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KK74HCT240A [KODENSHI]

Octal 3-State Inverting Buffer/Line Driver/Line Receiver High-Performance Silicon-Gate CMOS; 八路三态缓冲器/线路驱动器/线接收器高性能硅栅CMOS
KK74HCT240A
型号： KK74HCT240A
厂家： KODENSHI KOREA CORP.    KODENSHI KOREA CORP.
描述：

Octal 3-State Inverting Buffer/Line Driver/Line Receiver High-Performance Silicon-Gate CMOS
八路三态缓冲器/线路驱动器/线接收器高性能硅栅CMOS

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TECHNICAL DATA  
KK74HCT240A  
Octal 3-State Inverting Buffer/Line  
Driver/Line Receiver  
High-Performance Silicon-Gate CMOS  
The KK74HCT240A is identical in pinout to the LS/ALS240. The  
KK74HCT240A may be used as a level converter for interfacing TTL or  
NMOS outputs to High Speed CMOS inputs.  
This octal inverting buffer/line driver/line receiver is designed to be  
used with 3-state memory address drivers, clock drivers, and other bus-  
oriented systems. The device has inverting outputs and two active-low  
output enables.  
ORDERING INFORMATION  
KK74HCT240AN P lastic  
KK74HCT240ADW SOIC  
TA = -55° to 125° C for all packages  
•
•
•
•
TTL/NMOS Compatible Input Levels  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 4.5 to 5.5 V  
Low Input Current: 1.0 µA  
PIN ASSIGNMENT  
LOGIC DIAGRAM  
FUNCTION TABLE  
Inputs  
Enable A,  
Outputs  
YA,YB  
A,B  
Enable B  
PIN 20=VCC  
PIN 10 = GND  
L
L
H
X
H
L
Z
L
H
X = don’t care  
Z = high impedance  
1
KK74HCT240A  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
-0.5 to +7.0  
-1.5 to VCC +1.5  
-0.5 to VCC +0.5  
±20  
Unit  
V
VCC  
VIN  
VOUT  
IIN  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
V
V
mA  
mA  
mA  
mW  
IOUT  
ICC  
DC Output Current, per Pin  
±35  
DC Supply Current, VCC and GND Pins  
±75  
PD  
Power Dissipation in Still Air, Plastic DIP+  
SOIC Package+  
750  
500  
Tstg  
TL  
Storage Temperature  
-65 to +150  
260  
°C  
°C  
Lead Temperature, 1 mm from Case for 10 Seconds  
(Plastic DIP or SOIC Package)  
*Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C  
SOIC Package: : - 7 mW/°C from 65° to 125°C  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
VCC  
Parameter  
Min  
4.5  
0
Max  
5.5  
Unit  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage, Output Voltage (Referenced to GND)  
Operating Temperature, All Package Types  
Input Rise and Fall Time (Figure 1)  
VIN, VOUT  
TA  
VCC  
+125  
500  
V
-55  
0
°C  
ns  
tr, tf  
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.  
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this  
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or  
V
OUT)≤VCC.  
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused  
outputs must be left open.  
2
KK74HCT240A  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
VCC  
Guaranteed Limit  
Symbol  
Parameter  
Test Conditions  
V
Unit  
25 °C ≤85  
≤125  
°C  
to  
°C  
-55°C  
VIH  
VIL  
Minimum High-  
Level Input Voltage  
VOUT=0.1 V  
⎢IOUT⎢≤ 20 µA  
4.5  
5.5  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
V
V
V
Maximum Low -  
Level Input Voltage  
VOUT= VCC-0.1 V  
⎢IOUT⎢ ≤ 20 µA  
4.5  
5.5  
0.8  
0.8  
0.8  
0.8  
0.8  
0.8  
VOH  
Minimum High-  
Level Output Voltage  
VIN= VIL  
⎢IOUT⎢ ≤ 20 µA  
4.5  
5.5  
4.4  
5.4  
4.4  
5.4  
4.4  
5.4  
VIN=VIL  
4.5  
3.98 3.84  
3.7  
⎢IOUT⎢ ≤ 6.0 mA  
VOL  
Maximum Low-  
Level Output Voltage  
VIN=VIH  
⎢IOUT⎢ ≤ 20 µA  
4.5  
5.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
VIN= VIH  
4.5  
5.5  
0.26 0.33  
0.4  
⎢IOUT⎢ ≤ 6.0 mA  
IIN  
Maximum Input  
Leakage Current  
VIN=VCC or GND  
±0.1 ±1.0  
±1.0  
µA  
µA  
IOZ  
Maximum three State Output in High-Impedance  
5.5  
±0.5 ±5.0 ±10.0  
Leakage Current  
State  
VIN = VIL or VIH  
VOUT=VCC or GND  
ICC  
Maximum Quiescent  
Supply Current  
(per Package)  
VIN=VCC or GND  
5.5  
4.0  
40  
160  
µA  
I
OUT=0µA  
Additional Quiescent VIN = 2.4 V, Any One Input  
mA  
∆ICC  
≥-55°C  
2.9  
25°C to  
125°C  
Supply Current  
VIN=VCC or GND, Other  
Inputs  
5.5  
2.4  
IOUT=0µA  
NOTE: Total Supply Current = ICC + ∑∆ICC  
3
KK74HCT240A  
AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V ± 10%, CL=50pF,Input tr=tf=6.0 ns)  
Guaranteed Limit  
≤85°C ≤125°C  
Symbol  
Parameter  
Unit  
25 °C  
to  
-55°C  
tPLH, tPHL Maximum Propagation Delay, A to YA or B to  
YB (Figures 1 and 3)  
20  
28  
25  
12  
25  
35  
31  
15  
30  
42  
38  
18  
ns  
ns  
ns  
ns  
tPLZ, tPHZ Maximum Propagation Delay, Output Enable to  
YA or YB (Figures 2 and 4)  
tPZH, tPZL Maximum Propagation Delay, Output Enable to  
YA or YB (Figures 2 and 4)  
tTLH, tTHL Maximum Output Transition Time, Any Output  
(Figures 1 and 3)  
CIN  
Maximum Input Capacitance  
10  
15  
10  
15  
10  
15  
pF  
pF  
COUT  
Maximum Three-State Output Capacitance  
(Output in High-Impedance State)  
Power Dissipation Capacitance (Per Enable  
Output)  
Typical @25°C,VCC=5.0 V  
CPD  
Used to determine the no-load dynamic power  
consumption:  
55  
pF  
PD=CPDVCC2f+ICCVCC  
Figure 1. Switching Waveforms  
Figure 2. Switching Waveforms  
4
KK74HCT240A  
Figure 3. Test Circuit  
Figure 4. Test Circuit  
EXPANDED LOGIC DIAGRAM  
(1/8 of the Device)  
5
KK74HCT240A  
N SUFFIX PLASTIC DIP  
(MS - 001AD)  
A
Dimension, mm  
11  
10  
20  
1
Symbol MIN  
MAX  
26.92  
7.11  
B
24.89  
6.1  
A
B
C
D
F
5.33  
0.36  
1.14  
0.56  
F
L
1.78  
2.54  
7.62  
G
H
J
C
SEATING  
PLANE  
-T-  
K
N
0
10  
°
°
M
J
G
H
D
2.92  
7.62  
0.2  
3.81  
8.26  
0.36  
K
L
M
N
0.25 (0.010) M  
T
NOTES:  
1. Dimensions “A”, “B” do not include mold flash or protrusions.  
Maximum mold flash or protrusions 0.25 mm (0.010) per side.  
0.38  
D SUFFIX SOIC  
(MS - 013AC)  
A
20  
11  
Dimension, mm  
Symbol MIN  
MAX  
13  
H
B
P
12.6  
7.4  
A
B
C
D
F
7.6  
2.35  
0.33  
0.4  
2.65  
0.51  
1.27  
1
10  
G
R x 45  
C
-T-  
SEATING  
PLANE  
1.27  
9.53  
G
H
J
K
M
D
J
F
M
0.25 (0.010) M T C  
0
°
8
°
NOTES:  
0.1  
0.23  
10  
0.3  
0.32  
10.65  
0.75  
K
M
P
1. Dimensions A and B do not include mold flash or protrusion.  
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side  
for A; for B 0.25 mm (0.010) per side.  
‑
0.25  
R
6

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