MX878R [IXYS]
Switching Controller, ROHS COMPLIANT, MO-220VHHD-1, QFN-28;
| 型号： | MX878R |
| 厂家： | 
IXYS CORPORATION |
| 描述： | Switching Controller, ROHS COMPLIANT, MO-220VHHD-1, QFN-28 开关 |
| 文件： | 总11页 (文件大小：418K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MX878
8-Channel, 60V Driver with
Open-Drain Output, 3 Wire Interface
Features
Description
• Eight (8) Outputs Rated at 60V, 200mA
• Open-Drain, Pull-Down Driver Configuration
• 6V to 60V Driver Supply Range
• 2.7V to 5.5V Logic Supply Range
• 3-Wire Serial Interface plus Chip Select
• Captures Serial & Parallel Input Data
• Outputs Can Be Paralleled
The MX878 is an 8-channel, high voltage switch with
8-bit parallel or serial input control. The MX878
connects directly to a microprocessor through a
standard 3-wire serial interface. The open-drain,
pull-down output configuration can drive up to 60 volts
at 200mA. Outputs can be paralleled for increased
drive current up to a device total of 1000mA sink.
• 28-Lead QFN Package
The MX878 is designed to operate over a temperature
range of -40°C to +85°C, and is available in a 28-lead
QFN Package.
Applications
• White Goods
• ATE
• Industrial Equipment
Ordering Information
Part
Description
RoHS
2002/95/EC
Pb
e3
MX878R
QFN-28 in Tubes (73/Tube)
MX878RTR
QFN-28 Tape & Reel (2500/Reel)
Functional Block Diagram
VCC
VPWR
CS*
SDO
IN7
IN6
IN5
IN4
IN3
IN2
IN1
IN0
I/O
Register
Latch
Register
Driver
OUT7
OUT6
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
Parallel
In & Out
Level
Translator
SCK
SDI
OE
GND
DS-MX878 - R00B
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1
MX878
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 Dynamic Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.6 Serial Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.7 Parallel Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Parallel In / Parallel Out Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 Serial Cascade Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 Control System Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
R00B
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2
MX878
1.2 Pin Description
1 Specifications
1.1 Package Pinout
Pin#
Name
OUT7
N/C
Description
1
Parallel Output
No Connection
Ground
2
3
GND
7
6
5
4
3
2
1
15
16
17
18
19
20
21
V
4
High Voltage Supply (6V to 60V)
No Connection
Logic Supply (2.7V to 5.5V)
Serial Data Output
Parallel Input
PWR
5
N/C
V
6
CC
7
SDO
IN7
8
9
IN6
Parallel Input
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
IN5
Parallel Input
BOTTOM V IEW
IN4
Parallel Input
IN3
Parallel Input
IN2
Parallel Input
IN1
Parallel Input
IN0
Parallel Input
SCK
GND
SDI
Serial Clock
Ground
Serial Data Input
Chip Select (Active Low)
Output Enable
Ground
CS*
OE
GND
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
Parallel Output
Parallel Output
Parallel Output
Parallel Output
Parallel Output
Parallel Output
Parallel Output
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MX878
1.3 Absolute Maximum Ratings
Absolute maximum electrical ratings are at 25°C
Parameter
Symbol Min
Max
Units
VPWR
VCC
VPWR Supply Voltage
Logic Supply Voltage
Input Pin Voltage
-
-
-
60
6
V
V
V
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings for
an extended period may degrade the device and affect its
reliability.
VIN
6
Continuous Output Current
OUT0 - OUT7
IOUTn
TJ
-
-
250
150
mA
°C
Operating Junction Temperature
Thermal Resistance
(Junction to Ambient)
RθJA
110 Typical
°C/W
TA
Operating Temperature
Storage Temperature
-40
-55
85
°C
°C
TSTG
150
Voltages with respect to GND=0V.
ESD Warning: ESD (electrostatic discharge) sensitive device. Although the MX878 features proprietary ESD protection
circuitry, permanent damage may be sustained if subjected to high energy electrostatic discharges. Proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
1.4 DC Electrical Characteristics
V
=5V, V
=42V, T =25°C, unless otherwise specified.
CC
PWR A
Parameter
Conditions
Symbol Minimum
Typical Maximum
Units
Logic Supply Voltage
Logic Supply Current
Quiescent Logic Supply Current
VPWR Voltage
-
V
VCC
ICC
2.7
-
50
-
5.5
-
fSCK=5MHz
fSCK=0
-
-
μA
μA
ICC
1
-
VPWR
6
-
-
-
60
V
GND Current
Total of all Outputs
VPWR=42V, No Load
-
1000
mA
Quiescent VPWR Current
High Level Input Voltage
IPWR
-
0.75
-
-
-
mA
V
IN0-IN7, SCK, SDI, OE, CS*
-
VIH
VIL
VCC-0.5
Low Level Input Voltage
-
-
-
-
-
-
-
0.5
1
V
Input Leakage Current
-
-
-
-
-
-
-
-
μA
μA
mA
Ω
SDO Tri-State Leakage Current
OUT0-OUT7 Current
CS*=Logic High
Any One Output, Sink
VPWR=42V
1
-
200
-
OUT0-OUT7 On-Resistance
OUT0-7 Tri-State Leakage Current
4.5
-
OE=Logic Low
1
μA
Notes: To avoid unwanted output during V
application and system initialization, keep OE at a logic low until
PWR
CS* has completed one cycle.
Thermal Resistance is measured in still air with the device soldered to a 6 square inch board without a
ground plane. Applications may require derating of the specified maximum currents to avoid exceeding the
maximum operation junction temperature.
4
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MX878
1.5 Dynamic Electrical Characteristics
=5V, V =42V, T =25°C, unless otherwise specified.
V
CC
PWR
A
Parameter
Conditions
Symbol
-
Minimum
100
40
Typical Maximum Units
-
-
-
-
-
-
-
-
-
-
DC
ns
ns
ns
ns
ns
ns
ns
ns
ns
SCK Period
-
-
-
-
-
-
-
-
-
-
SCK High Time
-
-
40
SCK Low Time
-
tCSwh
tCSs
tCSwl
tINs
tINh
tSDIs
50
CS* High Time
Setup Time
150
150
15
CS* Falling to SCK Rising
CS* Low Time
SCK Low (Parallel Input Mode)
-
-
-
INx to CS Falling (SETUP TIME)
INx to CS Falling (HOLD TIME)
SDI to SCK Rising (SETUP TIME)
30
20
-
tSDIh
25
-
-
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
SDI to SCK Rising (HOLD TIME)
SCK Falling to to SDO Data Valid
CS* Rising to SDO High Z
CS* Rising to OUTx Falling
OUTx Fall Time
-
-
tSDO
10
tSDOz
-
12
To 50%, C(OUTx)=1000pF
From 10% to 90%, C(OUTx)=1000pF
To 90%
tOUTf
-
570
75
-
-
-
-
-
-
-
580
390
130
90
OE Rising to OUTx Rising
OE Rising to OUTx Falling
OE Falling to OUTx High Z
To 90%
-
To 10%, OUTx High
To 10%, OUTx Low
-
-
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MX878
1.6 Serial Timing
INx
tINs
CS*
tINh
tCSs
tCSwh
SCK
SDI
tSDIh
tSDIs
tSDOz
tSDO
SDO
tOUTr
tOUTf
OUTx
1.7 Parallel Timing
INx
tINs
tINh
CS*
tCSwl
tOUTr
OUTx
tOUTf
6
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MX878
Figure 1. Serial Data Transfer Example
2 Functional Description
0
IN7
IN6
IN5
IN4
IN3
IN2
IN1
IN0
The MX878 is an 8-channel high-voltage driver with
8-bit input control. The MX878 interfaces to a
microprocessor through a standard 3-wire serial
interface and an active-low chip select, or can be used
in a parallel-in, parallel-out configuration.
0
1
0
1
1
1
0
Parallel data is transferred to the I/O register of the
MX878 through the parallel input pins, IN0 through
IN7, on the falling edge of the chip select pin, CS*.
When CS* is in a logic-low state, serial data can be
transferred to the I/O register through the serial input
pin, SDI, and from the I/O register through the serial
output pin, SDO. Parallel or serial input data is
transferred from the I/O register to the latch and high
voltage output drivers, OUT0 through OUT7, on the
positive edge of CS*. This data remains latched until
the next positive edge of CS*.
0
0
1
t1
0
0
0
1
0
1
1
1
1
1
0
SDI
CS
*
SCK
SDO
0
0
SDI at
time t1
OUT7
OUT6
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
1
0
The 8-bit I/O shift register is clocked by the serial clock
pin, SCK. Serial data presented at the SDI pin is
transferred to the shift register on the positive edge of
SCK. Data shifts out of the register through the SDO
pin on the negative edge of SCK. SDI and SCK are
ignored, and SDO transitions to a high impedance
condition when CS* is at a logic high state.
0
0
0
1
1
0
Serial data is received by the MX878 through the SDI
pin. This data is accepted on the rising edge of SCK. A
specific output is programmed to a logic-high state if
SDI is at a logic-high state during the rising edge of
SCK. Conversely, a specific output is programmed to a
logic-low state if SDI is at a logic-low state during the
rising edge of SCK. Outputs transition to their
Devices may be serially cascaded by connecting SDO
to SDI of the next device. Pins SCK and CS* are
common to all devices in serial cascade. For
n-cascaded devices the CS* should remain low for 8n
cycles of SCK.
programmed states on the positive edge of CS* if the
output enable pin, OE, is in a logic-high state.
An output enable pin, OE, enables the driver outputs
OUT0 through OUT7 when logic-high. A logic-low
level on OE forces the OUT0 through OUT7 outputs to
a high-impedance state.
The MSB input data (IN7) is presented at the serial
output pin, SDO, on the falling edge of CS*. Input data
from IN6 through IN0 is sequentially presented at
SDO on negative SCK transitions if CS* remains in a
logic-low state. If CS* is at a logic-low state beyond 8
cycles of SCK, SDI data that has propagated through
the I/O register will then be presented at SDO. The
SDO pin transitions to a high-impedance state when
CS* is in a logic-high state, thus allowing multiple
serial peripherals to share the microprocessor data
pin.
The MX878 can also operate as a parallel-in,
parallel-out level shifter and driver. SCK must remain
at a logic-low state when operating in this mode.
Parallel input data presented to IN0 through IN7 is
captured on the falling edge of CS*. This data is
transferred to OUT0 through OUT7 on the rising edge
of CS*, and remains latched until the next rising edge
of CS*.
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MX878
3 Application Examples
3.1 Parallel In / Parallel Out Application
8
8
IN
OUT
CS*
OE
SDI
SCK
3.2 Serial Cascade Application
MASTER IN
SDO
OUT
IN
8
8
SCK
CS*
OE
SDI
SDO
IN
OUT
8
8
SCK
CS*
OE
SDI
MASTER OUT
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MX878
3.3 Control System Application
System
sensors
MX878
capture
drive
IN
8
8
SDI
SDO
SCK
CS*
OE
µC
actuators
OUT
Type 1 timing:
capture N
drive N
analyze N, calculate N+1
capture N+1
drive N+1
CS*
SDI
µC
output N
µC
output N+1
SCK
SDO
input N
µC
input N+1
µC
Type 2 timing:
capture N
analyze N, calculate N+1
drive N+1
capture N+1
CS*
SDI
don't care
µC
output N+1
SCK
SDO
input N
µC
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MX878
4 Manufacturing Information
4.1 Mechanical Dimensions
4.1.1 QFN-28 Package & Recommended PCB Land Pattern
4.70
(0.185)
3.25
0.45 / 0.65
(0.018 / 0.026)
(0.128)
3.00 / 3.25
(0.118 / 0.128)
Pin 1 REF
2
1
0.18 / 0.30
(0.007 / 0.012)
5.00 BSC
(0.197 BSC)
28
1.00
(0.039)
0.30
(0.012)
0.500 BSC
(0.0197 BSC)
0.80 / 1.00
(0.031 / 0.039)
0.200 REF
(0.008 REF)
NOTES: (Unless otherwise specified)
1. Coplanarity applies to the exposed
heat sink slug as well as the terminals.
2. Dimensions and tolerancing conform
to ASME Y14.5M-1994.
3. Molded package shall conform to
JEDEC Standard configuration
MO-220 Variation VHHD-1.
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.00 / 0.05
(0.000 / 0.002)
4.1.2 Tape & Reel
4.00 0.10
(0.157 0.004)
1.75 0.10
(0.069 0.004)
B
ø1.55 0.05
(ø0.061 0.002)
2.00 0.05
(0.079 0.002)
330.2 DIA.
(13.00 DIA.)
R0.50 TYP
(R0.020 TYP)
Top Cover
12.00 0.10
(0.472 0.004)
Tape Thickness
0.066 MAX.
(0.0026 MAX.)
BO=5.30 0.10
(0.209 0.004)
5.50 0.05
(0.217 0.002)
A
A
KO=1.10 0.10
(0.043 0.004)
B
ø1.50 MIN
(ø0.059 MIN)
8.00 0.10
(0.315 0.004)
Section B-B
AO=5.30 0.10
(0.209 0.004)
Embossed Carrier
Dimensions
mm
(inches)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
Section A-A
Embossment
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MX878
4.2 Soldering
4.3 Washing
For proper assembly, the component must be
processed in accordance with the current revision of
IPC/JEDEC standard J-STD-020. Failure to follow the
recommended guidelines may cause permanent
damage to the device resulting in impaired
Clare does not recommend ultrasonic cleaning or the
use of chlorinated hydrocarbons.
RoHS
2002/95/EC
Pb
e3
performance and/or a reduced lifetime expectancy.
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-MX878-R00B
©Copyright 2009, Clare, Inc.
All rights reserved. Printed in USA.
12/17/09
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