MC145583DW [LANSDALE]
3.3 Volt Only Driver/Receiver with an Integrated Standby Mode RS 232/EIA-232-E and CCITT V.28; 3.3伏，只有驱动器/接收器，集成待机模式RS 232 / EIA- 232 -E和CCITT V.28
| 型号： | MC145583DW |
| 厂家： | 
LANSDALE SEMICONDUCTOR INC. |
| 描述： | 3.3 Volt Only Driver/Receiver with an Integrated Standby Mode RS 232/EIA-232-E and CCITT V.28 |
| 文件： | 总7页 (文件大小：527K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ML145583
3.3 Volt Only Driver/Receiver with
an Integrated Standby Mode
RS 232/EIA–232–E and CCITT V.28
Legacy Device: Motorola MC145583
SOIC 28W = -7P
The ML145583 is a CMOS transceiver composed of three drivers and
five receivers that fulfills the electrical specifications of EIA–232–E,
EIA–562, and CCITT V.28 while operating from a single + 3.3 or + 5.0 V
power supply. This transceiver is a high–performance, low–power con-
sumption device that is equipped with a standby function.
A voltage tripler and inverter converts the + 3.3 V to 8.8 V, or a volt-
age doubler and inverter converts the + 5.0 V to 8.8 V. This is accom-
plished through an on–chip 40 kHz oscillator and five inexpensive exter-
nal capacitors.
SOG PACKAGE
CASE 751F
28
1
PACKAGE
SOIC 28W
MOTOROLA
LANSDALE
MC145583DW ML145583-7P
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
FEATURES
Drivers:
•
5 V Minimum Output Swing at 3.3 or 5.0 V Power Supply
• 300 Ω Power–Off Impedance
• Output Current Limiting
• Three–State Outputs During Standby Mode
PIN ASSIGNMENT
C5+
GND
1
2
28
27
26
25
24
C2+
Receivers:
•
25 V Input Range
V
CC
• 3 to 7 kΩ Input Impedance
• 0.8 V Hysteresis for Enhanced Noise Immunity
• Three–State Outputs During Standby Mode
C5–
3
4
C2–
C1+
C1–
RING
MONITOR
CIRCUIT
RIMON
Ring Monitor Circuit:
• Invert the Input Level on Rx1 to Logic Output Level on RIMON at
Standby Mode
5
V
(INVERTING)
SS
6
23
22
STB
Rx1
Rx2
Rx3
Tx1
Rx4
Tx2
Rx5
Tx3
V
DD
7
DO1
DO2
DO3
DI1
8
21
20
19
18
17
16
15
9
10
11
12
13
14
DO4
DI2
DO5
DI3
Page 1 of 7
www.lansdale.com
Issue A
ML145583
LANSDALE Semiconductor, Inc.
FUNCTION DIAGRAM
CHARGE PUMPS
OSC
V
GND
CC
VOLTAGE
TRIPLER
VOLTAGE
INVERTER
+
C4
C3
+
C1
C2
C5
+
V
V
SS
DD
C5+
C5–
C1–
C1+
C2–
+
C2+
**
RECEIVER
V
DD
*
V
STB
CC
15 kΩ
+
–
DO
5.4 kΩ
1.0 V
TURN OFF
1.8 V
*Protection Circuit.
**Capacitors C1 and C2 are replaced by a 1 µF capacitor at
= 5.0 V supply.
TURN ON
V
CC
DRIVER
V
DD
STB
V
CC
300
Ω
LEVEL
SHIFTER
+
–
DI
Tx
1.4 V
V
SS
Page 2 of 7
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145583
MAXIMUM RATINGS (Voltage polarities referenced to GND)
This device contains protection circuitry to
Rating
DC Supply Voltage
Symbol
Value
Unit
V
guard against damage due to high static
voltages or electric fields. However, precau-
tions must be taken to avoid applications of
any voltage higher than maximum rated volt-
agestothishigh–impedancecircuit.Forproper
operation, it is recommended that the voltage
at the DI and DO pins be constrained to the
V
CC
– 0.5 to + 6.0
Input Voltage
Rx1 – Rx5 Inputs
DI1 – DI3 Inputs
V
IR
V
– 15 to V
+ 15
+ 0.5
V
SS
– 0.5 to V
DD
CC
DC Current per Pin
Power Dissipation
I
100
1
mA
W
P
D
range GND ≤ V ≤ V
and GND ≤ V
DI
CC
DO
≤ V . Also, the voltage at the Rx pin should
CC
Operating Temperature Range
Storage Temperature Range
T
A
– 40 to + 85
°C
°C
be constrained to (V
– 15 V) ≤ V
Rx1 – Rx5
SS
+ 15 V), and Tx should be constrained
T
stg
– 85 to + 150
≤ (V
to V
DD
SS
≤ V
≤ V .
Tx1 – Tx3
DD
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., GND or
V
CC
for DI, and GND for Rx).
RECOMMENDED OPERATING LIMITS
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply
V
3.0
4.5
3.3
5.0
3.6
5.5
V
CC
V
CC
*
Operating Temperature Range
T
A
– 40
—
85
°C
* Capacitors C1 and C2 are replaced by a 1 µF capacitor at V
CC
= 5 V.
DC ELECTRICAL CHARACTERISTICS (Voltage polarities referenced to GND = 0 V; C1 – C5 = 1 µF; T = 25°C)
A
Parameter
Symbol
Min
3.0
—
Typ
3.3
2.8
< 5
Max
3.6
6.0
10
Unit
V
DC Power Supply
V
CC
Quiescent Supply Current (Output Unloaded, Input Low)
Quiescent Supply Current (Standby Mode; STB = 1, Output Unloaded)
Control Signal Input Voltage (STB)
I
mA
µA
V
CC
I
—
CC(STB)
V
—
—
—
0.5
—
IL
V
IH
V
– 0.5
CC
Control Signal Input Current (STB)
I
—
—
—
—
10
10
µA
IL
I
IH
Charge Pumps Output Voltage (V
CC
= 3 V; C1, C2, C3, C4, C5 = 1 µF)
V
DD
V
Output Voltage (V
)
I
I
= 0 mA
= 6 mA
8.5
7.5
8.8
7.9
—
—
DD
load
load
Output Voltage (V
)
I
I
= 0 mA
= 6 mA
V
SS
—
—
– 8.8
– 7.8
– 8.5
– 7.0
SS
load
load
RECEIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; V
= + 3.3 V 10%; C1 – C5 = 1 µF; T = 25°C)
CC
A
Parameter
Symbol
Min
Typ
Max
Unit
Input Turn–On Threshold (V
Input Turn–Off Threshold (V
Input Resistance
= V ; Rx1 – Rx5)
OL
3.3 V
5.0 V
V
1.35
2.00
1.8
2.5
2.35
3.10
V
DO1 – DO5
on
= V ; Rx1 – Rx5)
OH
3.3 V
5.0 V
V
off
0.75
1.20
1.0
1.5
1.25
1.80
V
DO1 – DO5
R
3
5.4
7
kΩ
in
High–Level Output Voltage (DO1 – DO5)
= – 3 to – 25 V
I
= – 20 µA
V
V
V
– 0.1
– 0.6
—
2.7
—
—
V
out
OH
CC
CC
V
I
= – 1 mA
Rx1 – Rx5
Low–Level Output Voltage (DO1 – DO5)
= + 3 to + 25 V
out
I
= + 20 µA
= + 1.6 mA
V
—
—
0.01
0.5
0.1
0.7
V
out
OL
V
I
I
Rx1 – Rx5
out
Ring Monitor Circuit (Input Threshold)
High–Level Output Voltage (RIMON)
V
—
1.1
—
V
V
TH
I
= – 20 µA
V
OH
V
CC
V
CC
– 0.1
– 0.6
—
2.7
—
—
out
I
= – 1 mA
out
Low–Level Output Voltage (RIMON)
I
= + 20 µA
= + 1.6 mA
V
—
—
0.01
0.5
0.1
0.7
V
out
OL
out
Page 3 of 7
www.lansdale.com
Issue A
ML145583
LANSDALE Semiconductor, Inc.
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; V
= + 3.3 V or + 5.0 V 10%; C1 – C5 = 1 µF; T = 25°C)
A
CC
Parameter
Symbol
Min
Typ
Max
Unit
Digital Input Voltage
Logic Low
Logic High
DI1 – DI3
DI1 – DI3
V
V
—
1.8
—
—
0.7
—
IL
V
IH
Digital Input Current
µA
V
V
DI
V
DI
= GND
I
—
—
7
—
—
1.0
IL
= V
I
IH
CC
Output High Voltage
Load on All Tx1 – Tx3, R = 3 kΩ; C = 2500 pF, V
No Load
V
OH
= Logic Low
= Logic High
5.0
8.5
7.0
8.8
—
—
L
P
DI1 – DI3
Output Low Voltage
Load on All Tx1 – Tx3, R = 3 kΩ; C = 2500 pF, V
No Load
V
OL
V
—
—
– 7.0
– 8.8
– 5.0
– 8.5
L
P
DI1 – DI3
Ripple (Refer to V
– V
Value) ***
V
—
—
—
5%
—
DD
SS
RF
Off Source Impedance
Tx1 – Tx3
Z
300
Ω
off
Output Short Circuit Current (V
Tx1 – Tx3 Shorted to GND*
Tx1 – Tx3 Shorted to 15 V**
= 3.3 V or 5.5 V)
I
mA
CC
SC
—
—
—
—
60
100
*Specification is for one Tx output to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation
limits could be exceeded.
**This condition could exceed package limitations.
***Ripple V
would not exceed 5% of (V
– V ).
RF
DD
SS
SWITCHING CHARACTERISTICS (V
CC
= + 3.3 V or + 5 V, 10%; C1 – C5 = 1 µF; T = 25°C)
A
Parameter
Symbol
Min
Typ
Max
Unit
Drivers
Propagation Delay Time
Low–to–High
Tx1 – Tx3
Tx1 – Tx3
t
µs
DPLH
(R = 3 kΩ, C = 50 pF or 2500 pF)
—
0.5
1
L
L
High–to–Low
t
DPHL
SR
(R = 3 kΩ, C = 50 pF or 2500 pF)
—
4
0.5
—
1
L
L
Output Slew Rate (Source R = 300 Ω)
30
V/µs
Loading: R = 3 – 7 kΩ; C = 2500 pF
L
L
Output Disable Time*
t
t
—
—
4
10
50
µs
DAZ
Output Enable Time*
25
ms
DZA
Receivers
Propagation Delay Time
Low–to–High
DO1 – DO5
µs
t
t
—
—
—
—
—
—
—
—
1
1
RPLH
High–to–Low
RPHL
Output Rise Time
Output Fall Time
DO1 – DO5
DO1 – DO5
t
r
120
40
4
200
100
10
50
ns
ns
t
f
Output Disable Time*
Output Enable Time*
t
t
µs
ms
RAZ
RZA
25
* Including the charge pump setup time.
TRUTH TABLES
Drivers
Receivers
DI
X
STB
H
Tx
Rx
X
STB
H
DO
Z*
L
Z*
H
L
L
L
H
H
L
L
L
L
H
* V
SS
V
Tx
≤ V
DD
X = Don’t Care
* GND
V
DO
≤ V
X = Don’t Care
CC
Page 4 of 7
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145583
PIN DESCRIPTIONS
the logic high level. During the standby mode, driver and receiver
output pins become high–impedance state. In this condition, supply
V
current I is below 5 µA (typ).
CC
CC
Digital Power Supply (Pin 27)
C5+, C5–, C2+, C2–, C1+, C1–
Voltage Tripler and Inverter (Pins 1, 3, 28, 26, 25, 24)
This digital supply pin is connected to the logic power supply. This
pin should have a not less than 0.33 µF capacitor GND.
These are the connections to the internal voltage tripler and invert-
GND
Ground (Pin 2)
er, which generate the V
DD
and V voltages.
SS
Rx1, Rx2, Rx3, Rx4, Rx5
Receive Data Inputs (Pins 7, 8, 9, 11, 13)
Ground return pin is typically connected to the signal ground pin of
the EIA–232–E connector (Pin 7) as well as to the logic power sup-
ply ground.
These are the EIA–232–E receive signal inputs. A voltage between
+ 3 and + 25 V is decoded as a space, and causes the corresponding
DO pin to swing to GND (0 V). A voltage between – 3 and – 25 V is
V
DD
Positive Power Supply (Pin 23)
decoded as a mark, and causes the DO pin to swing up to V
.
CC
This is the positive output of the on–chip voltage tripler and the
positive power supply input of the driver/receiver sections of the
device. This pin requires an external storage capacitor to filter the
50% duty cycle voltage generated by the charge pump.
DO1, DO2, DO3, DO4, DO5
Data Outputs (Pins 22, 21, 20, 18, 16)
These are the receiver digital output pins, which swing from V
to GND. Output level of these pins is high impedance while in stand-
by mode.
CC
V
SS
Negative Power Supply (Pin 5)
DI1, DI2, DI3
Data Inputs (Pins 19, 17, 15)
This is the negative output of the on–chip voltage tripler/inverter
and the negative power supply input of the driver/ receiver sections
of the device. This pin requires an external storage capacitor to filter
the 50% duty cycle voltage generated by the charge pump.
These are the high impedance digital input pins to the drivers.
Input voltage levels on these pins must be betweenV and GND.
CC
RIMON
Ring Monitor Circuit (Pin 4)
Tx1, Tx2, Tx3
Transmit Data Output (Pins 10, 12, 14)
The Ring Monitor Circuit will convert the input level on Rx1 pin
at standby mode and output on the RIMON pin.
These are the EIA–232–E transmit signal output pins, which
swing toward V
and V . A logic 1 at a DI input causes the cor-
SS
DD
responding Tx output to swing toward V . The actual levels and
SS
STB
slew rate achieved will depend on the output loading (RL/CL). The
Standby Mode (Pin 6)
minimum output impedance is 300 Ω when turned off.
The device enters the standby mode while this pin is connected to
SWITCHING CHARACTERISTICS
DRIVER
DI1 – DI3
DRIVER
+ 3.3 V
+ 3 V
0 V
STB (INPUT)
+ 1.5 V
+ 1.5 V
50%
(INPUT)
0 V
t
t
V
f
r
OH
+ 5 V
– 5 V
+ 5 V
– 5 V
V
Tx1 – Tx3
(OUTPUT)
HIGH Z
OH
Tx1 – Tx3
(OUTPUT)
90%
10%
V
OL
V
OL
t
DAZ
t
DZA
t
t
DPLH
DPHL
RECEIVER
RECEIVER
+ 3 V
0 V
+ 3.3 V
0 V
Rx1 – Rx5
(INPUT)
STB (INPUT)
+ 1.5 V
+ 1.5 V
50%
t
t
RPLH
RPHL
90%
10%
V
OH
90%
10%
V
90%
10%
OH
DO1 – DO5
(OUTPUT)
HIGH Z
DO1 – DO5
(OUTPUT)
V
V
OL
OL
t
t
t
RAZ
t
RZA
f
r
Page 5 of 7
www.lansdale.com
Issue A
ML145583
LANSDALE Semiconductor, Inc.
ESD PROTECTION
through the internal ESD protection diodes which are designed
to do just that. The key to protecting the IC is to shunt as much
of the energy to ground as possible before it enters the IC.
Figure 1 shows a technique which will clamp the ESD voltage
at approximately 15 V using the MMBZ15VDLT1. Any
residual voltage which appears on the supply pins is shunted to
ground through the capacitors C1and C2.
ESD protection on IC devices that have their pins accessible
to the outside world is essential. High static voltages applied to
the pins when someone touches them either directly or indi-
rectly can cause damage to gate oxides and transistor junctions
by coupling a portion of the energy from the I/O pin to the
power supply buses of the IC. This coupling will usually occur
C5+
C2+
GND
C5–
V
CC
0.1
0.1
µ
F
F
C2–
MMBZ15VDLT1 x 8
C1
C2
RIMON
C1+
C1–
V
µ
SS
V
STB
Rx1
DD
DO1
Rx2
Rx3
Tx1
Rx4
Tx2
Rx5
Tx3
DO2
DO3
DI1
DO4
DI2
DO5
DI3
Figure 1. ESD Protection Scheme
Page 6 of 7
www.lansdale.com
Issue A
ML145583
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
SOIC 28W = -7P
(ML145583-7P)
SOG PACKAGE
CASE 751F–04
-A-
NOTES:
28
1
15
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
14X P
M
M
-B-
0.010 (0.25)
B
14
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
28X D
M
M
S
S
0.010 (0.25)
T
A
B
R X 45°
MILLIMETERS
INCHES
C
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
17.80
7.40
2.35
0.35
0.41
1.27 BSC
0.23
0.13
MAX
18.05
7.60
2.65
0.49
0.90
MIN
MAX
0.711
0.299
0.104
0.019
0.035
-T-
0.701
0.292
0.093
0.014
0.016
-T-
26X G
SEATING
PLANE
K
F
0.050 BSC
0.009
0.005
0.32
0.29
0.013
0.011
8°
0.415
0.029
J
0°
8°
0°
10.05
0.25
10.55
0.75
0.395
0.010
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabil-
ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-
tomer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
Page 7 of 7
www.lansdale.com
Issue A
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