IXZ308N120 [IXYS]

Z-MOS RF Power MOSFET; Z- MOS RF功率MOSFET
IXZ308N120
型号: IXZ308N120
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

Z-MOS RF Power MOSFET
Z- MOS RF功率MOSFET

文件: 总3页 (文件大小:149K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IXZ308N120  
Z-MOS RF Power MOSFET  
N-Channel Enhancement Mode SwitchModeRFMOSFET
LowCapacitanceZ-MOSTMMOSFETProcess  
Optimized for RFOperation
Ideal for Class C, D, &EApplications
VDSS  
ID25  
= 1200 V  
=
=
=
8.0 A  
2.1 Ω  
RDS(on)  
PDC  
Symbol  
Test Conditions  
Maximum Rat-  
ings  
880 W  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
Continuous  
1200  
1200  
V
V
VDSS  
VDGR  
±20  
±30  
8
V
V
VGS  
VGSM  
ID25  
IDM  
Transient  
Tc = 25°C  
A
Tc = 25°C, pulse width limited by TJM  
Tc = 25°C  
40  
A
8
A
IAR  
Tc = 25°C  
TBD  
mJ  
EAR  
IS IDM, di/dt 100A/µs, VDD VDSS  
Tj 150°C, RG = 0.2Ω  
,
5 V/ns  
dv/dt  
IS = 0  
>200 V/ns  
DRAIN  
880  
440  
3.0  
W
W
W
PDC  
GATE  
Tc = 25°C, Derate 4.4W/°C above 25°C  
Tc = 25°C  
PDHS  
PDAMB  
RthJC  
RthJHS  
0.17 C/W  
0.34 C/W  
SG1 SG2  
SD1  
SD2  
Features  
Isolated Substrate  
high isolation voltage (>2500V)  
min.  
1200  
3.5  
typ.  
max.  
excellent thermal transfer  
Increased temperature and power  
cycling capability  
VGS = 0 V, ID = 4 ma  
VDS = VGS, ID = 250µΑ  
VGS = ±20 VDC, VDS = 0  
V
V
VDSS  
VGS(th)  
IGSS  
IXYS advanced Z-MOS process  
Low gate charge and capacitances  
6.5  
±100  
nA  
easier to drive  
faster switching  
Low RDS(on)  
VDS = 0.8VDSS  
VGS=0  
TJ = 25C  
TJ =125C  
50  
1
IDSS  
µA  
mA  
Very low insertion inductance (<2nH)  
VGS = 20 V, ID = 0.5ID25  
Pulse test, t 300µS, duty cycle d 2%  
2.1  
RDS(on)  
No beryllium oxide (BeO) or other  
hazardous materials  
VDS = 50 V, ID = 0.5ID25, pulse test  
10.1  
S
°C  
°C  
°C  
°C  
g
gfs  
Advantages  
-55  
-55  
+175  
TJ  
Optimized for RF and high speed  
Easy to mount—no insulators needed  
High power density  
175  
TJM  
Tstg  
TL  
+ 175  
1.6mm(0.063 in) from case for 10 s  
300  
3.5  
Weight  
IXZ308N120  
Z-MOS RF Power MOSFET  
Symbol  
Test Conditions  
Characteristic Values  
(TJ = 25°C unless otherwise specified)  
min.  
typ.  
max.  
1
RG  
pF  
pF  
1960  
59  
Ciss  
Coss  
VGS = 0 V, VDS = 0.8 VDSS(max)  
f = 1 MHz  
,
9.2  
33  
4
pF  
pF  
ns  
ns  
ns  
ns  
Crss  
Back Metal to any Pin  
Cstray  
Td(on)  
Ton  
VGS = 15 V, VDS = 0.8 VDSS  
ID = 0.5 IDM  
5
RG = 1 (External)  
4
Td(off)  
Toff  
6
Source-Drain Diode  
Characteristic Values  
(TJ = 25°C unless otherwise specified)  
Symbol  
Test Conditions  
min.  
typ.  
max.  
8
VGS = 0 V  
IS  
Α
Repetitive; pulse width limited by  
TJM  
48  
A
ISM  
IF=Is, VGS=0 V, Pulse test, t  
300µs, duty cycle 2%  
1.5  
V
VSD  
Trr  
TBD  
ns  
IXYS RF reserves the right to change limits, test conditions and dimensions.  
IXYS RF MOSFETS are covered by one or more of the following U.S. patents:  
4,835,592  
5,034,796  
5,381,025  
6,731,002  
4,860,072  
5,049,961  
5,640,045  
4,881,106  
5,063,307  
6,404,065  
4,891,686  
5,187,117  
6,583,505  
4,931,844  
5,237,481  
6,710,463  
5,017,508  
5,486,715  
6,727,585  
IXZ308N120  
Z-MOS RF Power MOSFET  
10000  
Ciss  
1000  
100  
Coss  
Crss  
10  
1
0
200  
400  
600  
800  
1000  
1200  
Vds in Volts  
IXZ308N120 Capacitances verses Vds  
Doc #dsIXZ308N12 REV 06/04  
© 2004 IXYS RF  
An IXYS Company  
2401 Research Blvd., Suite 108  
Fort Collins, CO USA 80526  
970-493-1901 Fax: 970-493-1903  
Email: info@ixysrf.com  
Web: http://www.ixysrf.com  

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