IS9-2100ARH/PROTO [INTERSIL]
Radiation Hardened High Frequency Half Bridge Driver; 抗辐射高频半桥驱动器型号: | IS9-2100ARH/PROTO |
厂家: | Intersil |
描述: | Radiation Hardened High Frequency Half Bridge Driver |
文件: | 总2页 (文件大小:61K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IS-2100ARH
®
Data Sheet
April 2003
FN9037.1
Radiation Hardened High Frequency
Half Bridge Driver
Features
• Electrically Screened to DSCC SMD # 5962-99536
• QML Qualified per MIL-PRF-38535 Requirements
The Radiation Hardened IS-2100ARH is a high frequency,
130V Half Bridge N-Channel MOSFET Driver IC, which is
functionally similar to industry standard 2110 types. The low-
side and high-side gate drivers are independently controlled.
This gives the user maximum flexibility in dead-time
selection and driver protocol.
• Radiation Environment
- Maximum Total Dose . . . . . . . . . . . . . . . . . 300krad(SI)
- DI RSG Process Provides Latch-up Immunity
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- SEU Rating. . . . . . . . . . . . . . . . . . . . . . 82MeV/mg/cm
- Vertical Device Architecture Reduces Sensitivity to Low
Dose Rates
In addition, the device has on-chip error detection and
correction circuitry, which monitors the state of the high-side
latch and compares it to the HIN signal. If they disagree, a
set or reset pulse is generated to correct the high-side latch.
This feature protects the high-side latch from single event
upsets (SEUs).
• Bootstrap Supply Max Voltage to 150V
• Drives 1000pF Load at 1MHz with Rise and Fall Times of
30ns (Typ)
• 1.5A (Typ) Peak Output Current
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed here must be used when ordering.
• Independent Inputs for Non-Half Bridge Topologies
• Low DC Power Consumption. . . . . . . . . . . . . 60mW (Typ)
Detailed Electrical Specifications for the IS-2100ARH are
contained in SMD 5962-99536. A “hotlink” is provided
on our website for downloading.
• Operates with V
DD
= V Over 12V to 20V Range
CC
• Low-side Supply Undervoltage Protection
Applications
Ordering Information
• High Frequency Switch-Mode Power Supplies
• Drivers for Inductive Loads
• DC Motor Drivers
INTERSIL MKT.
NUMBER
TEMP.
o
ORDERING NUMBER
5962F9953602VXC
5962F9953602QXC
IS9-2100ARH/Proto
RANGE ( C)
-55 to 125
-55 to 125
IS9-2100ARH-Q
IS9-2100ARH-8
Pinout
IS9-2100ARH/Proto -55 to 125
IS-2100ARH
FLATPACK (CDFP4-F16)
TOP VIEW
LO
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
NC
V
COM
SS
V
LIN
CC
NC
NC
VS
VB
HO
SD
HIN
V
DD
NC
NC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
IS-2100ARH
Die Characteristics
DIE DIMENSIONS:
Backside Finish:
4820µm x 3300µm (190 mils x 130 mils)
Thickness: 483µm ±25.4µm (19 mils ±1 mil)
Silicon
ASSEMBLY RELATED INFORMATION:
INTERFACE MATERIALS:
Glassivation:
Substrate Potential:
Unbiased (DI)
Type: PSG (Phosphorous Silicon Glass)
Thickness: 8.0kÅ ±1.0kÅ
ADDITIONAL INFORMATION:
Worst Case Current Density:
Top Metallization:
5
2
<2.0 x 10 A/cm
Type: ALSiCu
Thickness: 16.0kÅ ±2kÅ
Transistor Count:
542
Substrate:
Radiation Hardened Silicon Gate,
Dielectric Isolation
Metallization Mask Layout
IS-2100ARH
SD (13)
HIN (12)
LIN (14)
V
(15)
SS
V
(11)
DD
HO (8)
VB (7)
LO (1)
COM (2)
V
(3)
CC
VS (6)
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable.
However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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