KA-3535QB25Z1S [KINGBRIGHT]
SINGLE COLOR LED, BLUE, 2.6mm, ROHS COMPLIANT, SMD, 4 PIN;型号: | KA-3535QB25Z1S |
厂家: | KINGBRIGHT CORPORATION |
描述: | SINGLE COLOR LED, BLUE, 2.6mm, ROHS COMPLIANT, SMD, 4 PIN 光电 |
文件: | 总6页 (文件大小:332K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
3.5x3.5 mm SMD CHIP LED LAMP
Part Number: KA-3535QB25Z1S
Blue
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Description
The Blue source color devices are made with InGaN on
Al2O3 substrate Light Emitting Diode.
Features
z White SMD package, silicone resin.
z Low thermal resistance.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
z Compatible with IR-reflow processes.
z ESD protection.
All devices, equipment and machinery must be electrically
grounded.
z Package: 2000pcs / reel.
z Moisture sensitivity level : level 2a.
z RoHS compliant.
Applications
z Signal and symbol luminaire for orientation.
z Marker lights (e.g. steps, exit ways, etc).
z Decorative and entertainment lighting.
z Commercial and residential lighting.
z Automotive interior lighting.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAK7727
APPROVED: WYNEC
REV NO: V.2
DATE: JAN/13/2011
DRAWN: D.M.Su
PAGE: 1 OF 6
CHECKED: Allen Liu
ERP: 1201005739
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diame-
ter of the nozzle should be as large as possible.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAK7727
APPROVED: WYNEC
REV NO: V.2
DATE: JAN/13/2011
DRAWN: D.M.Su
PAGE: 2 OF 6
CHECKED: Allen Liu
ERP: 1201005739
Selection Guide
Iv (cd) [2]
@ 150mA
Φv (lm) [2]
@ 150mA
Viewing
Angle [1]
Dice
Lens Type
Part No.
Min.
0.7
Typ.
Min.
3.5
Typ.
2 θ 1/2
120 °
KA-3535QB25Z1S
Notes:
Blue (InGaN)
Water Clear
1.3
5
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
Absolute Maximum Ratings at TA=25°C
Parameter
Power Dissipation
Symbol
PD
Value
600
Unit
mW
°C
Junction Temperature [1]
Operating Temperature
Storage Temperature
TJ
110
Top
-40 To +85
-40 To +85
°C
Tstg
°C
DC Forward Current [1]
Peak Forward Current [2]
Reverse Voltage
IF
150
300
5
mA
mA
V
IFM
VR
Thermal Resistance [1]
(Junction/ambient)
Rth j-a
Rth j-S
180
°C/W
Thermal Resistance [1]
(Junction/solder point)
60
°C/W
V
Electrostatic Discharge Threshold (HBM)
Notes:
8000
1.Results from mounting on PC board FR4(pad size ≥ 70mm2), mounted on pc board-metal core PCB is recommend
for lowest thermal Resistance.
2.1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA=25°C
Parameter
Symbol
λ peak
λ dom [1]
Δλ
Value
445
Unit
Wavelength at peak emission IF=150mA
[Typ.]
nm
nm
nm
Dominant Wavelength IF=150mA [Typ.]
450
Spectral Line Half-width IF=150mA [Typ.]
Forward Voltage IF=150mA [Min.]
Forward Voltage IF=150mA [Typ.]
Forward Voltage IF=150mA [Max.]
Allowable Reverse Current [Max.]
Temperature coefficient of λ peak
20
2.7
3.5
4.0
85
VF [2]
V
IR
mA
TC λ peak
0.12
0.1
nm/° C
IF=150mA, -10 ° C≤ T≤100 ° C
[Typ.]
Temperature coefficient of λ dom
TC λ dom
nm/° C
mV/° C
IF=150mA, -10 ° C≤ T≤100 ° C
[Typ.]
Temperature coefficient of VF
TCV
-2.3
IF=150mA, -10 ° C≤ T≤100 ° C [Typ.]
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
SPEC NO: DSAK7727
APPROVED: WYNEC
REV NO: V.2
DATE: JAN/13/2011
DRAWN: D.M.Su
PAGE: 3 OF 6
CHECKED: Allen Liu
ERP: 1201005739
Blue
KA-3535QB25Z1S
SPEC NO: DSAK7727
APPROVED: WYNEC
REV NO: V.2
DATE: JAN/13/2011
DRAWN: D.M.Su
PAGE: 4 OF 6
CHECKED: Allen Liu
ERP: 1201005739
KA-3535QB25Z1S
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Reel Dimension
Recommended Soldering Pattern
(Units : mm; Tolerance: ±0.1)
Tape Specifications
(Units : mm)
SPEC NO: DSAK7727
APPROVED: WYNEC
REV NO: V.2
DATE: JAN/13/2011
DRAWN: D.M.Su
PAGE: 5 OF 6
CHECKED: Allen Liu
ERP: 1201005739
PACKING & LABEL SPECIFICATIONS
KA-3535QB25Z1S
數位簽署者:yalin
DN:cn=yalin,o,
yali ou=SPEC 專用,
email=yalin@ yali
n.com,c=<無>
日期 2011.02.25
08:38:19+08'00'
n
SPEC NO: DSAK7727
APPROVED: WYNEC
REV NO: V.2
CHECKED: Allen Liu
DATE: JAN/13/2011
DRAWN: D.M.Su
PAGE: 6 OF 6
ERP: 1201005739
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