold time
0
-
-
-
-
-
-
-
-
t3
CC/SR
Data set-up time
100
1.3
0.6
0.6
0.6
0.6
1.3
t4
CC/SR
LOW period of SCL clock
HIGH period of SCL clock
t5
CC/SR
t6
CC/SR
Hold time for (repeated)
START condition
t7
CC/SR
Set-up time for repeated
START condition
t8
CC/SR
Set-up time for STOP
condition
t9
CC/SR
t10
CC/SR
Bus free time between a
STOP and START
condition
Capacitive load for each
bus line
Cb SR
-
-
400
pF
1) Due to the wired-AND configuration of an IIC bus system, the port drivers of the SCL and SDA signal lines
need to operate in open-drain mode. The high level on these lines must be held by an external pull-up device,
approximalely 10 kOhm for operation at 100 kbit/s, approximately 2 kOhm for operation at 400kbit/s.
2) Cb refers to the total capacitance of one bus line in pF.
Data Sheet
60
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Electrical Parameter
t1
t2
t4
70%
30%
SDA
SCL
t1
t3
t2
t6
9th
clock
t7
t5
t10
S
SDA
SCL
t8
t7
t9
9th
clock
Sr
P
S
Figure 26
USIC IIC Timing
Data Sheet
61
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Package and Reliability
4
Package and Reliability
The XMCXXXXSC is a member of the XMC1000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the exposed die pad may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
4.1
Package Parameters
Table 37 provides the thermal characteristics of the packages used in XMCXXXXSC.
Table 37
Thermal Characteristics of the Packages
Parameter
Symbol
Limit Values
Min. Max.
Unit
Package Types
Exposed Die Pad
Dimensions
Ex Ey
CC
-
3.7 3.7 mm
PG-VQFN-40-17
PG-VQFN-40-171)
Thermal resistance
Junction-Ambient
RJA CC
-
45.3 K/W
1) Device mounted on a 4-layer JEDEC board (JESD 51-5); exposed pad soldered.
Note: For electrical reasons, it is required to connect the exposed pad to the board
ground VSSP, independent of EMC and thermal requirements.
4.1.1
Thermal Considerations
When operating the XMCXXXXSC in a system, the total heat generated in the chip
must be dissipated to the ambient environment to prevent overheating and the
resulting thermal damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance RJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 115 °C.
Data Sheet
62
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
Package and Reliability
The difference between junction temperature and ambient temperature is determined by
T = (PINT + PIOSTAT + PIODYN) RJA
The internal power consumption is defined as
P
INT = VDDP IDDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
IOSTAT = ((VDDP-VOH) IOH) + (VOL IOL)
P
The dynamic external power consumption caused by the output drivers (PIODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Reduce VDDP, if possible in the system
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
Data Sheet
63
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
XMCxxxxSCQ040
XMC1000 Family
4.2
Package Outlines
0.4
9 x
= 3.6
5
A
0.4
0.9MAX.
M
0.1 A C 2x
0.05
A B C
B
21
30
31
40
0.08
C
20
40x
0.1C
COPLANARITY
11
10
1
Index Marking
±0.05 40x
0.1 B C
2x
0.2
M
M
M
0.07
0.05
0.05
A B C
C
Index Marking
C
(0.2)
±0.1
3.6
A B C
0.05MAX.
STANDOFF
PG-VQFN-40-13, -14, -17-PO V05
Figure 30
PG-VQFN-40-17
All dimensions in mm.
5
Quality Declaration
Table 38 shows the characteristics of the quality parameters in the XMCXXXXSC.
Table 38
Quality Parameters
Symbol Limit Values
Parameter
Unit Notes
Min.
Max.
VHBM
ESD susceptibility
-
2000
V
V
Conforming to
EIA/JESD22-
A114-B
according to Human Body SR
Model (HBM)
VCDM
ESD susceptibility
-
500
Conforming to
according to Charged
Device Model (CDM) pins
SR
JESD22-C101-C
MSL
CC
Moisture sensitivity level
-
-
3
-
JEDEC
J-STD-020D
TSDR
SR
Soldering temperature
260
°C
Profile according
to JEDEC
J-STD-020D
Data Sheet
64
V1.3, 2019-05
Subject to Agreement on the Use of Product Information
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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