IXDF404PI [IXYS]
4 Ampere Dual Low-Side Ultrafast MOSFET Drivers; 4安培双低侧超快MOSFET驱动器
| 型号： | IXDF404PI |
| 厂家： | 
IXYS CORPORATION |
| 描述： | 4 Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| 文件： | 总10页 (文件大小：248K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IXDN404PI / N404SI / N404SI-16 IXDI404PI / I404SI / I404SI-16
IXDF404PI / F404SI / F404SI-16
4 Ampere Dual Low-Side Ultrafast MOSFET Drivers
Features
General Description
• Built using the advantages and compatibility
of CMOS and IXYS HDMOSTM processes
• Latch-UpProtectedOverEntire
OperatingRange
• High Peak Output Current: 4A Peak
• Wide Operating Range: 4.5V to 25V
• High Capacitive Load
DriveCapability:1800pFin<15ns
• Matched Rise And Fall Times
• Low Propagation Delay Time
• LowOutputImpedance
TheIXDN404/IXDI404/IXDF404iscomprisedoftwo4Ampere
CMOS high speed MOSFET drivers. Each output can source
and sink 4A of peak current while producing voltage rise and
fall times of less than 15ns to drive the latest IXYS MOSFETs
& IGBT's. The input of the driver is compatible with TTL or
CMOS and is fully immune to latch up over the entire operating
range. A patent-pending circuit virtually eliminates CMOS
power supply cross conduction and current shoot-through.
Improvedspeedanddrivecapabilitiesarefurtherenhancedby
very low, matched rise and fall times.
TheIXDN404isconfiguredasadualnon-invertinggatedriver,
the IXDI404 is a dual inverting gate driver, and the IXDF404 is a
dualinverting+non-invertinggatedriver.
• LowSupplyCurrent
• TwoDriversinSingleChip
Applications
• DrivingMOSFETsandIGBTs
• MotorControls
TheIXDN404/IXDI404/IXDF404familyareavailableinthe
standard 8 pin P-DIP (PI), SOP-8 (SI) and SOP-16 (SI-16)
packages.
• LineDrivers
• PulseGenerators
• Local Power ON/OFF Switch
• Switch Mode Power Supplies (SMPS)
• DCtoDCConverters
• PulseTransformerDriver
• Class D Switching Amplifiers
• Limiting di/dt Under Short Circuit
Figure 1 - IXDN404 Dual 4A Non-Inverting Gate Driver Functional Block Diagram
Vcc
P
ANTI-CROSS
IN A
OUT A
CONDUCTION
CIRCUIT *
N
P
ANTI-CROSS
IN B
OUT B
CONDUCTION
CIRCUIT *
N
GND
* Patent Pending
Copyright©IXYSCORPORATION2001
First Release
IXDN404PI / N404SI / N404SI-16 IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
Figure 2 - IXDI404 Dual Inverting 4A Gate Driver Functional Block Diagram
Vcc
P
N
ANTI-CROSS
CONDUCTION
CIRCUIT *
IN A
OUT A
P
N
ANTI-CROSS
CONDUCTION
CIRCUIT *
OUT B
IN B
GND
Figure 3 - IXDF404 Inverting + Non-Inverting 4A Gate Driver Functional Block Diagram
Vcc
P
ANTI-CROSS
IN A
OUT A
CONDUCTION
CIRCUIT *
N
P
N
ANTI-CROSS
CONDUCTION
CIRCUIT *
OUT B
IN B
GND
* Patent Pending
2
IXDN404PI / N404SI / N404SI-16 IXDI404PI / I404SI / I404SI-16
IXDF404PI / F404SI / F404SI-16
Absolute Maximum Ratings (Note 1)
Operating Ratings
Parameter
Value
Parameter
Value
Supply Voltage
All Other Pins
25V
-0.3V to V
Operating Temperature Range
o
o
-40 C to 85 C
+ 0.3V
CC
Thermal Impedance (Junction To Ambient)
o
Junction Temperature
Storage Temperature
o
8 Pin PDIP (PI) (θJA)
120 C/W
150 C
o
8 Pin SOIC (SI) (θJA)
o
o
110 C/W
-65 C to 150 C
o
16 Pin SOIC (SI-16) (θJA)
Soldering Lead Temperature
(10 seconds maximum)
o
110 C/W
300 C
Electrical Characteristics
Unless otherwise noted, TA = 25 oC, 4.5V ≤ VCC ≤ 25V .
All voltage measurements with respect to GND. Device configured as described in Test Conditions. All specifications are for one channel.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
VIH
High input voltage
Low input voltage
Input voltage range
Input current
3.5
V
VIL
0.8
VCC + 0.3
10
V
VIN
-5
V
IIN
-10
0V ≤ VIN ≤ VCC
µA
VOH
VOL
ROH
High output voltage
Low output voltage
VCC - 0.025
V
V
Ω
0.025
3
Output resistance
@ Output High
Output resistance
@ Output Low
IOUT = 10mA, VCC = 18V
IOUT = 10mA, VCC = 18V
VCC is 18V
1.5
1.5
4
ROL
IPEAK
IDC
3
Ω
A
A
Peak output current
Continuous output
current
1
tR
Rise time
CL=1800pF Vcc=18V
CL=1800pF Vcc=18V
CL=1800pF Vcc=18V
11
12
33
12
14
34
15
17
38
ns
ns
ns
tF
Fall time
tONDLY
On-time propagation
delay
tOFFDLY
Off-time propagation
delay
Power supply voltage
CL=1800pF Vcc=18V
28
30
18
35
25
ns
V
VCC
ICC
4.5
Power supply current
VIN = 3.5V
VIN = 0V
VIN = + VCC
1
0
3
10
10
mA
µA
µA
Ordering Information
Part Number
IXDN404PI
IXDN404SI
IXDN404SI-16
IXDI404PI
Package Type
Temp. Range
Configuration
8-Pin PDIP
8-Pin SOIC
16-Pin SOIC
8-Pin PDIP
8-Pin SOIC
16-Pin SOIC
8-Pin PDIP
8-Pin SOIC
16-Pin SOIC
Dual Non Inverting
-40°C to +85°C
IXDI404SI
Dual Inverting
-40°C to +85°C
-40°C to +85°C
IXDI404SI-16
IXDF404PI
IXDF404SI
Inverting + Non Inverting
IXDF404SI-16
NOTE: Mounting or solder tabs on all packages are connected to ground
3
IXDN404PI / N404SI / N404SI-16 IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
Pin Description
SYMBOL
FUNCTION
A Channel Input
DESCRIPTION
A Channel Input signal-TTL or CMOS compatible.
IN A
The system ground pin. Internally connected to all circuitry, this pin provides
ground reference for the entire chip. This pin should be connected to a low
noise analog ground plane for optimum performance.
GND
Ground
IN B
B Channel Input
B Channel Input signal-TTL or CMOS compatible.
B Channel Driver output. For application purposes, this pin is connected via
a resistor to a gate of a MOSFET/IGBT.
OUT B
B Channel Output
Positive power-supply voltage input. This pin provides power to the entire
chip. The range for this voltage is from 4.5V to 25V.
VCC
Supply Voltage
A Channel Driver output. For application purposes, this pin is connected via
a resistor to a gate of a MOSFET/IGBT.
OUT A
A Channel Output
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when
handling and assembling this component.
Note 1: Operating the device beyond parameters with listed “Absolute Maximum Ratings” may cause permanent
damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not
guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
Figure 4 - Characteristics Test Diagram
Vcc
1
2
3
4
8
7
6
5
NC
NC
In A
Gnd
In B
Out A
Vcc
10uF
25V
Out B
Agilent 1147A
Current Probe
Agilent 1147A
Current Probe
1800 pF
1800 pF
4
IXDN404PI / N404SI / N404SI-16 IXDI404PI / I404SI / I404SI-16
IXDF404PI / F404SI / F404SI-16
Typical Performance Characteristics
Fig. 6
Fig. 5
40
Rise Time vs. Supply Voltage
Fall Time vs. Supply Voltage
60
50
40
30
20
10
0
35
30
25
20
15
10
5
CL=4700 pF
1800 pF
CL=4700 pF
1800 pF
200 pF
200 pF
16
0
8
10
12
14
18
8
10
12
14
16
18
SupplyVoltage(V)
Supply Voltage (V)
Fig. 7
Rise And Fall Times vs. Case Temperature
Fig. 8
80
Rise Time vs. Load Capacitance
C =1nF VCC=18V
L
25
70
60
50
40
30
20
10
8V
20
15
10
5
10V
12V
tF
tR
18V
16V
14V
0
0
0k
-40
-20
0
20
40
60
80
100
120
2k
4k
6k
8k
10k
Temperature (°C)
Load Capacitance (pF)
Max / Min Input vs. Case Temperature
Fig. 10
Fig. 9
100
Fall Timevs. LoadCapacitance
VCC=18V C =1nF
L
3.2
8V
90
80
70
60
50
40
30
20
10
3.0
2.8
2.6
2.4
2.2
2.0
1.8
Minimum Input High
10V
12V
18V
Maximum Input Low
16V
14V
1.6
-60
0
0k
-40
-20
0
20
40
60
80
100
2k
4k
6k
8k
10k
Temperature (oC)
Load Capacitance (pF)
5
IXDN404PI / N404SI / N404SI-16 IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
Fig. 11
Supply Current vs. Load Capacitance
Supply Current vs. Frequency
Vcc=18V
Fig. 12
Vcc=18V
100
100
CL= 1800 pF
80
60
40
20
10
1
1000 pF
200 pF
2 MHz
1 MHz
500 KHz
0.1
100 kHz
50 kHz
10 kHz
0
0.01
1
10
100
1000
0.1k
1.0k
10.0k
Frequency (kHz)
Load Capacitance (pF)
Fig. 14
Supply Current vs. Frequency
Vcc=12V
Fig. 13
Supply Current vs. Load Capacitance
Vcc=12V
100
100
80
60
40
20
CL= 1800 pF
200 pF
10
1
1000 pF
2 MHz 1 MHz
500 KHz
0.1
100 kHz
50 kHz
10 kHz
0
0.01
1
10
100
1000
0.1k
1.0k
10.0k
Frequency (kHz)
Load Capacitance (pF)
Fig. 15
Supply Current vs. Load Capacitance
Vcc=8V
Supply Current vs. Frequency
Vcc=8V
Fig. 16
100
100
80
60
40
20
10
1
CL= 1800 pF
200 pF
1000 pF
500 KHz
2 MHz
1 MHz
0.1
100 kHz
50 kHz
10 kHz
0
0.01
1
10
100
1000
0.1k
1.0k
10.0k
Load Capacitance (pF)
Frequency (kHz)
6
IXDN404PI / N404SI / N404SI-16 IXDI404PI / I404SI / I404SI-16
IXDF404PI / F404SI / F404SI-16
Fig. 18
Fig. 17
Propagation Delay vs. Input Voltage
CL=1800pF VCC=15V
Propagation Delay vs. Supply Voltage
CL=1800pF V =5V@1kHz
IN
60
50
40
30
20
10
0
50
40
30
20
10
tONDLY
tONDLY
tOFFDLY
tOFFDLY
0
8
0
2
4
6
8
10
12
10
12
14
16
18
Input Voltage (V)
Supply Voltage (V)
Fig. 20
0.26
Quiescent Supply Current vs. Temperature
VCC=18V V =5V@1kHz C =1000pF
Fig. 19
Propagation Delay Times vs. Temperature
IN
L
C =1800pF VCC=18V
L
60
55
50
45
40
35
30
25
20
15
0.24
tONDLY
0.22
0.20
tOFFDLY
0.18
0.16
0.14
10
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
100
120
Temperature (oC)
Temperature (°C)
Fig. 22
Fig. 21
P Channel Output Current Vs. Temperature
N Channel Output Current Vs. Temperature
VCC=18V, C =1000pF
VCC=18V, C =1000pF
L
L
6
6
5
4
3
5
4
3
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (oC)
Temperature (oC)
7
IXDN404PI / N404SI / N404SI-16 IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
Fig. 24
Low-State Output Resistance
Fig. 23
High State Output Resistance
Vs. Supply Voltage
vs. Supply Voltage
5
3.0
4
3
2
1
2.0
1.0
0.0
8
0
8
10
15
20
25
10
15
20
25
Supply Voltage (V)
Supply Voltage (V)
Fig. 25
Vcc vs. P Channel Output Current
Fig. 26
VCC vs. N Channel Output Current
8
0
-2
-4
-6
6
4
2
-8
8
0
8
10
15
20
25
30
10
15
20
25
30
Vcc
Vcc
8
IXDN404PI / N404SI / N404SI-16 IXDI404PI / I404SI / I404SI-16
IXDF404PI / F404SI / F404SI-16
PIN CONFIGURATIONS
1
2
3
4
NC
OUT A
VS
NC
8
7
6
5
1
2
3
4
NC
OUT A
VS
NC
8
7
6
5
1
2
3
4
NC
OUT A
VS
NC
8
7
6
5
IN A
GND
INB
IN A
GND
INB
IN A
GND
INB
OUT B
OUT B
OUT B
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDN404
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDI404
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDF404
NC
NC
1
NC
OUT A
OUT A
VCC
16
15
14
13
12
11
NC 16
1
NC
NC
OUT A
OUT A
VCC
16
15
14
13
12
11
1
2
3
4
5
6
7
8
OUT A
15
14
13
12
11
2
3
4
5
6
7
8
IN A
NC
2
3
4
5
6
7
8
IN A
NC
IN A
NC
OUT A
VCC
GND
GND
GND
GND
NC
VCC
GND
NC
VCC
GND
NC
VCC
OUT B
OUT B
OUT B
IN B
NC
IN B
NC
OUT B 10
NC
OUT B 10
NC
IN B
NC
OUT B 10
NC
9
9
9
16 Pin SOIC
IXDI404SI-16
16 Pin SOIC
IXDF404SI-16
16 Pin SOIC
IXDN404SI-16
Supply Bypassing, Grounding Practices And Output Lead inductance
GROUNDING
When designing a circuit to drive a high speed MOSFET
utilizing the IXDN404/IXDI404/IXDF404, it is very important to
observe certain design criteria in order to optimize performance
of the driver. Particular attention needs to be paid to Supply
Bypassing, Grounding, and minimizing the Output Lead
Inductance.
In order for the design to turn the load off properly, the IXDN404
must be able to drain this 2.5A of current into an adequate
grounding system. There are three paths for returning current
that need to be considered: Path #1 is between the IXDN404
and its load. Path #2 is between the IXDN404 and its power
supply. Path #3 is between the IXDN404 and whatever logic is
driving it. All three of these paths should be as low in resistance
and inductance as possible, and thus as short as practical. In
addition, every effort should be made to keep these three
ground paths distinctly separate. Otherwise, the returning
ground current from the load may develop a voltage that would
have a detrimental effect on the logic line driving the IXDN404.
Say,forexample,weareusingtheIXDN404tochargea2500pF
capacitive load from 0 to 25 volts in 25ns.
Using the formula: I= ∆V C / ∆t, where ∆V=25V C=2500pF &
∆t=25ns, we can determine that to charge 2500pF to 25 volts
in 25ns will take a constant current of 2.5A. (In reality, the
charging current won’t be constant, and will peak somewhere
around 4A).
OUTPUTLEADINDUCTANCE
Of equal importance to Supply Bypassing and Grounding are
issues related to the Output Lead Inductance. Every effort
should be made to keep the leads between the driver and its
load as short and wide as possible. If the driver must be placed
farther than 2” (5mm) from the load, then the output leads
should be treated as transmission lines. In this case, a twisted-
pair should be considered, and the return line of each twisted
pair should be placed as close as possible to the ground pin
ofthedriver,andconnecteddirectlytothegroundterminal
of the load.
SUPPLYBYPASSING
In order for our design to turn the load on properly, the IXDN404
must be able to draw this 2.5A of current from the power supply
in the 25ns. This means that there must be very low impedance
between the driver and the power supply. The most common
method of achieving this low impedance is to bypass the power
supply at the driver with a capacitance value that is a magnitude
larger than the load capacitance. Usually, this would be
achievedbyplacingtwodifferenttypesofbypassingcapacitors,
with complementary impedance curves, very close to the driver
itself. (These capacitors should be carefully selected, low
inductance, low resistance, high-pulse current-service
capacitors). Lead lengths may radiate at high frequency due
to inductance, so care should be taken to keep the lengths of
the leads between these bypass capacitors and the IXDN404
to an absolute minimum.
9
IXDN404PI / N404SI / N404SI-16 IXDN404PI / N404SI / N404SI-16
IXDF404PI / F404SI / F404SI-16
IXYS Corporation
3540 Bassett St; Santa Clara, CA 95054
Tel: 408-982-0700; Fax: 408-496-0670
e-mail: sales@ixys.net
IXYS Semiconductor GmbH
Edisonstrasse15 ; D-68623; Lampertheim
Tel: +49-6206-503-0; Fax: +49-6206-503627
e-mail: marcom@ixys.de
Directed Energy, Inc.
An IXYS Company
2401 Research Blvd. Ste. 108, Ft. Collins, CO 80526
Tel: 970-493-1901; Fax: 970-493-1903
e-mail: deiinfo@directedenergy.com
Doc #9200-0234 R1
10
相关型号：
©2020 ICPDF网 联系我们和版权申明