LBD2014-XX [LIGITEK]
LIGHT BAR LED DISPLAY; 灯条LED显示屏
| 型号： | LBD2014-XX |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | LIGHT BAR LED DISPLAY |
| 文件： | 总7页 (文件大小：109K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LIGHT BAR LED DISPLAY
LBD2014-XX
DATA SHEET
DOC. NO : QW0905-LBD2014-XX
REV.
: A
DATE
: 15 - Feb.- 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LBD2014-XX
Page 1/6
Package Dimensions
LBD2014-XX
6.35(0.25")
8.0(0.315")
LIGITEK
PIN NO.1
13.97
(0.55")
12.7
(0.5")
2.54X2=5.08
(0.2")
7.49(0.295")
4.3±0.5
Ø0.45
TYP
5.08(0.2")
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LBD2014-XX
Page 2/6
Internal Circuit Diagram
LBD2014-XX
6 3
1 4
Electrical Connection
PIN NO.1
LBD2014-XX
1
Cathode
NP
2
3
Anode
Cathode
NC
4
5
Anode
6
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/6
PART NO. LBD2014-XX
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
E
Forward Current Per Chip
IF
30
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
120
Power Dissipation Per Chip
mW
PD
100
10
μA
Reverse Current Per Any Chip
Operating Temperature
Ir
Topr
Tstg
-25 ~ +85
-25 ~ +85
℃
℃
Storage Temperature
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
Material
λP △λ
Vf(v)
Typ.
Iv(mcd)
Typ.
Max. Min.
IV-M
2:1
PART NO
(nm)
(nm)
Emitted
Orange
Min.
1.7
Common
Cathode
LBD2014-XX
GaAsP/GaP
635
45
2.1 2.6 3.05 5.0
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/6
PART NO. LBD2014-XX
Test Condition For Each Parameter
Symbol
Unit
volt
Test Condition
Parameter
Forward Voltage Per Chip
Vf
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Luminous Intensity Per Chip
Peak Wavelength
Iv
mcd
nm
λP
△λ
Ir
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
nm
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LBD2014-XX
5/6
Typical Electro-Optical Characteristics Curve
E CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
2.5
2.0
1000
100
10
1.5
1.0
1.0
0.1
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
1.1
1.0
0.9
0.8
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/6
PART NO. LBD2014-XX
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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