HS-1840BEH [INTERSIL]
Rad-Hard 16 Channel BiCMOS Analog Multiplexer with High-Z Analog Input Protection; 抗辐射16通道的BiCMOS模拟多路复用器具有高阻抗模拟输入保护型号: | HS-1840BEH |
厂家: | Intersil |
描述: | Rad-Hard 16 Channel BiCMOS Analog Multiplexer with High-Z Analog Input Protection |
文件: | 总7页 (文件大小:415K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Rad-Hard 16 Channel BiCMOS Analog Multiplexer with
High-Z Analog Input Protection
HS-1840ARH, HS-1840AEH,
HS-1840BRH, HS-1840BEH
Features
• Electrically Screened to SMD # 5962-95630
• QML Qualified per MIL-PRF-38535 Requirements
• Pin-to-Pin for Intersil’s HS-1840RH and HS-1840/883S
• Improved Radiation Performance
The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are
radiation hardened, monolithic 16 channel multiplexers constructed
with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric
Isolation process. They are designed to provide a high input impedance
to the analog source if device power fails (open), or the analog signal
voltage inadvertently exceeds the supply by up to ±35V, regardless of
whether the device is powered on or off. Excellent for use in redundant
applications, since the secondary device can be operated in a standby
unpowered mode affording no additional power drain. More
significantly, a very high impedance exists between the active and
inactive devices preventing any interaction. One of sixteen channel
selections is controlled by a 4-bit binary address plus an Enable-Inhibit
input which conveniently controls the ON/OFF operation of several
multiplexers in a system. All inputs have electrostatic discharge
protection. The HS-1840ARH, HS-1840AEH, HS-1840BRH and
HS-1840BEH are processed and screened in full compliance with
MIL-PRF-38535 and QML standards. The devices are available in a
28 Ld SBDIP and a 28 Ld Ceramic Flatpack.
5
- Gamma Dose (γ) 3x10 RAD(Si)
• Improved r
DS(ON)
Linearity
• Improved Access Time 1.5µs (Max) Over Temp and Post Rad
• High Analog Input Impedance 500MΩ During Power Loss (Open)
• ±35V Input Overvoltage Protection (Power On or Off)
• Dielectrically Isolated Device Islands
• Excellent in Hi-Rel Redundant Systems
• Break-Before-Make Switching
• No Latch-Up
Specifications for Rad Hard QML devices are controlled by the
Defense Logistics Agency Land and Maritime (DLA). The SMD
numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are contained in
SMD 5962-95630. A “hot-link” is provided on our homepage for
downloading:
http://www.landandmaritime.dla.mil/Downloads/MilSpec/Smd/956
30.pdf
April 6, 2012
FN4355.5
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas Inc. 2002, 2009-2012. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1
HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH
Ordering Information
INTERNAL
MKT. NUMBER
(Note)
ORDERING
NUMBER
TEMP. RANGE
(°C)
PART
MARKING NO.
PACKAGE
(RoHS Compliant)
5962F9563002QXC
HS1-1840ARH-8
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
Q 5962F95 63002QXC
Q 5962F95 63002QYC
Q 5962F95 63002VXC
Q 5962F95 63002VYC
HS1- 1840ARH /PROTO
HS9- 1840ARH /PROTO
Q 5962R95 63002TXC
28 Ld SBDIP
28 Ld Flatpack
28 Ld SBDIP
28 Ld Flatpack
28 Ld SBDIP
28 Ld Flatpack
28 Ld SBDIP
5962F9563002QYC
5962F9563002VXC
5962F9563002VYC
HS1-1840ARH/PROTO
HS9-1840ARH/PROTO
HS1-1840ARH-T
HS9-1840ARH-8
HS1-1840ARH-Q
HS9-1840ARH-Q
HS1-1840ARH/PROTO
HS9-1840ARH/PROTO
HS1-1840ARH-T
HS0-1840ARH-Q
HS0-1840AEH-Q
HS1-1840AEH-Q
HS9-1840AEH-Q
HS0-1840BEH-Q
HS1-1840BEH-Q
HS9-1840BEH-Q
HS1-1840BRH-8
HS9-1840BRH-8
HS1-1840BRH-Q
HS9-1840BRH-Q
HS1-1840BRH/PROTO
HS9-1840BRH/PROTO
HS0-1840BRH-Q
5962F9563002V9A
5962F9563004V9A
5962F9563004VXC
5962F9563004VYC
5962F9563005V9A
5962F9563005VXC
5962F9563005VYC
5962F9563003QXC
5962F9563003QYC
5962F9563003VXC
5962F9563003VYC
HS1-1840BRH/PROTO
HS9-1840BRH/PROTO
5962F9563003V9A
Q 5962F95 63004VXC
Q 5962F95 63004VYC
28 Ld SBDIP
28 Ld Flatpack
Q 5962F95 63005VXC
Q 5962F95 63005VYC
Q 5962F95 63003QXC
Q 5962F95 63003QYC
Q 5962F95 63003VXC
Q 5962F95 63003VYC
HS1- 1840BRH /PROTO
HS9- 1840BRH /PROTO
28 Ld SBDIP
28 Ld Flatpack
28 Ld SBDIP
28 Ld Flatpack
28 Ld SBDIP
28 Ld Flatpack
28 Ld SBDIP
28 Ld Flatpack
NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with
both SnPb and Pb-free soldering operations.
Pin Configurations
HS1-1840ARH, HS1-1840AEH, HS1-1840BRH
(28 LD SBDIP) CDIP2-T28
TOP VIEW
HS9-1840ARH, HS9-1840AEH, HS9-1840BRH
(28 LD FLATPACK) CDFP3-F28
TOP VIEW
+V
1
2
3
4
5
6
7
8
9
28 OUT
S
+V
S
NC
NC
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
OUT
NC
NC
27 -V
S
-V
S
IN 8
2
3
26 IN 8
25 IN 7
24 IN 6
23 IN 5
22 IN 4
21 IN 3
IN 16
IN 15
IN 14
IN 13
IN 12
IN 11
IN 10
IN 9
IN 7
4
IN 16
IN 15
IN 14
IN 13
IN 12
IN 11
IN 6
5
IN 5
6
IN 4
7
IN 3
8
IN 2
9
IN 1
10
11
12
13
14
20
IN 2
ENABLE
ADDR A0
ADDR A1
ADDR A2
IN 10 10
IN 9 11
GND 12
19 IN 1
GND
18 ENABLE
17 ADDR A0
16 ADDR A1
15 ADDR A2
(+5V ) V
S
REF
ADDR A3
(+5V ) V
13
ADDR A3 14
S
REF
FN4355.5
April 6, 2012
2
HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH
Functional Diagram
V
DD
IN1
A0
1
MAINSWITCH 1
A1
A2
A3
DIGITAL
ADDRESS
OUT
IN16
16
EN
MAINSWITCH 16
ADDRESS INPUT
BUFFER AND
LEVEL SHIFTER
DECODERS
MULTIPLEX
SWITCHES
NOTE: MAINSWITCH INXX: SWITCH ON, BODY TIED TO SOURCE
SWITCH OFF, BODY TIED TO VCC-0.7V
TABLE 1. TRUTH TABLE
A3
A2
A1
X
L
A0
X
L
EN
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
“ON” CHANNEL
X
L
X
L
None
1
L
L
L
H
L
2
L
L
H
H
L
3
L
L
H
L
4
L
H
H
H
H
L
5
L
L
H
L
6
L
H
H
L
7
L
H
L
8
H
H
H
H
H
H
H
H
9
L
L
H
L
10
11
12
13
14
15
16
L
H
H
L
L
H
L
H
H
H
H
L
H
L
H
H
H
FN4355.5
April 6, 2012
3
HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH
Burn-In/Life Test Circuits
R
R
+V
28
27
26
25
24
23
22
21
20
19
18
17
16
15
+V
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
S
S
-V
-V
S
S
R
R
3
R
3
R
4
4
5
5
6
6
7
7
8
8
9
9
10
11
12
13
14
10
11
12
13
14
F5
F2
GND
F1
F3
GND
F4
V
R
R
NOTE:
R = 1kΩ ±5%, 1/4W.
= C = 0.01µF MINIMUM, 1 EACH PER SOCKET, MINIMUM.
NOTE:
V + = +15.5V ±0.5V, V - = -15.5V ±0.5V.
S
S
C
1
2
R = 1kΩ ±5%.
V + = 15.5V ±0.5V, V - = -15.5V ±0.5V, V = 15.5 ±0.5V
S
S
R
C
D
= C = 0.01µF ±10%, 1 EACH PER SOCKET, MINIMUM.
1
1
2
= D = 1N4002, 1 EACH PER BOARD, MINIMUM.
2
INPUT SIGNALS:
SQUARE WAVE, 50% DUTY CYCLE, 0V TO 15V PEAK ±10%.
F1 = 100kHz; F2 = F1/2; F3 = F1/4; F4 = F1/8; F5 = F1/16.
FIGURE 2. .STATIC BURN-IN TEST CIRCUIT
FIGURE 1. DYNAMIC BURN-IN AND LIFE TEST CIRCUIT
NOTES:
1. The above test circuits are utilized for all package types.
2. The Dynamic Test Circuit is utilized for all life testing.
Irradiation Circuit
HS-1840ARH, HS-1840AEH, HS-1840BRH
+15V
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
-15V
NC
NC
1kΩ
3
+1V
4
5
6
7
8
9
10
11
12
13
14
+5V
NOTE:
3. All irradiation testing is performed in the 28 lead CERDIP package.
FN4355.5
April 6, 2012
4
HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH
Die Characteristics
DIE DIMENSIONS:
ASSEMBLY RELATED INFORMATION:
(2820µmx4080µm x 483µm ±25.4μm)
111 milsx161 milsx19 mils ±1 mil
Substrate Potential:
Unbiased (DI)
INTERFACE MATERIALS:
Glassivation:
ADDITIONAL INFORMATION:
Worst Case Current Density:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 8.0kÅ ±1kÅ
Modified SEM
Transistor Count:
Top Metallization:
407
Type: AlSiCu
Thickness: 16.0kÅ ±2kÅ
Process:
Radiation Hardened Silicon Gate,
DI Wafer, Dielectric Isolation
Backside Finish:
Silicon
Metallization Mask Layout
HS-1840ARH, HS-1840BRH
IN8
ENABLE
A0
-V
A1
OUT
+V
A2
A3
V
REF
IN16
GND
FN4355.5
April 6, 2012
5
HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1 LEAD FINISH
D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C)
28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
-A-
-D-
E
INCHES
MIN
MILLIMETERS
BASE
(c)
METAL
SYMBOL
MAX
0.232
0.026
0.023
0.065
0.045
0.018
0.015
1.490
0.610
MIN
-
MAX
5.92
NOTES
b1
A
b
-
-
2
3
-
M
A
M
(b)
0.014
0.014
0.045
0.023
0.008
0.008
-
0.36
0.36
1.14
0.58
0.20
0.20
-
0.66
-B-
b1
b2
b3
c
0.58
SECTION A-A
S
S
S
D
bbb
C
A - B
1.65
D
1.14
4
2
3
-
BASE
S2
Q
PLANE
0.46
-C-
SEATING
PLANE
c1
D
0.38
L
37.85
15.49
S1
b2
eA
A A
E
0.500
12.70
-
e
eA/2
aaa M C A - B S D S
b
c
e
0.100 BSC
2.54 BSC
-
eA
eA/2
L
0.600 BSC
0.300 BSC
15.24 BSC
7.62 BSC
-
ccc
M
C A - B S D S
-
NOTES:
0.125
0.200
3.18
5.08
-
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
Q
0.015
0.005
0.005
0.060
0.38
0.13
0.13
1.52
5
6
7
-
S1
S2
α
-
-
-
-
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
o
o
o
o
90
105
90
105
aaa
bbb
ccc
M
-
-
-
-
0.015
0.030
0.010
0.0015
-
-
-
-
0.38
0.76
0.25
0.038
-
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
-
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
-
2
8
N
28
28
5. Dimension Q shall be measured from the seating plane to the
base plane.
Rev. 0 5/18/94
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4355.5
April 6, 2012
6
HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH
Ceramic Metal Seal Flatpack Packages (Flatpack)
K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B)
A
28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
A
e
INCHES
MIN
MILLIMETERS
PIN NO. 1
ID AREA
SYMBOL
MAX
0.115
0.022
0.019
0.009
0.006
0.740
0.520
0.550
-
MIN
1.14
0.38
0.38
0.10
0.10
-
MAX
2.92
0.56
0.48
0.23
0.15
18.80
13.21
13.97
-
NOTES
D
A
b
0.045
0.015
0.015
0.004
0.004
-
-
-
-A-
-B-
S1
b1
c
-
-
b
c1
D
-
E1
3
-
0.004
Q
H
A - B
D
0.036
H
A - B
D
S
M
S
S
M
S
C
E
0.460
-
11.68
-
E
E1
E2
E3
e
3
-
-D-
A
0.180
0.030
4.57
0.76
-H-
-C-
-
-
7
-
L
E2
L
E3
E3
0.050 BSC
1.27 BSC
SEATING AND
BASE PLANE
c1
LEAD FINISH
k
0.008
0.250
0.026
0.00
-
0.015
0.370
0.045
-
0.20
6.35
0.66
0.00
-
0.38
9.40
1.14
-
2
-
L
BASE
METAL
Q
S1
M
N
8
6
-
(c)
b1
0.0015
0.04
M
M
(b)
28
28
-
SECTION A-A
Rev. 0 5/18/94
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the lim-
its of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maximum lim-
its of lead dimensions b and c or M shall be measured at the cen-
troid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied.
5. N is the maximum number of terminal positions.
6. Measure dimension S1 at all four corners.
7. For bottom-brazed lead packages, no organic or polymeric mate-
rials shall be molded to the bottom of the package to cover the
leads.
8. Dimension Q shall be measured at the point of exit (beyond the
meniscus) of the lead from the body. Dimension Q minimum
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-
der dip lead finish is applied.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
FN4355.5
April 6, 2012
7
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