MFSYS35 [INTEL]
Technical Product Specification; 产品技术指标
| 型号： | MFSYS35 |
| 厂家： | 
INTEL |
| 描述： | Technical Product Specification |
| 文件： | 总52页 (文件大小：2701K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Intel® Modular Server System
MFSYS25/MFSYS35
Technical Product Specification
Intel order number E15155-006
Revision 1.3
November, 2008
Enterprise Platforms and Services Division
Revision History
Intel® Modular Server System MFSYS25/MFSYS35 TPS
Revision History
Date
Revision
Number
0.88
Modifications
July, 2007
Initial release.
Updated.
September, 2007
February, 2008
June, 2008
1.0
1.1
1.2
Updated.
Updated Power Budget of Hardware Components, Table 5. Added 3.5-inch drive
bay information for the Intel® Modular Server System MFSYS35.
November, 2008
1.3
Updated System Details, power and heat specifications
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or
implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except
as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel
products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for
use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and
product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
“reserved” inches or “undefined” Intel reserves these for future definition and shall have no responsibility
whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Modular Server System MFSYS25/MFSYS35 may contain design defects or errors known as
errata, which may cause the product to deviate from published specifications. Current characterized
errata are available on request.
Intel Corporation server baseboards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the
intended thermal requirements of these components when the fully integrated system is used together. It
is the responsibility of the system integrator that chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of airflow
required for their specific application and environmental conditions. Intel Corporation cannot be held
responsible if components fail or the server board does not operate correctly when used outside any of
their published operating or non-operating limits.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others. Copyright © Intel Corporation 2007-
2008
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Table of Contents
Table of Contents
1. Product Overview.................................................................................................................1
2. System Overview..................................................................................................................2
2.1
2.2
Introduction..............................................................................................................2
External Chassis Features – Front ..........................................................................5
Compute Module .....................................................................................................6
Storage Enclosure ...................................................................................................6
I/O Cooling Module..................................................................................................6
External Chassis Features – Rear...........................................................................7
Power Supply Module..............................................................................................7
I/O Slots...................................................................................................................7
Chassis Management Module .................................................................................8
Main Cooling Module...............................................................................................8
Internal Chassis Features........................................................................................8
Midplane Board......................................................................................................10
Storage Interposer Board ......................................................................................11
Mounting and Service Features.............................................................................11
Chassis..................................................................................................................11
Rails.......................................................................................................................11
Server Management ..............................................................................................11
Chassis Management Module ...............................................................................12
Compute Module Management .............................................................................12
Reliability, Availability, Serviceability, Usability, Manageability (RASUM) .............13
2.2.1
2.2.2
2.2.3
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.4
2.4.1
2.4.2
2.5
2.5.1
2.5.2
2.6
2.6.1
2.6.2
2.7
3. System Details....................................................................................................................14
3.1
3.1.1
Specifications.........................................................................................................14
Environmental Specifications Summary ................................................................14
Physical Specifications Summary..........................................................................14
Power Specifications Summary.............................................................................15
Chassis..................................................................................................................16
Midplane Board......................................................................................................19
Mechanical Outline ................................................................................................19
3D Renderings.......................................................................................................20
Compute Module ...................................................................................................21
Introduction............................................................................................................21
Drawings................................................................................................................22
Chassis Management Module ...............................................................................22
Introduction............................................................................................................22
Mechanical Outline ................................................................................................23
Block Diagram .......................................................................................................24
3.1.2
3.1.3
3.2
3.3
3.3.1
3.3.2
3.4
3.4.1
3.4.2
3.5
3.5.1
3.5.2
3.5.3
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3.5.4
3.5.5
Drawings................................................................................................................24
Architectural Overview...........................................................................................25
Ethernet Switch Module.........................................................................................26
Introduction............................................................................................................26
Mechanical Outline ................................................................................................26
Block Diagram .......................................................................................................27
Architectural Overview...........................................................................................27
Storage Controller Module.....................................................................................28
Storage Subsystem Introduction............................................................................28
Mechanical Outline ................................................................................................28
Storage Controller Module View............................................................................29
Architectural Overview...........................................................................................29
Power Supply Module............................................................................................30
Jumpers and LEDs ................................................................................................31
3.6
3.6.1
3.6.2
3.6.3
3.6.4
3.7
3.7.1
3.7.2
3.7.3
3.7.4
3.8
3.9
4. Product Regulatory Requirements ...................................................................................32
4.1
4.1.1
Product Regulatory Compliance............................................................................32
Product Safety Compliance ...................................................................................32
Product EMC Compliance - Class A Compliance..................................................32
Product Ecology Compliance.................................................................................33
Certifications / Registrations / Declarations...........................................................33
Product Regulatory Compliance Markings ............................................................33
Regulated Specified Components .........................................................................38
Electromagnetic Compatibility Notices ..................................................................39
FCC Verification Statement (USA) ........................................................................39
ICES-003 (Canada) ...............................................................................................40
Europe (CE Declaration of Conformity) .................................................................40
VCCI (Japan).........................................................................................................41
BSMI (Taiwan).......................................................................................................41
4.1.2
4.1.3
4.1.4
4.2
4.3
4.4
4.4.1
4.4.2
4.4.3
4.4.4
4.4.5
Glossary.....................................................................................................................................43
Reference Documents..............................................................................................................46
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List of Figures
List of Figures
Figure 1. Intel® Modular Server System MFSYS25 Wiring Diagram.............................................3
Figure 2. Intel® Modular Server System MFSYS35 Wiring Diagram.............................................4
Figure 3. Front View of Server Platform........................................................................................5
Figure 4. Rear View of Server Platform ........................................................................................7
Figure 5. View of Intel® Modular Server System MFSYS25 System Board Connectivity..............9
Figure 6. View of Intel® Modular Server System MFSYS35 System Board Connectivity............10
Figure 7. Server Management Connectivity................................................................................12
Figure 8. Front View of Empty Intel® Modular Server System MFSYS25...................................16
Figure 9. Front View of Empty Intel® Modular Server System MFSYS35...................................17
Figure 10. Rear View of Empty Intel® Modular Server System MFSYS25..................................18
Figure 11. Rear View of Empty Intel® Modular Server System MFSYS35..................................18
Figure 12. Midplane Board Mechanical Outline (Front View) .....................................................19
Figure 13. Front View of Midplane Board ...................................................................................20
Figure 14. Rear View of Midplane Board....................................................................................21
Figure 15. Front View of Compute Module .................................................................................22
Figure 16. Chassis Management Module Board Outline (Top View)..........................................23
Figure 17. Chassis Management Module Block Diagram...........................................................24
Figure 18. Front View of Chassis Management Module.............................................................25
Figure 19. Ethernet Switch Module Mechanical Outline (Top View)...........................................26
Figure 20. Ethernet Switch Module Block Diagram ....................................................................27
Figure 21. Mechanical Outline of Storage Controller Module Board...........................................28
Figure 22. Front View of Storage Controller Module...................................................................29
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List of Tables
Intel® Modular Server System MFSYS25/MFSYS35 TPS
List of Tables
Table 1. Server Platform Feature List...........................................................................................2
Table 2. Environmental Specifications Summary .......................................................................14
Table 3. Physical Specifications of Chassis................................................................................14
Table 4. Physical Dimensions of Hardware Components...........................................................15
Table 5. Power Budget of Hardware Components .....................................................................15
Table 6. Power and Heat Dissipation Specifications of Chassis.................................................15
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Product Overview
1. Product Overview
This product specification details the features of the Intel® Modular Server System
MFSYS25/MFSYS35. This product is designed to serve the small to medium business
environment. Primary design considerations include ease of use, reliability, low cost, modularity,
and remote management.
The Intel® Modular Server System MFSYS25/MFSYS35 supports up to six dual-processor
compute modules, or a total of 12 Multi-Core Intel® Xeon® 5000 sequence processors. The
chassis also incorporates features that clearly distinguish it as an easy-to-use and highly
available server platform. Building on previous server platforms, the Intel® Modular Server
System MFSYS25/MFSYS35 includes redundant storage and networking, in addition to the
enterprise features of hot-swap power, cooling, and hard disk drives. Advanced server
management features remotely monitor and manage the server.
This document is organized into four sections:
Section 1: Product Overview
This section provides an overview of the product.
Section 2: System Overview
This section provides an overview of the system hardware.
Section 3: System Details
This section provides details of the various hardware components specific to the server
platform.
Section 4: Product Regulatory Requirements
This section describes system compliance to regulatory specifications.
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System Overview
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2.
System Overview
This section provides an overview of the features of the Intel® Modular Server System
MFSYS25/MFSYS35.
2.1
Introduction
The platform supports six compute modules providing sockets for up to 12 Multi-Core Intel®
Xeon® processors 5000 sequence, up to 192 GB of memory (using 4-GB DIMMs), up to
fourteen hot-swap 2.5-inch SAS hard disk drives in the Intel® Modular Server System MFSYS25
or up to six hot-swap 3.5-inch SAS/SATA hard disk drives in the Intel® Modular Server System
MFSYS35, an integrated server management module, redundant Ethernet switches and
redundant storage controllers. The server ships configured for rack mounting, but may be
mounted in a pedestal configuration.
The following table lists and briefly describes the features of the Intel® Modular Server System
MFSYS25/MFSYS35.
Table 1. Server Platform Feature List
Feature
Compact, high-density
system
Description
Rack-mount server with a height of 6U (10.5 inches) and a depth of 28 inches (706 mm)
Configuration flexibility
Shared storage hard drive bay supporting up to fourteen (14) 2.5-inch SAS hard drives in
the Intel® Modular Server System MFSYS25 and up to six (6) 3.5-inch SAS/SATA hard
drives in the Intel® Modular Server System MFSYS35.
Up to six (6) compute modules
Optional secondary Ethernet switch module
Optional secondary storage controller
Serviceability
Tool-less design features
Front access to optional hot-swap hard disk drives
Rear access to I/O slots, cooling, and hot-swap power supplies
Status and fault indicator LEDs
Front viewable compute module ID LEDs
Color-coded parts to identify hot-swap and non-hot-swap serviceable components
Four 1000-W power supplies in a redundant (3+1) configuration with separate power cords
Up to six compute modules
Availability
Redundant networking and storage
Redundant cooling
Manageability
Remote management
Extensive system sensors and monitoring
Remote diagnostics support via serial and LAN ports
Web management console
KVM console redirection
The front of each individual compute module provides video, USB, a power button, and
status LEDs that allow local monitoring and managing of the individual compute module.
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System Overview
Feature
Description
The cooling subsystem consists of three cooling zones
Cooling
•
•
•
I/O module cooling
Hard drives and power supplies
Compute modules
Each cooling zone contains dedicated hot-swap fan modules.
Each fan module contains a status LED to indicate a fan failure.
The front- and rear-accessible fan modules connect directly to the system midplane board.
Full system management via Web browser
Easy to use
Configuration wizards assist in setup of storage and network
Figure 1. Intel® Modular Server System MFSYS25 Wiring Diagram
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Figure 2. Intel® Modular Server System MFSYS35 Wiring Diagram
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2.2
External Chassis Features – Front
Figure 3 shows the front view of the platform with all modules populated.
B
A
C
AF002657
D
Item
A
Description
Compute modules (six)
Storage enclosure:
B
14 hot-swap 2.5-inch SAS hard disk drives – Intel® Modular Server
System MFSYS25 only
6 hot-swap 3.5-inch SAS/SATA hard disk drives – Intel® Modular
Server System MFSYS35 only
C
D
I/O cooling module
System Fault LED (amber)
Figure 3. Front View of Server Platform
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2.2.1
Compute Module
The Intel® Modular Server System MFSYS25/MFSYS35 supports up to six compute modules.
Each of these general-purpose servers provides the following minimum features:
Processor(s)
Memory
Integrated Baseboard management controller
Network interface
Each server connects to the chassis management module, storage controllers and switch
modules via the midplane board. The midplane also distributes the 12V power from the power
supplies to the compute modules. The servers connect to the shared storage (14 SAS drives in
the Intel® Modular Server System MFSYS25 and 6 SAS/SATA drives in the Intel® Modular
Server System MFSYS35) via the storage controller(s) in the rear of the chassis.
See the individual Intel® Compute Module Technical Product Specification for model-specific
information about your compute module(s).
2.2.2
Storage Enclosure
The Intel® Modular Server System MFSYS25/MFSYS35 supports an optional hard disk drive
storage enclosure and has the following minimum features:
Bays for 14 hot-swap 2.5-inch SAS hard disk drives in the Intel® Modular Server System
MFSYS25 and six (6) 3.5-inch SAS/SATA hard drives in the Intel® Modular Server
System MFSYS35
At least one storage controller in an I/O slot
Because hard disk drives have different cooling, power, and vibration characteristics, Intel
validates specific hard disk drive types in the platforms. See the Intel® Modular Server System
MFSYS25/MFSYS35 Tested Hardware and Operating System List for a list of qualified drives.
2.2.3
I/O Cooling Module
The I/O cooling module consists of six fans that operate in a (3 + 3) cooling redundancy in a
hot-swap module with power and failure indicators. These fans provide cooling for all I/O
modules. This module is accessible from the front of the system even though it cools the I/O
modules in the rear of the system.
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System Overview
2.3
External Chassis Features – Rear
The following figure shows the rear view of the platform with all modules populated.
C
A
B
D
E
AF002564
Item
A
Description
Power supply units (four, 3+1)
B
C
D
E
Main cooling modules (required)
Ethernet switch modules
Storage controllers
Management module (required)
Figure 4. Rear View of Server Platform
2.3.1
Power Supply Module
Four hot-swap power supply modules are installed in the right rear of the chassis. Each supply
has its own AC input power connector and is rated at 1000 W over an input range of 100-240
VAC. Each power supply includes two fans that provide cooling for optional hot-swap disk
drives.
See Section 3.8 for more details on the power supply module.
2.3.2
I/O Slots
The middle-rear of the chassis can accommodate up to four expansion modules. See the
following sections for a description of the two I/O modules currently offered.
2.3.2.1
Ethernet Switch Module
The chassis can accommodate up to two hot-swap Ethernet switch modules. Each switch has
ten uplink ports on the rear panel in addition to two ports routed to each compute module. One
switch module is the minimum configuration for external networking, with a second switch
module allowing network redundancy.
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See Section 3.6 for a description of this module.
2.3.2.2 Storage Controller Module
The chassis can accommodate up to two hot-swap storage controller modules to support the
external hard disks in the front storage enclosure. One storage controller is the minimum
configuration, with a second storage controller allowing storage controller redundancy. Storage
controller failures are automatically detected and hard drive access is maintained through the
operational storage controller.
See Section 3.7 for a description of this system.
2.3.3
Chassis Management Module
The chassis management module, installed in the middle-rear of the chassis amid the four I/O
slots, provides an Internet browser interface that allows for configuration and management of
the entire Intel® Modular Server System MFSYS25/MFSYS35. This module is not redundant,
but the system continues to operate normally should this module fail although any changes to
the system configuration cannot be made until the failed chassis management module is
replaced.
See Section 3.5 for a description of this module.
2.3.4
Main Cooling Module
Two hot-swap cooling modules are installed on the left rear of the chassis. Each cooling module
contains two redundant fans that operate in a (1+1) cooling redundancy. Cooling module 1
cools compute modules 1-3; cooling module 2 cools compute modules 4-6.
2.4
Internal Chassis Features
The following figures provide an internal view of how the Intel® Modular Server System
MFSYS25/MFSYS35 system boards are connected.
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Item
A
Description
Server board
B
C
D
E
F
G
H
I
14-drive backplane
Interposer board (connects drive backplane to midplane)
I/O fan controller
Midplane board
Compute module fan controllers
Storage controller boards
Switch module boards
Chassis management module board
Figure 5. View of Intel® Modular Server System MFSYS25 System Board Connectivity
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Item
A
Description
Server board
B
C
D
E
F
G
H
I
6-drive backplane
Interposer board (connects drive backplane to midplane)
I/O fan controller
Midplane board
Compute module fan controllers
Storage controller boards
Switch module boards
Chassis management module board
Figure 6. View of Intel® Modular Server System MFSYS35 System Board Connectivity
2.4.1
Midplane Board
The midplane board mounts vertically in the middle of the system and provides power and I/O
signaling, both high-speed and low-speed, to all chassis subassemblies and options. This board
is considered to be a part of the chassis and cannot be replaced. For this reason, there are no
active components on this board.
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2.4.2
Storage Interposer Board
The interposer board mounts vertically in the front left of the system and connects the midplane
to the hot-swap backplane in the storage enclosure. Each compute module connects to the
storage controller with a non-RAID SAS controller, with the storage controller providing the RAID
functionality.
2.5 Mounting and Service Features
2.5.1
Chassis
The platform utilizes a standard 19-inch EIA chassis, 6U high by 28 inches deep. The chassis
can be rack-mounted or used as a pedestal system. Rack mounting the platform requires a
space of 6U high by 19 inches wide by 34 inches deep, with additional six inches required for
cable management. When used in a rack, the chassis may be mounted with an optional rail kit.
Pedestal operation requires the installation of six rubber feet to the bottom of the chassis.
The 6U height is defined by standard EIA rack units, where 1U equals 1.75 inches. The 28-inch
depth is measured from the front mounting flange to the back of the I/O slots. This
measurement does not include cables or the bezel.
2.5.2
Rails
The platform accommodates rails to mount the chassis into a standard 19-inch rack. The Intel®
Modular Server System MFSYS25/MFSYS35 uses fixed rails. All customer-accessible
components provide either front or rear access. The rails attach to the rack using a tool-less
mechanism. The system rests on the shelves of the rails and attaches to the rack using the
integrated thumbscrews on the front flanges of the system. No loose hardware is needed.
2.6
Server Management
The management of all components in the system can be done through the chassis
management module. This module provides a browser-based management interface that allows
the configuration and management of all modules. As part of the compute module
manageability, the chassis management module provides remote access (such as connectivity
via Ethernet) to Keyboard-VDU-Mouse (KVM), USB media and serial console.
The management subsystem conforms to the IPMI v2.0 Specification for communication within
the chassis (such as between the chassis management module and other system components).
SNMP is supported by the chassis management module for external system management.
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PSU
PSU
I2C BUS_0
I2C BUS_
Clear Bay:
Chassis Management
Connections
I2C BUS_1
I2C BUS_1
0
I/O FAN MODULE
I2C BUS
10/100Mbps
Ethernet
STORAGE
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
Ethernet
VLAN in-band
SPI BUS
I2C BUS_2
I2C BUS_2
Ethernet
VLAN in-band
Ethernet
VLAN in-band
SWITCH
SAS EXPANDER
INTERPOSER
I2C BUS_3
7 Busses
I2C BUS
MANAGEMENT
10/100 Ethernet
5 Used w/ SMB
SAS EXPANDER
I2C BUS_4
SPI Bus
FRU
I2C BUS_2
NVMEM
SWITCH
Ethernet
VLAN in-band
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
SERVER COMPUTE MODULE
Ethernet
VLAN in-band
I2C BUS_2
Ethernet
VLAN in-band
STORAGE
I2C BUS_1
SYSTEM FAN MODULE
SYSTEM FAN MODULE
PSU
PSU
I2C BUS_0
I2C BUS_0
I2C BUS_1
Figure 7. Server Management Connectivity
2.6.1
Chassis Management Module
The main controller in the chassis management module is an Intel® XScale IXP425
microcontroller that runs Linux to provide a robust operating environment. The service
processor provides IPMI communication within the system in addition to the user interface used
to manage the system over Ethernet.
See Section 3.5 for a description of this board.
2.6.2
Compute Module Management
Each compute module contains an Integrated Baseboard Management Controller (BMC) that is
responsible for all management local to the module, including power control, reset, sensor
reading, remote KVM, remote media and remote serial console. The Integrated BMC also
gathers events to be stored in the server event log. However, the compute module’s Integrated
BMC is managed by the chassis management module and must communicate with the chassis
management before providing any of these management features.
This architecture allows the chassis management module to control the security of all
components in the system.
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System Overview
2.7
Reliability, Availability, Serviceability, Usability, Manageability
(RASUM)
The platform supports the following reliability, availability, serviceability, usability and
manageability (RASUM) features:
Reliability features
Voltage and temperature monitoring throughout the system
Availability features
Hot-plug compute modules
Hot-spare compute modules
Redundant hot-swap power supply modules
Redundant hot-swap system fans
Hot-swap SAS hard drives
Optional teaming and failover Ethernet ports
Serviceability features
Tool-less installation and removal of major sub-assemblies
Color-coded parts to identify serviceable components
Green: To identify hot-swap or hot-plug components
Blue: To identify non-hot-swap components
Compute module ID buttons and LEDs
LED indicators for system health, configured options, and activity
Usability features
Tool-less design features
External access to hot-swap hard disk drives, power supplies, LEDs and switches
Front viewable compute module ID LEDs
Color-coded parts to identify hot-swap and non-hot-swap serviceable components
Manageability features
Remote management via serial and LAN
IPMI 2.0 compliance
Remote management via KVM and dedicated LAN
All subsystems are connected by a server management I2C bus to satisfy the system RASUM
requirements.
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3. System Details
3.1 Specifications
3.1.1
Environmental Specifications Summary
The following table describes the environmental specifications of the Intel® Modular Server
System MFSYS25/MFSYS35
Table 2. Environmental Specifications Summary
Environment
Temperature operating
Specification
50°F to 95°F
10°C to 35°C
-40°C to 70°C
-30 to 1,500 m
Temperature non-operating
Altitude
-40°F to 158°F
-100 to 5,000 ft
Humidity non-operating
Vibration non-operating
Shock operating
95%, non-condensing at temperatures of 25°C (77°F) to 30°C (86°F)
2.2 g, 10 minutes per axis on each of the three axes
Half-sine 2 G, 11 ms pulse, 100 pulses in each direction, on each of the three axes
Trapezoidal, 25 G, two drops on each of six faces
Shock non-operating
∆V : 175 inches/sec on bottom face drop, 90 inches/sec on other 5 faces
Safety
UL60 950, CSA60 950, AS/NZS 3562, GB4943-1995, EN60 950 and 73/23/EEC, IEC 60
950, EMKO-TSE (74-SEC) 207/94, GOST-R 50377-92
Emissions
Certified to FCC Class A; tested to CISPR 22 Class A, EN 55022 Class A and
89/336/EEC, VCCI Class A, AS/NZS 3548 Class A, ICES-003 Class A, GB9254-1998,
MIC Notice 1997-42 Class A, GOST-R 29216-91 Class A, BSMI CNS13438
Immunity
Verified to comply with EN55024, CISPR 24, GB9254-1998, MIC Notice 1997-41,
GOST-R 50628-95
Electrostatic discharge
Acoustic
Tested to ESD levels up to 15 kilovolts (kV) air discharge and up to 8 kV contact
discharge without physical damage
Sound power: < 7.0 BA at ambient temperature < 23° C measured using the Dome
Method
GOST MsanPiN 001-96
3.1.2
Physical Specifications Summary
The following table describes the physical specifications of the Intel® Modular Server System
MFSYS25/MFSYS35.
Table 3. Physical Specifications of Chassis
Specification
Height – 6U
Value
10.3 inches 261.4 mm
Width
17.5 inches 444.4 mm
28.4 inches 720.2 mm
Depth
Weight (full configuration)
187 lbs
85 kg
The following table describes the physical dimensions of the Intel® Modular Server System
MFSYS25/MFSYS35 and all components.
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Table 4. Physical Dimensions of Hardware Components
Module
Chassis
Height
261.4 mm
41.7 mm
25.0 mm
38.0 mm
32.0 mm
182.5 mm
53.3 mm
Width
Length
444.4 mm
279.4 mm
167.6 mm
167.6 mm
167.6 mm
130.2 mm
115 mm
720.2 mm
420.3 mm
295.9 mm
295.9 mm
295.9 mm
419.1 mm
286.3 mm
Compute module
CMM
I/O
Storage
Hard drive bay
Power supply
module
Main cooling module
I/O cooling module
126.6 mm
49.4 mm
126.0 mm
132.6 mm
291.9 mm
416.9 mm
3.1.3
Power Specifications Summary
The following table provides a summary of the 12V power budget for all modules in the Intel®
Modular Server System MFSYS25/MFSYS35.
Table 5. Power Budget of Hardware Components
Subsystem
12V
Budget
406 W
Compute module
Mezzanine card
5 W
5 W
Chassis management module
I/O Switch
40 W
48 W
140 W
188 W
26 W
Storage module
2.5/3.5-inch SAS drives
Chassis
Power supply blank
System Total
Power subsystem spec
3000 W
The following table provides a summary of the power and heat dissipation specifications for the
Intel® Modular Server System MFSYS25/MFSYS35.
Table 6. Power and Heat Dissipation Specifications of Chassis
Power Supply Input
Power Supply Output
System Power Input
System Power Output
System Power
1240 W
1050 W
3720 W
3150 W
100 V – 127 V, 200 V – 240 V
3720 W (12,701 BTUH) maximum
428 W (1461 BTUH) minimum
System Heat Dissipation
System Heat Dissipation
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3.2 Chassis
The Intel® Modular Server System MFSYS25/MFSYS35 design accommodates multiple
generations of compute modules, I/O modules, and storage controllers without the need to
upgrade or modify the chassis or the midplane board. This strategy allows the system to be in
use for many years with only the occasional upgrade of front and/or rear components as new
technologies become available.
The following two figures show the front view of an empty Intel® Modular Server System
MFSYS25/MFSYS35. Note that the hard drive bay is installed and the hard drive backplane is
visible on the left side of the chassis. The midplane board is also installed and is visible through
the empty compute module bay area.
HDD
Midplane
Figure 8. Front View of Empty Intel® Modular Server System MFSYS25
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Figure 9. Front View of Empty Intel® Modular Server System MFSYS35
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The following two figures show the rear view of an empty Intel® Modular Server System
MFSYS25/MFSYS35. The midplane is installed and is visible through the empty I/O and power
supply module areas.
Figure 10. Rear View of Empty Intel® Modular Server System MFSYS25
Figure 11. Rear View of Empty Intel® Modular Server System MFSYS35
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3.3 Midplane Board
This section describes the platform’s midplane board. The midplane is the central board that
connects to all removable modules. The midplane board, like the chassis, is designed to
accommodate multiple generations of compute modules, I/O modules and storage controllers
without the need to upgrade or modify the board. The connectors and electrical routing of the
midplane board have been designed to support future, higher speed technologies up to 10
Gb/s.
3.3.1
Mechanical Outline
The following figure shows the mechanical outline drawing of the platform’s midplane board.
Figure 12. Midplane Board Mechanical Outline (Front View)
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3.3.2
3D Renderings
This section contains perspective views of the midplane board.
Figure 13. Front View of Midplane Board
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Figure 14. Rear View of Midplane Board
3.4 Compute Module
This section describes the platform’s compute module at a high level. Refer to the Intel®
Compute Module MFS5000SI Technical Product Specification for additional details.
3.4.1
Introduction
The Intel® Modular Server System MFSYS25/MFSYS35 architecture allows new compute
modules to be developed around future processor/chipset combinations without any change to
the rest of the system. Given that processor/chipset improvements have occurred more
frequently than other technologies, such as I/O and storage, the compute module should be
updated more often than other components in the system.
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3.4.2
Drawings
This section contains perspective views of the compute module.
The following figure shows the front view of the module.
Figure 15. Front View of Compute Module
3.5 Chassis Management Module
This section describes the chassis management module (CMM) in the Intel® Modular Server
System MFSYS25/MFSYS35.
3.5.1
Introduction
The server platform’s chassis management module provides chassis-wide system
management. It interfaces with all system components either via the I2C bus or via the Intel®
Ethernet Switch Module. (The CMM connects via ethernet directly to the storage controller
module(s) and the Intel® Ethernet Switch Module(s), and indirectly to the compute modules.
There are no ethernet connections to the power supply modules, cooling modules, or LED
boards.) The main components of the CMM are the IXP-425 microcontroller, which runs the
Linux OS in addition to the built-in server control GUI, and the FPGA, which provides I²C bus
expansion among other functionality.
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3.5.2
Mechanical Outline
Figure 16. Chassis Management Module Board Outline (Top View)
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3.5.3
Block Diagram
The following block diagram divides the chassis management module into physical and
functional blocks. Arrows represent buses and signals. Blocks represent the physical and
functional circuits. The following figure illustrates the general architecture of the chassis
management module.
Figure 17. Chassis Management Module Block Diagram
3.5.4
Drawings
The following figure shows the front view of the CMM.
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Figure 18. Front View of Chassis Management Module
3.5.5
Architectural Overview
The chassis management module provides configuration and management capabilities for the
entire Intel® Modular Server System MFSYS25/MFSYS35. The CMM runs the Web browser-
accessible Server Control. The 10/100 Ethernet port on the front panel of the CMM provides the
main interface to the Intel® Modular Server System MFSYS25/MFSYS35.
The CMM runs the Linux operating system in addition to the built-in server control GUI
application. Through the GUI, the customer can configure and manage any system component.
Refer to the Intel® Modular Server System MFSYS25/MFSYS35 User Guide for more details on
how to manage the system.
The CMM monitors platform management events and logs their occurrence. This includes
events such as over-temperature and over-voltage conditions, fan failures, etc. The CMM also
provides the interface to this monitored information so that system management software can
poll and retrieve the present status of the platform.
The following is a list of the major functions of the CMM:
System power control
Storage controllers
Ethernet switch modules
Compute modules
System initialization
System fan management
System Event Log (SEL) interface
FRU inventory
Event message generation and reception
Serial over LAN (SOL)
Sensor monitoring
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Temperature
Voltage
Fan speed
Processor status
Power supplies
IPMB communication interface
Checks and forces automatic update of firmware of newly installed system boards to
versions stored in the SD (secure digital) card on the midplane.
CMM GUI provides remote KVM to the compute modules
External serial port connector for local/remote management access
External Ethernet connector for local/remote management
3.6 Ethernet Switch Module
3.6.1
Introduction
The Intel® Ethernet Switch Module (ESM) provides ethernet connectivity for the CMM to the
compute modules and for the compute modules to an external network.
3.6.2
Mechanical Outline
The following figure shows the mechanical outline of the ESM.
Figure 19. Ethernet Switch Module Mechanical Outline (Top View)
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3.6.3
Block Diagram
Figure 20. Ethernet Switch Module Block Diagram
3.6.4
Architectural Overview
The ESM provides networking and switch functions to the compute modules. Each compute
module is capable of accessing up to two ESMs via point-to-point links across the midplane.
The ESM has ten (10) 1000BaseT external links to the outside, two (2) internal 10 Gbps XAUI
links (one to the other ESM and one to the storage controller), twelve (12) internal point-to-point
1Gbps serializer/deserializer (SerDes) links (two to each compute module), one point-to-point
internal 10/100 Mbps link to the CMM, and one I²C interface to the CMM (for the CMM to
configure and control the ESM).
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3.7 Storage Controller Module
3.7.1
Storage Subsystem Introduction
The Intel® Modular Server System MFSYS25/MFSYS35 enables up to six diskless compute
modules to interface via SAS connections to one or two (for redundancy) internal storage
controller modules. The storage controller modules include RAID and storage virtualization
functionality with connections to back-end shared internal SAS disk drives. Connectivity
between the storage controller modules and the disk drive backplane is achieved via an
interposer card to a 14-drive backplane in the Intel® Modular Server System MFSYS25 and a 6-
drive backplane in the Intel® Server System MFSYS35. In combination, these components
allow up to 14 2.5-inch SAS drives in the Intel® Modular Server System MFSYS25 and up to 6
3.5-inch SAS/SATA drives in the Intel® Modular Server System MFSYS35 to be shared between
all compute modules. The CMM is used to configure drive arrays and to match LUNs to specific
compute modules.
3.7.2
Mechanical Outline
Figure 21. Mechanical Outline of Storage Controller Module Board
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3.7.3
Storage Controller Module View
Figure 22. Front View of Storage Controller Module
3.7.4
Architectural Overview
3.7.4.1
Storage Controller Module Interface
The Interposer SAS signals from the storage controller module (SCM) originate from the LSI*
1068 and PM8399* devices.
A hardware reset line for each expander originates from each SCM. One SAS expander on the
Interposer is managed by one SCM; the second expander is managed by the second SCM (if
installed).
An I²C bus connects the SCM(s) to the Interposer VPD SEEPROM and each expander. The
SCM(s) can retrieve hardware monitor and drive backplane IDROM information from the
expanders, which are connected via I²C to these devices.
Disk drive status is communicated via SES pages to the expanders from the RAID stack in the
SCM, and this status is exported to GPIO LED signals, one for each disk drive. One overall
RAID status LED is also sent via SES and exported to a single LED.
Expander firmware can be downloaded from the SCM.
3.7.4.2
Interposer Card Functionality
SAS expander-1 provides connectivity to all disk drive “A” ports; SAS expander-2 provides
connectivity to all disk drive “B” ports. “A” port SAS traffic originates only from SCM-1, and “B”
port SAS traffic originates only from SCM-2. The SAS connection from SCM-1 to expander-2
(and SCM-2 to expander-1) is intended for high-speed controller to controller traffic only (write
cache mirroring).
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12 V bulk power is provided by the midplane. The Interposer has a power converter function for
internal needs, and also supplies the disk drive power (12 V boost may be required).
The VPD SEEPROM contains a WW (World Wide) unique address which the SCM uses to
derive a SAS WWN (World Wide Name). It also contains manufacturing data, such as serial and
version numbers for the Interposer.
Hardware monitoring on the Interposer includes a temperature sensor. The data is passed
back to the SCM via expander SES pages.
Disk drive status LEDs are driven by expander GPIO signals, and collaboration logic must be
present on the Interposer since either SCM (and either expander) can drive the status LEDs.
3.7.4.3
Drive Backplane Interface
The Interposer converts bulk 12 V from the midplane to provide +5 V and +12 V for disk drive
power. Sufficient current is supplied for sequenced spin-up of drives in groups of 4-4-2-2-2 (for
2.5-inch configurations). Supported drive types include 15K RPM SAS drives.
Signals are provided for single-color status LEDs for each disk drive.
An expander sourced I²C bus is connected to the drive backplane IDROM.
Expanders send appropriate command/signal to an optional SATA active/active MUX dongle
card on disk drive carriers to control 5 V and 12 V power.
3.8 Power Supply Module
The power supply module in Intel® Modular Server System MFSYS25/MFSYS35 is a 1000-W
DC output supply with 110-240V AC input. Each power supply includes two fans that provide
cooling for optional hot-swap disk drives.
The power subsystem is configured as follows:
With four power supply modules installed, a fully configured system has (3+1) power
redundancy.
With three power supply modules installed, a fully configured system would not have
redundant power.
Three power supply modules are capable of handling the maximum power requirements for fully
configured platforms, which includes six compute modules, 192 GB of memory, two storage
controllers, two Ethernet switch modules, one chassis management module, and fourteen hot-
swap 2.5-inch hard disk drives or six hot-swap 3.5-inch hard disk drives.
When four power supply modules are installed, the user can replace a failed power supply
module without affecting system functionality. Power supplies have two LEDs to identify failure,
power good and AC OK.
The power subsystem receives AC power through four power cords.
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Note: The total power requirement for the platforms exceeds the 240 VA energy hazard limits
that define an operator accessible area. As a result, only qualified technical individuals should
access the processor and non-hot-plug I/O areas while the system is energized. Power cords
should be removed from the system before accessing non-hot-plug areas.
3.9 Jumpers and LEDs
The compute module is the only module with jumper headers. Refer to the Intel® Compute
Module MFS5000SI Technical Product Specification for details on the function and location of
the server jumpers.
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4. Product Regulatory Requirements
4.1 Product Regulatory Compliance
The Server Chassis product, when correctly integrated per this document, complies with the
following safety, electromagnetic compatibility (EMC, and Product Ecology regulations and
requirements.
Intended Application - This product was evaluated as Information Technology Equipment
(ITE), which may be installed in offices, schools, computer rooms, and similar commercial type
locations. The suitability of this product for other product categories and environments (such as:
medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment,
etc.), other than an ITE application, may require further evaluation.
4.1.1
Product Safety Compliance
UL60950 - CSA 60950(USA / Canada)
EN60950 (Europe)
IEC60950 (International)
CB Certificate & Report, IEC60950 (report to include all country national deviations)
GS Certification (Germany)
GOST R 50377-92 - Certification (Russia)
Belarus Certification (Belarus)
Ukraine Certification (Ukraine)
CE - Low Voltage Directive 73/23/EEE (Europe)
IRAM Certification (Argentina)
GB4943- CNCA Certification (China)
4.1.2
Product EMC Compliance - Class A Compliance
FCC /ICES-003 - Emissions (USA/Canada) Verification
CISPR 22 - Emissions (International)
EN55022 - Emissions (Europe)
EN55024 - Immunity (Europe)
EN61000-3-2 - Harmonics (Europe)
EN61000-3-3 - Voltage Flicker (Europe)
CE - EMC Directive 89/336/EEC (Europe)
VCCI Emissions (Japan)
AS/NZS 3548 Emissions (Australia / New Zealand)
BSMI CNS13438 Emissions (Taiwan)
GOST R 29216-91 Emissions (Russia)
GOST R 50628-95 Immunity (Russia)
Belarus Certification (Belarus)
Ukraine Certification (Ukraine)
KCC Notice No. 1997-41 (EMC) & 1997-42 (EMI) (Korea)
GB 9254 - CNCA Certification (China)
GB 17625 - (Harmonics) CNCA Certification (China)
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4.1.3
Product Ecology Compliance
Intel has a system in place to restrict the use of banned substances in accordance with world
wide regulatory requirements. A Material Declaration Data Sheet is available for Intel products.
For more reference on material restrictions and compliance you can view Intel's Environmental
Product Content Specification at http://supplier.intel.com/ehs/environmental.htm.
Europe - European Directive 2002/95/EC
Restriction of Hazardous Substances (RoHS)
Threshold limits and banned substances are noted below.
Quantity limit of 0.1% by mass (1000 PPM) for:
Lead, Mercury, Hexavalent Chromium, Polybrominated Biphenyls Diphenyl Ethers
(PBB/PBDE)
Quantity limit of 0.01% by mass (100 PPM) for:
Cadmium
California Code of Regulations, Title 22, Division 4.5, Chapter 33:
Best Management Practices for Perchlorate Materials
China - Restriction of Hazardous Substances (China RoHS)
WEEE Directive (Europe)
Packaging Directive (Europe)
4.1.4
Certifications / Registrations / Declarations
UL Certification (US/Canada)
CE Declaration of Conformity (CENELEC Europe)
FCC/ICES-003 Class A Attestation (USA/Canada)
VCCI Certification (Japan)
C-Tick Declaration of Conformity (Australia)
MED Declaration of Conformity (New Zealand)
BSMI Certification (Taiwan)
GOST R Certification / License (Russia)
Belarus Certification / License (Belarus)
KCC Certification (Korea)
IRAM Certification (Argentina)
CNCA Certification (China)
Ecology Declaration (International)
China RoHS Environmental Friendly Use Period
Packaging & Product Recycling Marks
4.2 Product Regulatory Compliance Markings
This Intel Server Chassis product is provided with the following regulatory and safety markings.
In the event there is no room for a marking(s) on the chassis, the information is provided here in
this document.
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Requirement
Country
Marking
cULus Listing
Marks
USA/Canada
GS Mark
Germany
CE Mark
Europe
USA
FCC Marking
(Class A)
EMC Marking
(Class A)
Canada
Japan
VCCI Marking
(Class A)
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Requirement
Country
Marking
BSMI
Taiwan
Certification &
Class A
Warning
GOST R
Marking
Russia
Korea
KCC Mark
Note: The following is the former Korean EMC mark and is seen on older Intel products.
KCC Mark
Korea
China
Note: The following symbol is the new Korean EMC mark and is seen on newer Intel
products.
China
Compulsory
Certification
Mark
于符合中国《子信息品染控制管理法》的声明
Management Methods on Control of Pollution from
Electronic Information Products
(China RoHS declaration)
品中有毒有害物.的名称及含量
部件名称
(Parts)
有毒有害物.或元素
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Requirement
Country
Marking
金属部件
(Metal Parts)
印刷板.件
(Printed Board
Assemblies
(PBA))
○：表'.有毒有害物.在.部件所有均.材料中的含量均在SJ/T 11363-2006 .准.定的
限量要求以下。
○：
Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in
SJ/T 11363-2006.
×：表'.有毒有害物.至少在.部件的某一均.材料中的含量超出SJ/T 11363-2006 .准
.定的限量要求。
×：
Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is above the limit
requirement in SJ/T 11363-2006.
售之日的所售.品,本表'示我公司供..的.子信息.品可能'含.些物.。注意：在
所售.品中可能'也可能'会含有所有所列的部件
This table shows where these substances may be found in the supply chain of our electronic information products, as of the
date of sale of the enclosed product. Note that some of the component types listed above may or may not be a part of the
enclosed product.
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Requirement
Country
Marking
Belarus Safety
Compliance
Mark
Belarus
Waste of
Europe
Electronic and
Electrical
Equipment
Recycling Mark
China
China
Restriction of
Hazardous
Substance
Environmental
Friendly Use
Period Mark
China
China
Recycling Mark
Recycling
Marks
International
Battery
Perchlorate
Warning
California
Perchlorate Material - Special handling may apply. See
www.dtsc.ca.gov/hazardouswaste/perchlorate
This notice is required by California Code of Regulations, Title 22, Division 4.5, and
Chapter 33: Best Management Practices for Perchlorate Materials. This product may
include a battery which contains Perchlorate material.
Information
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Requirement
Country
Marking
Safety
Multiple Power
Cord Marking
This unit has more than one power supply cord. To reduce the risk of electrical shock,
disconnect (2) two power supply cords before servicing.
Simplified Chinese:
Traditional Chinese:
German:
Dieses GerŠte hat mehr als ein Stromkabel. Um eine Gefahr des elektrischen Schlages
zu verringern trennen sie beide (2) Stromkabeln bevor Instandhaltung.
Nordic
Countries
Connection to
Proper Ground
Outlet
"WARNING:"
"Apparaten skall anslutas till jordat uttag, nŠr den ansluts till ett nŠtverk."
"Laite on liitettŠvä suojamaadoituskoskettimilla varustettuun pistorasiaan."
"Connect only to a properly earth grounded outlet."
Safety
Standyby power
4.3 Regulated Specified Components
To maintain the UL listing and compliance to other regulatory certifications and/or declarations,
the following regulated components must be used and conditions adhered to. Interchanging or
use of other component will void the UL listing and other product certifications and approvals.
You can find updated product information for configurations on the Intel Server Builder Web site
at the following URL: http://channel.intel.com/go/serverbuilder
If you do not have access to Intel’s Web address, contact your local Intel representative.
1. Server Chassis: Base chassis is provided with power supply and fans—UL listed.
2. Server board: You must use an Intel server board—UL recognized.
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3. Add-in Boards: Must have a printed wiring board flammability rating of minimum
UL94V-1. Add-in boards containing external power connectors and/or lithium batteries
must be UL recognized or UL listed. Any add-in board containing modem
telecommunication circuitry must be UL listed. In addition, the modem must have the
appropriate telecommunications, safety, and EMC approvals for the region in which it is
sold.
4. Peripheral Storage Devices: Must be UL recognized or UL listed accessory and TUV
or VDE licensed. Maximum power rating of any one device is 19 watts. Total server
configuration is not to exceed the maximum loading conditions of the power supply.
4.4 Electromagnetic Compatibility Notices
4.4.1
FCC Verification Statement (USA)
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124-6497
Phone: 1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void
the user's authority to operate the equipment. The customer is responsible for ensuring
compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC
Class A or B limits may be attached to this computer product. Operation with noncompliant
peripherals is likely to result in interference to radio and TV reception.
All cables used to connect to peripherals must be shielded and grounded. Operation with
cables, connected to peripherals that are not shielded and grounded may result in interference
to radio and TV reception.
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4.4.2
ICES-003 (Canada)
Cet appareil numŽrique respecte les limites bruits radioŽlectriques applicables aux appareils
numŽriques de Classe A prescrites dans la norme sur le matŽriel brouilleur: “Appareils
NumŽriques”, NMB-003 ŽdictŽe par le Ministre Canadian des Communications.
English translation of the notice above:
This digital apparatus does not exceed the Class A limits for radio noise emissions from digital
apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,”
ICES-003 of the Canadian Department of Communications.
Recycle battery in accordance with applicable WEEE and Battery laws.
Perchlorate Material - special handling may apply. See:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate
This notice is required by California Code of Regulations, Title 22, Division 4.5, Chapter 33:
Best Management Practices for Perchlorate Materials. This product/part includes a battery
which contains perchlorate material.
4.4.3
Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark
to illustrate its compliance.
Recycle battery in accordance with applicable WEEE and Battery laws.
Perchlorate Material - special handling may apply. See:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate
This notice is required by California Code of Regulations, Title 22, Division 4.5, Chapter 33:
Best Management Practices for Perchlorate Materials. This product/part includes a battery
which contains perchlorate material.
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Intel® Modular Server System MFSYS25/MFSYS35 TPS
Product Regulatory Requirements
4.4.4
VCCI (Japan)
English translation of the notice above:
This is a Class A product based on the standard of the Voluntary Control Council for
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or
television receiver in a domestic environment, it may cause radio interference. Install and use
the equipment according to the instruction manual.
Recycle battery in accordance with applicable WEEE and Battery laws.
Perchlorate Material - special handling may apply. See:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate
This notice is required by California Code of Regulations, Title 22, Division 4.5, Chapter 33:
Best Management Practices for Perchlorate Materials. This product/part includes a battery
which contains perchlorate material.
4.4.5
BSMI (Taiwan)
The BSMI Certification Marking and EMC warning is located on the outside rear area of the
product.
Recycle battery in accordance with applicable WEEE and Battery laws.
Revision 1.3
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Intel order number E15155-005
Product Regulatory Requirements
Intel® Modular Server System MFSYS25/MFSYS35 TPS
Perchlorate Material - special handling may apply. See:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate
This notice is required by California Code of Regulations, Title 22, Division 4.5, Chapter 33:
Best Management Practices for Perchlorate Materials. This product/part includes a battery
which contains perchlorate material.
42
Revision 1.3
Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS
Glossary
Glossary
This appendix contains important terms used in the preceding sections. Acronyms are followed
by non-acronyms.
Word / Acronym
ACPI
Definition
Advanced Configuration and Power Interface
BIOS
BMC
CE
Basic Input / Output System
Baseboard Management Controller
European Conformity (Conformité Européenne)
CISPR
Special International Committee on Radio Interference (Comité International Spécial
des Perturbations Radioélectriques)
CMM
CMOS
CSA
DB
Chassis Management Module
Complementary Metal-Oxide Semiconductor
Canadian Standards Organization
Data Bus
dBA
Decibel Acoustic
DDR2
DIMM
DMA
ECC
EEPROM
EMC
EMI
Double Data Rate
Dual In-line Memory Module
Direct Memory Access
Error Checking Code
Electrically Erasable Programmable Read-Only Memory
Electromagnetic Compatibility
Electromagnetic Interference
Emergency Management Port
External Product Specification
Electrostatic Discharge
Ethernet Switch Module
Federal Communications Commission
Field-Programmable Gate Array
Fault Resilient Booting
EMP
EPS
ESD
ESM
FCC
FPGA
FRB
FRU
FSB
FWH
GbE
GND
GUI
Field Replaceable Unit
Front Side Bus
Firmware Hub
Gigabit Ethernet
Ground
Graphical User Interface
Hard Disk Drive
HDD
HL
Hub-Link
HSC
I/O
Hot-Swap Controller
Input / Output
I²C
Inter-Integrated Circuit
ICMB
IDE
Intelligent Chassis Management Bus
Integrated Device Electronics
International Electrotechnical Commission
IEC
Revision 1.3
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Glossary
Intel® Modular Server System MFSYS25/MFSYS35 TPS
Word / Acronym
IMB
Definition
Intelligent Management Bus
IPMB
IPMI
ISP
Intelligent Platform Management Bus
Intelligent Platform Management Interface
In-System Programmable
ITE
Information Technology Equipment
In-Target Probe
ITP
JTAG
KVM
LAN
Joint Test Action Group
Keyboard, VDU, and Mouse
Local Area Network
LED
Light Emitting Diode
LPC
Low-Pin Count
LVDS
NIC
Low Voltage Differential SCSI
Network Interface Card
OEM
OS
Original Equipment Manufacturer
Operating System
OTP
PCI
Over-Temperature Protection
Peripheral Component Interconnect
Power Distribution Board
PDB
PEF
Platform Event Filtering
PEP
Platform Event Paging
PFC
Power Factor Correction
PIROM
PLD
Processor Information Read-Only Memory
Programmable Logic Device
Power Supply Module
PSM
PSU
PWM
RAID
RAS
RASUM
ROMB
RPM
RoHS
SAF-TE
SAS
Power Supply Unit
Pulse Width Modulator
Redundant Array of Independent Disks
Reliability, Availability, and Serviceability
Reliability, Availability, Serviceability, Usability, and Manageability
RAID On Motherboard
Revolutions Per Minute
Restriction of Hazardous Substances
SCSI Accessed Fault-Tolerant Enclosure
Serial Attached SCSI
SATA
SCA
SCL
Serial Advanced Technology Attachment
Single Connector Attachment
Serial Clock
SCM
SCSI
SDA
SDINT
SDR
SDRAM
SE
Switch Controller Module
Small Computer Systems Interface
Serial Data
System Diagnostic Interrupt
Sensor Data Record
Synchronous Dynamic Random Access Memory
Single-Ended
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Glossary
Word / Acronym
SEEPROM
Definition
Serial Electrically Erasable Programmable Read-Only Memory
SEL
System Event Log
SerDes
SMASH CLP
SMP
Serializer/Deserializer
Systems Management Architecture for Server Hardware/Command Line Protocol
Symmetric Multiprocessing
SNMP
SOL
Simple Network Management Protocol
Serial Over LAN
TTL
Transistor-Transistor Logic
TUV
Technical Monitoring Association (Technischer Überwachungsverein)
Universal Serial Bus
USB
UL
Underwriters Laboratories, Inc.
UV
Under-Voltage
VAC
Alternating Current (AC) voltage
VCC
Voltage Controlled Current
VCCI
VDE
Voluntary Control Council for Interference by Information Technology Equipment
Association for Electrical, Electronic and Information Technologies (Verband der
Elektrotechnik, Elektronik und Informationstechnik)
VDU
VGA
VID
Video Display Unit
Video Graphics Array
Voltage Identifier
VRM
VSB
Voltage Regulator Module
Voltage Standby
WfM
WS
Wired for Management
Web Services
WS-MAN
XAUI
WS-Management
10-Gigabit Attachment Unit Interface
Revision 1.3
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Intel order number E15155-005
Reference Documents
Intel® Modular Server System MFSYS25/MFSYS35 TPS
Reference Documents
See the following documents for additional information:
SCSI Accessed Fault-Tolerant Enclosures Interface Specification (SAF-TE)
Intel® Compute Module MFS5000SI Technical Product Specification (TPS)
Intel® Modular Server System MFSYS25/MFSYS35 Tested Hardware and Operating
Systems List (THOL)
IPMI Specification, Version 2.0
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