IN74LV241DW [INTEGRAL]

OCTAL BUFFER/LINE DRIVE; 3-STATE; 八路缓冲器/线路驱动器; 3 -STATE
IN74LV241DW
型号: IN74LV241DW
厂家: INTEGRAL CORP.    INTEGRAL CORP.
描述:

OCTAL BUFFER/LINE DRIVE; 3-STATE
八路缓冲器/线路驱动器; 3 -STATE

驱动器
文件: 总5页 (文件大小:47K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TECHNICAL DATA  
IN74LV241  
OCTAL BUFFER/LINE DRIVE; 3-STATE  
The IN74LV241 is a low-voltage Si-gate CMOS device and is pin and  
function compatible with IN74HC/HCT241.  
The IN74LV241 is an octal non-inverting buffer/line driver with 3-  
state outputs. The 3-state outputs are controlled by the output enable  
inputs 1OE and 2OE.  
N SUFFIX  
PLASTIC DIP  
20  
1
·
·
·
·
·
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 1.2 to 3.6 V  
Low Input Current: 1.0 mA, 0.1 mÀ at Ò = 25 °Ñ  
Output Current: 8 mA at VCC = 3.0 V  
DW SUFFIX  
SO  
20  
1
High Noise Immunity Characteristic of CMOS Devices  
ORDERING INFORMATION  
IN74LV241N  
IN74LV241DW  
IZ74LV241  
Plastic DIP  
SOIC  
chip  
TA = -40° to 125° C for all packages  
LOGIC DIAGRAM  
PIN ASSIGNMENT  
2
18  
16  
14  
12  
9
1Y  
1Y  
1A  
1A  
0
1
0
1
1OE  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
VCC  
2OE  
1Y0  
2A3  
1Y1  
2A2  
1Y2  
2A1  
1Y3  
2A0  
4
1A0  
2Y3  
2
6
1Y  
1A  
1A  
2A  
2A  
3
2
2
3
0
1
1A1  
4
8
1Y  
3
2Y2  
5
NONINVERTING  
OUTPUTS  
DATA  
INPUTS  
1A2  
6
11  
13  
15  
17  
2Y  
0
2Y1  
7
7
2Y  
1A3  
8
1
2Y0  
9
5
2Y  
2Y  
2A  
0
1
0
10  
GND  
3
2A  
1
1
1OE  
2OE  
FUNCTION TABLE  
OUTPUT  
ENABLES  
19  
Input  
1OE 1An  
Output  
Input  
Output  
1Yn  
L
2OE 2An  
2Yn  
L
L
L
L
H
X
H
H
L
L
H
X
H
H
PIN 20=VCC  
PIN 10 = GND  
H
Z
Z
H= high level  
L = low level  
X = don’t care  
Z = high impedance  
INTEGRAL  
1
IN74LV241  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
-0.5 to +5.0  
±20  
Unit  
V
VCC  
DC supply voltage  
1
IIK  
*
DC Input diode current  
DC Output diode current  
mA  
mA  
mA  
mA  
mA  
mW  
2
IOK  
*
±50  
IO *3  
DC Output source or sink current  
DC VCC current  
±35  
ICC  
±70  
IGND  
PD  
DC GND current  
±70  
Power dissipation per package: *4  
Plastic DIP  
SO  
750  
500  
Tstg  
TL  
Storage Temperature  
-65 to +150  
260  
°C  
°C  
Lead Temperature, 1.5 mm (Plastic DIP Package), 0.3 mm (SO  
Package) from Case for 4 Seconds  
*Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
*1 V < -0.5 V or V > VCC + 0.5 V.  
I
I
*2 VO < -0.5 V or VO > VCC + 0.5 V.  
*3 -0.5 V < VO < VCC + 0.5 V.  
*4 Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C  
SO Package: : - 8 mW/°C from 70° to 125°C  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
1.2  
0
Max  
3.6  
Unit  
V
VCC  
DC Supply Voltage  
Input Voltage  
V
I
VCC  
V
VO  
TA  
Output Voltage  
0
VCC  
V
Operating Temperature, All Package Types  
Input Rise and Fall Time (Figure 1)  
-40  
+125  
°C  
ns  
tr, tf  
VCC =1.2 V  
VCC =2.0 V  
VCC =3.0 V  
VCC =3.6 V  
0
0
0
0
1000  
700  
500  
400  
This device contains protection circuitry to guard against damage due to high static voltages or electric  
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages  
to this high-impedance circuit. For proper operation, V and VOUT should be constrained to the range GND£(V or  
IN  
IN  
VOUT)£VCC.  
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused  
outputs must be left open.  
INTEGRAL  
2
IN74LV241  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
Test  
VCC  
V
Guaranteed Limit  
Symbol  
Parameter  
conditions  
25°C  
-40°C to 85°C  
125°C  
Unit  
min max min  
max  
min  
max  
V
IH  
HIGH level input  
voltage  
1.2  
2.0  
3.0  
3.6  
0.9  
1.4  
2.1  
2.5  
-
-
-
-
0.9  
1.4  
2.1  
2.5  
-
-
-
-
0.9  
1.4  
2.1  
2.5  
-
-
-
-
V
V
LOW level input  
voltage  
1.2  
2.0  
3.0  
3.6  
-
-
-
-
0.3  
0.6  
0.9  
1.1  
-
-
-
-
0.3  
0.6  
0.9  
1.1  
-
-
-
-
0.3  
0.6  
0.9  
1.1  
V
V
IL  
VOH  
HIGH level output V = V or V  
IL  
voltage  
1.2  
2.0  
3.0  
3.6  
1.1  
-
-
-
-
1.0  
1.9  
2.9  
3.5  
-
-
-
-
1.0  
1.9  
2.9  
3.5  
-
-
-
-
I
IH  
IO = -50 mÀ  
1.92  
2.92  
3.52  
V = V or V  
IL  
3.0  
2.48  
-
2.34  
-
2.20  
-
V
V
I
IH  
IO = -8 mÀ  
LOW level output V = V or V  
IL  
VOL  
1.2  
2.0  
3.0  
3.6  
-
-
-
-
0.09  
0.09  
0.09  
0.09  
-
-
-
-
0.1  
0.1  
0.1  
0.1  
-
-
-
-
0.1  
0.1  
0.1  
0.1  
I
IH  
voltage  
IO = 50 mÀ  
V = V or V  
IL  
3.0  
-
0.33  
-
0.4  
-
0.5  
V
I
IH  
IO = 8 mÀ  
V = VCC or 0 V  
II  
Input current  
*
-
-
±0.1  
±0.5  
-
-
±1.0  
±5  
-
-
±1.0  
±10  
mÀ  
mÀ  
I
IOZ  
Three state leakage 3-state outputs  
1.2  
*
current  
V (01,19) = V  
I
IH  
VO =VCC or 0 V  
ICC  
Supply current  
V =VCC or 0 V  
I
*
-
8.0  
-
80  
-
160  
mÀ  
IO = 0 mÀ  
* VCC = 3.3 ± 0.3 V  
INTEGRAL  
3
IN74LV241  
AC ELECTRICAL CHARACTERISTICS (CL=50 pF, tr=tf=6.0 ns)  
Test  
VCC  
V
Guaranteed Limit  
Symbol  
Parameter  
conditions  
25°C  
-40°C to  
85°C  
125°C  
Unit  
min max min  
max  
min  
max  
tPHL, tPLH Propagation delay , 1An V = 0 V or VCC  
1.2  
2.0  
*
-
-
-
100  
24  
15  
-
-
-
125  
30  
19  
-
-
-
150  
36  
23  
ns  
ns  
ns  
ns  
I
to 1Yn, 2An to 2Yn  
Figure 1 and 3  
tPHZ tPLZ Propagation delay, 1OE to V = 0 V or VCC  
1.2  
2.0  
*
-
-
-
140  
30  
20  
-
-
-
175  
35  
24  
-
-
-
210  
41  
28  
I
1Yn, 2OE to 2Yn  
Figure 2 and 4  
tPZH tPZL Propagation delay, 1OE to V = 0 V or VCC  
1.2  
2.0  
*
-
-
-
140  
32  
20  
-
-
-
175  
40  
25  
-
-
-
210  
48  
30  
I
1Yn, 2OE to 2Yn  
Figure 2 and 4  
tTHL, tTLH Output Transition Time,  
Any Output  
V = 0 V or VCC  
Figure 1 and 3  
1.2  
2.0  
*
-
-
-
60  
16  
10  
-
-
-
75  
20  
13  
-
-
-
90  
24  
15  
I
CI  
Input capacitance  
3.0  
-
-
7.0  
70  
-
-
7.0  
-
-
-
7.0  
-
pF  
pF  
CPD  
Power dissipation  
capacitance (per one  
channel)  
V = 0 V or VCC  
I
* VCC = 3.3 ± 0.3 V  
VCC  
50%  
1OE  
2OE  
t
t
GND  
r
f
VCC  
VCC  
90%  
50%  
1Anor 2An  
50%  
10%  
GND  
GND  
tPZL  
tPLZ  
tPLH  
tPHL  
V
CC  
90%  
50%  
50%  
10%  
1Yn or 2Y  
1Ynor 2Yn  
1Ynor 2Yn  
n
VOL  
VOH  
GND  
tPHZ  
tPZH  
tTLH  
tTHL  
50%)  
Figure 1. Switching Waveforms  
Figure 2. Switching Waveforms  
TEST POINT  
TEST POINT  
Connect to V when  
CC  
and t  
PZL  
DEVICE  
UNDER  
TEST  
1 k  
OUTPUT  
testing t  
OUTPUT  
PLZ  
DEVICE  
UNDER  
TEST  
Connect to GND when  
testing t and t  
*
*
L
PHZ  
PZH  
C
C
L
* Includes all probe and jig capacitance  
* Includes all probe and jig capacitance  
INTEGRAL  
4
IN74LV241  
Figure 3. Test Circuit  
Figure 4. Test Circuit  
CHIP PAD DIAGRAM  
Chip marking  
25LV241  
13  
18  
17  
19  
16 15  
14  
12  
11  
20  
10  
09  
01  
02  
05  
06  
04  
07 08  
03  
Y
(0,0)  
X
1.9 + 0.03  
Location of marking (mm): left lower corner x=1.539, y=1.433.  
Chip thickness: 0.46 ± 0.02 mm.  
PAD LOCATION  
Location (left lower corner), mm  
Pad No  
Symbol  
Pad size, mm  
X
Y
01  
02  
03  
04  
05  
06  
07  
08  
09  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
1OE  
1A0  
0.115  
0.55  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.108 x0.108  
0.1075  
0.3215  
0.76  
0.246  
0.131  
0.131  
0.131  
0.131  
0.131  
0.131  
0.43  
0.643  
1.0855  
1.266  
1.4345  
1.4345  
1.4345  
1.4345  
1.4345  
1.4345  
1.1385  
0.949  
2Y  
3
1A1  
2Y  
0.9285  
1.2115  
1.4615  
1.674  
1.674  
1.685  
1.674  
1.6795  
1.674  
1.0525  
0.7545  
0.586  
0.293  
0.112  
0.112  
0.112  
2
2A2  
2Y  
1
2A3  
2Y  
0
GND  
2A0  
1Y  
3
2A1  
1Y  
2
2A2  
1Y  
1
2A3  
1Y  
0
2OE  
VCC  
Note: Pad location is given as per metallization layer  
INTEGRAL  
5

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